JP2015015279A - High frequency device and method for inspecting high frequency device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide: a high frequency device in which a short circuit between a signal line and a ground terminal can be prevented while the signal line and the ground terminal are provided to be adjacent to each other, and capable of accurately bringing a conductor into contact with the signal line and the ground terminal; and a method for inspecting the high frequency device.SOLUTION: A high frequency device includes: a base 12 having a main surface; a dielectric 20 formed on a part of the main surface; a signal line formed on the upper surface of the dielectric; and ground terminal 24, 26 formed to sandwich the signal line on the upper surface of the dielectric and having upper surface portions 24a, 26a. Grooves 28a, 28b or steps 308a, 308b for imparting a height difference between the signal line and the upper surface portions, which are formed between the signal line of the dielectric and the upper surface portions.

Description

  The present invention relates to a high-frequency device used for, for example, microwave or millimeter wave band power amplification, and a method for inspecting the high-frequency device.

  The high-frequency device disclosed in Patent Literature 1 includes a feed-through portion formed on a metal base. The feedthrough portion includes a signal line (wiring conductor) and ground terminals (ground wiring conductors) arranged on the left and right sides of the signal line.

JP2012-243781A

  In the feedthrough portion disclosed in Patent Document 1, since the distance between the signal line and the ground terminal is short, the signal line and the ground terminal may be short-circuited. Further, when the signal line and the ground terminal are formed on the same plane, for example, there is a problem that it is difficult to bring the conductor into contact with each of the signal line and the ground terminal when the high frequency device is inspected.

  The present invention has been made to solve the above-described problems, and prevents a short circuit between the signal line and the ground terminal, and makes a conductor contact with each other accurately. It is an object of the present invention to provide a high-frequency device that can perform the same and a method for inspecting the high-frequency device.

  The high-frequency device according to the present invention includes a base having a main surface, a dielectric formed on a part of the main surface, a signal line formed on the upper surface of the dielectric, and an upper surface of the dielectric. A ground terminal having an upper surface portion formed so as to sandwich the signal line, and a groove or a difference in height between the signal line and the upper surface portion of the dielectric between the signal line and the upper surface portion. It is characterized in that a step for attaching is formed.

  The method for inspecting a high-frequency device according to the invention of the present application includes a dielectric formed on a part of a main surface of a base, a signal line formed on an upper surface of the dielectric, and an upper surface of the dielectric. A high frequency device having a ground terminal having an upper surface portion formed on the upper surface of the dielectric so as to sandwich the signal line through a groove or a step, and a first terminal and the first terminal are formed. A moving step of bringing a test jig having a second terminal closer, a first connecting terminal and a second connecting terminal formed so as to sandwich the first connecting terminal after the moving step, and the groove or A contactor shaped to fit into the step is fitted into the groove or the step, the signal line and the first terminal are connected by the first connection terminal, and the ground terminal and the second terminal are connected by the second connection terminal. A connecting step of connecting and measuring electrical characteristics of the high-frequency device after the connecting step A measuring step that, characterized by comprising a.

  According to the present invention, since the groove or step is formed between the signal line and the ground terminal, it is possible to prevent a short circuit between the signal line and the ground terminal, and to accurately contact the conductor with these.

1 is a plan view of a high frequency device according to Embodiment 1 of the present invention. It is sectional drawing of the high frequency apparatus in the II-II 'broken line of FIG. It is a perspective view of a contactor. It is a perspective view which shows having brought the test jig | tool close to the high frequency apparatus. It is sectional drawing of the feedthrough part which concerns on Embodiment 2 of this invention. It is a perspective view of a contactor. It is a perspective view which shows the inspection method of the high frequency device which concerns on Embodiment 2 of this invention.

  A high-frequency device and an inspection method for a high-frequency device according to an embodiment of the present invention will be described with reference to the drawings. The same or corresponding components are denoted by the same reference numerals, and repeated description may be omitted.

Embodiment 1 FIG.
FIG. 1 is a plan view of a high-frequency device 10 according to Embodiment 1 of the present invention. The high-frequency device 10 includes a metal base 12 having a main surface 12a. A dielectric 20 is formed on a part of the main surface 12a along the outer periphery of the metal base 12. The dielectric 20 is made of, for example, ceramic. A signal line 22 is formed on the upper surface of the dielectric 20. The signal line 22 is made of metal for transmitting a high frequency signal.

