JP2006049735A5 - - Google Patents

Download PDF

Info

Publication number
JP2006049735A5
JP2006049735A5 JP2004231828A JP2004231828A JP2006049735A5 JP 2006049735 A5 JP2006049735 A5 JP 2006049735A5 JP 2004231828 A JP2004231828 A JP 2004231828A JP 2004231828 A JP2004231828 A JP 2004231828A JP 2006049735 A5 JP2006049735 A5 JP 2006049735A5
Authority
JP
Japan
Prior art keywords
transparent resin
led
chip
resin portion
led chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2004231828A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006049735A (ja
JP4858867B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2004231828A priority Critical patent/JP4858867B2/ja
Priority claimed from JP2004231828A external-priority patent/JP4858867B2/ja
Priority to US11/199,168 priority patent/US7754527B2/en
Publication of JP2006049735A publication Critical patent/JP2006049735A/ja
Publication of JP2006049735A5 publication Critical patent/JP2006049735A5/ja
Priority to US12/824,995 priority patent/US8648366B2/en
Application granted granted Critical
Publication of JP4858867B2 publication Critical patent/JP4858867B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2004231828A 2004-08-09 2004-08-09 Ｌｅｄ及びその製造方法 Expired - Fee Related JP4858867B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2004231828A JP4858867B2 (ja) 2004-08-09 2004-08-09 Ｌｅｄ及びその製造方法
US11/199,168 US7754527B2 (en) 2004-08-09 2005-08-09 LED and method of manufacturing the same
US12/824,995 US8648366B2 (en) 2004-08-09 2010-06-28 LED and method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004231828A JP4858867B2 (ja) 2004-08-09 2004-08-09 Ｌｅｄ及びその製造方法

Publications (3)

Publication Number Publication Date
JP2006049735A JP2006049735A (ja) 2006-02-16
JP2006049735A5 true JP2006049735A5 (enExample) 2007-09-20
JP4858867B2 JP4858867B2 (ja) 2012-01-18

Family

ID=35908820

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004231828A Expired - Fee Related JP4858867B2 (ja) 2004-08-09 2004-08-09 Ｌｅｄ及びその製造方法

Country Status (2)

Country Link
US (2) US7754527B2 (enExample)
JP (1) JP4858867B2 (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080149949A1 (en) * 2006-12-11 2008-06-26 The Regents Of The University Of California Lead frame for transparent and mirrorless light emitting diodes
WO2008073400A1 (en) 2006-12-11 2008-06-19 The Regents Of The University Of California Transparent light emitting diodes
JP4205135B2 (ja) * 2007-03-13 2009-01-07 シャープ株式会社 半導体発光装置、半導体発光装置用多連リードフレーム
JP5284006B2 (ja) * 2008-08-25 2013-09-11 シチズン電子株式会社 発光装置
US8034644B2 (en) * 2009-01-23 2011-10-11 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Light emitting device
TWI463708B (zh) * 2009-02-24 2014-12-01 榮創能源科技股份有限公司 側面出光型發光元件封裝結構及其製造方法
CN102510804A (zh) * 2009-09-25 2012-06-20 海洋王照明科技股份有限公司 发光玻璃、其制造方法及发光装置
KR101034054B1 (ko) * 2009-10-22 2011-05-12 엘지이노텍 주식회사 발광소자 패키지 및 그 제조방법
JP2013004739A (ja) * 2011-06-16 2013-01-07 Panasonic Corp 発光装置及びそれを用いた照明器具
JP6657735B2 (ja) * 2014-10-07 2020-03-04 日亜化学工業株式会社 発光装置
US10490711B2 (en) 2014-10-07 2019-11-26 Nichia Corporation Light emitting device
US10810932B2 (en) * 2018-10-02 2020-10-20 Sct Ltd. Molded LED display module and method of making thererof
US11592166B2 (en) 2020-05-12 2023-02-28 Feit Electric Company, Inc. Light emitting device having improved illumination and manufacturing flexibility
US11876042B2 (en) 2020-08-03 2024-01-16 Feit Electric Company, Inc. Omnidirectional flexible light emitting device
US20220254962A1 (en) * 2021-02-11 2022-08-11 Creeled, Inc. Optical arrangements in cover structures for light emitting diode packages and related methods
EP4102307A1 (fr) * 2021-06-08 2022-12-14 The Swatch Group Research and Development Ltd Pièce d'horlogerie à illumination localisée

