TW200921720A - Spiral inductor - Google Patents
Spiral inductor Download PDFInfo
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- TW200921720A TW200921720A TW096141810A TW96141810A TW200921720A TW 200921720 A TW200921720 A TW 200921720A TW 096141810 A TW096141810 A TW 096141810A TW 96141810 A TW96141810 A TW 96141810A TW 200921720 A TW200921720 A TW 200921720A
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- 239000004020 conductor Substances 0.000 claims description 38
- 239000000758 substrate Substances 0.000 claims description 22
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- 241000238631 Hexapoda Species 0.000 claims 1
- 230000035807 sensation Effects 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- 239000013589 supplement Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 description 80
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 239000011241 protective layer Substances 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 230000001939 inductive effect Effects 0.000 description 4
- 239000002356 single layer Substances 0.000 description 4
- 238000009826 distribution Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 239000004575 stone Substances 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 241000237858 Gastropoda Species 0.000 description 1
- 241000257303 Hymenoptera Species 0.000 description 1
- 101100066898 Mus musculus Flna gene Proteins 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 238000005121 nitriding Methods 0.000 description 1
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- RUDFQVOCFDJEEF-UHFFFAOYSA-N yttrium(III) oxide Inorganic materials [O-2].[O-2].[O-2].[Y+3].[Y+3] RUDFQVOCFDJEEF-UHFFFAOYSA-N 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/5227—Inductive arrangements or effects of, or between, wiring layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F2017/0046—Printed inductances with a conductive path having a bridge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F2017/0086—Printed inductances on semiconductor substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/10—Connecting leads to windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Coils Or Transformers For Communication (AREA)
- Semiconductor Integrated Circuits (AREA)
Abstract
Description
200921720 九、發明說明: 【發明所屬之技術領域】 本發明係有關於一種電感器,特別係關於一種具有多 重導線結構的電感元件。 【先前技術】 如第1圖所示,在一 〇.35-/xm的石夕製程中,一氧化石夕 層3係設置於矽基底1上的P型井層2之上,三個金屬層 Ml、M2、M3係嵌於氧化矽層3中,最上層的金屬層M3 則暴露於氧化石夕層3的上表面,一氮化石夕層4則覆蓋氧化 珍層3與金屬層M3。在三個金屬層Ml、M2、M3中,金 屬層M3的厚度最大,因此其導電率高於其他二者,並具 有最低的導體損失(conductor loss),而適用於低損失的射 頻元件設計。 第2圖係顯示一傳統的三匝式的電感元件5的俯視 圖。電感元件5的最内阻導線部分6具有最南的磁通量’ 因此在最内匝導線部分6所產生的感應渦電流會使此處的 電流密度的分佈非常不均勻。亦即,流動的電流會集中於 最内匝導線部分6的内侧,而明顯地減少了此處供電流流 動的有效截面積,而對電感元件5的性能造成不良影響而 降低其品質因子(quality factor ; Q質)。而且,當電子訊號 的頻率增加時,對電感元件5的品質因子的不良影響就更 加劇烈。200921720 IX. Description of the Invention: [Technical Field] The present invention relates to an inductor, and more particularly to an inductance element having a multi-wire structure. [Prior Art] As shown in Fig. 1, in a 〇.35-/xm process, a layer of oxidized stone layer 3 is placed on the p-type well layer 2 on the ruthenium substrate 1, three metals. The layers M1, M2, and M3 are embedded in the yttrium oxide layer 3, the uppermost metal layer M3 is exposed on the upper surface of the oxidized stone layer 3, and the nitriding layer 4 is covered with the oxidized layer 3 and the metal layer M3. Among the three metal layers M1, M2, and M3, the metal layer M3 has the largest thickness, and thus has higher conductivity than the other two, and has the lowest conductor loss, and is suitable for low loss RF element design. Fig. 2 is a plan view showing a conventional three-turn type inductance element 5. The innermost resistance wire portion 6 of the inductance element 5 has the southmost magnetic flux '. Therefore, the induced eddy current generated at the innermost wire portion 6 causes the current density distribution here to be very uneven. That is, the flowing current concentrates on the inner side of the innermost wire portion 6, and the effective sectional area for current flow therein is remarkably reduced, which adversely affects the performance of the inductance element 5 and lowers its quality factor (quality) Factor ; Q quality). Moreover, when the frequency of the electronic signal is increased, the adverse effect on the quality factor of the inductance element 5 is more severe.
