CN103578708B - Magnetic module, power inductor and its manufacture method for power inductor - Google Patents
Magnetic module, power inductor and its manufacture method for power inductor Download PDFInfo
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- CN103578708B CN103578708B CN201310104695.3A CN201310104695A CN103578708B CN 103578708 B CN103578708 B CN 103578708B CN 201310104695 A CN201310104695 A CN 201310104695A CN 103578708 B CN103578708 B CN 103578708B
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- 238000000034 method Methods 0.000 title claims description 22
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 239000000758 substrate Substances 0.000 claims description 57
- 239000000696 magnetic material Substances 0.000 claims description 9
- 239000011810 insulating material Substances 0.000 claims description 8
- 230000004888 barrier function Effects 0.000 claims description 6
- 239000011159 matrix material Substances 0.000 claims description 3
- 230000035699 permeability Effects 0.000 claims description 3
- 239000011435 rock Substances 0.000 claims 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 16
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 12
- 229910052751 metal Inorganic materials 0.000 description 12
- 239000002184 metal Substances 0.000 description 12
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 12
- 239000002002 slurry Substances 0.000 description 12
- 239000000463 material Substances 0.000 description 10
- 229910000859 α-Fe Inorganic materials 0.000 description 9
- 239000010949 copper Substances 0.000 description 8
- 239000010931 gold Substances 0.000 description 7
- 230000004907 flux Effects 0.000 description 6
- 229910052759 nickel Inorganic materials 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 230000007850 degeneration Effects 0.000 description 4
- 229910052763 palladium Inorganic materials 0.000 description 4
- 229910052697 platinum Inorganic materials 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- RKTYLMNFRDHKIL-UHFFFAOYSA-N copper;5,10,15,20-tetraphenylporphyrin-22,24-diide Chemical group [Cu+2].C1=CC(C(=C2C=CC([N-]2)=C(C=2C=CC=CC=2)C=2C=CC(N=2)=C(C=2C=CC=CC=2)C2=CC=C3[N-]2)C=2C=CC=CC=2)=NC1=C3C1=CC=CC=C1 RKTYLMNFRDHKIL-UHFFFAOYSA-N 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000006247 magnetic powder Substances 0.000 description 1
- 230000005415 magnetization Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229920000307 polymer substrate Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F10/00—Thin magnetic films, e.g. of one-domain structure
- H01F10/08—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F5/00—Coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
- H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
Abstract
The invention provides a kind of power inductor, the power inductor includes：Main body；And the first external electrode and the second external electrode, the first external electrode and the second external electrode are formed in two ends of the main body, wherein, the main body includes：Upper caldding layer and lower caldding layer；At least one coil support layer, the coil support layer has the central through hole formed in the coil support layer, in two side surfaces of the coil support layer formed with least one first concave part and at each angle of the coil support layer formed with multiple second concave parts, the coil support layer is between the upper caldding layer and the lower caldding layer；First Line ring layer and the second coil layer, the First Line ring layer and second coil layer are formed on two surfaces of the coil support layer and the First Line ring layer and second coil layer respectively there is one end to be connected to the first external electrode and the second external electrode.
Description
This application claims on 07 18th, the 2012 korean patent application No.10- in Korean Intellectual Property Office's application
2012-0078421 priority, during this application disclosure is incorporated herein by reference at this.
Technical field
The application is related to a kind of magnetic module, power inductor and its manufacture method for power inductor.
Background technology
Inductor and the critical passive element that resistor and capacitor are composition electronic circuits.Inductor is used for element
In with reduce noise or formed LC resonance circuits.Inductor can be categorized as coiled pipe type inductor, laminated-type inductor with
And film-type inductor etc..
Coiled pipe type inductor can be by forming around ferrite core wound coil.
Coiled pipe type inductor can have stray capacitance (stray capacitance) between coil and therefore
Increase coil the number of turn to obtain higher inductance in the case of, the degeneration of high frequency characteristics may be caused.
Laminated-type inductor can be formed by being laminated multiple ferrite sheets.
In laminated-type inductor, the metal pattern of coiled type is formed on each ferrite sheet, and coiled type metal figure
Case can be continuously connected by multiple conductive through holes (conductive via) being arranged in ferrite sheet.
Compared with coiled pipe type inductor, laminated-type inductor is suitable for producing in enormous quantities and with excellent high frequency spy
Property.
However, in laminated-type inductor, metal pattern is by with low magnetic saturation value (saturation
Magnetization value) material formed, and when laminated-type inductor is fabricated to miniaturization, metal pattern layer
The limited amount of pressure, cause DC superposition characteristic to reduce and sufficient electric current can not be obtained.
Film-type inductor can use the material with high magnetic saturation value, and compared with laminated-type inductor, even if
In the case where film-type inductor is fabricated to miniaturization, the internal circuit pattern of film-type inductor can be readily formed.
Therefore, recently, the research on film-type inductor is energetically being carried out.
When film-type inductor is fabricated to larger, the thickness of coil is thicker, it is thus eliminated that because series resistance increases
Caused by product performance degeneration.
However, when film-type inductor is fabricated to miniaturization, the increase of the width or thickness of the line of coil is limited
System, so that series resistance increases to cause product performance to be degenerated.
Relevant technical literature 1 be not disclosed in substrate two surfaces be respectively formed on it is fluted to reduce series resistance and keep
With the structure of certain inductance value.