  FIG. 2 is a cross-sectional view of the high-frequency device taken along the broken line II-II ′ in FIG. Upper surface portions 24 a and 26 a are formed on the upper surface of the dielectric 20 so as to sandwich the signal line 22. Further, side portions 24 b and 26 b are formed on the side surface of the dielectric 20. The side surface portion 24 b is in contact with the upper surface portion 24 a and the metal base 12. The side surface portion 26 b is in contact with the upper surface portion 26 a and the metal base 12.

  The upper surface portion 24a and the side surface portion 24b are collectively referred to as a ground terminal 24. The upper surface portion 26a and the side surface portion 26b are collectively referred to as a ground terminal 26. The ground terminals 24 and 26 are metals that are grounded by contacting the metal base 12.

  A groove 28a is formed in the dielectric 20 between the signal line 22 and the upper surface portion 24a. A groove 28b is formed in the dielectric 20 between the signal line 22 and the upper surface portion 26a. The grooves 28a and 28b are V-shaped grooves. Accordingly, the ground terminals 24 and 26 sandwich the signal line 22 via the grooves 28 a and 28 b on the upper surface of the dielectric 20.

  Returning to the description of FIG. The dielectric 20, the signal line 22, the ground terminals 24 and 26, and the grooves 28 a and 28 b constitute the first feedthrough portion 30. A feedthrough portion 40 is formed at a position opposite to the feedthrough portion 30 of the metal base 12. The feedthrough part 40 has the same configuration as the feedthrough part 30. One of the feedthrough portions 30 and 40 is an input-side feedthrough portion, and the other is an output-side feedthrough portion.

  Metal frame 50 is formed so as to surround the central portion of main surface 12a. The metal frame 50 is formed so as to straddle the dielectric 20 and the signal line 22. Alternatively, the dielectric 20 and the signal line 22 may be formed so as to penetrate the metal frame 50. Since the signal line 22 is a portion that transmits a high-frequency signal between the inside and the outside of the metal frame 50, the signal line 22 is formed so as not to contact the metal frame 50.

  Prior to the description of the inspection method for the high-frequency device according to Embodiment 1 of the present invention, a contactor used in the inspection method will be described. FIG. 3 is a perspective view of the contactor. The contactor 100 includes a substrate 102 formed of an insulator. A first connection terminal 104 is formed on the substrate 102. Further, second connection terminals 106 and 108 are formed on the substrate 102 so as to sandwich the first connection terminal 104. The first connection terminal 104 and the second connection terminals 106 and 108 are made of metal.

  The substrate 102 includes a convex portion 110a that is linearly formed between the first connection terminal 104 and the second connection terminal 106, and a convex portion that is linearly formed between the first connection terminal 104 and the second connection terminal 108. Part 110b. By having the convex portions 110 a and 110 b, the contactor 100 has a shape that fits into the grooves 28 a and 28 b of the feedthrough portion 30.

  An inspection method for a high-frequency device according to Embodiment 1 of the present invention will be described. First, the high-frequency device 10 and the test jig 200 are brought close to each other. This process is called a movement process. FIG. 4 is a perspective view showing that the test jig 200 is brought close to the high-frequency device 10. The test jig 200 includes first terminals 202 and second terminals 204 and 206 formed so as to sandwich the first terminals 202. A groove 208 a is formed between the first terminal 202 and the second terminal 204 of the test jig 200. Further, a groove 208 b is formed between the first terminal 202 and the second terminal 206 of the test jig 200.

  In the moving process, the high-frequency device 10 and the test jig 200 are brought closer to each other, the distance between the signal line 22 and the first terminal 202, the distance between the ground terminals 24 and 26 and the second terminals 204 and 206, the first connection terminal 104, and The length is shorter than the length of the second connection terminals 106 and 108 in the longitudinal direction. The high-frequency device 10 is covered with a cap 150, and only the feedthrough portion is exposed to the outside.

  After the moving process, the convex portions 110a and 110b of the contactor 100 are fitted into the grooves 28a and 28b of the high-frequency device 10. At the same time, the convex portions 110 a and 110 b are fitted into the grooves 208 a and 208 b of the test jig 200. As a result, the first connection terminal 104 connects the signal line 22 and the first terminal 202. The second connection terminal 106 connects the ground terminal 24 and the second terminal 204. The second connection terminal 108 connects the ground terminal 26 and the second terminal 206. This process is called a connection process.