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19638667C2 (de) 1996-09-20 2001-05-17 Osram Opto Semiconductors Gmbh Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement
BR9709998B1 (pt) 1996-06-26 2010-04-20 elemento de construção semicondutor, irradiador de luz, com elemento de conversão de luminescência
US6613247B1 (en) 1996-09-20 2003-09-02 Osram Opto Semiconductors Gmbh Wavelength-converting casting composition and white light-emitting semiconductor component
JP3065263B2 (ja) 1996-12-27 2000-07-17 日亜化学工業株式会社 発光装置及びそれを用いたｌｅｄ表示器
JPH1187778A (ja) * 1997-09-02 1999-03-30 Toshiba Corp 半導体発光素子、半導体発光装置およびその製造方法
JP3584163B2 (ja) * 1998-07-27 2004-11-04 サンケン電気株式会社 半導体発光装置の製造方法
CN1190997C (zh) 1999-07-23 2005-02-23 电灯专利信托有限公司 光源的发光物质及其相关的光源
JP2001127346A (ja) 1999-10-22 2001-05-11 Stanley Electric Co Ltd 発光ダイオード
JP2001177157A (ja) * 1999-12-15 2001-06-29 Matsushita Electronics Industry Corp 半導体発光装置
JP2001196639A (ja) 2000-01-12 2001-07-19 Sanyo Electric Co Ltd Ｌｅｄ発光素子及びその製造方法
JP2001202812A (ja) * 2000-01-18 2001-07-27 Sharp Corp 発光装置およびその製造方法並びにそれを用いた表示装置
JP2001210872A (ja) 2000-01-26 2001-08-03 Sanyo Electric Co Ltd 半導体発光装置及びその製造方法
JP2001345483A (ja) 2000-05-31 2001-12-14 Toshiba Lighting & Technology Corp 発光ダイオード
JP4101468B2 (ja) * 2001-04-09 2008-06-18 豊田合成株式会社 発光装置の製造方法
JP3707688B2 (ja) 2002-05-31 2005-10-19 スタンレー電気株式会社 発光装置およびその製造方法
JP2004047748A (ja) 2002-07-12 2004-02-12 Stanley Electric Co Ltd 発光ダイオード
JP4606000B2 (ja) * 2003-07-17 2011-01-05 三洋電機株式会社 発光ダイオード及びその製造方法

Similar Documents

Publication Publication Date Title
JP2006049735A5 (enExample)
CN203205453U (zh) 一种半导体发光芯片、及半导体照明灯具
JP2008523637A5 (enExample)
CN104282819A (zh) 倒装式发光二极管封装模块及其制造方法
JP2013501368A5 (enExample)
JP2009027166A5 (enExample)
WO2008138183A1 (en) Side emission type led
CN111095580A (zh) 柔性led面光源、制作方法及发光设备
CN201057438Y (zh) 一种三基色片式发光二极管
CN108682670A (zh) 一种显示屏用表面贴装发光二极管模组及其制作方法
JP2009194189A5 (enExample)
CN102280562A (zh) 发光二极管的封装工艺与其结构
TW200905322A (en) Light source, method for manufacturing the same and backlight module thereof
TW200605293A (en) Chip package structure and process for fabricating the same
KR101086997B1 (ko) 발광 소자 패키지와 그의 제조 방법 및 그를 이용한 카메라 플래시 모듈
JP2008294414A5 (enExample)
CN204461449U (zh) 电子装置
CN203218332U (zh) 高反射率的高照度led光源模块
CN202172089U (zh) 发光二极管改良结构
CN217280763U (zh) 一种小尺寸加厚的led芯片结构
CN207068923U (zh) 一种新型全彩led光源封装结构及应用
CN1956178A (zh) 光电芯片封装构造、制造方法及其芯片承载件
CN101621052B (zh) 发光二极管封装阵列、封装结构及封装方法
JP2006066551A5 (enExample)
JP2019220405A5 (enExample)