[relevant technical literature 1]
(patent document 1) Korean Patent Publication No.2006-0061709
The content of the invention
One aspect of the present invention provides a kind of feelings that can be reduced series resistance and be minimized even in power inductor
It still is able to keep the power inductor of the inductance coefficent of certain level under condition.
A kind of power inductor is provided according to an aspect of the present invention, and the power inductor includes：Main body；And first
External electrode and the second external electrode, the first external electrode and the second external electrode are formed in two ends of the main body, its
In, the main body includes：Upper caldding layer and lower caldding layer；At least one coil support layer, the coil support layer, which has, to be formed
The central through hole of the coil support layer, in two side surfaces of the coil support layer formed with least one first concave part
And it is located at the upper covering formed with multiple second concave parts, the coil support layer at each angle of the coil support layer
Between layer and the lower caldding layer；First Line ring layer and the second coil layer, the First Line ring layer and the second coil layer shape
Into on two surfaces of the coil support layer and the First Line ring layer and second coil layer have one end respectively
It is connected to the first external electrode and the second external electrode.
The permeability of the coil support layer can be 80% or smaller.
The area ratio of all second concave parts in the through hole and the coil support layer can be 0.60 or
Person is bigger.
First concave part of the coil support layer can be formed as along the length direction of the coil support layer
Elongated groove.
First concave part of the coil support layer can be including the length direction along the coil support layer each other
Multiple concave parts spaced apart.
First concave part of the coil support layer can be formed as with it is described the second of the coil support layer recessed
Groove portion is connected.
The coil support layer can be the substrate formed by insulating materials or magnetic material.
Insulating barrier is could be formed with around the First Line ring layer and second coil layer.
According to another aspect of the present invention, there is provided a kind of magnetic module for power inductor, the magnetic module bag
Main body is included, the main body connects in the matrix form, wherein, each described main body includes：Upper caldding layer and lower caldding layer；At least
One coil support layer, formed with center through hole in the coil support layer, formed in two side surfaces of the coil support layer
There is at least one first concave part and at each angle of the coil support layer formed with multiple second concave parts, the coil
Supporting layer is between the upper caldding layer and the lower caldding layer；And First Line ring layer and the second coil layer, described first
Coil layer and second coil layer are formed on two surfaces of the coil support layer and the First Line ring layer and institute
State the second coil layer has one end exposed to the external world respectively.
According to another aspect of the present invention, there is provided a kind of method for manufacturing power inductor, this method include：Prepare base
Piece, the substrate is formed by insulating materials or magnetic material and has through hole in the center of the substrate, the two of the substrate
Individual side surface is formed with least one first concave part, and at each angle of the substrate formed with multiple second concave parts；
First Line ring layer and the second coil layer are formed on two surfaces of the substrate；Will thereon formed with the First Line ring layer and
The substrate of second coil layer is arranged on lower caldding layer；Main body is formed by forming upper caldding layer on the substrate；
And the first external electrode and the second external electrode are formed in two ends of the main body, to cause the first external electrode and described
What the second external electrode was connected to the First Line ring layer and second coil layer leads to the first external electrode and described
The part of two external electrodes.
Before the substrate is set, it can use insulating materials covering thereon formed with the First Line ring layer and described
Around the substrate of second coil layer.
The setting of the substrate can include multiple substrates being laminated on the lower caldding layer.
When preparing the substrate, first concave part can be made to be formed as the length direction along the coil support layer
Elongated groove.
When preparing the substrate, two side surfaces of the substrate can be removed to only leaving one of the substrate
Divide to form multiple first concave parts separated from one another.
When preparing the substrate, first concave part can be made to be formed as connecting with second concave part.
Brief description of the drawings
By detailed description below in conjunction with the accompanying drawings, be able to will be more clearly understood the present invention above and other aspect,
Feature and other advantages.
Fig. 1 is the stereogram of inductor according to the embodiment of the present invention；
Fig. 2 is the sectional view intercepted along the A-A ' lines in Fig. 1；
Fig. 3 is the sectional view intercepted along the B-B ' lines in Fig. 1；
Fig. 4 A to Fig. 4 F are the plans of the substrate of the inductor for the embodiment for showing the various modifications according to the present invention；
Fig. 5 is the structure for showing the magnetic module for the power inductor according to another embodiment of the invention
Section plan；
Fig. 6 is the section plan for only showing the substrate in the structure in Fig. 5；And
Fig. 7 is shown to inductor according to the embodiment of the present invention and according to the electricity between the inductor of correlation technique
The curve map that sense coefficient and series resistance are compared.
Embodiment
Embodiments of the present invention are described in detail next, with reference to accompanying drawing.But the present invention can be by a variety of different
Form is realized, and should not be construed as being limited to embodiment presented herein.Conversely, there is provided these embodiments are intended to make
It is comprehensively complete to obtain the disclosure, and the scope of the present invention is fully passed on to those skilled in the art.In the accompanying drawings,
The shape and size of element are may be exaggerated for purposes of clarity, and identical reference mark is used in whole accompanying drawings
Show same or analogous element.
Referring to Fig. 1 to Fig. 3, inductor 1 according to the embodiment of the present invention includes main body 10 and formed in main body 10
Two ends the first external electrode 21 and the second external electrode 22.