  In the connection step, the feedthrough portion 40 is connected to the test jig using the contactor in the same manner as the feedthrough portion 30. After the connecting step, the electrical characteristics of the high frequency device are measured. This process is called a measurement process.

  According to the high frequency device 10 according to the first embodiment of the present invention, the groove 28a is formed between the signal line 22 and the ground terminal 24, and the groove 28b is formed between the signal line 22 and the ground terminal 26. It is possible to prevent the signal line 22 and the ground terminals 24 and 26 from being short-circuited.

  Moreover, according to the high frequency apparatus 10 according to the first embodiment of the present invention, the metal base 12 is used as the base, and the side surface portions are in contact with the ground terminals 24 and 26 and the upper surface portions 24a and 26a and the metal base 12. By providing 24b and 26b, the ground terminals 24 and 26 can be grounded with a simple configuration to the ground of the device on which the high-frequency device 10 is mounted.

  When inspecting the high-frequency device 10 according to the first embodiment of the present invention, the convex portions 110 a and 110 b of the contactor 100 are fitted into the grooves 28 a and 28 b of the high-frequency device 10. Therefore, the relative position between the contactor 100 and the high-frequency device 10 is fixed, and the conductor (the first connection terminal 104, the second connection terminal 106, 108) is accurately brought into contact with the signal line 22 and the ground terminals 24, 26. Can do.

  Furthermore, by fitting the convex portions 110a and 110b of the contactor 100 into the grooves 208a and 208b of the test jig 200, the relative positions of the contactor 100 and the test jig 200 can be fixed.

  The grooves 28 a and 28 b of the high frequency device 10 may be reused after the high frequency device 10 is inspected. That is, when the high frequency device 10 is mounted on the circuit board of the module, the mounting position of the high frequency device 10 may be determined using the grooves 28a and 28b of the high frequency device 10. In this case, convex portions that fit into the grooves 28a and 28b are prepared on the circuit board side.

  According to the high frequency device 10 according to the first embodiment of the present invention, since the signal line 22 is sandwiched between the ground terminals 24 and 26, a pseudo waveguide structure (coplanar line shape) can be generated. . Accordingly, by preventing the attenuation of the high frequency signal in the feedthrough portion 30 by the ground terminals 24 and 26 adjacent to the signal line 22, the reflection characteristic and the gain characteristic can be improved.

  Incidentally, the grooves 208a and 208b may not be formed in the test jig 200, and the convex portions of the contactor may be formed shorter than the convex portions 110a and 110b in FIG. Even in this case, as described above, the relative position between the contactor 100 and the high-frequency device 10 can be fixed.

  A lead may be connected to the signal line 22. Further, another lead may be connected to the ground terminals 24 and 26. The presence or absence of the lead may be determined in consideration of the mounting target or mounting method of the high-frequency device. When the lead is connected, it is necessary to change the shape of the contactor according to the shape of the lead.

  Moreover, although the case where the metal base 12 was used as a base of the high frequency apparatus 10 was shown, you may use materials other than a metal as a base material. For example, when the base is formed of an insulator such as ceramic, a metal film is formed on the back surface of the base, and the metal film and the ground terminals 24 and 26 are electrically connected to each other, whereby the high frequency device The ground terminals 24 and 26 may be grounded to the ground of the device on which 10 is mounted.

  These modifications described above can also be applied to the high-frequency device and the inspection method for the high-frequency device according to the second embodiment.

Embodiment 2. FIG.
Since the high-frequency device and the inspection method for the high-frequency device according to the second embodiment of the present invention have much in common with the first embodiment, the differences from the first embodiment will be mainly described. FIG. 5 is a cross-sectional view of the feedthrough portion according to Embodiment 2 of the present invention. FIG. 5 is a cross-sectional view of the feedthrough portion outside the metal frame and corresponds to FIG.

  A step 308a is formed between the signal line 302 and the upper surface portion 304a to make a difference in height between the signal line 302 and the upper surface portion 304a. Further, a step 308b is formed between the signal line 302 and the upper surface portion 306a to make a difference in height between the signal line 302 and the upper surface portion 306a. The steps 308 a and 308 b are formed in the dielectric 300. The upper surface portion 304 a and the side surface portion 304 b constitute the ground terminal 304, and the upper surface portion 306 a and the side surface portion 306 b constitute the ground terminal 306.