Clienfs Docket No.: VIT07-0070 TT’s Docket No: 0608-A41296-TW-f.doc/fmal/dwwang/2007-l 1-01 200921720 【發明内容】 有鑑於此,業界需要一種技術,可消除或減少電感元 件内部的電流密度分佈不均的情形,而藉此提升電感元件 的性能,提升電感元件的品質因子。 本發明係提供一種螺旋電感元件,包含:一第一螺旋 導線,其為多匝式,其具有一外匝端點部與一内匝端點部; 一第二螺旋導線圍繞於上述第一螺旋導線的最外匝導線部 分的至少一部分的外侧,其具有一第一端點部與一第二端 點部;以及一連接裝置,電性連接於上述内匝端點部與上 述第一端點部之間。 本發明係又提供一種螺旋電感元件,包含:一絕緣層, 設置於一基底上;一第一螺旋導線,其為多匝式,設置於 上述絕緣層内,其具有一外匝端點部與一内匝端點部;一 第二螺旋導線設置於上述絕緣層内、且圍繞於上述第一螺 旋導線的最外匝導線部分的至少一部分的外侧,其具有一 第一端點部與一第二端點部,上述第一螺旋導線與上述第 二螺旋導線是屬於同一導線層;一第一柱狀導體,電性連 接於上述内匝端點部且凸出於上述第一螺旋導線;一第二 柱狀導體,電性連接於上述第一端點部且凸出於上述第二 螺旋導線,且其凸出方向實質上與上述第一柱狀導體的凸 出方向相同;以及一連接線,電性連接於上述第一柱狀導 體與上述第二柱狀導體之間,上述連接線與上述第一螺旋 導線為不同導線層。 【實施方式】Clienfs Docket No.: VIT07-0070 TT's Docket No: 0608-A41296-TW-f.doc/fmal/dwwang/2007-l 1-01 200921720 [Invention] In view of this, the industry needs a technology that can eliminate or reduce The current density distribution inside the inductance element is uneven, thereby improving the performance of the inductance element and improving the quality factor of the inductance element. The present invention provides a spiral inductor component, comprising: a first spiral wire, which is a multi-turn type having an outer end portion and an inner end portion; a second spiral surrounding the first spiral An outer side of at least a portion of the outermost wire portion of the wire having a first end portion and a second end portion; and a connecting device electrically connected to the inner end portion and the first end portion Between the ministries. The invention further provides a spiral inductor component, comprising: an insulating layer disposed on a substrate; a first spiral wire, which is multi-turned, disposed in the insulating layer, having an outer end portion and An inner end portion; a second spiral wire disposed in the insulating layer and surrounding an outer side of at least a portion of the outermost wire portion of the first spiral wire, having a first end portion and a first a second end portion, the first spiral wire and the second spiral wire belong to the same wire layer; a first column conductor is electrically connected to the inner end portion of the inner end and protrudes from the first spiral wire; a second columnar conductor electrically connected to the first end portion and protruding from the second spiral wire, and having a protruding direction substantially the same as a protruding direction of the first columnar conductor; and a connecting line And electrically connected between the first columnar conductor and the second columnar conductor, wherein the connecting line and the first spiral wire are different wire layers. [Embodiment]
Client's Docket No.: VIT07-0070 TT^ Docket No: 0608-A41296-TW-f.doc/flna]/dwwang/2007-ll-01 6 200921720 為讓本發明之上述和其他目的、特徵 顯易懂,下文特舉出較佳實 ;::能更明 細說明如下: i配口所附圖式,作詳 『a述;『「實f上」均勻』、『「實質上」平行 只貝上」等於』、『「實 」十仃』、 述,係指在設計上期望為约勺工/ ……相同』等的敘 但受限於實際势造:^ ^平行、等於、(與).....·相同, 梓所㈣之均勻、平行、等於、(與二=如^或 均勾、平行、等於、(與的:二:視為 =知識者應當瞭解’前述製造規格係依 有不同的變化,故未一一列出。 種條件而 °月參考第3圖,為一俯視圖,争 例之螺旋電减元件。笛L 不本發明較佳實施 旋莫绩Μ 所示的螺旋電感元件包含-蟫 方疋導線κ)、一螺旋導線2() 累 :旋導線1 〇為多e式的螺旋導線,具有一外區端 人一内_點部12 ’其整體可實質上位於相同平面、二 1?=相同平面。外味點部11為最㈣線部分、 n處’内亟端點部12為最内E導線部分14的終止 地’ 5疋3-觀點而言,内端點部12為最内应導 分Η的起始處,外阻端點部! i為最外巫導線部分η的二 止處。在本實施例中’螺旋導線1〇係由外ϋ端點部u 始以順時鐘方向迴旋至内阻端點部12為止,而發明所屬: 術領域中具有通常知識者亦可視其需求變更為逆時針方向Client's Docket No.: VIT07-0070 TT^ Docket No: 0608-A41296-TW-f.doc/flna]/dwwang/2007-ll-01 6 200921720 To make the above and other objects and features of the present invention easy to understand, The following is a better example;:: It can be more clearly explained as follows: i. The drawing of the mouthpiece is described as "a"; "the real f is even" and "substantially parallel" is equal to 』, ""实十仃", 述, refers to the design is expected to be about the work / ... the same 』, etc. is limited by the actual situation: ^ ^ parallel, equal, (and)... ..· identical, 梓 (4) uniform, parallel, equal, (and two = such as ^ or even hook, parallel, equal, (and: two: as = knowledge should understand] 'the aforementioned manufacturing specifications are different The changes are not listed one by one. The conditions and the month refer to Figure 3, which is a top view, the spiral electric reduction component of the case. The flute L is not the preferred embodiment of the present invention. Included - 蟫 疋 疋 κ 、 一 、 、 一 一 一 一 一 : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : The whole may be substantially in the same plane, two 1?=the same plane. The outer taste point portion 11 is the most (four) line portion, and the n end portion end portion 12 is the end point of the innermost E wire portion 14 '5疋3- In view of this, the inner end portion 12 is the start of the innermost guide branch, and the outer end portion! i is the second stop of the outermost wrap wire portion η. In the present embodiment, the 'spiral wire 1' The outer end portion u is rotated clockwise to the end point end portion 12, and the invention belongs to: the general knowledge in the field of art can also be changed to the counterclockwise direction according to the demand.