In the following description, according to the direction in Fig. 1, it is " length direction " to define " L directions ", defines " W directions " and is
" width " and to define " T directions " be " thickness direction ".
Main body 10 can have rectangular shape and including：Upper caldding layer 11 and lower caldding layer 12, the upper caldding layer 11
Formed with lower caldding layer 12 by magnetic material；Coil support layer 30, the coil support layer 30 are located at upper caldding layer 11 and lower covering
Between layer 12；And the coil layer 42 of First Line ring layer 41 and second, the coil layer 42 of First Line ring layer 41 and second are formed online
Enclose on two surfaces of supporting layer 30, and have an end electric with the first external electrode 21 and the second external electrode 22 respectively respectively
Connection.
Upper caldding layer 11 and lower caldding layer 12 can be formed as by answering including ferrite/metallic magnetic powder and polymer
Substrate made of the slurry of compound or slurry including magnetic material (such as nickel-zinc-cu ferrite).
Upper caldding layer 11 and lower caldding layer 12 can be used for preventing the substantially electric of the coil layer 42 of First Line ring layer 41 and second
Learn performance degradation.
The first external electrode 21 and the second external electrode 22 can include the metal that can provide electric conductivity.For example, the first dispatch from foreign news agency
Pole 21 and the second external electrode 22 can be included from by golden (Au), platinum (Pt), copper (Cu), nickel (Ni), palladium (Pd) and their conjunction
At least one metal selected in the group that gold is formed.
Herein, if necessary, nickel coating (not shown) or tin coating (not shown) can be further formed at the first dispatch from foreign news agency
On pole 21 and the surface of the second external electrode 22.
Coil support layer 30 can be fabricated to by such as electrically insulating material (such as photosensitive polymer) or magnetic material (example
Such as ferrite) etc. formation substrate.
Moreover, photosensitive insulating material can be only fitted between the coil layer 42 of First Line ring layer 41 and second adjacent to each other,
And the coil layer 42 of First Line ring layer 41 and second can be electrically connected by conductive through hole (conductive via) (not shown).
Conductive through hole can be by forming through-thickness through the through hole (not shown) of coil support layer 30 and using
Electrocondution slurry etc. is filled the through hole and formed.
In order to increase inductance coefficent, the number of turn or the increase first of the coil layer 42 of First Line ring layer 41 and second can be increased
The length of the coil layer 42 of coil layer 41 and second.
But in order that the increment of inductance coefficent and the increment of the number of turn of the coil layer 42 of First Line ring layer 41 and second are mutually fitted
Should, it is ensured that the specific dimensions of the through hole 63 of coil support layer 30, so as to the number of turn of the coil layer 42 of First Line ring layer 41 and second
Amount can be restricted.
Moreover, reducing the thickness of the coil layer 42 of First Line ring layer 41 and second to increase the line of First Line ring layer 41 and second
In the case of the number of turn of ring layer 42, resistance can increase.
Meanwhile in the case of the length of the increase coil layer 42 of First Line ring layer 41 and second, resistance can be proportionally
Increase.
Therefore, in the present embodiment, following suggest to realize reduction First Line ring layer 41 and the second coil can be used
The length of layer 42 is to reduce the structure that inductance coefficent is maintained at certain level by resistance simultaneously.
In coil supporting layer 30, through hole 63 can be formed in the center of coil supporting layer 30, and the first concave part 61 can be with
Formed in along its length two side surfaces of coil supporting layer 30, and multiple second concave parts 62 can be formed in coil
Each angle of supporting layer 30.
Coil support layer 30 has the low magnetic conductivity of the magnetic conductivity of the magnetic material than main body 10, and therefore, magnetic flux
Possibly smooth it can not circulate so as to reduce inductance coefficent.
But in the present embodiment, magnetic flux can pass through the concave part 61 of through hole 63 and first and the second concave part
62 and smooth circulation, can effectively suppress the increase of series resistance whereby while prevent the degeneration of inductance coefficent.
Following table 1 show the area based on the concave part 62 of through hole 63 and second than inductance coefficent change.Herein, inductance
Index variation rate (%) represents the ratio that the inductance value of sample 2 to sample 7 reduces relative to the inductance value of sample 1.
[table 1]
Referring to table 1, it can be seen that when the area of through hole is fixed as 0.902655, inductance coefficent can according to through hole 63 with
The area ratio of second concave part 62 changes.
Specifically, in sample 6 and sample 7, the area ratio of the concave part 62 of through hole 63 and second be decreased to 50% or
Smaller, in this case, inductance coefficent is promptly reduced to 0.62 from 0.88 in sample 5 and dropped from 0.62 in sample 6
As little as 0.41.Moreover, inductance coefficent rate of change is rapidly reduced to 41% and from 41% in sample 6 from 16% in sample 5
61% is rapidly reduced to, and therefore, can confirm that to ensure certain inductance value, the concave part 62 of through hole 63 and second
Area ratio need for 60% (0.60) or bigger.
The coil layer 42 of First Line ring layer 41 and second of coil support layer 30 generally has helical structure and can had
There are pentagon shape, hex shape, round-shaped, elliptical shape etc..Also, if necessary, the first of coil support layer 30
The coil layer 42 of coil layer 41 and second can have irregular shape.
