JP2006024756A - 冷却モジュール - Google Patents
冷却モジュール Download PDFInfo
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- JP2006024756A JP2006024756A JP2004201721A JP2004201721A JP2006024756A JP 2006024756 A JP2006024756 A JP 2006024756A JP 2004201721 A JP2004201721 A JP 2004201721A JP 2004201721 A JP2004201721 A JP 2004201721A JP 2006024756 A JP2006024756 A JP 2006024756A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
【解決手段】伝熱部材21に沿って吸熱室42、放熱室43、冷媒溜まり室62および循環ポンプ室63は区画される。吸熱室42で伝熱部材21に冷却対象物13が接触する。冷却対象物13の熱は冷媒に受け渡される。続いて冷媒は伝熱部材21に沿って放熱室43まで導かれる。冷媒は伝熱部材21から徐々に熱を奪っていく。その後、冷媒は放熱室43に導入される。放熱室43では冷媒から熱が奪い取られる。冷媒は冷却される。冷却後の冷媒は再び循環ポンプ室63から吸熱室42まで導かれる。こうした冷却サイクルが繰り返される結果、冷却モジュールでは効率的に冷却は実現される。伝熱部材21上で吸熱室42、放熱室43および循環ポンプ室63は並列に配置されることから、冷却モジュールの高さは最小限に抑制される。
【選択図】図4
Description
Claims (5)
- 部分的に熱伝導性を有する伝熱部材と、伝熱部材に沿って区画され、冷媒に熱エネルギを受け渡す吸熱室と、伝熱部材に沿って吸熱室に並列に区画され、冷媒から熱エネルギを奪う放熱室と、伝熱部材に沿って吸熱室に並列に区画される循環ポンプ室と、循環ポンプ室に収容されて、吸熱室および放熱室に冷媒を循環させる循環ポンプとを備えることを特徴とする冷却モジュール。
- 請求項1に記載の冷却モジュールにおいて、吸熱室および放熱室の間で伝熱部材に向き合わせられ、吸熱室から放熱室に向かう冷媒の流路を形成する補助部材をさらに備えることを特徴とする冷却モジュール。
- 請求項1に記載の冷却モジュールにおいて、伝熱部材に沿って放熱室に並列に区画され、放熱室から吐き出される冷媒を溜める冷媒溜まり室をさらに備えることを特徴とする冷却モジュール。
- 平板状の上側伝熱部材と、上側伝熱部材に向き合わせられる平板状の下側伝熱部材と、上側および下側伝熱部材の間に区画され、冷媒に熱エネルギを受け渡す吸熱室と、上側および下側伝熱部材の間で吸熱室に並列に区画され、冷媒から熱エネルギを奪う放熱室とを備えることを特徴とする冷却モジュール。
- 第1流路に曝される外壁面で少なくとも部分的に区画され、冷媒に熱エネルギを受け渡す吸熱室と、第2流路に曝される外壁面で少なくとも部分的に区画され、冷媒から熱エネルギを奪う放熱室と、第1流路および第2流路を連結する空間に配置される送風ファンとを備えることを特徴とする冷却モジュール。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004201721A JP4549759B2 (ja) | 2004-07-08 | 2004-07-08 | 冷却モジュール |
US10/990,653 US7222661B2 (en) | 2004-07-08 | 2004-11-18 | Cooling module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004201721A JP4549759B2 (ja) | 2004-07-08 | 2004-07-08 | 冷却モジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006024756A true JP2006024756A (ja) | 2006-01-26 |
JP4549759B2 JP4549759B2 (ja) | 2010-09-22 |
Family
ID=35540103
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004201721A Expired - Fee Related JP4549759B2 (ja) | 2004-07-08 | 2004-07-08 | 冷却モジュール |
Country Status (2)
Country | Link |
---|---|
US (1) | US7222661B2 (ja) |
JP (1) | JP4549759B2 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110637507A (zh) * | 2017-11-21 | 2019-12-31 | 扎尔曼技术株式会社 | 电子元件用水冷式冷却器的水泵 |
JP7268124B1 (ja) | 2021-12-09 | 2023-05-02 | レノボ・シンガポール・プライベート・リミテッド | 電子機器及び冷却モジュール |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4214106B2 (ja) * | 2004-11-17 | 2009-01-28 | 富士通株式会社 | 電子装置の冷却装置 |
CN100371854C (zh) * | 2004-12-24 | 2008-02-27 | 富准精密工业(深圳)有限公司 | 液冷式散热装置 |
US7325591B2 (en) * | 2005-02-18 | 2008-02-05 | Cooler Master Co., Ltd. | Liquid-cooling heat dissipation apparatus |
