CN203205453U - 一种半导体发光芯片、及半导体照明灯具 - Google Patents
一种半导体发光芯片、及半导体照明灯具 Download PDFInfo
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- CN203205453U CN203205453U CN2013200687448U CN201320068744U CN203205453U CN 203205453 U CN203205453 U CN 203205453U CN 2013200687448 U CN2013200687448 U CN 2013200687448U CN 201320068744 U CN201320068744 U CN 201320068744U CN 203205453 U CN203205453 U CN 203205453U
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- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
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- H01L2224/17—Structure, shape, material or disposition of the bump connectors after the connecting process of a plurality of bump connectors
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
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- Engineering & Computer Science (AREA)
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN2013200687448U CN203205453U (zh) | 2012-11-19 | 2013-02-06 | 一种半导体发光芯片、及半导体照明灯具 |
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CN201210468041.4 | 2012-11-19 | ||
CN201210468041 | 2012-11-19 | ||
CN2013200687448U CN203205453U (zh) | 2012-11-19 | 2013-02-06 | 一种半导体发光芯片、及半导体照明灯具 |
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CN203205453U true CN203205453U (zh) | 2013-09-18 |
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CN2013200687448U Expired - Fee Related CN203205453U (zh) | 2012-11-19 | 2013-02-06 | 一种半导体发光芯片、及半导体照明灯具 |
CN201310047522.2A Active CN103824923B (zh) | 2012-11-19 | 2013-02-06 | 一种半导体发光芯片、半导体照明灯具及其制造方法 |
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CN201310047522.2A Active CN103824923B (zh) | 2012-11-19 | 2013-02-06 | 一种半导体发光芯片、半导体照明灯具及其制造方法 |
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104752594A (zh) * | 2013-12-25 | 2015-07-01 | 宝钢金属有限公司 | 一种用于ac-led芯片结构倒装焊金属层的制作方法 |
CN104752578A (zh) * | 2013-12-25 | 2015-07-01 | 宝钢金属有限公司 | 一种用于ac-led芯片结构倒装焊金属层结构 |
WO2015154648A1 (zh) * | 2014-04-08 | 2015-10-15 | 浙江聚光科技有限公司 | 一种可焊接型led基板 |
CN105304807A (zh) * | 2014-07-18 | 2016-02-03 | 首尔伟傲世有限公司 | 发光二极管、发光装置及其制造方法 |
CN107304981A (zh) * | 2016-04-20 | 2017-10-31 | 通用电气照明解决方案有限公司 | 照明装置 |
US9941455B2 (en) | 2014-06-03 | 2018-04-10 | Seoul Viosys Co., Ltd. | Light emitting diode and light emitting device including the same |
Families Citing this family (10)
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US10658546B2 (en) * | 2015-01-21 | 2020-05-19 | Cree, Inc. | High efficiency LEDs and methods of manufacturing |
CN105742465A (zh) * | 2016-04-15 | 2016-07-06 | 深圳大道半导体有限公司 | 半导体发光芯片 |
CN105742469A (zh) * | 2016-04-15 | 2016-07-06 | 深圳大道半导体有限公司 | 半导体发光芯片 |
US10535799B2 (en) | 2017-05-09 | 2020-01-14 | Epistar Corporation | Semiconductor device |
CN108011005A (zh) * | 2017-11-10 | 2018-05-08 | 深圳大道半导体有限公司 | 半导体发光器件及其制造方法 |
US10892296B2 (en) * | 2017-11-27 | 2021-01-12 | Seoul Viosys Co., Ltd. | Light emitting device having commonly connected LED sub-units |
US10892297B2 (en) | 2017-11-27 | 2021-01-12 | Seoul Viosys Co., Ltd. | Light emitting diode (LED) stack for a display |
CN108916667B (zh) * | 2018-05-22 | 2020-03-24 | 东莞市闻誉实业有限公司 | 照明灯 |
CN109185749A (zh) * | 2018-09-13 | 2019-01-11 | 中国科学院深海科学与工程研究所 | 一种全海深水下照明灯具 |
CN112701202A (zh) * | 2021-03-23 | 2021-04-23 | 北京芯海视界三维科技有限公司 | 发光单元、发光模组、显示模组、显示屏及显示器 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
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CN2434788Y (zh) * | 1999-11-09 | 2001-06-13 | 洲磊科技股份有限公司 | 发光二极管装置 |
CN100544014C (zh) * | 2006-09-13 | 2009-09-23 | 海立尔股份有限公司 | 发光二极管结构 |
CN201392846Y (zh) * | 2009-04-29 | 2010-01-27 | 山东华光光电子有限公司 | 硅衬底上外延生长的铝镓铟磷发光二极管 |
CN101944491A (zh) * | 2009-07-08 | 2011-01-12 | 景华管理顾问股份有限公司 | 发光模块的制造方法 |
CN101997074A (zh) * | 2010-07-30 | 2011-03-30 | 晶科电子(广州)有限公司 | 一种基于硅基板的led表面贴片式封装结构及其封装方法 |
CN102130284A (zh) * | 2010-09-28 | 2011-07-20 | 映瑞光电科技(上海)有限公司 | 单色led芯片及其制作方法 |
CN102034925B (zh) * | 2010-10-28 | 2013-04-03 | 山东华光光电子有限公司 | 平板倒装焊GaN基LED芯片结构 |
CN102244175A (zh) * | 2011-07-08 | 2011-11-16 | 泉州市金太阳电子科技有限公司 | 发光二极管及其制造方法 |
CN202469637U (zh) * | 2012-03-04 | 2012-10-03 | 郭鹏超 | 具有良好散热性的led灯具 |
-
2013
- 2013-02-06 CN CN2013200687448U patent/CN203205453U/zh not_active Expired - Fee Related
- 2013-02-06 CN CN201310047522.2A patent/CN103824923B/zh active Active
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104752594A (zh) * | 2013-12-25 | 2015-07-01 | 宝钢金属有限公司 | 一种用于ac-led芯片结构倒装焊金属层的制作方法 |
CN104752578A (zh) * | 2013-12-25 | 2015-07-01 | 宝钢金属有限公司 | 一种用于ac-led芯片结构倒装焊金属层结构 |
CN104752594B (zh) * | 2013-12-25 | 2017-11-10 | 宝钢金属有限公司 | 一种用于ac‑led芯片结构倒装焊金属层的制作方法 |
WO2015154648A1 (zh) * | 2014-04-08 | 2015-10-15 | 浙江聚光科技有限公司 | 一种可焊接型led基板 |
US9941455B2 (en) | 2014-06-03 | 2018-04-10 | Seoul Viosys Co., Ltd. | Light emitting diode and light emitting device including the same |
CN105304807A (zh) * | 2014-07-18 | 2016-02-03 | 首尔伟傲世有限公司 | 发光二极管、发光装置及其制造方法 |
CN105304807B (zh) * | 2014-07-18 | 2018-04-20 | 首尔伟傲世有限公司 | 发光二极管、发光装置及其制造方法 |
CN107304981A (zh) * | 2016-04-20 | 2017-10-31 | 通用电气照明解决方案有限公司 | 照明装置 |
US10400961B2 (en) | 2016-04-20 | 2019-09-03 | Current Lighting Solutions, Llc | Double-sided LED lighting device |
Also Published As
Publication number | Publication date |
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CN103824923A (zh) | 2014-05-28 |
CN103824923B (zh) | 2016-11-09 |
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