JP2006080257A5 - - Google Patents

Download PDF

Info

Publication number
JP2006080257A5
JP2006080257A5 JP2004261908A JP2004261908A JP2006080257A5 JP 2006080257 A5 JP2006080257 A5 JP 2006080257A5 JP 2004261908 A JP2004261908 A JP 2004261908A JP 2004261908 A JP2004261908 A JP 2004261908A JP 2006080257 A5 JP2006080257 A5 JP 2006080257A5
Authority
JP
Japan
Prior art keywords
forming
organic semiconductor
fine particles
cluster
electronic device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2004261908A
Other languages
English (en)
Japanese (ja)
Other versions
JP4639703B2 (ja
JP2006080257A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2004261908A priority Critical patent/JP4639703B2/ja
Priority claimed from JP2004261908A external-priority patent/JP4639703B2/ja
Publication of JP2006080257A publication Critical patent/JP2006080257A/ja
Publication of JP2006080257A5 publication Critical patent/JP2006080257A5/ja
Application granted granted Critical
Publication of JP4639703B2 publication Critical patent/JP4639703B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2004261908A 2004-09-09 2004-09-09 電子装置の製造方法、並びに、半導体装置の製造方法 Expired - Fee Related JP4639703B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004261908A JP4639703B2 (ja) 2004-09-09 2004-09-09 電子装置の製造方法、並びに、半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004261908A JP4639703B2 (ja) 2004-09-09 2004-09-09 電子装置の製造方法、並びに、半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2006080257A JP2006080257A (ja) 2006-03-23
JP2006080257A5 true JP2006080257A5 (cg-RX-API-DMAC7.html) 2007-08-02
JP4639703B2 JP4639703B2 (ja) 2011-02-23

Family

ID=36159477

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004261908A Expired - Fee Related JP4639703B2 (ja) 2004-09-09 2004-09-09 電子装置の製造方法、並びに、半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JP4639703B2 (cg-RX-API-DMAC7.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8085578B2 (en) 2009-03-13 2011-12-27 Paul Scherrer Institut Method and system for coding and read out of information in a microscopic cluster comprising coupled functional islands

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1498456A4 (en) * 2002-04-22 2009-06-10 Konica Corp ORGANIC SEMICONDUCTOR COMPOSITION, ORGANIC SEMICONDUCTOR ELEMENT AND MANUFACTURING METHOD THEREFOR
JP4635410B2 (ja) * 2002-07-02 2011-02-23 ソニー株式会社 半導体装置及びその製造方法

Similar Documents

Publication Publication Date Title
CN100440534C (zh) 半导体装置及其制造方法
US9741662B2 (en) Semiconductor device and method of manufacturing the same, and power supply apparatus
JP2004103905A (ja) 有機半導体素子
CN101257091B (zh) 半导体装置及其制造方法
CN101071803A (zh) 配线和有机晶体管及其制造方法
CN103137591A (zh) 电子器件及制造电子器件的方法
CN106298730B (zh) 具有电连接至导电结构的金属结构的半导体器件
JP4622424B2 (ja) 絶縁ゲート型電界効果トランジスタの製造方法
JP2006080257A5 (cg-RX-API-DMAC7.html)
JP2005210107A5 (cg-RX-API-DMAC7.html)
JP4834992B2 (ja) 半導体装置の製造方法
US20190346403A1 (en) Bio-sensing device
JP2006108354A5 (cg-RX-API-DMAC7.html)
JP4639703B2 (ja) 電子装置の製造方法、並びに、半導体装置の製造方法
CN100394560C (zh) 适用于氮化镓器件的铝/钛/铝/钛/金欧姆接触系统
TWI377645B (en) Ohmic contact having silver material
CN116234325A (zh) 基于界面增强的有机反双极型晶体管器件及其制备方法
JP4940618B2 (ja) 半導体装置
JPS59500542A (ja) N型GaAs用のオ−ム接触装置
US11990517B2 (en) Electronic device and method of manufacturing the same
JP2025014161A (ja) シャント抵抗、シャント抵抗の製造方法および半導体装置
TW540160B (en) Schottky structure on GaAs semiconductor substrate
JP4967503B2 (ja) 有機薄膜トランジスタ、有機薄膜トランジスタの形成方法
JPH10242166A (ja) 半導体装置
JP2006147909A (ja) 半導体装置及びその製造方法