Clint’s Docket No.: VIT07-0070 Docket No. 0608-A41296-TW-f.doc/final/dwwang/2007-l i_〇iClint’s Docket No.: VIT07-0070 Docket No. 0608-A41296-TW-f.doc/final/dwwang/2007-l i_〇i
Clienfs Docket No.: VIT07-0070 200921720 迴旋。第3圖雖顯示螺旋導線10的匝數為2,但是發明所 屬技術領域中具有通常知識者亦可視其需求增加其匝數, 而且螺旋導線10的匝數可以是整數、亦可以為非整數,可 視需求加以變化。另外,螺旋導線10之外型可為圓型、橢 圓型、矩型、六邊型、八邊型、或多邊型。在第3圖中, 係以矩型作為範例說明。 螺旋導線20圍繞於螺旋導線10的最外匝導線部分13 的至少一部分的外侧、亦可圍繞於螺旋導線10的最外匝導 線部分13的整個外側,其具有一端點部21與一端點部 22,其整體可實質上位於相同平面、亦可以不位於相同平 面。而在螺旋導線10的整體實質上位於相同平面的情況 下,螺旋導線20可實質上與螺旋導線10位於相同平面、 亦可以不位於相同平面。另外,螺旋導線20未伸入螺旋導 線10所圍繞的領域15中、且未接觸螺旋導線10。再者, 由於螺旋導線20是圍繞於螺旋導線10的最外匝導線部分 13,其外型係視所選擇的螺旋導線10之外型而變化。 連接裝置30係電性連接於内匝端點部12與端點部21 之間,且除了内匝端點部12與端點部21之外,連接裝置 30並未接觸螺旋導線10、20的其他部分,例如連接裝置 30可設於螺旋導線10、20的上方、下方、或是其他不會 接觸螺旋導線10、20的其他部分的形式。在本發明較佳實 施例之螺旋電感元件的各種不同的應用例中,連接裝置30 可具有不同的細部組成,可詳見後文對第4〜7圖所作敘述。 而為因應本發明較佳實施例之螺旋電感元件對外連線Clienfs Docket No.: VIT07-0070 200921720 Roundabout. Although the figure 3 shows that the number of turns of the spiral wire 10 is two, those skilled in the art can increase the number of turns according to their needs, and the number of turns of the spiral wire 10 can be an integer or a non-integer. Change as needed. Further, the spiral wire 10 may be of a round shape, an elliptical shape, a rectangular shape, a hexagonal shape, an octagonal shape, or a polygonal type. In Fig. 3, a rectangular shape is taken as an example. The spiral wire 20 surrounds the outer side of at least a portion of the outermost wire portion 13 of the spiral wire 10, and may also surround the entire outer side of the outermost wire portion 13 of the spiral wire 10, having an end portion 21 and an end portion 22 The whole may be located substantially in the same plane or may not be in the same plane. Where the spiral wires 10 are substantially in the same plane, the spiral wires 20 may be substantially in the same plane as the spiral wires 10 or may not be in the same plane. In addition, the spiral wire 20 does not protrude into the field 15 surrounded by the spiral wire 10 and does not contact the spiral wire 10. Furthermore, since the spiral wire 20 is the outermost wire portion 13 surrounding the spiral wire 10, its appearance varies depending on the shape of the selected spiral wire 10. The connecting device 30 is electrically connected between the inner end portion 12 and the end portion 21, and the connecting device 30 does not contact the spiral wires 10, 20 except for the inner end portion 12 and the end portion 21. Other portions, such as attachment device 30, may be provided above, below, or other portions of spiral conductors 10, 20 that do not contact spiral conductors 10, 20. In various different applications of the spiral inductor element of the preferred embodiment of the present invention, the connecting means 30 can have different detail compositions, as will be described later in connection with Figures 4-7. In order to comply with the preferred embodiment of the present invention, the spiral inductor component is externally connected.
Clients Docket No.: VIT07-0070 TT^ Docket No: 0608-A41296-TW-f.doc/fmal/dwwang/2007-ll-01 200921720 的需求,可视情況增設信號輸入/輸出埠41、42。其中信號 輸入/輪出埠41是電性連接於外匝端點部11,且朝遠離螺 旋導線10的方向延伸;而信號輸入/輸出埠42是電性連接 於端點部22,且朝遠離螺旋導線20的方向延伸。信號輸 入/輸出埠41與42的延伸方向可以實質上平行或不平行, 而第3圖所示的情況則為信號輸入/輸出埠41與42實質上 平行。 另外,第3圖所示的螺旋導線20的匝數是不足但接近 於一匝而使信號輸入/輸出埠41、42的排列位置相當接近. 但在另一實施例中’螺旋導線2〇的匝數可以視 ’ — N 疋而 ’ 二、二分之一、或是其他小於1的正數,廿m 如門e π认 筑’亚因而 拉開t就輻入/輸出埠41、42的距離。亦即, 圍植於艘β、音系方疋$線20 固%於螺%導線10的最外匝導線部分13的至少—苦八 外侧、亦可圍繞於螺旋1〇白勺最外 Ρ刀的 個外侧。 彳、展邵分13的整 ϋ 而在實用上,螺旋導線1〇、2〇的材質鱼 較好為實質上均勻,以方便計算、控财發’ ^參數 :螺旋電感元件的電感值與其他性能表現。 之螺%電感元件的較佳尺寸參數亦可應用於本說明奎^ 1文所舉f的應用例、以發明所屬技術領域中具有;常 =識者所能應用的其他應用例中。另外,為了方便說明, ^二未知數來表現一些尺寸上的參數’在實際實施方面, 、言_、未♦數所表示的數值是可由本發明所屬技術領域中 具有通常知識者根據其需求而作適當調整。 CHenrs Docket No.: VIT07-〇〇7〇 ocketNo: 0608-A4i296-TW-f.doc/fmal/dwwang/2007-ll-01 9 200921720 螺才疋導線;[〇、2〇較好麻所 以對一導線層進行圖形化^貝f位於相同平面,例如可 螺旋導線Π)較好為具有實;^螺旋導線10、20。 而求可在某些部位有所變W 度值可漸變為w2,苴中w,㈣鳊點部12的寬 的各相《之間的導。另外,螺旋導線10 的間距值P。在—H t距teh)較好為具有實質上均勾 可螺旋導線10、20的線編:涵部12的寬度值可與 、'复值相同’皆為Wi(未緣示)。 办僧L疋Γ較好為亦具有實質上均勾的線寬,且其線 擇增設錢輸人/輸料41、42的情財,二者可實t 二ΐ同:面、或是位於不同平面。而在較佳的實施例中, 4口就輸入/輸出蜂41、42 "όΓ访? aw # .昔/λ 早1 42可與螺旋導線10、20實質上位於 相同平面,例如可以在形成螺旋導線10、20時,藉由同一 的步驟,而同時形成螺旋導線1G、2G與信號輪入/ :i 41、42。朽號輸入/輸出埠41、42較好為均具有實 質上均勻的線寬,且線寬值更好為均實質上等於螺旋導線 的線寬值Wi。 螺旋導線2 0與螺旋導線1 〇的最外阻導線部分i 3較 ^為實質上為平行’螺旋導線2Q與職導線1G的最外阻 ‘線部分13的導線間距更好為實質上等於螺旋導線1〇的 各相㈣之間的導線間距值P。