JP2006086146A - Package for housing electronic component and electronic device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a package for housing an electronic component that is actuated in a high frequency band of ≥40 GHz and has good transmitting characteristics between an electronic component and a relaying substrate, and to provide an electronic device. <P>SOLUTION: On the relaying substrate 2 of the package for housing the electronic component, grooves 2c are formed from the same-surface grounding conductor layer 2b-A to a bottom-surface grounding conductor layer 2b-B on both sides of the other end side of a signal line 2a. At the same time, conductor layers 2c-A which electrically connect the same-surface grounding conductor layer 2b-A and the bottom-surface grounding conductor layer 2b-B are formed on internal surfaces of the grooves 2c. The grooves 2c are formed in a state that bottom sides of opened edges of the grooves 2c on the signal line 2a side on side faces of the signal line 2a are positioned closer to the signal line 2a side than to top sides of the opened edges. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention is for storing electronic components including various electronic components that operate at a high frequency and are used in optical communication, microwave communication, millimeter wave communication, and the like, and a relay board electrically connected to the electronic components. The present invention relates to a package and an electronic device.

  Among electronic component storage packages that house various electronic components that operate at high frequencies, used in optical communication, microwave communication, millimeter wave communication, etc., together with a relay substrate that is electrically connected to this electronic component, An example of a conventional electronic component storage package used in the field of optical communication is shown in the sectional view of FIG.

  As shown in the drawing, a conventional electronic component storage package 101 has a mounting surface on which an electronic component 108 such as an LD (laser diode) or PD (photodiode) is mounted via a mounting base 104b. It has a base 104 provided with a placement portion 104a. The substrate 104 is made of a metal material such as a copper (Cu) -tungsten (W) alloy or an iron (Fe) -nickel (Ni) -cobalt (Co) alloy.

  Further, a frame body 106 is attached to the upper surface of the base 104 via a brazing material such as a silver brazing material so as to surround the mounting portion 104a. A through window 106b used as an optical transmission path for optically coupling with the electronic component 108 is formed on one side of the frame 106. The frame 106 is made of a metal material such as an Fe—Ni—Co alloy.

  The periphery of the opening of the through-hole 106b on the outer surface of the frame body 106 is made of a metal material such as an Fe-Ni-Co alloy or Fe-Ni alloy that approximates the thermal expansion coefficient of the frame body 106, and prevents return light. A cylindrical fixing member 114 to which a metal holder 112 in which the optical isolator 111 and the optical fiber 113 are bonded with a resin adhesive is fixed is joined with a brazing material such as a silver brazing material. The cylindrical fixing member 114 is fixed with a translucent member 110 made of amorphous glass or the like, which functions as a condensing lens and cools the inside of the electronic component storage package 101. .

  Note that the end surfaces of the fixing member 114 and the metal holder 112 are fixed by YAG laser welding or the like. On the other hand, the fixing member 114 and the translucent member 110 include a plating layer formed on the inner peripheral surface of the fixing member 114 and a plating layer formed on a part of the outer peripheral surface of the translucent member 110 as Au- It is fixed by brazing with a low melting point brazing material such as Sn alloy solder.

  The coaxial connector 107 is made of a metal material such as an Fe-Ni-Co alloy, and the inner peripheral surface of a through hole 106a formed on the side of the frame body 106 is made of a low melting point solder such as Au-Sn alloy solder. A cylindrical outer conductor 107a to be brazed, and an insulator 107b made of a dielectric such as borosilicate glass filled in the outer conductor 107a and filled between the outer conductor 107a and the center conductor 107c; The center conductor 107c is mounted on the central axis portion of the insulator 107b and conducts the inside and outside of the electronic component storage package 101.

  The coaxial connector 107 has a function of electrically connecting an external electric circuit and the electronic component 108 via the signal line 102a of the relay substrate 102 and the bonding wire 109, and the inside of the electronic component storage package 101. Has a function to block.

  Further, as shown in FIG. 6A, the coaxial connector 107 includes a central conductor 107c through which a high-frequency signal is transmitted, and an outer peripheral portion thereof, that is, an outer peripheral conductor 107a made of a metal material and an inner peripheral surface of the through hole 106a. A coaxial structure capable of matching impedance during high-frequency signal transmission is formed.