As shown in Figure 1 to Figure 3, when main body 10 is cuboid, the coil layer 42 of First Line ring layer 41 and second can have
There is tetragonal shape to allow the area of the coil layer 42 of First Line ring layer 41 and second significantly to increase, to cause the magnetic field of sensing
Intensity can significantly increase.
41 and second coil layer of First Line ring layer, 42 respective one end leads to the end of coil support layer 30 with first
External electrode 21 and the second external electrode 22 electrically connect.
Moreover, 41 and second coil layer of First Line ring layer, the 42 respective other end can be located at the center of coil support layer 30
Near with pass through via conductors (via conductor) (not shown) electrically connect.
The coil layer 42 of First Line ring layer 41 and second can have 80% or a lower magnetic conductivity, and can include from
Selected in the group being made up of golden (Au), silver-colored (Ag), platinum (Pt), copper (Cu), nickel (Ni), palladium (Pd) and their alloy to
A kind of few metal.The coil layer 42 of First Line ring layer 41 and second can be formed by any material that can provide electric conductivity.Therefore,
The material of the coil layer 42 of First Line ring layer 41 and second can be not limited to the metal listed.
Meanwhile in order that the coil layer 42 of First Line ring layer 41 and second insulate with main body 10, insulating barrier 50 can be formed
To cover the surface of the coil layer 42 of First Line ring layer 41 and second around the coil layer 42 of First Line ring layer 41 and second.
Insulating barrier 50 is formed by the material with insulation characterisitic.For example, insulating barrier 50 can be formed by polymer etc., still
The present invention is not restricted to this.
Meanwhile the first concave part 61 formed in coil supporting layer 30 and the second concave part 62 can be made as needed
Change.
Fig. 4 A to Fig. 4 F show the part of the change of the first concave part 61 and the second concave part 62.Herein, in order to illustrate
Purpose do not show the through hole 63 of coil support layer 30.
Referring to Fig. 4 A, the first concave part 601 and the second concave part 602 can pass through two pair of first extension 302 and second
Extension 301 is separated from one another, wherein the first extension 302 leads to two surfaces of coil support layer 300, the second extension
301 lead to two ends of coil support layer 300.
Herein, can be formed as along coil supporting layer by two the first extensions 302, each first concave part 601
The single elongate grooves (elongated recess) that 300 length direction is formed.The inner corner face of first concave part 601
304 can be formed as right-angled surface, but the present invention is not limited thereto.
Moreover, the second concave part 602 can be formed in a manner of chamfering on four angles of coil supporting layer 300, second is recessed
The inner surface 303 of groove portion 602 can be formed as curved surface, but the present invention is not limited thereto, and if necessary, the second groove
The inner surface 303 in portion 602 can be formed as flat surface.
Referring to Fig. 4 B, the first concave part 611 and the second concave part 612 can pass through two pair of first extension 312 and second
Extension 311 is separated from one another, wherein the first extension 312 leads to two side surfaces of coil support layer 310, the second extension
Portion 311 leads to two ends of coil support layer 310.
Herein, can be formed as along coil supporting layer by two pair of first extension 312, each first concave part 611
The single elongate grooves that 310 length direction is formed.The inner corner face 314 of first concave part 611 can be formed as bending table
Face, but the present invention is not limited thereto.
Moreover, the second concave part 612 can be formed in a manner of chamfering on four angles of coil supporting layer 310, second is recessed
The inner surface 313 of groove portion 612 can be formed as curved surface, but the present invention is not limited thereto, and if necessary, the second groove
The inner surface 313 in portion 612 can be formed as flat surface.
Referring to Fig. 4 C, the first concave part 621 and the second concave part 622 can pass through a pair of first extensions 322 and second
Extension 321 is separated from one another, wherein the first extension 322 leads to two side surfaces of coil support layer 320, the second extension
Portion 321 leads to two ends of coil support layer 320.
Herein, by the first extension 322, the first concave part 621 can be along circle supporting layer 320 length direction that
This two groove separated.The first concave part 621 and second that is adjacent to each other and being separated by the second extension 321 is recessed
Groove portion 622 can be formed as communicating with each other, but the present invention is not limited thereto.
Moreover, the inner surface 323 of the second concave part 622 can be formed as curved surface, but the present invention is not limited thereto,
And if necessary, the inner surface 323 of the second concave part 622 can be formed as flat surface.
Referring to Fig. 4 D, the first concave part 631 and the second concave part 632 can pass through multiple first extensions 332 and second
Extension 331 is separated from one another, wherein the first extension 332 leads to two side surfaces of coil support layer 330, the second extension
Portion 331 leads to two ends of coil support layer 330.
Herein, the length along coil supporting layer 330 can be formed as by multiple first extensions 332, the first concave part 631
Spend multiple grooves separated from one another in direction.The inner corner face 334 of first concave part 631 can be formed as right-angled surface, but
It is that the present invention is not limited thereto.
Moreover, the second concave part 632 can be formed in a manner of chamfering on four angles of coil supporting layer 330, second is recessed
The inner surface 333 of groove portion 632 can be formed as curved surface, but the present invention is not limited thereto, and if necessary, the second groove
The inner surface 333 in portion 632 can be formed as flat surface.
Referring to Fig. 4 E, the first concave part 641 and the second concave part 642 can pass through two couple of first extension 342a and second
Extension 341 is separated from one another, wherein the first extension 342a leads to two side surfaces of coil support layer 340, second prolongs
Extending portion 341 leads to two ends of coil support layer 340.
