JP2006075776A - 洗浄方法及びそれを実施するための洗浄液供給装置 - Google Patents

洗浄方法及びそれを実施するための洗浄液供給装置 Download PDF

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Publication number
JP2006075776A
JP2006075776A JP2004264584A JP2004264584A JP2006075776A JP 2006075776 A JP2006075776 A JP 2006075776A JP 2004264584 A JP2004264584 A JP 2004264584A JP 2004264584 A JP2004264584 A JP 2004264584A JP 2006075776 A JP2006075776 A JP 2006075776A
Authority
JP
Japan
Prior art keywords
cleaning liquid
cleaning
cleaned
sprayed
washed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004264584A
Other languages
English (en)
Japanese (ja)
Inventor
Yoshiki Kobayashi
小林　　芳樹
Masahiko Yasukawa
雅彦 安川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ZEBIOSU KK
Original Assignee
ZEBIOSU KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ZEBIOSU KK filed Critical ZEBIOSU KK
Priority to JP2004264584A priority Critical patent/JP2006075776A/ja
Priority to TW094128390A priority patent/TW200610591A/zh
Priority to KR1020050083275A priority patent/KR20060051081A/ko
Priority to CNA2005101025295A priority patent/CN1745911A/zh
Publication of JP2006075776A publication Critical patent/JP2006075776A/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels

Landscapes

  • Engineering & Computer Science (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Liquid Crystal (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
JP2004264584A 2004-09-10 2004-09-10 洗浄方法及びそれを実施するための洗浄液供給装置 Pending JP2006075776A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2004264584A JP2006075776A (ja) 2004-09-10 2004-09-10 洗浄方法及びそれを実施するための洗浄液供給装置
TW094128390A TW200610591A (en) 2004-09-10 2005-08-19 Cleaning method and cleaning liquid feeder practicing the same
KR1020050083275A KR20060051081A (ko) 2004-09-10 2005-09-07 세정방법 및 그것을 실시하기 위한 세정액 공급장치
CNA2005101025295A CN1745911A (zh) 2004-09-10 2005-09-08 清洗方法以及实施该方法的清洗液供给装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004264584A JP2006075776A (ja) 2004-09-10 2004-09-10 洗浄方法及びそれを実施するための洗浄液供給装置

Publications (1)

Publication Number Publication Date
JP2006075776A true JP2006075776A (ja) 2006-03-23

Family

ID=36155676

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004264584A Pending JP2006075776A (ja) 2004-09-10 2004-09-10 洗浄方法及びそれを実施するための洗浄液供給装置

Country Status (4)

Country Link
JP (1) JP2006075776A (ko)
KR (1) KR20060051081A (ko)
CN (1) CN1745911A (ko)
TW (1) TW200610591A (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4832415B2 (ja) * 2007-12-13 2011-12-07 トヨタ自動車株式会社 シリンダヘッド洗浄方法及びシリンダヘッド洗浄装置
CN105814667B (zh) * 2013-12-02 2019-03-15 独立行政法人产业技术综合研究所 自旋清洗装置及自旋清洗方法
CN111755320A (zh) * 2020-05-20 2020-10-09 嘉兴市轩禾园艺技术有限公司 多晶硅功能膜、制备方法及其用途

Also Published As

Publication number Publication date
KR20060051081A (ko) 2006-05-19
CN1745911A (zh) 2006-03-15
TW200610591A (en) 2006-04-01

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