JP2006024601A5 - - Google Patents

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Publication number
JP2006024601A5
JP2006024601A5 JP2004198932A JP2004198932A JP2006024601A5 JP 2006024601 A5 JP2006024601 A5 JP 2006024601A5 JP 2004198932 A JP2004198932 A JP 2004198932A JP 2004198932 A JP2004198932 A JP 2004198932A JP 2006024601 A5 JP2006024601 A5 JP 2006024601A5
Authority
JP
Japan
Prior art keywords
semiconductor substrate
type
insulating film
type region
gate electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2004198932A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006024601A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2004198932A priority Critical patent/JP2006024601A/ja
Priority claimed from JP2004198932A external-priority patent/JP2006024601A/ja
Priority to US11/172,696 priority patent/US7282768B2/en
Publication of JP2006024601A publication Critical patent/JP2006024601A/ja
Publication of JP2006024601A5 publication Critical patent/JP2006024601A5/ja
Withdrawn legal-status Critical Current

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JP2004198932A 2004-07-06 2004-07-06 電界効果型mosトランジスタ Withdrawn JP2006024601A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2004198932A JP2006024601A (ja) 2004-07-06 2004-07-06 電界効果型mosトランジスタ
US11/172,696 US7282768B2 (en) 2004-07-06 2005-07-01 MOS field-effect transistor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004198932A JP2006024601A (ja) 2004-07-06 2004-07-06 電界効果型mosトランジスタ

Publications (2)

Publication Number Publication Date
JP2006024601A JP2006024601A (ja) 2006-01-26
JP2006024601A5 true JP2006024601A5 (enExample) 2007-05-31

Family

ID=35540410

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004198932A Withdrawn JP2006024601A (ja) 2004-07-06 2004-07-06 電界効果型mosトランジスタ

Country Status (2)

Country Link
US (1) US7282768B2 (enExample)
JP (1) JP2006024601A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007324305A (ja) 2006-05-31 2007-12-13 Fujifilm Corp 半導体素子、半導体素子の製造方法
JP5460279B2 (ja) * 2009-12-11 2014-04-02 株式会社日立製作所 半導体装置およびその製造方法
JP6270607B2 (ja) * 2014-04-18 2018-01-31 ルネサスエレクトロニクス株式会社 半導体装置および半導体装置の製造方法
DE102016004338B4 (de) * 2016-04-13 2019-03-21 Drägerwerk AG & Co. KGaA Verwendung eines Gassensor für Anästhesiegasse
US10886405B2 (en) 2016-12-07 2021-01-05 Macronix International Co., Ltd. Semiconductor structure

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3999212A (en) * 1967-03-03 1976-12-21 Hitachi, Ltd. Field effect semiconductor device having a protective diode
JPS54101294A (en) * 1978-01-27 1979-08-09 Hitachi Ltd Dummy mos semiconductor device
JPH05308139A (ja) * 1992-04-01 1993-11-19 Nec Corp 半導体装置
JPH07202181A (ja) * 1993-12-28 1995-08-04 Rohm Co Ltd ゲート絶縁膜保護ダイオードを有するmosfetおよびmosfetの層間絶縁膜形成方法
US5536958A (en) * 1995-05-02 1996-07-16 Motorola, Inc. Semiconductor device having high voltage protection capability
JP3489602B2 (ja) * 1995-07-28 2004-01-26 関西日本電気株式会社 半導体装置およびその製造方法
JPH1041526A (ja) * 1996-07-18 1998-02-13 New Japan Radio Co Ltd 半導体装置およびその製造方法
JP3758366B2 (ja) * 1998-05-20 2006-03-22 富士通株式会社 半導体装置
JP4054155B2 (ja) * 2000-02-01 2008-02-27 三菱電機株式会社 半導体装置

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