  6B is an enlarged perspective view of a main part of the relay substrate 102 of the electronic component storage package of FIG. 6A. The relay substrate 102 includes a signal line 102a formed on the upper surface of the dielectric. The lower surface ground conductor layer 102b-B formed on the lower surface is configured such that the high frequency impedance of the signal line 102a matches the impedance inside the through hole 106a of the center conductor 107c in the coaxial connector 107. The tip of the central conductor 107c of the coaxial connector 107 is made of a low-melting brazing material such as tin-lead solder and the tip of the signal line 102a constituting the microstrip line or coplanar line formed on the relay substrate 102. The other end of the signal line 102a is connected to the electrode of the electronic component 108 by the bonding wire 109, whereby the external electric circuit and the electronic component 108 are electrically connected.

  In order to propagate a high-frequency signal on the relay substrate 102, a typical transmission line structure includes a strip line, a coplanar line, and the like in addition to a microstrip line. The characteristic impedance of each line structure includes the width of the signal line 102a, the thickness of the dielectric, the geometric dimension of the gap between the signal line 102a and the same-surface ground conductor layer 102b-A disposed on both sides thereof, and the dielectric It is determined by the relative dielectric constant.

  When the relay substrate 102 is configured by a coplanar line, the same-surface ground conductor layer 102b-A disposed at a predetermined interval is formed on both sides of the upper signal line 102a, and the grounding effect is improved. A lower surface ground conductor layer 102b-B is formed at a position facing the signal line 102a on the lower surface of the dielectric, and the same surface ground conductor layer 102b-A and the lower surface ground conductor layer 102b-B are connected to the relay substrate 102. Through conductors formed from the same ground conductor layer 102b-A to the lower ground conductor layer 102b-B, or from the same ground conductor layer 102b-A to the lower ground conductor layer 102b-B on the side surface of the relay substrate 102. A so-called castellation in which a conductor layer 102c-A electrically connecting the same-surface ground conductor layer 102b-A and the lower-surface ground conductor layer 102b-B is attached to the inner surface of the groove 102c of equal width formed in Electrically connected .

  In such an electronic component storage package 101, the mounting base 104b on which the electronic component 108 and the relay substrate 102 are mounted is mounted on the mounting portion 104a via an adhesive such as a resin adhesive or a brazing material. After mounting and fixing on the portion 104a, one end of the central conductor 107c is joined to the signal line 102a on the upper surface of the relay substrate 102 with a low melting point brazing material. Next, the electrode of the electronic component 108 and the signal line 102a, and the grounding electrode of the electronic component 108 and the same-surface ground conductor layer 102b-A are electrically connected by the bonding wire 109. Thereafter, the metal holder 112 to which the optical isolator 111 and the optical fiber 113 are fixed is welded to the fixing member 114. Then, the lid 105 is joined to the upper surface of the frame 106 by a known seam welding method, brazing method, or the like, so that an electronic device as a product is obtained.

In addition, this electronic device, for example, optically excites the electronic component 108 by a high-frequency signal supplied from the outside via the coaxial connector 107, and transmits and receives the excited light such as laser light to the optical fiber 113 through the translucent member 110. By transmitting through the fiber 113, it functions as a photoelectric conversion device capable of transmitting a large amount of information at high speed, and is widely used in the optical communication field.
JP 2004-64459 A (page 4-5, FIG. 1)

  In the above-described conventional electronic component storage package 101, in the frequency band exceeding 40 GHz, in order to minimize the transmission loss of the high frequency signal, the electrical component 108 is electrically connected to the signal line 102a and the common ground conductor layer 102b-A. It is necessary to connect the bonding wire 109 for the general connection from the electronic component 108 with the shortest length. For this reason, the bonding wire 109 is connected between the same-surface ground conductor layer 102b-A and the electronic component 108. The bonding is performed by bonding a wire to a narrow area which is an end portion of the same-surface ground conductor layer 102b-A close to the signal line 102a and an end portion close to the electronic component 108 of the relay substrate 102. However, for this purpose, the conductor layer 102c-A for electrically connecting the same-surface ground conductor layer 102b-A and the lower-surface ground conductor layer 102b-B is disposed outside the region (bonding wire as viewed from the signal line 102a side). Therefore, the effective dielectric constant between the line conductor 102a and the ground conductor layer 102b-A on the same plane is increased, and the resonance point of the line is lowered. To do. As a result, in the high frequency band exceeding 40 GHz, the pass band of the signal line is limited to the low band side, causing a problem that a desired high frequency signal is not transmitted well.

  Accordingly, the present invention has been devised in view of the above-described problems, and an object of the present invention is to provide an electronic component storage package and an electronic component having good transmission characteristics between the electronic component and the relay substrate in a high frequency band of 40 GHz or higher. To provide an apparatus.