Herein, the inner corner face 344 of the first concave part 641 can be formed as curved surface, but the present invention is not limited to
This.
Moreover, the second concave part 642 can be formed in a manner of chamfering on four angles of coil supporting layer 340, second is recessed
The inner surface 343 of groove portion 642 can be formed as curved surface, but the present invention is not limited thereto, and if necessary, the second groove
The inner surface 343 in portion 642 can be formed as flat surface.
Referring to Fig. 4 F, the first concave part 651 and the second concave part 652 can pass through multiple first extensions 352 and second
Extension 351 is separated from one another, wherein the first extension 352 leads to two side surfaces of coil support layer 350, the second extension
Portion 351 leads to two ends of coil support layer 350.
Herein, the length along coil supporting layer 350 can be formed as by multiple first extensions 352, the first concave part 651
Multiple grooves separated from one another in direction are spent, and the inner surface 354 of the first concave part 651 can be formed as curved surface,
But the present invention is not limited thereto.
Moreover, the second concave part 652 can be formed in a manner of chamfering on four angles of coil supporting layer 350, second is recessed
The inner surface 353 of groove portion 652 can be formed as curved surface, but the present invention is not limited thereto, and if necessary, the second groove
The inner surface 353 in portion 652 can be formed as flat surface.
Fig. 5 and Fig. 6 shows the magnetic module 100 for power inductor, wherein, it is being configured to the above form
Power inductor 1 in, it is more before two ends that the first external electrode 21 and the second external electrode 22 form in each main body 10
Individual main body 10 is connected to each other in the matrix form.
Herein, reference 70 is represented for magnetic module 100 to be cut into the magnetic for manufacturing each power inductor
The line of cut of property main unit.
Fig. 7 is shown to inductor according to the embodiment of the present invention and according to the electricity between the inductor of correlation technique
The curve map that sense coefficient and series resistance are compared.
Referring to Fig. 7, including the groove to be circulated for magnetic flux inductor according to the embodiment of the present invention (hereinafter referred to as
For invention example) there is 0.95 μ H inductance coefficent, without the groove to be circulated for magnetic flux according to existing related skill
The inductor (hereinafter referred to as correlation technique example) of art has 0.94 μ H inductance coefficent, and the therefore inductance system of invention example
Number is about smaller by 1% than the inductance coefficent of correlation technique example.
Moreover, the series resistance of correlation technique example is 231.1m Ω and the series resistance of invention example is 198.8m Ω,
Accordingly, it can be seen that the series resistance of the invention example of the present invention is about smaller by 14% than the series resistance of correlation technique example.
Generally, the length of the number of turn and coil of inductance coefficent and coil proportionally increases, and series resistance also with line
The number of turn of circle and the length of coil proportionally increase.
, it is necessary to which series resistance is maintained at into alap horizontal while meets needs in the case of power inductor
Inductance value, but in the case of relatively large inductor, coil can have larger thickness, eliminate due to series electrical
The degeneration of properties of product caused by resistance increase.
However, when the size of inductor reduces according to the trend that product size minimizes, the increase of the thickness of coil
In the presence of limitation, and therefore, series resistance increases so that product performance is degenerated.
As can be seen that due to forming the concave part 61 of through hole 63 and first and the second concave part in coil supporting layer 30
62, compared with the film-type power inductor according to prior art, series resistance can significantly decrease in the present embodiment
The inductance coefficent of phase same level is kept simultaneously.
Therefore, in the present embodiment, the size of product center line ring layer increases to the requirement for meeting inductance coefficent while gone here and there
Join resistance to reduce, and can also reach this effect in the case of product size is less.
Below, it will the method for the power inductor of description manufacture according to the embodiment of the present invention.
First, the substrate formed by insulating materials or magnetic material is prepared.Herein, substrate refers to coil support layer, and
Therefore substrate is represented by same reference 30.
Substrate 30 includes being located therein first of the through hole 63 of centre, at least one formation in two side surfaces of substrate 30
Concave part 61 and multiple each angles for being formed at substrate 30 are to allow the second concave part 62 of the smooth circulation of magnetic flux.
Herein, the first concave part 61 can be formed as the elongated slot of the length direction along substrate 30, or can be by cutting
The remainder of the part for cutting two side surfaces of substrate 30 while two side surfaces for leaving substrate 30 and be formed as multiple
The groove separated.Moreover, if necessary, the first concave part 61 and the second concave part 62 can communicate with each other.
Next, First Line ring layer 41 and the second coil layer 42 are formed on two surfaces of substrate 30.
The coil layer 42 of First Line ring layer 41 and second can be formed according to following steps.I.e., it is possible to electrocondution slurry is coated
To form First Line ring layer 41 on a surface of substrate 30, the conductive through hole of passing through substrate 30 is formed, and by conductive paste
Material be coated in First Line ring layer 41 formed the relative surface in surface on to form the second coil layer 42.First Line ring layer
41 and second coil layer 42 can be electrically connected by conductive through hole.
Conductive through hole can form through hole and the use along the thickness direction of substrate 30 by using laser, stamping machine etc.
Electrocondution slurry etc. is filled through hole and formed.