在選擇增設信號輸入/輪出 埠41、42的情況中,二者的間距可以是等於螺旋導線ι〇 的各相鄰匝之間的導線間距值p、亦可以是大於p的其他Clients Docket No.: VIT07-0070 TT^ Docket No: 0608-A41296-TW-f.doc/fmal/dwwang/2007-ll-01 200921720 The signal input/output ports 41 and 42 can be added as needed. The signal input/wheel exit 41 is electrically connected to the outer end portion 11 and extends away from the spiral wire 10; and the signal input/output port 42 is electrically connected to the end portion 22 and faces away from each other. The direction of the spiral wire 20 extends. The direction in which the signal input/output ports 41 and 42 extend may be substantially parallel or non-parallel, and the case shown in Fig. 3 is substantially parallel to the signal input/output ports 41 and 42. In addition, the number of turns of the spiral wire 20 shown in FIG. 3 is insufficient but close to one turn and the arrangement positions of the signal input/output ports 41, 42 are relatively close. However, in another embodiment, the 'spiral wire 2' The number of turns can be regarded as '- N 疋 and ' two, one-half, or other positive numbers less than one, 廿m such as the door e π recognizes the 'sub, thus pulling away the distance of the radiation / output 埠 41, 42 . That is, it is surrounded by the β, the sound system, and the line 20 is at least the outermost part of the outermost wire portion 13 of the screw % wire 10, and can also surround the outermost file of the spiral 1〇. One outside.彳 展 展 展 分 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 Performance. The preferred size parameter of the snail% inductive component can also be applied to the application example of the present invention, which is exemplified in the technical field of the invention; and other application examples which can be applied by the expert. In addition, for convenience of explanation, ^two unknowns are used to represent some parameters in size. In actual implementation, the numerical values represented by the words _, ♦, and ♦ are made by those having ordinary knowledge in the technical field of the present invention according to their needs. Appropriate adjustments. CHenrs Docket No.: VIT07-〇〇7〇ocketNo: 0608-A4i296-TW-f.doc/fmal/dwwang/2007-ll-01 9 200921720 Screws and wires; [〇, 2〇好麻, so one The wire layer is patterned to be in the same plane, for example, a spiral wire, preferably having a solid wire; However, the W value can be changed to w2 in some parts, w2 in the middle, and w in the middle of the width of each of the 12 points. In addition, the pitch value P of the spiral wire 10 is. Preferably, the line width of the stencil 12 is 20: the width of the culvert 12 can be the same as the width of the culvert 12, and the 'the same value' is Wi (not shown). It is better to have a line width that is substantially hooked, and the line chooses to add money to lose/transfer 41, 42. The two can be the same: face, or located Different planes. In the preferred embodiment, four ports are input/output bees 41, 42 " Suwa? Aw #. 昔/λ early 1 42 may be substantially in the same plane as the spiral wires 10, 20, for example, when forming the spiral wires 10, 20, by the same step, simultaneously forming the spiral wires 1G, 2G and the signal wheel In / : i 41, 42. Preferably, the imaginary input/output ports 41, 42 each have a substantially uniform line width, and the line width values are preferably substantially equal to the line width value Wi of the spiral wire. The outermost resistance wire portion i 3 of the spiral wire 20 and the spiral wire 1 较 is substantially parallel. The wire spacing of the wire portion 2 of the spiral wire 2Q and the wire 1G of the wire 1G is preferably substantially equal to the spiral. The wire spacing value P between the phases (4) of the wire 1 turns. In the case where the additional signal input/rounding 埠41, 42 is selected, the spacing between the two may be equal to the value of the wire spacing p between adjacent turns of the spiral wire ι, or may be other than p.
Clienfs Docket No.: VIT07-0070 TT s Docket No. 〇608-A41296-TW-f.doc/iinal/dwwang/2007-li_〇i 10 200921720 數值。 接下來說明本發明較佳實施例之螺旋電感元件作為晶 片内建電感元件的應用例,其一例示的剖面結構、即是沿 著第3圖的AA’線的剖面結構,係繪示於第4圖。 在第4圖中,一絕緣層110係設置於一基底100上。 在晶片内建電感元件之應用例中,基底100包括一矽基底 或其他習知的半導體基底。另外,基底100中可包含各種 不同的元件,例如電晶體、電阻、及其他習用的半導體元 件。再者,基底100亦可包含其他導電層(例如,銅、鋁、 或其合金)以及絕緣層(例如,氧化梦層、氮化石夕層、或低 介電材料層)。此處為了簡化圖式,上述結構僅以一平整基 底表示之。 絕緣層110通常是具有多層不同介電材料的多層膜, 且其各層是分別對應於嵌入、設置於其内的内連線系統之 各導線層122、123。同樣地,為了簡化圖式,上述結構僅 以單一且平整的絕緣層表示之。 在第4圖中,螺旋導線10、20是屬於同一最上層的導 線層123,由於導線層123的厚度在各導線層中屬最大者, 因此其導電率高於其他的導電層,並具有最低的導體損 失,而適用於低損失的射頻元件設計。而在其他的實施例 中,亦可將螺旋導線10、20設置於其他較低層的導線層例 如導線層122中。 在本實施例中,由於螺旋導線10、20是屬於同一最上 層的導線層123,電性連接於内匝端點部12與端點部21Clienfs Docket No.: VIT07-0070 TT s Docket No. 