  An electronic component storage package according to the present invention includes a base having a mounting portion on which an electronic component that operates at a frequency of 40 GHz or more is mounted on the upper surface, a relay substrate mounted on the mounting portion, and the base A frame having a through-hole formed in the side portion and a cylindrical outer peripheral conductor and a central conductor installed through an insulator on the central axis thereof. And a coaxial connector inserted into the through hole, and the relay board has a signal line having one end on the upper surface and electrically connected to the central conductor of the coaxial connector, and a predetermined interval on both sides thereof. And an electronic component storage package having a lower surface grounding conductor layer facing the signal line on a lower surface, wherein the relay substrate includes the signal The other end of the track Grooves are respectively formed on both sides of the signal line on the side surface from the same-surface ground conductor layer to the lower-surface ground conductor layer, and the same-surface ground conductor layer and the lower-surface ground conductor layer are electrically connected to the inner surface of the groove. The conductor layer to be connected is attached, and the groove is such that the lower side of the opening edge on the side of the signal line on the side surface is located closer to the signal line than the upper side.

  In the electronic component storage package according to the present invention, preferably, the groove has a quadrangular cross-sectional shape.

  Furthermore, in the electronic component storage package according to the present invention, preferably, in the above configuration, the relay substrate has a groove formed at a portion between the signal line on the upper surface and the ground conductor layer on the same plane. Features.

  The electronic device according to the present invention includes the electronic component storage package according to the present invention, the electronic component mounted on the mounting portion and an electrode electrically connected to the other end of the signal line. And a lid attached to the upper surface of the frame so as to cover the mounting portion.

  According to the electronic component storage package of the present invention, the relay substrate has grooves formed on both sides of the signal line on the side surface on the other end side of the signal line from the same surface ground conductor layer to the lower surface ground conductor layer. A conductor layer for electrically connecting the same-surface grounding conductor layer and the lower-surface grounding conductor layer is attached to the inner surface of the groove, and the groove has a lower side of the opening edge of the signal line side on the side surface than the upper side. Since the volume of the dielectric between the same-surface ground conductor layer and the lower-surface ground conductor layer on the signal line side of the groove can be reduced below the opening edge of the groove, the effective dielectric The rate can be lowered, so that the resonance point generated in the transmission line when propagating the high frequency can be prevented from being lowered, the pass band of the transmission line is expanded to the high frequency side, and the transmission characteristics are improved. Signal line And the opening edge on the signal line side above the groove can be maintained at a desired distance, and the wire bonding that makes the shortest to the very narrow area in the signal line and the same-surface ground conductor layer easy and reliable. Connect well.

  In the electronic component storage package according to the present invention, preferably, the groove has a quadrangular cross section, so that the groove has a semicircular or oval cross section. Since the rectangular shape is formed so as to go around the corners, the volume of the dielectric can be further reduced, and the effective dielectric constant can be further reduced. High frequency transmission characteristics can be improved.

  Furthermore, in the electronic component storage package of the present invention, preferably, in the above configuration, the relay substrate has a groove formed in a portion between the signal line on the upper surface and the ground conductor layer on the same plane. Can reduce the volume of the dielectric between the signal line and the same-surface grounded conductor layer, and can suppress the generation of stray capacitance between the signal line and the same-surface grounded conductor layer. Further suppression can be achieved.

  An electronic device according to the present invention includes an electronic component storage package according to the present invention, an electronic component mounted on the mounting portion and having an electrode electrically connected to the other end of the signal line, and a frame body. Since the electronic component storage package has a high resonance point with respect to the high-frequency signal, the loss in the required frequency band is small because the lid mounted on the upper surface so as to cover the mounting portion is provided. An electronic device capable of high-frequency transmission is obtained.

The electronic component storage package of the present invention will be described in detail below.
FIG. 1 is a cross-sectional view showing an example of an embodiment of an electronic component storage package A of the present invention, FIG. 2 is a perspective view of a relay board 2 in FIG. 1, and FIG. It is an enlarged side view, (a), (b), (c), (d) shows the example of the form of the groove | channel where the lower end of the opening edge by the side of the signal track | line 2a is located in the signal track | line side rather than an upper end, respectively. . 4 is an enlarged perspective view of a main part of the relay substrate 2 in another example of the embodiment of the present invention, and FIG. 5 is a cross-sectional view of the electronic device of the present invention.

