JP2006117449A - 窒化アルミニウム焼結体 - Google Patents
窒化アルミニウム焼結体 Download PDFInfo
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- JP2006117449A JP2006117449A JP2004304980A JP2004304980A JP2006117449A JP 2006117449 A JP2006117449 A JP 2006117449A JP 2004304980 A JP2004304980 A JP 2004304980A JP 2004304980 A JP2004304980 A JP 2004304980A JP 2006117449 A JP2006117449 A JP 2006117449A
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- aluminum nitride
- sintered body
- less
- nitride sintered
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- H—ELECTRICITY
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- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
- H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
- H05B3/143—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds applied to semiconductors, e.g. wafers heating
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/62605—Treating the starting powders individually or as mixtures
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- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
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- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3224—Rare earth oxide or oxide forming salts thereof, e.g. scandium oxide
- C04B2235/3225—Yttrium oxide or oxide-forming salts thereof
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- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
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- C04B2235/3895—Non-oxides with a defined oxygen content, e.g. SiOC, TiON
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- C04B2235/54—Particle size related information
- C04B2235/5418—Particle size related information expressed by the size of the particles or aggregates thereof
- C04B2235/5445—Particle size related information expressed by the size of the particles or aggregates thereof submicron sized, i.e. from 0,1 to 1 micron
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
- C04B2235/658—Atmosphere during thermal treatment
- C04B2235/6583—Oxygen containing atmosphere, e.g. with changing oxygen pressures
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- C04B2235/9692—Acid, alkali or halogen resistance
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Structural Engineering (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
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- Resistance Heating (AREA)
- Surface Heating Bodies (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
【解決手段】 本発明の窒化アルミニウム焼結体は、含有するスズとイオウの量を一定値以下に制御する。すなわち、窒化アルミニウムを主成分とする窒化アルミニウム焼結体において、窒化アルミニウム焼結体中のスズの含有量が50ppm以下であり、かつイオウの含有量が100ppm以下であることを特徴とする。前記窒化アルミニウム焼結体に、抵抗発熱体が形成されていることが好ましく、半導体加熱用部品として使用されることが好ましい。
【選択図】 なし
Description
Claims (3)
- 窒化アルミニウムを主成分とする窒化アルミニウム焼結体において、窒化アルミニウム焼結体中のスズの含有量が50ppm以下であり、かつイオウの含有量が100ppm以下であることを特徴とする窒化アルミニウム焼結体。
- 前記窒化アルミニウム焼結体に、抵抗発熱体が形成されていることを特徴とする請求項1に記載の窒化アルミニウム焼結体。
- 半導体加熱用部品として使用されることを特徴とする請求項1または2に記載の窒化アルミニウム焼結体。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004304980A JP4831953B2 (ja) | 2004-10-20 | 2004-10-20 | 窒化アルミニウム焼結体 |
US11/234,765 US7341969B2 (en) | 2004-10-20 | 2005-09-23 | Aluminum nitride sintered body |
TW094133114A TWI386383B (zh) | 2004-10-20 | 2005-09-23 | 氮化鋁燒結體 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004304980A JP4831953B2 (ja) | 2004-10-20 | 2004-10-20 | 窒化アルミニウム焼結体 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006117449A true JP2006117449A (ja) | 2006-05-11 |
JP4831953B2 JP4831953B2 (ja) | 2011-12-07 |
Family
ID=36535701
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004304980A Expired - Fee Related JP4831953B2 (ja) | 2004-10-20 | 2004-10-20 | 窒化アルミニウム焼結体 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7341969B2 (ja) |
JP (1) | JP4831953B2 (ja) |
TW (1) | TWI386383B (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012191241A (ja) * | 2012-06-27 | 2012-10-04 | Sumitomo Electric Ind Ltd | ウエハプローバ用ウエハ保持体及びそれを搭載したウエハプローバ |
JP2020537352A (ja) * | 2017-10-12 | 2020-12-17 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 疎水性静電チャック |
CN112979335A (zh) * | 2021-02-08 | 2021-06-18 | 哈尔滨化兴软控科技有限公司 | 氮化铝多孔隙原料的制备方法 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8148283B2 (en) * | 2007-02-02 | 2012-04-03 | Tokuyama Corporation | Aluminum nitride sintered body |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0226871A (ja) * | 1988-07-12 | 1990-01-29 | Showa Alum Corp | 透光性に優れた窒化アルミニウム焼結体の製造方法 |
JP3389384B2 (ja) * | 1995-10-31 | 2003-03-24 | 京セラ株式会社 | 窒化アルミニウム質基板 |
JP3670416B2 (ja) * | 1995-11-01 | 2005-07-13 | 日本碍子株式会社 | 金属包含材および静電チャック |
JP3145664B2 (ja) | 1997-08-29 | 2001-03-12 | 京セラ株式会社 | ウエハ加熱装置 |
JP4447750B2 (ja) * | 1999-09-30 | 2010-04-07 | 日本碍子株式会社 | 窒化アルミニウム焼結体および半導体製造用部材 |
TWI243158B (en) * | 2000-12-21 | 2005-11-11 | Ngk Insulators Ltd | Aluminum nitride sintered bodies |
JP2003292377A (ja) * | 2002-03-29 | 2003-10-15 | Toshiba Ceramics Co Ltd | 半導体装置用セラミックス部材 |
JP2003212658A (ja) * | 2002-10-30 | 2003-07-30 | Ibiden Co Ltd | 窒化アルミニウム焼結体およびセラミック基板 |
JP4783560B2 (ja) * | 2003-09-25 | 2011-09-28 | 株式会社トクヤマ | 窒化アルミニウム焼結体及びその製造方法 |
EP1518843A3 (en) * | 2003-09-25 | 2007-05-23 | Tokuyama Corporation | Aluminum nitride sintered body and method of producing the same |
-
2004
- 2004-10-20 JP JP2004304980A patent/JP4831953B2/ja not_active Expired - Fee Related
-
2005
- 2005-09-23 TW TW094133114A patent/TWI386383B/zh not_active IP Right Cessation
- 2005-09-23 US US11/234,765 patent/US7341969B2/en not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012191241A (ja) * | 2012-06-27 | 2012-10-04 | Sumitomo Electric Ind Ltd | ウエハプローバ用ウエハ保持体及びそれを搭載したウエハプローバ |
JP2020537352A (ja) * | 2017-10-12 | 2020-12-17 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 疎水性静電チャック |
CN112979335A (zh) * | 2021-02-08 | 2021-06-18 | 哈尔滨化兴软控科技有限公司 | 氮化铝多孔隙原料的制备方法 |
CN112979335B (zh) * | 2021-02-08 | 2022-07-01 | 哈尔滨化兴软控科技有限公司 | 氮化铝多孔隙原料的制备方法 |
Also Published As
Publication number | Publication date |
---|---|
JP4831953B2 (ja) | 2011-12-07 |
TWI386383B (zh) | 2013-02-21 |
US20060116272A1 (en) | 2006-06-01 |
US7341969B2 (en) | 2008-03-11 |
TW200614851A (en) | 2006-05-01 |
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