  FIG. 6 is a perspective view of the contactor. The contactor 310 includes a substrate 312. A first connection terminal 314 is formed on the substrate 312. Second connection terminals 316 and 318 are formed on the substrate 312 so as to sandwich the first connection terminal 314. The first connection terminal 314 and the second connection terminals 316 and 318 are made of metal.

  A step 320 a is formed between the first connection terminal 314 and the second connection terminal 316. A step 320 b is formed between the first connection terminal 314 and the second connection terminal 318. By having the steps 320 a and 320 b on the substrate 312, the contactor 310 is shaped to fit into the steps 308 a and 308 b of the dielectric 300.

  FIG. 7 is a perspective view showing an inspection method for a high-frequency device according to Embodiment 2 of the present invention. The test jig 400 includes first terminals 402 and second terminals 404 and 406 formed so as to sandwich the first terminal 402 therebetween. A step 408 a is formed between the first terminal 402 and the second terminal 404 of the test jig 400. In addition, a step 408 b is formed between the first terminal 402 and the second terminal 406 of the test jig 400.

  First, a moving process is performed. Next, a connection process is performed. In the connection process, the step 320a, 320b of the contactor 310 is fitted (contacted) with the step 308a, 308b of the high frequency device, the signal line 302 and the first terminal 402 are connected by the first connection terminal 314, and the second connection terminal 316 is connected. 318 connects the ground terminals 304 and 306 to the second terminals 404 and 406. Then, a measurement process is implemented.

  Steps 308 a and 308 b formed between the signal line 302 and the ground terminals 304 and 306 can prevent a short circuit between the signal line 302 and the ground terminals 304 and 306. Further, the feedthrough portion has a convex shape as a whole due to the steps 308a and 308b formed in the dielectric of the high-frequency device. By fitting the contactor 310 having a concave shape by forming the steps 320a and 320b into the feedthrough portion, the relative position between the contactor 310 and the high-frequency device can be fixed. The feedthrough portion may be formed to have a concave shape as a whole, and the contactor may be formed to have a convex shape as a whole.

  The high-frequency device and the inspection method for the high-frequency device described in the first and second embodiments can be variously modified without departing from the gist of the present invention, and should not be interpreted in a limited manner.

10 high frequency device, 12 metal base, 12a main surface, 20 dielectric, 22 signal line, 24,26 ground terminal, 24a, 26a upper surface portion, 24b, 26b side surface portion, 28a, 28b groove, 30,40 feedthrough portion, 50 metal frame, 100 contactor, 102 substrate, 104 first connection terminal,
106,108 Second connection terminal, 110a, 110b Convex part, 200 Test jig, 202 First terminal, 204,206 Second terminal, 208a, 208b Groove, 308a, 308b, 320a, 320b Step difference

Claims (5)

A base having a main surface;
A dielectric formed on a part of the main surface;
A signal line formed on the top surface of the dielectric;
A ground terminal having an upper surface portion formed so as to sandwich the signal line on the upper surface of the dielectric,
A high-frequency device characterized in that a groove or a step difference in height between the signal line and the upper surface portion is formed between the signal line and the upper surface portion of the dielectric. The dielectric is formed along the outer periphery of the base,
The high-frequency device according to claim 1, further comprising a metal frame formed so as to surround a central portion on the main surface. The base is a metal base;
The high-frequency device according to claim 1, wherein the ground terminal has a side surface portion formed on a side surface of the dielectric so as to be in contact with the upper surface portion and the metal base.   The high frequency device according to claim 1, further comprising a lead connected to the signal line. The dielectric is formed on a part of the main surface of the base, the signal line is formed on the top surface of the dielectric, and the signal line is sandwiched through a groove or a step formed on the top surface of the dielectric. A moving step of bringing a high-frequency device having a ground terminal having an upper surface portion formed on the upper surface of the dielectric and a test jig having a first terminal and a second terminal formed so as to sandwich the first terminal therebetween When,
After the moving step, a contactor having a first connection terminal and a second connection terminal formed so as to sandwich the first connection terminal and fitting into the groove or the step is formed as the groove or the step. Connecting the signal line and the first terminal at the first connection terminal and connecting the ground terminal and the second terminal at the second connection terminal;
And a measuring step of measuring electrical characteristics of the high-frequency device after the connecting step.

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