〇608-A41296-TW-f.doc/iinal/dwwang/2007-li_〇i 10 200921720 Value. Next, an application example of a spiral inductor element according to a preferred embodiment of the present invention as a built-in inductor element of a wafer will be described. An example of a cross-sectional structure, that is, a cross-sectional structure along the line AA' of FIG. 3, is shown in FIG. 4 picture. In FIG. 4, an insulating layer 110 is disposed on a substrate 100. In an application example in which an inductive component is built into a wafer, the substrate 100 includes a germanium substrate or other conventional semiconductor substrate. Additionally, various components such as transistors, resistors, and other conventional semiconductor components can be included in substrate 100. Further, the substrate 100 may also include other conductive layers (e.g., copper, aluminum, or alloys thereof) and an insulating layer (e.g., an oxidized dream layer, a nitride layer, or a layer of low dielectric material). Here, in order to simplify the drawing, the above structure is represented only by a flat base. The insulating layer 110 is typically a multilayer film having a plurality of layers of different dielectric materials, and each of the layers corresponds to each of the wire layers 122, 123 of the interconnect system embedded therein. Similarly, in order to simplify the drawing, the above structure is represented only by a single and flat insulating layer. In Fig. 4, the spiral wires 10, 20 are the same uppermost layer of the wire layer 123. Since the thickness of the wire layer 123 is the largest among the wire layers, the conductivity is higher than that of the other conductive layers, and has the lowest The conductor loss is suitable for low loss RF component design. In other embodiments, the spiral wires 10, 20 may also be disposed in other lower layer conductor layers such as the wire layer 122. In the present embodiment, since the spiral wires 10, 20 are the wire layers 123 belonging to the same uppermost layer, they are electrically connected to the inner end portion 12 and the end portion 21
Client’s Docket No.: VIT07-0070 TT5s DocketNo: 0608-A41296-TW-f.doc/final/dwwang/2007-ll-01 11 200921720 之間的連接裴置30 (請來考笛q, π)、卿方,並具;柱則是設置於螺旋導線 接線料結構。 特3卜_導體32、與連 ,導體31是電性連接物 螺旋導線1G;柱狀導體#電性連接於端點部21Ϊ^ 導線2〇,且其凸出方向實質上與柱狀導體31的: 出方向相同。在本實施例中,柱狀導體3i、U是設置於絕 緣層110内的插塞結構,且分 '' 部21的下方。而連接線33: = : =點部12、端點Client's Docket No.: VIT07-0070 TT5s DocketNo: 0608-A41296-TW-f.doc/final/dwwang/2007-ll-01 11 Connection between 200921720 Set 30 (please come to Kadi q, π), Qing Square, and the column; is placed on the spiral wire wiring material structure. The conductors 31 are connected to each other, and the conductor 31 is an electrical connector spiral wire 1G; the columnar conductor # is electrically connected to the end portion 21 Ϊ ^ wire 2 〇, and its convex direction is substantially the same as the columnar conductor 31 : The same direction. In the present embodiment, the columnar conductors 3i, U are plug structures provided in the insulating layer 110, and are located below the '' portion 21. And the connection line 33: = : = point part 12, the end point
疋牧冰w疋電性連接於柱狀導體3i、U 之間’連接線33與螺旋導線1Q為不同導線層。在本實施 例中,連接線33是位於導線層⑵下方的導線層⑵中, 即是所謂的「下跨線」(underpass);在另一實施例中,亦 可將連接線33設於導線層122的下一層導線層(未緣示) 中,此時導線層122的其他繞線必須避開柱狀導體3ι、^ 預定通過的區域而避免與其電性接觸,而使柱狀導體Μ、 κ,. 32直接向下延伸而電性連接位於導線層122的下一層導電 層中的連接線33 ;在又另一實施例中,連接線%亦可設 置於導線層122以下數層的其他導電層(未繪示)中,此時 螺旋導線10、20與連接線33之間的各導電層的其他繞線 均必須避開柱狀導體31、32預定通過的區域而避免與其電 性接觸’而使柱狀導體31、32直接向下延伸而電性連接連 接線33。 另外,將螺旋導線10、20設置於其他較低層的導線層 的情況中’可將連接線33設置於其下層或上層的其他導電The 疋 冰 ice w疋 is electrically connected between the columnar conductors 3i and U. The connecting line 33 and the spiral wire 1Q are different wire layers. In this embodiment, the connecting line 33 is located in the wire layer (2) below the wire layer (2), that is, the so-called "underpass"; in another embodiment, the connecting line 33 may also be placed on the wire. In the next layer of the conductor layer of the layer 122 (not shown), at this time, the other windings of the layer of the conductor layer 122 must avoid the area through which the columnar conductors 3, ^ are intended to pass, thereby avoiding electrical contact with the columnar conductor, κ,. 32 extends directly downward to electrically connect the connection line 33 in the next conductive layer of the wire layer 122; in still another embodiment, the connection line % may also be disposed on the number of layers below the wire layer 122. In the conductive layer (not shown), at this time, other windings of the conductive layers between the spiral wires 10, 20 and the connecting wires 33 must avoid the area through which the columnar conductors 31, 32 are intended to pass to avoid electrical contact therewith. The columnar conductors 31, 32 are directly extended downward to electrically connect the connecting wires 33. In addition, in the case where the spiral wires 10, 20 are disposed in the wiring layers of other lower layers, the other conductive wires may be disposed on the lower layer or the upper layer of the connection wires 33.