Herein, electrocondution slurry can include the metal that can provide electric conductivity.For example, electrocondution slurry can include from by gold
(Au), at least one selected in the group that silver-colored (Ag), platinum (Pt), copper (Cu), nickel (Ni), palladium (Pd) and their alloy are formed
Kind metal.
Moreover, in order to obtain stable electrical characteristics, the coil layer 42 of First Line ring layer 41 and second and conductive through hole can be with
It is formed from the same material.
Below, the substrate 30 with the coil layer 42 of First Line ring layer 41 and second being formed thereon is placed on by magnetic
On the lower caldding layer 12 that material is formed.
Herein, multiple substrates 30 can be laminated along the thickness direction of main body 10, and substrate 30 is adjacent along laminating direction
The coil layer 42 of First Line ring layer 41 and second an end can be in contact with each other by via conductors (not shown) so as to electricity
Connection.
Moreover, insulating barrier can be formed by the material such as the polymer with insulation characterisitic, with along First Line ring layer 41
And second cover First Line ring layer 41 and the second coil layer 42 around coil layer 42.
Below, formed by the compound including ferrite/metallic magnetic grain and polymer with First Line ring layer 41
With on the substrate 30 of the second coil layer 42 to manufacture main body 10.
Upper caldding layer 11 can be by being further laminated the compound by including ferrite/metallic magnetic grain and polymer
Or the slurry being formed from the same material by coating is formed on the substrate 30.
Below, the first external electrode 21 and the second external electrode 22 can be formed in two ends of main body 10, to cause first
The guiding of external electrode 21 and the second external electrode 22 and the coil layer 42 of First Line ring layer 41 and second is to the first external electrode 21 and second
The part electrical connection of external electrode 22.
Herein, the first external electrode 21 and the second external electrode 22 can be immersed in electrocondution slurry by using by main body 10
Method either prints electrocondution slurry, electroplate or splash is formed to the method for two ends of main body 10 etc..
Electrocondution slurry can be formed from the metal that electric conductivity can be provided to the first external electrode 21 and the second external electrode 22.Example
Such as, electrocondution slurry can be included from by golden (Au), silver-colored (Ag), platinum (Pt), copper (Cu), nickel (Ni), palladium (Pd) and their conjunction
At least one metal selected in the group that gold is formed.
If necessary, nickel coating or tin coating can also be further formed at the first external electrode 21 and the second external electrode 22
On surface.
As mentioned above it is possible, according to the embodiment of the present invention, the groove for magnetic flux circulation is formed in two side tables
The center in face and each angle of coil support layer, tool can also be realized in the case that power inductor minimizes whereby
There is relatively low series resistance while realize the power inductor and its manufacture method of high inductance coefficent characteristic.
Although combined embodiment has shown and described the present invention, will be apparent to those skilled in the art
It is that can modify and become in the case of without departing substantially from the spirit and scope of the present invention being defined by the appended claims
Type.
Claims (15)
1. a kind of power inductor, the power inductor includes：
Main body；And
The first external electrode and the second external electrode, the first external electrode and the second external electrode form two in the main body
End,
Wherein, the main body includes：Upper caldding layer and lower caldding layer；At least one coil support layer, the coil support layer have
Form the central through hole in the coil support layer, two side surfaces on the width of the coil support layer formed with
At least one first concave part and at each angle of the coil support layer formed with multiple second concave parts, the coil branch
Layer is supportted between the upper caldding layer and the lower caldding layer；First Line ring layer and the second coil layer, the First Line ring layer
Formed with second coil layer on two surfaces of the coil support layer and the First Line ring layer and described second
Coil layer respectively there is one end to be connected to the first external electrode and the second external electrode, wherein, the through hole and the line
The area ratio of all second concave parts enclosed in supporting layer is 0.60 or bigger.
2. power inductor according to claim 1, wherein, the permeability of the coil support layer is 80% or more
It is small.
3. power inductor according to claim 1, wherein, first concave part of the coil support layer is formed as
Along the elongated groove of the length direction of the coil support layer.
4. power inductor according to claim 1, wherein, first concave part of the coil support layer includes edge
Multiple grooves that the length direction of the coil support layer is spaced apart from each other.
5. power inductor according to claim 1, wherein, first concave part of the coil support layer is formed as
It is connected with second concave part of the coil support layer.
6. power inductor according to claim 1, wherein, the coil support layer is by insulating materials or magnetic material
Expect the substrate formed.
7. power inductor according to claim 1, wherein, in the week of the First Line ring layer and second coil layer
Enclose formed with insulating barrier.
8. a kind of magnetic module for power inductor, the magnetic module includes main body, and the main body connects in the matrix form,
Wherein, each described main body includes：
Upper caldding layer and lower caldding layer；
At least one coil support layer, center through hole is provided with the coil support layer, in the width side of the coil support layer
Two upward side surfaces are formed with least one first concave part and at each angle of the coil support layer formed with more
Individual second concave part, the coil support layer is between the upper caldding layer and the lower caldding layer；And
First Line ring layer and the second coil layer, the First Line ring layer and second coil layer are formed in the coil support layer
Two surfaces on and the First Line ring layer and second coil layer respectively have one end exposed to the external world, wherein, institute
The area ratio for stating through hole and all second concave parts in the coil support layer is 0.60 or bigger.
9. the magnetic module according to claim 8 for power inductor, wherein, the permeability of the coil support layer
For 80% or smaller.
