JP2006049851A5 - - Google Patents
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- Publication number
- JP2006049851A5 JP2006049851A5 JP2005187582A JP2005187582A JP2006049851A5 JP 2006049851 A5 JP2006049851 A5 JP 2006049851A5 JP 2005187582 A JP2005187582 A JP 2005187582A JP 2005187582 A JP2005187582 A JP 2005187582A JP 2006049851 A5 JP2006049851 A5 JP 2006049851A5
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- nitride
- oxide
- film integrated
- mixture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 150000004767 nitrides Chemical class 0.000 claims 52
- 239000010409 thin film Substances 0.000 claims 48
- 239000000758 substrate Substances 0.000 claims 30
- 239000000203 mixture Substances 0.000 claims 28
- 238000000034 method Methods 0.000 claims 13
- 239000010408 film Substances 0.000 claims 12
- 238000004519 manufacturing process Methods 0.000 claims 9
- 229910052736 halogen Inorganic materials 0.000 claims 7
- -1 halogen fluoride Chemical class 0.000 claims 7
- 239000007788 liquid Substances 0.000 claims 6
- 230000015572 biosynthetic process Effects 0.000 claims 2
- 238000010030 laminating Methods 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 238000005452 bending Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 238000000206 photolithography Methods 0.000 claims 1
- 238000007747 plating Methods 0.000 claims 1
- 238000004544 sputter deposition Methods 0.000 claims 1
- 238000007740 vapor deposition Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005187582A JP5041681B2 (ja) | 2004-06-29 | 2005-06-28 | 半導体装置の作製方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004192250 | 2004-06-29 | ||
| JP2004192250 | 2004-06-29 | ||
| JP2005187582A JP5041681B2 (ja) | 2004-06-29 | 2005-06-28 | 半導体装置の作製方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006049851A JP2006049851A (ja) | 2006-02-16 |
| JP2006049851A5 true JP2006049851A5 (https=) | 2008-05-15 |
| JP5041681B2 JP5041681B2 (ja) | 2012-10-03 |
Family
ID=36027993
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005187582A Expired - Fee Related JP5041681B2 (ja) | 2004-06-29 | 2005-06-28 | 半導体装置の作製方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5041681B2 (https=) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8900970B2 (en) | 2006-04-28 | 2014-12-02 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing a semiconductor device using a flexible substrate |
| JP5364242B2 (ja) * | 2006-04-28 | 2013-12-11 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP5204959B2 (ja) | 2006-06-26 | 2013-06-05 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP5094232B2 (ja) * | 2006-06-26 | 2012-12-12 | 株式会社半導体エネルギー研究所 | 半導体装置を内包する用紙およびその作製方法 |
| CN101479747B (zh) | 2006-06-26 | 2011-05-18 | 株式会社半导体能源研究所 | 包括半导体器件的纸及其制造方法 |
| JP6957252B2 (ja) | 2017-07-20 | 2021-11-02 | 岩谷産業株式会社 | 切断加工方法 |
| JP6925900B2 (ja) | 2017-07-20 | 2021-08-25 | 岩谷産業株式会社 | 切断加工方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08274072A (ja) * | 1995-03-31 | 1996-10-18 | Toshiba Corp | 表面処理装置および表面処理方法 |
| JP2000020665A (ja) * | 1998-06-30 | 2000-01-21 | Toshiba Corp | 半導体装置 |
| JP4748859B2 (ja) * | 2000-01-17 | 2011-08-17 | 株式会社半導体エネルギー研究所 | 発光装置の作製方法 |
| JP2002353235A (ja) * | 2001-05-23 | 2002-12-06 | Matsushita Electric Ind Co Ltd | アクティブマトリクス基板とそれを用いた表示装置およびその製造方法 |
| EP2565924B1 (en) * | 2001-07-24 | 2018-01-10 | Samsung Electronics Co., Ltd. | Transfer method |
| ATE463845T1 (de) * | 2001-10-11 | 2010-04-15 | Koninkl Philips Electronics Nv | Dünnfilmtranistor-bauelement und diesbezügliches verfahren |
| JP2003229548A (ja) * | 2001-11-30 | 2003-08-15 | Semiconductor Energy Lab Co Ltd | 乗物、表示装置、および半導体装置の作製方法 |
| JP3956697B2 (ja) * | 2001-12-28 | 2007-08-08 | セイコーエプソン株式会社 | 半導体集積回路の製造方法 |
-
2005
- 2005-06-28 JP JP2005187582A patent/JP5041681B2/ja not_active Expired - Fee Related
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