TWI360557B - Resin composition and its use - Google Patents
Resin composition and its useInfo
- Publication number
- TWI360557B TWI360557B TW94137605A TW94137605A TWI360557B TW I360557 B TWI360557 B TW I360557B TW 94137605 A TW94137605 A TW 94137605A TW 94137605 A TW94137605 A TW 94137605A TW I360557 B TWI360557 B TW I360557B
- Authority
- TW
- Taiwan
- Prior art keywords
- resin composition
- resin
- composition
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
- C08K5/3415—Five-membered rings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/204—Di-electric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/714—Inert, i.e. inert to chemical degradation, corrosion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31721—Of polyimide
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004313562A JP4784066B2 (ja) | 2004-10-28 | 2004-10-28 | 樹脂組成物及び銅張積層板 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200621852A TW200621852A (en) | 2006-07-01 |
TWI360557B true TWI360557B (en) | 2012-03-21 |
Family
ID=36262322
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW94137605A TWI360557B (en) | 2004-10-28 | 2005-10-27 | Resin composition and its use |
Country Status (4)
Country | Link |
---|---|
US (1) | US20060093824A1 (zh) |
JP (1) | JP4784066B2 (zh) |
KR (1) | KR101268482B1 (zh) |
TW (1) | TWI360557B (zh) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2067592B1 (en) | 2006-09-28 | 2020-07-15 | Toray Industries, Inc. | Process for producing composite prepreg base, layered base, and fiber-reinforced plastic |
JP5024205B2 (ja) * | 2007-07-12 | 2012-09-12 | 三菱瓦斯化学株式会社 | プリプレグ及び積層板 |
KR101466181B1 (ko) * | 2007-10-29 | 2014-11-27 | 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 | 수지 조성물, 이를 이용한 프리프레그 및 라미네이트 |
JP2009218509A (ja) * | 2008-03-12 | 2009-09-24 | Fujifilm Corp | 導電膜の形成方法及びプリント配線板の製造方法 |
US8658719B2 (en) | 2009-06-11 | 2014-02-25 | Arlon | Low loss pre-pregs and laminates and compositions useful for the preparation thereof |
US20110123796A1 (en) * | 2009-11-20 | 2011-05-26 | E.I. Dupont De Nemours And Company | Interposer films useful in semiconductor packaging applications, and methods relating thereto |
SG10201503091TA (en) * | 2010-04-21 | 2015-06-29 | Mitsubishi Gas Chemical Co | Heat curable composition |
US8686069B2 (en) * | 2010-10-12 | 2014-04-01 | Hexcel Corporation | Solvent resistance of epoxy resins toughened with polyethersulfone |
EP2660269A4 (en) * | 2010-12-27 | 2014-09-03 | Mitsubishi Gas Chemical Co | HEAT-CURABLE RESIN COMPOSITION |
JP6492455B2 (ja) * | 2014-08-19 | 2019-04-03 | Dic株式会社 | 硬化性組成物、硬化物、半導体封止材料、半導体装置、プリプレグ、プリント回路基板、フレキシルブル配線基板、ビルドアップフィルム、ビルドアップ基板、繊維強化複合材料、成形品 |
US10458197B2 (en) * | 2015-06-16 | 2019-10-29 | Baker Huges, A Ge Company, Llc | Disintegratable polymer composites for downhole tools |
JP6819854B2 (ja) * | 2016-08-26 | 2021-01-27 | 三菱瓦斯化学株式会社 | 樹脂組成物、プリプレグ、金属箔張積層板、積層樹脂シート、樹脂シート、及びプリント配線板 |
JP6955329B2 (ja) * | 2016-10-28 | 2021-10-27 | 株式会社日本触媒 | 硬化性樹脂組成物、それを用いた封止材及び半導体装置 |
US20180179424A1 (en) * | 2016-12-23 | 2018-06-28 | Industrial Technology Research Institute | Adhesive composition and composite substrate employing the same |
CN111511839B (zh) | 2017-12-22 | 2023-03-31 | 帝人株式会社 | 热固性树脂组合物 |
US20210229407A1 (en) * | 2018-06-01 | 2021-07-29 | Mitsubishi Gas Chemical Company, Inc. | Resin Composition, Prepreg, Metal Foil-Clad Laminate, Resin Sheet, and Printed Wiring Board |
CN112236464B (zh) * | 2018-06-01 | 2024-02-23 | 三菱瓦斯化学株式会社 | 树脂组合物、预浸料、覆金属箔层叠板、树脂片及印刷电路板 |
CN113004690B (zh) * | 2019-12-20 | 2022-04-12 | 中国科学院大连化学物理研究所 | 一种双马来酰亚胺树脂组合物、其制备方法及应用 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4389516A (en) * | 1980-03-24 | 1983-06-21 | Mitsubishi Gas Chemical Company, Inc. | Curable polyphenylene ether resin composition |
US4645805A (en) * | 1984-03-14 | 1987-02-24 | Mitsubishi Gas Chemical Company, Inc. | Adhesive composition and adhesive film or sheet on which the composition is coated |
NL8403091A (nl) * | 1984-10-11 | 1986-05-01 | Gen Electric | Thermoplastisch mengsel met polyfunctionele verbinding. |
US4962161A (en) * | 1987-08-17 | 1990-10-09 | Hercules Incorporated | Thermosettable resin compositions |
MY104191A (en) * | 1988-09-06 | 1994-02-28 | Mitsubishi Gas Chemical Co | Process for producing multilayer printed wiring board |
JPH0753864A (ja) * | 1993-08-19 | 1995-02-28 | Mitsubishi Gas Chem Co Inc | 硬化性樹脂組成物 |
JPH07196793A (ja) * | 1993-12-28 | 1995-08-01 | Sumitomo Bakelite Co Ltd | 封止用樹脂組成物 |
JP2003238681A (ja) * | 2002-02-19 | 2003-08-27 | Sumitomo Bakelite Co Ltd | 樹脂組成物、プリプレグ及び積層板 |
US20050182203A1 (en) * | 2004-02-18 | 2005-08-18 | Yuuichi Sugano | Novel cyanate ester compound, flame-retardant resin composition, and cured product thereof |
-
2004
- 2004-10-28 JP JP2004313562A patent/JP4784066B2/ja active Active
-
2005
- 2005-10-18 US US11/251,934 patent/US20060093824A1/en not_active Abandoned
- 2005-10-27 TW TW94137605A patent/TWI360557B/zh active
- 2005-10-27 KR KR1020050101803A patent/KR101268482B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR20060052264A (ko) | 2006-05-19 |
JP4784066B2 (ja) | 2011-09-28 |
US20060093824A1 (en) | 2006-05-04 |
JP2006124494A (ja) | 2006-05-18 |
KR101268482B1 (ko) | 2013-06-04 |
TW200621852A (en) | 2006-07-01 |
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