Client’s Docket No.: VIT07-0070 TT^s Docket No: 0608-A41296-TW-f.doc/final/dwwang/2007-ll-0i 12 200921720 層中,藉由類似柱狀導體31、32的插塞結構,完成内匝端 點部12與端點部21之間的電性連接。 還有,在選擇增設信號輸入/輸出埠4卜42的情況中, 雖然第4圖並未繪示,信號輸入/輸出埠41、42亦可以設 置於與螺旋導線10、20相同的導線層123中,而直接電性 連接外匝端點部11、端點部22 (請參考第3圖);在另一實 施例中,信號輸入/輸出埠41、42亦可以設置於與螺旋導 線10、20不同的導線層中,而藉由類似柱狀導體31、32 的結構而電性連接外匝端點部11、端點部22 (請參考第3 圖)。 第4圖所示的結構為本發明較佳實施例之螺旋電感元 件作為晶片内建電感元件的應用例的一例示的剖面結構, 然而亦適用於其他具有多層線路結構的裝置例如作為封裝 基板或電子裝置母板的印刷電路板、或作為封裝基板的多 層線路的導線架。此時,基底100就可以是上述裝置的核 心基板,而設於絕緣層110上的保護層130則可作為防銲 層。 站在螺旋電感元件的觀點,連接裝置30為一重要的元 件,藉由連接裝置30而能夠串接螺旋導線10、20而成為 完整的螺旋電感元件。而在其他應用例中,可以僅將螺旋 導線10、20形成於一内連線系統中,連接裝置30則不一 定需要形成於此一内連線系統中,而藉由使上述内連線系 統與一外部裝置的連接,而電性連接螺旋導線10、20,完 成本發明較佳實施例之螺旋電感元件。Client's Docket No.: VIT07-0070 TT^s Docket No: 0608-A41296-TW-f.doc/final/dwwang/2007-ll-0i 12 200921720 In the layer, by plugs similar to the columnar conductors 31, 32 The structure completes the electrical connection between the inner end portion 12 and the end portion 21. Further, in the case where the additional signal input/output port 42 is selected, although not shown in FIG. 4, the signal input/output ports 41, 42 may be disposed on the same wire layer 123 as the spiral wires 10, 20. And directly electrically connecting the outer end portion 11 and the end portion 22 (refer to FIG. 3); in another embodiment, the signal input/output ports 41, 42 may also be disposed on the spiral wire 10, Among the 20 different wire layers, the outer end portion 11 and the end portion 22 are electrically connected by a structure similar to the columnar conductors 31, 32 (refer to Fig. 3). The structure shown in FIG. 4 is a cross-sectional structure of an example of application of the spiral inductor element of the preferred embodiment of the present invention as a built-in inductor element of a wafer, but is also applicable to other devices having a multilayer wiring structure, for example, as a package substrate or A printed circuit board of an electronic device motherboard, or a lead frame of a multilayer circuit as a package substrate. At this time, the substrate 100 may be the core substrate of the above device, and the protective layer 130 provided on the insulating layer 110 may serve as a solder resist layer. From the standpoint of the spiral inductor element, the connecting device 30 is an important component, and the spiral wires 10, 20 can be connected in series by the connecting device 30 to become a complete spiral inductor element. In other applications, only the spiral wires 10, 20 may be formed in an interconnecting system, and the connecting device 30 does not necessarily need to be formed in the interconnecting system, and the interconnecting system is The spiral inductors 10, 20 are electrically connected to an external device to complete the spiral inductor component of the preferred embodiment of the present invention.
Client’s Docket No.: VIT07-0070 XT's Docket No: 0608-A41296-TW-f.doc/flnal/dwwang/2007-ll-01 13 200921720 例如在第4圖所示的晶片内建電 _ 内建電感元件、或導線架内建電感元;^件。、印刷電路板 10的内匝端點部12與螺旋導線2〇 ’可使螺旋導線 點部 0 1 性連接不經由其下層導電層,而是葬 之間的電 10、20上方的外部裝置來達成。如此^來連接於螺旋導線 佳實施例之螺旋電感元件不止可適用於2 可使本發明較 統元件的裝置’亦可適用於僅具單層内P ^多層内連線系 例如作為封裝基板的單層佈線的印刷電連線系統的裝置, 架等。上述内連線系統的一例示結構的气反或單層的導線 5圖,其俯視圖亦可為第3圖所顯示去圖係繪示於第 ,亦艮卩,楚^ — 為沿著第3圖之剖面線ΑΑ,之剖面圖。 昂5圖亦 第5圖中所示的螺旋導線1〇盥2〇 -、α、内匝端 端點部21、基底1 〇〇、絕緣層^ 1 〇及其 、 .a ' 衣面ll〇a、導綠 層123、與保護層130等元件,係斑第4 p! _ 、、 诉興乐4圖所不的同樣元Client's Docket No.: VIT07-0070 XT's Docket No: 0608-A41296-TW-f.doc/flnal/dwwang/2007-ll-01 13 200921720 For example, the built-in inductive component is built into the wafer shown in Figure 4. Or the built-in inductor element of the lead frame; The inner end portion 12 of the printed circuit board 10 and the spiral wire 2' can connect the spiral wire point portion to the lower conductive layer, but the external device above the electricity 10, 20 Achieved. Therefore, the spiral inductor element of the preferred embodiment can be applied to not only the device of the present invention, but also the device of the present invention can be applied to a single layer of P ^ multilayer interconnection system, for example, as a package substrate. A device for mounting a printed wiring system of a single layer wiring, a shelf, and the like. An example of a gas-reverse or single-layer wire 5 of the structure of the above-mentioned interconnecting system, the top view of which can also be shown in FIG. 3 is shown in the figure, and also, along the third The section line of the figure is a cross-sectional view. The ang 5 diagram also shows the spiral wire 1〇盥2〇-, α, the end portion 21 of the inner end, the base 1 〇〇, the insulating layer ^ 1 〇 and the .a ' 衣 〇 第a, the green layer 123, and the protective layer 130 and other components, the same element of the 4th p! _, and the v. Xingle 4
件付號所代表的元件為相同或等效元件,故在此省略其敘 述。而在另一實施例中,上述内連線系統可僅具有單層的 導線層123;或可在導電層123下增設一或數層的導線層。 在第5圖中,螺旋導線1〇、2〇的上表面曝露於絕緣層 11〇的上表面110a中,可在保護層130形成開口 131、132, 而分別曝露端點部21與内匝端點部12,以便製作銲墊34、 35分別電性連接端點部21與内匝端點部12。此時較好為 經由適當的佈局,使端點部21與内匝端點部12位於適於 形成銲墊34、35的位置。完成銲墊34、35的製作後,可 視需求再形成一保護層140於保護層130及銲墊34、35The components represented by the parts are the same or equivalent elements, and the description thereof is omitted here. In another embodiment, the interconnect system may have only a single layer of the conductive layer 123; or one or more layers of the conductive layer may be added under the conductive layer 123. In Fig. 5, the upper surfaces of the spiral wires 1〇, 2〇 are exposed in the upper surface 110a of the insulating layer 11〇, and the openings 131 and 132 may be formed in the protective layer 130 to expose the end portions 21 and the inner ends, respectively. The dot portion 12 is formed so that the solder pads 34, 35 are electrically connected to the end portion 21 and the inner end portion 12, respectively. At this time, it is preferable that the end portion 21 and the inner end portion 12 are located at positions suitable for forming the pads 34, 35 via an appropriate layout. After the fabrication of the pads 34, 35 is completed, a protective layer 140 may be formed on the protective layer 130 and the pads 34, 35 as needed.