  In these drawings, A is an electronic component storage package of the present invention, 1a is a mounting portion on which an electronic component 8 operating at a frequency of 40 GHz or more is mounted, 1 is a Cu-W alloy, Fe-Ni-Co alloy, or the like. A base body having a placement portion 1a on the upper surface, 1b placed on the placement portion 1a, a placement base 2 on which the relay substrate 2 and the electronic component 8 are placed, and 2 on the placement portion 1a The relay substrate 6 mounted via the mounting base 1b is made of Fe-Ni alloy, Fe-Ni-Co alloy, stainless steel or the like attached to the upper surface of the base 1 so as to surround the mounting portion 1a. The metal frame body 6a is a through-hole formed in the side portion of the frame body 6, the lid body is attached to the upper surface of the frame body 6 so as to cover the mounting portion 1a, and 7 is the through-hole 6a. A coaxial connector 7a is a cylindrical outer conductor of the coaxial connector 7, and 7b is an insulation of the coaxial connector 7. , 7c is established via an insulator 7b to the central axis of the coaxial connector 7, it shows the connected center conductor at one end of the signal line 2a of the relay substrate 2.

  2a is a signal line formed from one end of the relay substrate 2 to the other end, 2b-A is a common ground conductor layer disposed on both sides of the signal line 2a at a predetermined interval, and 2b-B is a relay substrate. A lower surface ground conductor layer facing the signal line 2a is shown on the lower surface of FIG. 2c-A has grooves 2c formed on both sides of the signal line 2a on the other side of the signal line 2a from the same-surface ground conductor layer 2b-A to the lower-surface ground conductor layer 2b-B. A conductor layer that electrically connects the same-surface grounding conductor layer and the lower-surface grounding conductor layer to the inner surface of the substrate, that is, a so-called castellation conductor layer.

  When the electronic component 8 mounted on the electronic component storage package A is an optical semiconductor element, a through window 6b is formed on the other side of the frame 6 and the through window 6b of the frame 6 is formed. One end surface of the fixing member 14 having the translucent member 10 bonded inside is attached around the outer opening, and the metal holder 12 having the optical isolator 11 and the optical fiber 13 bonded thereto is fixed to the other end surface of the fixing member 14. ing. If the electronic component 8 accommodated in the electronic component storage package A is a high-frequency semiconductor element or the like that is not an optical semiconductor element for millimeter wave amplification or the like, these can be omitted. Hereinafter, the electronic component storage package A will be described on the assumption that the electronic component 8 is an optical semiconductor element.

  Basically, the base 1, the frame 6, the coaxial connector 7, the fixing member 14, the translucent member 10 and the lid 5 constitute an electronic component storage package A for accommodating the electronic component 8 therein. The A metal holder 12 in which the optical isolator 11 and the optical fiber 13 are bonded with a resin adhesive or the like is welded and fixed to the outer end surface of the fixing member 14 by YAG laser welding or the like.

  In the electronic component storage package A, the coaxial connector 7 is composed of an outer peripheral conductor 7a made of a tubular Fe—Ni alloy, Fe—Ni—Co alloy, etc., and borosilicate glass filled inside the outer peripheral conductor 7a. An insulator 7b and a central conductor 7c that conducts the inside and outside of the electronic component storage package A made of Fe-Ni alloy, Fe-Ni-Co alloy, etc., installed on the central axis of the outer conductor 7a of the insulator 7b. Composed.

  The coaxial connector 7 has a structure in which an insulator 7b is interposed between the outer conductor 7a and the center conductor 7c. The outer conductor 7a and the inner peripheral surface of the through hole 6a made of a metal material and the center conductor 7c are A coaxial structure in which impedance matching is performed with respect to a high-frequency signal is formed. Furthermore, the front end of the center conductor 7c protrudes to the inside of the frame body 6, and the front end thereof is connected to the signal line 2a of the relay substrate 2 mounted on the mounting base 1b. .

  Further, the relay substrate 2 is formed with a signal line 2a, one end of which is electrically connected to the center conductor 7c of the coaxial connector 7 on the upper surface, and a coplanar ground conductor layer 2b-A disposed on both sides thereof at a predetermined interval. In addition, since the lower surface ground conductor layer 2b-B facing the signal line 2a is formed on the lower surface, that is, the signal transmission path has a coplanar structure, the microstrip is also used when transmitting a high-frequency signal. The thickness of the dielectric of the relay substrate 2 can be increased as compared with the structure, and the relay substrate 2 with high productivity can be obtained.