CN100584166C (zh) * | 2005-05-07 | 2010-01-20 | 富准精密工业(深圳)有限公司 | 液冷散热装置 |
TWI296187B (en) * | 2005-07-29 | 2008-04-21 | Foxconn Tech Co Ltd | Integrated liquid cooling system |
US7637312B1 (en) * | 2005-08-04 | 2009-12-29 | Sun Microsystems, Inc. | Unitary field-replaceable active integrated liquid pump heat sink module for thermal management of electronic components |
CN100499974C (zh) * | 2005-08-10 | 2009-06-10 | 富准精密工业(深圳)有限公司 | 整合式液冷散热装置 |
JP4593438B2 (ja) * | 2005-10-24 | 2010-12-08 | 富士通株式会社 | 電子機器および冷却モジュール |
US20080135216A1 (en) * | 2006-12-07 | 2008-06-12 | Chunbo Zhang | Miniature actuator integration for liquid cooling |
EP2535928A3 (de) * | 2007-04-26 | 2014-08-20 | CeramTec GmbH | Kühldose für Bauelemente oder Schaltungen |
US20090205809A1 (en) * | 2008-02-19 | 2009-08-20 | Man Zai Industrial Co., Ltd. | Liquid cooling device |
CN101754654A (zh) * | 2008-12-08 | 2010-06-23 | 富准精密工业(深圳)有限公司 | 传热基板及具有该传热基板的散热装置 |
CN102135117A (zh) * | 2010-01-23 | 2011-07-27 | 富准精密工业(深圳)有限公司 | 离心风扇 |
CN102402263A (zh) * | 2010-09-10 | 2012-04-04 | 鸿富锦精密工业(深圳)有限公司 | 散热装置 |
TWI426861B (zh) * | 2011-04-08 | 2014-02-11 | Sunonwealth Electr Mach Ind Co | 具有水平對流扇之散熱系統 |
CN103188916A (zh) * | 2011-12-30 | 2013-07-03 | 鸿富锦精密工业(深圳)有限公司 | 散热装置及带有该散热装置的电子设备 |
CN203327457U (zh) * | 2013-05-20 | 2013-12-04 | 中兴通讯股份有限公司 | 一种散热装置 |
US20150330718A1 (en) * | 2013-08-28 | 2015-11-19 | Hamilton Sundstrand Corporation | Integrated blower diffuser-fin single phase heat exchanger |
US9677820B2 (en) * | 2015-05-11 | 2017-06-13 | Cooler Master Co., Ltd. | Electronic device and liquid cooling heat dissipation structure thereof |
CN105263301B (zh) * | 2015-11-12 | 2017-12-19 | 深圳市研派科技有限公司 | 一种液冷散热系统及其液体散热排 |
TWM523889U (zh) * | 2015-11-27 | 2016-06-11 | 台達電子工業股份有限公司 | 散熱裝置與可攜式電子裝置 |
CN107013467B (zh) | 2016-01-27 | 2019-09-10 | 讯凯国际股份有限公司 | 热交换模块及其串联泵 |
US10058007B2 (en) * | 2016-09-26 | 2018-08-21 | Asia Vital Components Co., Ltd. | Water-cooling radiator unit and water-cooling module using same |
CN108022895A (zh) * | 2017-12-25 | 2018-05-11 | 奇鋐科技股份有限公司 | 水冷排散热结构 |
US20190215986A1 (en) * | 2018-01-11 | 2019-07-11 | Asia Vital Components Co., Ltd. | Water-cooling radiator assembly |
US20190215987A1 (en) * | 2018-01-11 | 2019-07-11 | Asia Vital Components Co., Ltd. | Water-cooling radiator structure |
US10921067B2 (en) * | 2018-01-11 | 2021-02-16 | Asia Vital Components Co., Ltd | Water-cooling radiator structure with internal partition member |
US10524386B1 (en) * | 2018-06-12 | 2019-12-31 | Arctic (Hk) Ltd | Water cooler assembly and system |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0387365U (ja) * | 1989-12-22 | 1991-09-05 | ||