Clients Docket No.: VIT07-0070 TT s Docket No: 0608-A41296-TW-f.doc/flnal/dwwang/2007-ll-01 14 200921720 上’再形成開口⑷、142而分別曝露鲜 以下說明在螺旋導線10的 5。 2〇的端點部21之《成紐她與螺旋導線 例如在第6目巾’可以使料線接合 銲線36而電性連接於銲墊%、乃 打,形成一 10的内匝端點邱D叙碑#措ώ 3 ’而完成螺旋導線 以心 疋導線20的端點部 性連接。此時,薛墊34、35可作為柱 之:的電 則作為連接線’而構成第3圖所示的連接裝置3〇而。杯線36 在另—例示的應用例中,如第7 部裝置5G,其具有連接端點53、M ^ 提供一外 點53與54之間的連接線37。外部 ;J接於連接端 路板、封I基板、半導體晶片、被動、元件、^是印刷電 線路的裝置,視第5圖所示的内連線b二^他具内部 例如半導體晶片、印刷電路板、導線、何種裝置 + 年深木或其他裝置而定。 接下來藉由導電凸塊51電性連接於料3 點”之間,並藉由導電凸塊52電性連接於銲…= 端點54之間,而完成螺旋導線1〇的内阻端點部㈣螺旋 導線20的端點部21之間的電性連接。此時,銲墊μ、% 可作為柱狀導體,而導電凸塊51、連接端點〜連接線 37、連接端點54、與導電凸塊52的組合則作為連接線, 而構成第3圖所示的連接裝置30。 _在另一應用例中,可以類似銲線36的銲線結構來取代 第7圖所示的導電凸塊51、52,此時外部裝 〇就可能 不會在螺旋導線10、20的上方,而可能在基底1〇〇的下方Clients Docket No.: VIT07-0070 TT s Docket No: 0608-A41296-TW-f.doc/flnal/dwwang/2007-ll-01 14 200921720 Upper 'reform openings (4), 142 and respectively exposed freshly below in the spiral 5 of the wire 10. The end point portion 21 of the 2" can be used to make the wire bond wire 36 and electrically connect to the pad %, to form a 10 inner end point. Qiu D Xuanbei #措ώ 3' and complete the spiral wire with the end point of the palpebral wire 20. At this time, the electric pads 34 and 35 can be used as the connecting wires ′ to form the connecting device 3 shown in Fig. 3 . The cup line 36 is in another exemplary embodiment, such as the seventh device 5G, having a connection end point 53, M^ providing a connection line 37 between the outer points 53 and 54. External; J is connected to the connection board, the I substrate, the semiconductor wafer, the passive, the component, and the device is a printed circuit. The interconnection shown in Fig. 5 is internal to the semiconductor chip, for example. Board, wire, device + year deep wood or other device. Next, the conductive bumps 51 are electrically connected between the three points of the material, and the conductive bumps 52 are electrically connected between the solder terminals = the end points 54 to complete the internal resistance end points of the spiral wires 1〇. (4) Electrical connection between the end portions 21 of the spiral wires 20. At this time, the pads μ, % can serve as columnar conductors, and the conductive bumps 51, the connection terminals - the connection lines 37, the connection terminals 54, The combination with the conductive bumps 52 serves as a connecting line to constitute the connecting device 30 shown in Fig. 3. In another application example, the wire bonding structure similar to the bonding wire 36 can be used instead of the conductive wire shown in Fig. 7. The bumps 51, 52, at this time, the external mounting may not be above the spiral wires 10, 20, but may be below the substrate 1
Client’s Docket No.: VIT07-0070 TT5s Docket No: 0608-A41296-TW-f.doc/flnal/dwwang/2007-l i_〇j 15 200921720 或旁邊。 本發明較佳實施例之螺旋電感元件的一項特徵,是以 螺旋導線20來取代傳統螺旋電感元件的最内匝導線,而可 以在總匝數不變的情形下,改善消除或減少電感元件内部 的電流密度分佈不均的情形,而藉此提升電感元件的性 能,提升電感元件的品質因子(Q值)。 本發明的實施例具有數項優點。其一,本發明較佳實 施例之螺旋電感元件的製造,適用於或相容於標準的矽製 程。另外,已藉由對照實驗證明,本發明較佳實施例之螺 旋電感元件的品質因子(Q值)係高於傳統螺旋電感元件的 品質因子(Q值)。另外,本發明較佳實施例之螺旋電感元 件的製造,不需要特殊的製造條件。還有,藉由本發明較 佳實施例之螺旋電感元件的實施,可以確保射頻裝置系統 的品質,並可降低製造成本。 雖然本發明已以較佳實施例揭露如上,然其並非用以 限定本發明,任何本發明所屬技術領域中具有通常知識 者,在不脫離本發明之精神和範圍内,當可作些許之更動 與潤飾,因此本發明之保護範圍當視後附之申請專利範圍 所界定者為準。 【圖式簡單說明】 第1圖為一剖面圖,係顯示習知的矽製程之半導體裝 置的結構。 第2圖為一俯視圖,係顯示傳統的三匝式的電感元件。 第3圖為一俯視圖,係顯示本發明較佳實施例之螺旋Client’s Docket No.: VIT07-0070 TT5s Docket No: 0608-A41296-TW-f.doc/flnal/dwwang/2007-l i_〇j 15 200921720 or next. A feature of the spiral inductor component of the preferred embodiment of the present invention is that the spiral conductor 20 replaces the innermost turns of the conventional spiral inductor component, and the inductor component can be eliminated or reduced with the total number of turns unchanged. The internal current density distribution is uneven, thereby improving the performance of the inductance element and improving the quality factor (Q value) of the inductance element. Embodiments of the invention have several advantages. First, the manufacture of the spiral inductor component of the preferred embodiment of the present invention is suitable or compatible with standard tantalum processes. Further, it