The relay substrate 2 is formed by forming a conductor layer on a ceramic dielectric such as an alumina (Al ₂ O ₃ ) sintered body or an aluminum nitride (AlN) sintered body, for example, a dielectric made of an alumina sintered body. When formed from a body, a sintering aid such as calcia (CaO), magnesia (MgO), silica (SiO ₂ ) is added to the alumina powder, and a plasticizer such as dibutyl phthalate (DBP) is added thereto. A binder such as acrylic resin and an organic solvent such as toluene are added together and kneaded by a kneader such as a ball mill to produce a slurry. Next, a ceramic green sheet having a thickness of 0.2 to 0.3 mm is obtained by a known doctor blade method. Then, a plurality of these ceramic green sheets are stacked as necessary and laminated while applying temperature and pressure with a die press machine to obtain a laminated body to be a ceramic mother board, and then the ceramic mother board is divided into a plurality of sections A split groove to be formed is formed in this laminate, and then sintered in air at 1600 ° C. to produce an alumina sintered body.

  Next, a through hole is formed at a predetermined position on the dividing groove of the alumina sintered body by a known sandblasting method or the like. At this time, a film made of, for example, an epoxy resin is pasted in advance except for an opening serving as a through hole, and then fine sand particles are sprayed onto the opening at a high speed, so that FIG. The through-hole which becomes the groove | channel 2c gradually widened from the middle to the lower end from the upper end to the lower end of the groove | channel 2c like this can be obtained. When the sandblasting method is applied, there is an advantage that the inner surface of the leading hole is appropriately roughened, and a conductor layer 2c-A described later is uniformly and firmly attached.

  Further, when forming the through hole, a laser beam such as a carbon dioxide laser may be irradiated to a predetermined portion, and by irradiating this laser beam, a through hole having a desired shape can be obtained. Then, if the roughness of the inner surface of the through hole is appropriately adjusted using the sandblast method after the laser light irradiation, the effect that the conductor layer 2c-A is firmly attached can be obtained.

  Next, the signal line 2a, the same-surface ground conductor layer 2b-A, the lower-surface ground conductor layer 2b-B, and the conductor layer 2c- are formed on the upper and lower surfaces of the alumina sintered body and the inner surface of the through-hole that becomes the groove 2c. A conductor layer to be A is formed by depositing a metal thin film such as titanium (Ti) or palladium (Pd) on the surface by sputtering or vapor deposition. At this time, a resist film may be formed in advance on a portion where it is not necessary to deposit the metal thin film, and the resist film may be removed after the metal thin film is formed.

  Further, it is preferable that nickel (Ni) plating and gold (Au) plating are sequentially applied to the surface of the conductive portion such as the transmission line 2a in the relay substrate 2.

  Finally, by bending the ceramic mother substrate made of an alumina sintered body along the dividing groove, the through hole that becomes the groove 2c provided at a predetermined position of the dividing groove is vertically divided into two by the dividing groove, A groove 2c is formed on the side surface of the relay substrate 2a from the same surface ground conductor layer 2b-A to the lower surface ground conductor layer 2b-B, and the same surface ground conductor layer 2b-A and the lower surface ground conductor layer are formed on the inner surface of the groove 2c. A conductor layer 2c-A that electrically connects 2b-B is deposited, and the groove 2c is formed such that the lower side of the opening edge on the side of the signal line 2a on the side surface of the relay substrate 2a is closer to the signal line 2a than the upper side. What is located at is obtained.

  The groove 2c shape may be a trapezoidal shape as viewed from the front side of the relay substrate 2 gradually widened from the upper end to the lower end of the groove 2c, but excluding the trapezoidal shape, as shown in FIG. The inner surface is gradually widened in a straight line from the middle to the lower edge from the upper end to the lower end of the groove 2c, as shown in FIG. As shown in FIG. 3 (c), the trapezoidal shape whose width is increased stepwise from the middle and whose inner side surface is gradually widened linearly from the upper end to the lower end of a groove such as a stepped shape. Can not be.

  Also, as shown in FIG. 3 (d), by providing a through hole serving as a groove 2c in an oblique direction in which the lower end is closer to the signal line side from the upper end and is vertically divided into two, the lower end is closer to the signal line side from the upper end. Various shapes can be employed in which the lower side of the opening edge of the groove 2c on the signal line 2a side is located closer to the signal line 2a than the upper side, such as those provided in the groove 2c. As described above, the positional relationship between the lower and upper opening edges of the groove 2c opposite to the signal line of the groove 2c may be closer to the signal line than the upper side, as shown in FIGS. Thus, the lower side may not be closer to the signal line than the upper side, and may be in a vertical positional relationship.

  3A to 3D, the signal line 2a is omitted, but the signal line 2a is located on the upper surface of the relay substrate 2 on the upper right side of the drawing.