JP2001196778A (ja) * | 1999-11-08 | 2001-07-19 | Samsung Electronics Co Ltd | Cplによる冷却装置 |
JP2004047809A (ja) * | 2002-07-12 | 2004-02-12 | Toshiba Corp | 発熱素子冷却装置及び電子機器 |
JP2004134742A (ja) * | 2002-08-16 | 2004-04-30 | Nec Corp | 電子機器の冷却装置 |
JP2004140061A (ja) * | 2002-10-16 | 2004-05-13 | Toshiba Home Technology Corp | 冷却モジュール |
Family Cites Families (16)
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JP3068892B2 (ja) | 1991-07-08 | 2000-07-24 | 株式会社東芝 | 自動配線方法 |
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JPH0832263A (ja) | 1994-07-20 | 1996-02-02 | Fujitsu Ltd | 発熱体パッケージの冷却構造 |
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JP2002368471A (ja) | 2001-06-05 | 2002-12-20 | Matsushita Electric Ind Co Ltd | 冷却装置 |
US20030121645A1 (en) * | 2001-12-28 | 2003-07-03 | Tien-Lai Wang | Heat dissipater for a central processing unit |
US6648064B1 (en) * | 2002-11-14 | 2003-11-18 | Lsi Logic Corporation | Active heat sink |
TW577586U (en) * | 2003-01-22 | 2004-02-21 | Hon Hai Prec Ind Co Ltd | Liquid cooling device |
TWM246989U (en) * | 2003-10-28 | 2004-10-11 | Hon Hai Prec Ind Co Ltd | Liquid cooling apparatus |
JP4409976B2 (ja) * | 2004-02-03 | 2010-02-03 | 山洋電気株式会社 | 電子部品冷却装置 |
TWM252981U (en) * | 2004-02-25 | 2004-12-11 | Ruei-Fu Jeng | Improved water basin structure of liquid cooler |
US6957692B1 (en) * | 2004-08-31 | 2005-10-25 | Inventec Corporation | Heat-dissipating device |
-
2004
- 2004-07-08 JP JP2004201721A patent/JP4549759B2/ja not_active Expired - Fee Related
- 2004-11-18 US US10/990,653 patent/US7222661B2/en not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0387365U (ja) * | 1989-12-22 | 1991-09-05 | ||
JP2001196778A (ja) * | 1999-11-08 | 2001-07-19 | Samsung Electronics Co Ltd | Cplによる冷却装置 |
JP2004047809A (ja) * | 2002-07-12 | 2004-02-12 | Toshiba Corp | 発熱素子冷却装置及び電子機器 |
JP2004134742A (ja) * | 2002-08-16 | 2004-04-30 | Nec Corp | 電子機器の冷却装置 |
JP2004140061A (ja) * | 2002-10-16 | 2004-05-13 | Toshiba Home Technology Corp | 冷却モジュール |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110637507A (zh) * | 2017-11-21 | 2019-12-31 | 扎尔曼技术株式会社 | 电子元件用水冷式冷却器的水泵 |
JP7268124B1 (ja) | 2021-12-09 | 2023-05-02 | レノボ・シンガポール・プライベート・リミテッド | 電子機器及び冷却モジュール |
JP2023085987A (ja) * | 2021-12-09 | 2023-06-21 | レノボ・シンガポール・プライベート・リミテッド | 電子機器及び冷却モジュール |
US12108561B2 (en) | 2021-12-09 | 2024-10-01 | Lenovo (Singapore) Pte. Ltd. | Electronic apparatus and cooling module |
Also Published As
Publication number | Publication date |
---|---|
US7222661B2 (en) | 2007-05-29 |
US20060005945A1 (en) | 2006-01-12 |
JP4549759B2 (ja) | 2010-09-22 |
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