10. a kind of method for manufacturing power inductor, this method include：
Substrate is prepared, the substrate is formed by insulating materials or magnetic material, and has through hole in the center of the substrate, in institute
Two side surfaces on the width of substrate are stated formed with least one first concave part, and at each angle of the substrate
Formed with multiple second concave parts；
First Line ring layer and the second coil layer are formed on two surfaces of the substrate；
The substrate thereon formed with the First Line ring layer and second coil layer is arranged on lower caldding layer；
Main body is formed by forming upper caldding layer on the substrate；And
The first external electrode and the second external electrode are formed in two ends of the main body, to cause the first external electrode and described
What the second external electrode was connected to the First Line ring layer and second coil layer leads to the first external electrode and described
The part of two external electrodes, wherein, the area ratio of the through hole and all second concave parts in the coil support layer
For 0.60 or bigger.
11. the method according to claim 11, wherein, before the substrate is set, by insulating materials cover it
Around the substrate formed with the First Line ring layer and second coil layer.
12. according to the method for claim 10, wherein, set the substrate include by multiple substrates be laminated to it is described under cover
On cap rock.
13. according to the method for claim 10, wherein, when preparing the substrate, be formed as first concave part
Along the elongated groove of the length direction of coil supporting layer.
14. the method according to claim 11, wherein, when preparing the substrate, by the width of the substrate
Two side surfaces remove to the part for only leaving the substrate to form multiple first concave parts separated from one another.
15. according to the method for claim 10, wherein, when preparing the substrate, be formed as first concave part
Connected with second concave part.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020120078421A KR20140011693A (en) | 2012-07-18 | 2012-07-18 | Magnetic substance module for power inductor, power inductor and manufacturing method for the same |
| KR10-2012-0078421 | 2012-07-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103578708A CN103578708A (en) | 2014-02-12 |
| CN103578708B true CN103578708B (en) | 2018-03-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310104695.3A Active CN103578708B (en) | 2012-07-18 | 2013-03-28 | Magnetic module, power inductor and its manufacture method for power inductor |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9478334B2 (en) |
| EP (1) | EP2688074B1 (en) |
| JP (1) | JP6455959B2 (en) |
| KR (1) | KR20140011693A (en) |
| CN (1) | CN103578708B (en) |
Families Citing this family (46)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9001527B2 (en) * | 2008-02-18 | 2015-04-07 | Cyntec Co., Ltd. | Electronic package structure |
| JP5965148B2 (en) * | 2012-01-05 | 2016-08-03 | 日東電工株式会社 | Power receiving module for mobile terminal using wireless power transmission and rechargeable battery for mobile terminal equipped with power receiving module for mobile terminal |
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| KR102105394B1 (en) * | 2015-03-09 | 2020-04-28 | 삼성전기주식회사 | Coil component and and board for mounting the same |
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| KR101762023B1 (en) * | 2015-11-19 | 2017-08-04 | 삼성전기주식회사 | Coil component and and board for mounting the same |
| KR101900880B1 (en) | 2015-11-24 | 2018-09-21 | 주식회사 모다이노칩 | Power Inductor |
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| KR101981466B1 (en) | 2016-09-08 | 2019-05-24 | 주식회사 모다이노칩 | Power Inductor |
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| JP6962284B2 (en) | 2018-07-17 | 2021-11-05 | 株式会社村田製作所 | Inductor parts |
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| KR102148832B1 (en) | 2018-10-12 | 2020-08-27 | 삼성전기주식회사 | Coil component |
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| KR102145308B1 (en) * | 2019-03-06 | 2020-08-18 | 삼성전기주식회사 | Coil component and manufacturing method for the same |
| JP7143817B2 (en) * | 2019-05-24 | 2022-09-29 | 株式会社村田製作所 | Laminated coil parts |
| KR102198533B1 (en) * | 2019-05-27 | 2021-01-06 | 삼성전기주식회사 | Coil component |
| KR102679990B1 (en) * | 2019-07-17 | 2024-07-02 | 삼성전기주식회사 | Coil component |
| KR20210142300A (en) * | 2020-05-18 | 2021-11-25 | 삼성전기주식회사 | Coil component |
| KR20210144031A (en) * | 2020-05-21 | 2021-11-30 | 삼성전기주식회사 | Coil component |
| KR20220073086A (en) * | 2020-11-26 | 2022-06-03 | 삼성전기주식회사 | Coil component |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998054733A2 (en) * | 1997-05-29 | 1998-12-03 | Tdk Corporation Of America | Low profile pin-less planar magnetic devices and method of making same |
