JP2006080234A5 - - Google Patents

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Publication number
JP2006080234A5
JP2006080234A5 JP2004261474A JP2004261474A JP2006080234A5 JP 2006080234 A5 JP2006080234 A5 JP 2006080234A5 JP 2004261474 A JP2004261474 A JP 2004261474A JP 2004261474 A JP2004261474 A JP 2004261474A JP 2006080234 A5 JP2006080234 A5 JP 2006080234A5
Authority
JP
Japan
Prior art keywords
wiring
layer
semiconductor device
additive
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004261474A
Other languages
English (en)
Japanese (ja)
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JP2006080234A (ja
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Publication date
Application filed filed Critical
Priority to JP2004261474A priority Critical patent/JP2006080234A/ja
Priority claimed from JP2004261474A external-priority patent/JP2006080234A/ja
Publication of JP2006080234A publication Critical patent/JP2006080234A/ja
Publication of JP2006080234A5 publication Critical patent/JP2006080234A5/ja
Pending legal-status Critical Current

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JP2004261474A 2004-09-08 2004-09-08 半導体装置およびその製造方法 Pending JP2006080234A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004261474A JP2006080234A (ja) 2004-09-08 2004-09-08 半導体装置およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004261474A JP2006080234A (ja) 2004-09-08 2004-09-08 半導体装置およびその製造方法

Publications (2)

Publication Number Publication Date
JP2006080234A JP2006080234A (ja) 2006-03-23
JP2006080234A5 true JP2006080234A5 (fr) 2007-10-04

Family

ID=36159457

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004261474A Pending JP2006080234A (ja) 2004-09-08 2004-09-08 半導体装置およびその製造方法

Country Status (1)

Country Link
JP (1) JP2006080234A (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4740083B2 (ja) 2006-10-05 2011-08-03 株式会社東芝 半導体装置、およびその製造方法
US8698697B2 (en) * 2007-06-12 2014-04-15 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US8168532B2 (en) 2007-11-14 2012-05-01 Fujitsu Limited Method of manufacturing a multilayer interconnection structure in a semiconductor device
JP5309722B2 (ja) * 2007-11-14 2013-10-09 富士通セミコンダクター株式会社 半導体装置およびその製造方法
CN102067293B (zh) * 2008-06-18 2013-07-03 富士通株式会社 半导体器件及其制造方法
JP5343417B2 (ja) * 2008-06-25 2013-11-13 富士通セミコンダクター株式会社 半導体装置およびその製造方法
JP5417754B2 (ja) 2008-07-11 2014-02-19 東京エレクトロン株式会社 成膜方法及び処理システム
JP2010087094A (ja) * 2008-09-30 2010-04-15 Nec Electronics Corp 半導体装置及び半導体装置の製造方法
JP5493096B2 (ja) 2009-08-06 2014-05-14 富士通セミコンダクター株式会社 半導体装置の製造方法
KR102121262B1 (ko) * 2017-01-20 2020-06-10 도판 인사츠 가부시키가이샤 표시 장치 및 표시 장치 기판

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