  Further, as shown in FIG. 8A, the groove 2c may be formed so that the opening edge on the signal line 2a side below the groove 2c is positioned closer to the signal line 2a on the bottom side of the groove 2c. . FIG. 8B is a bottom view of the left groove portion shown by arrow C in FIG. 8A, and the lower opening edge of the groove 2c is the depth of the portion on the signal line 2a side of the bottom surface of the groove 2c. It shows that it forms so that it may be located in the signal track | line 2a side rather than the site | part by the side of the signal track | line 2a of the direction upper end. As a result, the volume of the dielectric that causes the resonance point to be lowered can be reduced at the bottom surface of the groove 2c on the signal line 2a side below the groove 2c, so that the resonance point can be more effectively prevented from lowering. In addition, it is possible to generate a magnetic field surrounding the signal line 2a and to stabilize the electrical state in the length direction of the transmission line, thereby obtaining an effect of reducing reflection loss. it can. Such a groove 2c can be obtained by obliquely irradiating the fired relay substrate 2 with carbon dioxide laser light.

  By forming the groove 2c in this shape, the volume of the dielectric between the same-surface ground conductor layer 2b-A and the lower-surface ground conductor layer 2b-B on the signal line 2a side is reduced. Therefore, the resonance point generated in the transmission line when propagating a high frequency is raised. Since the pass band of the signal line 2a extends to the high frequency side as with the low-pass filter, the relay substrate 2 having good transmission characteristics in the high frequency band can be obtained.

  Further, the distance between the signal line 2a and the opening edge of the signal line 2a on the upper side of the groove 2c can be maintained at a desired distance, and the portion of the ground conductor layer 2b-A facing the signal line 2a is extremely Since the narrow region does not become too narrow, the wire bonding 9 or the like that is the shortest to this region can be easily and reliably connected. The wire bonding 9 may be other connection means such as a lead terminal.

  FIG. 9 shows the result of simulating the transmission characteristic of the signal line 2a with three-dimensional electromagnetic field analysis software (software name: HFSS, manufactured by ANSOFT), (a) is the reflection characteristic with the horizontal axis representing the frequency, (b). Indicates transmission characteristics with frequency on the horizontal axis. FIG. 10 shows the result of a similar simulation of the conventional relay substrate 102, where (a) shows the reflection characteristics with the frequency on the horizontal axis, and (b) shows the transmission characteristics with the frequency on the horizontal axis.

  The simulation result shown in FIG. 9 is performed for the groove 2c having the shape shown in FIG. 3A. In the transmission characteristics shown in FIG. 10B, the passband is cut off in the vicinity of 60 GHz. 3 (a), the passband is formed by depositing the conductor layer 2c-A in the groove 2c as shown in FIG. 9 (b). Is spreading to the high frequency side, and it can be seen that there is a significant improvement effect. When an evaluation was performed using an actual sample, a very approximate result was obtained, and thus the improvement effect of the high frequency transmission characteristics by the electronic component storage package A of the present invention was actually confirmed.

  Preferably, in the case of the groove 2c as shown in FIGS. 3A, 3B and 3C, the angle formed between the inner surface on the signal line 2a side above the groove 2c and the same grounded conductor layer 2b-A Does not become an acute angle of less than 90 °, when the wire bonding 9 is applied to the signal line 2a side of the coplanar ground conductor layer 2b-A, the opening edge of the groove 2c of the relay substrate 2 may be lost due to an impact. Is effectively prevented. Further, since the groove 2c as shown in FIG. 3 (d) is obtained by forming the through holes obliquely, it is only necessary to form through holes having the same diameter between the upper and lower sides by sandblasting or carbon dioxide laser beam irradiation. It can be easily processed.

  Further, except for the case where the inner surface is stepped as shown in FIG. 3 (c), the groove 2c as shown in FIG. 3 (a) or 3 (b) is formed by appropriately changing the sandblasting conditions. When the inner surface is formed in a stepped shape as shown in FIG. 3 (c), a through hole having a different diameter in advance in a green sheet state is punched out by a well-known die punching method, A method of stacking these may be used.

  Further, as shown in FIG. 7, the groove 2c may have a rectangular cross-sectional shape, that is, the shape of the groove 2c in plan view. As a result, the rectangular groove 2c is formed so as to pass through the corner between the bottom surface and the side surface with respect to the groove 2c formed of a circular or elliptical curved surface. The volume of the dielectric can be further reduced, and the resonance point of the signal line 2a can be raised to widen the pass band to the high frequency side. Needless to say, the bottom surface and the side surface do not have to be completely perpendicular, and may be connected by a small arcuate curved surface or the like.