has been confirmed by comparative experiments that the quality factor (Q value) of the spiral inductance element of the preferred embodiment of the present invention is higher than that of the conventional spiral inductance element (Q value). Further, the manufacture of the spiral inductor element of the preferred embodiment of the present invention does not require special manufacturing conditions. Further, with the implementation of the spiral inductor element of the preferred embodiment of the present invention, the quality of the radio frequency device system can be ensured, and the manufacturing cost can be reduced. Although the present invention has been disclosed in the above preferred embodiments, the present invention is not intended to limit the invention, and it is possible to make a few changes without departing from the spirit and scope of the invention. And the scope of the present invention is defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view showing the structure of a conventional semiconductor device of a tantalum process. Figure 2 is a top view showing a conventional three-turn inductor component. Figure 3 is a plan view showing a spiral of a preferred embodiment of the present invention.
Clienfs Docket No.: VIT07-0070 TT^ Docket No: 0608-A41296-TW-f.doc/fmal/dwwang/2007-ll-01 16 200921720 電感元件。 第4圖為一剖面圖,係顯示本發明較佳實施例之螺旋 電感元件的一應用例。 第5圖為一剖面圖,係顯示本發明較佳實施例之螺旋 電感元件的另一應用例。 第6圖為一剖面圖,係顯示第5圖所示的應用例的一 變化形式。 第7圖為一剖面圖,係顯示第5圖所示的應用例的另 一變化形式。 【主要元件符號說明】 Ml〜金屬層 M2〜金屬層 M3〜金屬層 1〜碎基底 2〜P型井層 3〜氧化矽層 4〜氮化矽層 5〜電感元件 6〜最内匝導線部分 10〜螺旋導線 11〜外匝端點部 12〜内阻端點部 13〜最外匝導線部分 14〜最内匝導線部分 15〜領域 20〜螺旋導線 21〜端點部 22〜端點部 30〜連接裝置 31〜柱狀導體 32〜柱狀導體 3 3〜連接線 3 4〜鲜塾 3 5〜銲墊 3 6〜鲜線 3 7〜連接線 41〜信號輸入/輸出埠 Client's Docket No.: VIT07-0070 42〜信號輸入/輸出埠 TT's Docket No: 0608-A41296-TW-f.doc/fmal/dwwang/2007-ll-01 200921720 50〜外部裝置 51〜導電凸塊 52〜導電凸塊 53〜連接端點 54〜連接端點 100〜基底 110〜絕緣層 110a〜上表面 122〜導線層 123〜導線層 130〜保護層 131〜開口 132〜開口 140〜保護層 141〜開口 142〜開口Clienfs Docket No.: VIT07-0070 TT^ Docket No: 0608-A41296-TW-f.doc/fmal/dwwang/2007-ll-01 16 200921720 Inductive components. Fig. 4 is a cross-sectional view showing an application example of the spiral inductor element of the preferred embodiment of the present invention. Fig. 5 is a cross-sectional view showing another application example of the spiral inductance element of the preferred embodiment of the present invention. Fig. 6 is a cross-sectional view showing a variation of the application example shown in Fig. 5. Fig. 7 is a cross-sectional view showing another variation of the application example shown in Fig. 5. [Description of main component symbols] M1 to metal layer M2 to metal layer M3 to metal layer 1 to broken substrate 2 to P type well layer 3 to yttria layer 4 to tantalum nitride layer 5 to inductance element 6 to innermost wire portion 10 to spiral wire 11 to outer end portion 12 to inner end portion 13 to outermost wire portion 14 to innermost wire portion 15 to field 20 to spiral wire 21 to end portion 22 to end portion 30 〜 Connection device 31 to columnar conductor 32 to columnar conductor 3 3 to connection line 3 4 to fresh 塾 3 5 to pad 3 6 to fresh line 3 7 to connection line 41 to signal input/output 埠 Client's Docket No.: VIT07-0070 42~Signal input/output 埠TT's Docket No: 0608-A41296-TW-f.doc/fmal/dwwang/2007-ll-01 200921720 50~External device 51~ Conductive bump 52~ Conductive bump 53~ Connection terminal 54 to connection terminal 100 to substrate 110 to insulating layer 110a to upper surface 122 to wiring layer 123 to wiring layer 130 to protective layer 131 to opening 132 to opening 140 to protective layer 141 to opening 142 to opening
Client's Docket No.: VIT07-0070 TT5s DockeiNo: 0608-A41296-TW-f.doc/final/dwwang/2007-ll-01 18Client's Docket No.: VIT07-0070 TT5s DockeiNo: 0608-A41296-TW-f.doc/final/dwwang/2007-ll-01 18
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Also Published As
Publication number | Publication date |
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US8081056B2 (en) | 2011-12-20 |
US20090115562A1 (en) | 2009-05-07 |
TWI397930B (en) | 2013-06-01 |
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