| CN1783366A (en) * | 2004-09-30 | 2006-06-07 | Tdk株式会社 | Electronic device having organic material based insulating layer and method for fabricating the same |
| KR20060061709A (en) * | 2004-12-02 | 2006-06-08 | 삼성전기주식회사 | Planar magnetic inductor and method for manufacturing the same |
| CN1817070A (en) * | 2003-07-03 | 2006-08-09 | 皇家飞利浦电子股份有限公司 | Soft magnetic material for manufacturing printed circuit boards |
| CN1858864A (en) * | 2003-02-26 | 2006-11-08 | Tdk株式会社 | Thin-film type common-mode choke coil and method of manufacture thereof |
| CN1910710A (en) * | 2004-06-07 | 2007-02-07 | 株式会社村田制作所 | Multilayer coil |
| CN101310346A (en) * | 2005-12-07 | 2008-11-19 | 胜美达集团株式会社 | Flexible coil |
| CN101517665A (en) * | 2006-09-12 | 2009-08-26 | 库帕技术公司 | Low profile layered coil and cores for magnetic components |
| CN101568978A (en) * | 2007-02-02 | 2009-10-28 | 株式会社村田制作所 | Laminated coil component |
| CN101752058A (en) * | 2008-12-08 | 2010-06-23 | 万国半导体有限公司 | multilayer inductor |
| JP2010205905A (en) * | 2009-03-03 | 2010-09-16 | Fuji Electric Systems Co Ltd | Magnetic component, and method of manufacturing the magnetic component |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1154327A (en) * | 1997-08-04 | 1999-02-26 | Murata Mfg Co Ltd | Coil parts |
| KR100249211B1 (en) | 1997-11-26 | 2000-03-15 | 구자홍 | Method of manufacturing thin film inductor |
| JP3583965B2 (en) * | 1999-11-26 | 2004-11-04 | 太陽誘電株式会社 | Surface mount type coil and manufacturing method thereof |
| US20040263309A1 (en) | 2003-02-26 | 2004-12-30 | Tdk Corporation | Thin-film type common-mode choke coil and manufacturing method thereof |
| KR100770249B1 (en) * | 2004-06-07 | 2007-10-25 | 가부시키가이샤 무라타 세이사쿠쇼 | Multilayer coil |
| US20060077029A1 (en) * | 2004-10-07 | 2006-04-13 | Freescale Semiconductor, Inc. | Apparatus and method for constructions of stacked inductive components |
| JP4638322B2 (en) * | 2005-10-25 | 2011-02-23 | Ｔｄｋ株式会社 | Common mode filter |
| JP5054445B2 (en) * | 2007-06-26 | 2012-10-24 | スミダコーポレーション株式会社 | Coil parts |
| TWM357691U (en) * | 2008-11-07 | 2009-05-21 | Delta Electronics Inc | Transformer |
| US8232855B2 (en) * | 2008-12-15 | 2012-07-31 | General Electric Company | High energy density inductor |
| JP5339974B2 (en) * | 2009-03-11 | 2013-11-13 | 新光電気工業株式会社 | Inductor device and manufacturing method thereof |
| KR101434351B1 (en) * | 2010-10-21 | 2014-08-26 | 티디케이가부시기가이샤 | Coil component and method for producing same |
| US9009951B2 (en) * | 2012-04-24 | 2015-04-21 | Cyntec Co., Ltd. | Method of fabricating an electromagnetic component |
-
2012
- 2012-07-18 KR KR1020120078421A patent/KR20140011693A/en active Application Filing
-
2013
- 2013-03-14 JP JP2013051347A patent/JP6455959B2/en active Active
- 2013-03-14 EP EP13275063.9A patent/EP2688074B1/en not_active Not-in-force
- 2013-03-15 US US13/839,607 patent/US9478334B2/en active Active
- 2013-03-28 CN CN201310104695.3A patent/CN103578708B/en active Active
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998054733A2 (en) * | 1997-05-29 | 1998-12-03 | Tdk Corporation Of America | Low profile pin-less planar magnetic devices and method of making same |
| CN1858864A (en) * | 2003-02-26 | 2006-11-08 | Tdk株式会社 | Thin-film type common-mode choke coil and method of manufacture thereof |
| CN1817070A (en) * | 2003-07-03 | 2006-08-09 | 皇家飞利浦电子股份有限公司 | Soft magnetic material for manufacturing printed circuit boards |
| CN1910710A (en) * | 2004-06-07 | 2007-02-07 | 株式会社村田制作所 | Multilayer coil |
| CN1783366A (en) * | 2004-09-30 | 2006-06-07 | Tdk株式会社 | Electronic device having organic material based insulating layer and method for fabricating the same |
| KR20060061709A (en) * | 2004-12-02 | 2006-06-08 | 삼성전기주식회사 | Planar magnetic inductor and method for manufacturing the same |
| CN101310346A (en) * | 2005-12-07 | 2008-11-19 | 胜美达集团株式会社 | Flexible coil |
| CN101517665A (en) * | 2006-09-12 | 2009-08-26 | 库帕技术公司 | Low profile layered coil and cores for magnetic components |
| CN101568978A (en) * | 2007-02-02 | 2009-10-28 | 株式会社村田制作所 | Laminated coil component |
| CN101752058A (en) * | 2008-12-08 | 2010-06-23 | 万国半导体有限公司 | multilayer inductor |
| JP2010205905A (en) * | 2009-03-03 | 2010-09-16 | Fuji Electric Systems Co Ltd | Magnetic component, and method of manufacturing the magnetic component |
Also Published As
| Publication number | Publication date |
|---|---|
| EP2688074B1 (en) | 2018-08-01 |
| JP6455959B2 (en) | 2019-01-23 |
| US9478334B2 (en) | 2016-10-25 |
| KR20140011693A (en) | 2014-01-29 |
| CN103578708A (en) | 2014-02-12 |
| US20140022041A1 (en) | 2014-01-23 |
| EP2688074A1 (en) | 2014-01-22 |
| JP2014022724A (en) | 2014-02-03 |
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