  Further, the groove 2c has a cross-sectional shape, that is, a rectangular shape of the groove 2c in plan view, and the end on the signal line 2a side of the bottom surface is located closer to the signal line 2a side than the portion on the signal line 2a side at the upper end in the depth direction. If the cross-sectional shape of the groove 2c is, for example, a trapezoidal shape whose bottom is the bottom surface side of the groove 2c, the volume of the dielectric on the side surface side can be further reduced, and the passband of the signal line 2a can be further increased. Can be expanded to the high frequency side.

  The groove 2c as shown in FIG. 7 forms a through hole in which the cross-sectional shape is a square-shaped groove 2c by sweeping the rectangular inside of the groove 2c with a laser beam such as a carbon dioxide laser narrowed down to about several tens of microns. Then, by irradiating laser light obliquely from the lower side of the through-hole that becomes the groove 2c, the inner surface of the groove 2c is gradually widened linearly from the middle to the lower end from the upper end to the lower end of FIG. 2c can be formed. In FIG. 7, the groove 2c has a shape in which the opening edge on the opposite side to the signal line 2a on the lower side of the groove 2c is also gradually widened, but the inner surface on the opposite side to the signal line 2a side is The shape may be inclined toward the signal line 2a, that is, the inside of the groove 2c, or may be vertical from the upper end to the lower end.

  The transmission line composed of the signal line 2a, the same-surface ground conductor layer 2b-A, and the lower-surface ground conductor layer 2b-B of the relay substrate 2 formed in this way is formed to match the high-frequency impedance of the coaxial connector 7. One end side of the transmission line 2a is connected to the center conductor 7c of the coaxial connector 7, and the other end side of the transmission line 2a is electrically connected to the electrode of the electronic component 8 via the bonding wire 9 or the like. By being connected, the electronic component 8 is electrically connected to the coaxial connector 7.

  In addition, the ground electrode of the electronic component 8 is connected to a portion near the transmission line 2a of the same-surface ground conductor layer 2b-A disposed on both sides of the transmission line 2a via a bonding wire 9 or the like. The electrical connection using the bonding wire 9 or the like is preferably performed so that the distance from the electronic component 8 is the shortest in order to minimize the generation of noise.

  Since the recent electronic component 8 is very small and the distance between the electrode of the electronic component 8 and the grounding electrode is short, the bonding wire 9 connected to the grounding electrode of the electronic component 8 is This is performed for a very narrow portion near the signal line 2a of the same-surface ground conductor layer 2b-A.

  Further, as shown in FIG. 4, the relay substrate 2 is preferably formed with a groove portion 3 at a portion between the signal line 2 a on the upper surface and the same grounded conductor layer 2 b -A. The groove 3 is formed by forming a through-hole that becomes the groove 3 in advance in a predetermined part of the ceramic green sheet and laminating the holes, or forming the groove 3 with a carbon dioxide laser after obtaining a sintered body. Apply the method. In FIG. 4, the groove portion 3 shows a state reaching the side surface of the relay substrate 2, but it may be formed in a portion close to the side surface where the groove 2c is formed, and the direction of the signal line 2a is not necessarily required. And the entire length direction of the signal line 2a from the side surface of the relay substrate 2 may not be formed.

  The groove 3 can reduce the volume of the dielectric between the signal line 2a and the same-surface ground conductor layer 2b-A, and can float between the signal line 2a and the same-surface ground conductor layer 2b-A. Since the generation of capacitance can be suppressed, the resonance point is raised, and the pass band of the signal line 2a is further expanded to the high frequency side.

  The mounting base 1b in the electronic component storage package A is made of a metal material having high thermal conductivity such as silicon (Si) or Cu-W alloy, and functions as a support member that supports the relay substrate 2. By appropriately setting the height, it has a function of matching the optical axes of the translucent member 11 and the electronic component 8. Although the mounting base 1b is provided for such a purpose, the mounting base 1b in the electronic component storage package A is not essential and may be omitted.

  Further, for example, a lid 5 made of a metal material such as Fe-Ni-Co alloy or Fe-Ni alloy or a ceramic material such as alumina ceramic is joined to the upper surface of the frame 6 so as to cover the mounting portion 1a. As a result, the electronic component 8 is hermetically sealed together with the relay substrate 2 inside the container including the base body 1, the frame body 6, and the lid body 5. The lid 5 is joined to the upper surface of the frame 6 by, for example, a seam weld method, a welding method such as a YAG laser welding method, or a brazing method using a low melting point brazing material such as Au—Sn alloy solder.

  Thus, as shown in FIG. 5, the electronic component storage package A of the present invention places and fixes the electronic component 8 and the relay substrate 2 on the mounting portion 1a of the base 1 via the mounting base 1b. The signal line 2a on the upper surface of the relay substrate 2 and the same-surface ground conductor layer 2b-A are electrically connected to the respective electrodes of the electronic component 8 through bonding wires 9 and the like, and the central conductor 7c of the coaxial connector 7 is used. Next, the lid body 5 is joined to the upper surface of the frame body 6 so as to cover the mounting portion 1a, and the inside of the container constituted by the base body 1, the frame body 6 and the lid body 5 is Sealing hermetically, and finally welding and attaching the metal holder 12 with the optical isolator 11 and the optical fiber 13 attached to the fixing member 14 attached to the through window 6b of the frame 6; The electronic device B is the final product.

  Note that the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the present invention. For example, the relay substrate 2 may be formed of an insulator such as glass or resin, and it goes without saying that the same effect can be obtained even if these insulators are used. A similar groove 2c is also formed on the side surface of the relay substrate 2 on the side that is joined to the central conductor 7c of the coaxial connector 7 at one end of the line conductor 2a. By connecting the same-surface ground conductor layer 2b-A close to one end side of the line 2a by a connecting means such as a bonding wire, the resonance point is also raised at one end side of the signal line 2a, and the pass band is expanded to the high frequency side. Thus, the electronic component storage package A can be further improved in high frequency characteristics.

It is sectional drawing which shows an example of embodiment of the electronic component storage package of this invention. It is a perspective view of the board | substrate for relay in an example of embodiment of the electronic component storage package of this invention. (A), (b), (c), (d) is the principal part expanded side view of the board | substrate for relay shown in FIG. 2, respectively. It is a perspective view of the board | substrate for relay in the other example of the electronic component storage package of this invention. It is sectional drawing of the electronic device of this invention. (A) is sectional drawing which shows the example of the conventional package for electronic component accommodation, (b) is a principal part expansion perspective view. It is a perspective view of the board | substrate for relay in the other example of embodiment of this invention. It is a perspective view of the board | substrate for relay in the other example of embodiment of this invention. It is a diagram which shows the simulation result of the high frequency transmission in the electronic component storage package of this invention. It is a diagram which shows the simulation result of the high frequency transmission in the conventional package for electronic component accommodation.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Base | substrate 1a ... Mounting part 1b ... Mounting base 2 ... Substrate for relay 2a ... Signal line 2b-A ... Coplanar ground conductor layer 2b-B ...・ Lower surface ground conductor layer 2c ... groove 2c-A ... conductor layer 3 ... groove 5 ... lid body 6 ... frame body 6a ... through hole 7 ... coaxial connector 7a ... Outer conductor 7b: Insulator 7c: Center conductor 8 ... Electronic component 9 ... Bonding wire A ... Electronic component storage package B ... Electronic device

Claims (4)

A base having a mounting portion on which an electronic component that operates at a frequency of 40 GHz or more is mounted on the upper surface, a relay substrate mounted on the mounting portion, and surrounding the mounting portion on the upper surface of the base And a frame having a through-hole formed in the side, a cylindrical outer conductor, and a central conductor installed through an insulator on the central axis of the frame and inserted into the through-hole. A signal line having one end electrically connected to the central conductor of the coaxial connector, and a coplanar ground conductor layer disposed at predetermined intervals on both sides thereof. And an electronic component storage package in which a lower surface ground conductor layer facing the signal line is formed on the lower surface,
The relay substrate has grooves formed on both sides of the signal line on the side surface on the other end side of the signal line from the same-surface ground conductor layer to the lower-surface ground conductor layer, and the same on the inner surface of the groove A conductor layer electrically connecting the surface ground conductor layer and the lower surface ground conductor layer is deposited, and the groove has a lower side of the opening edge on the side of the signal line on the side surface than the upper side of the signal line side. An electronic component storage package characterized by being located in 2. The electronic component storage package according to claim 1, wherein the groove has a quadrangular cross-sectional shape. 3. The electronic component storage package according to claim 1, wherein the relay substrate has a groove formed at a portion between the signal line on the upper surface and the ground conductor layer on the same plane. The electronic component storage package according to any one of claims 1 to 3, and the electronic component mounted on the mounting portion and having an electrode electrically connected to the other end of the signal line An electronic device comprising: a lid attached to the upper surface of the frame so as to cover the mounting portion.

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