JP2006011573A - 配線基板設計における条件表示方法及び配線基板 - Google Patents

配線基板設計における条件表示方法及び配線基板 Download PDF

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Publication number
JP2006011573A
JP2006011573A JP2004184397A JP2004184397A JP2006011573A JP 2006011573 A JP2006011573 A JP 2006011573A JP 2004184397 A JP2004184397 A JP 2004184397A JP 2004184397 A JP2004184397 A JP 2004184397A JP 2006011573 A JP2006011573 A JP 2006011573A
Authority
JP
Japan
Prior art keywords
wiring board
height
area
gap
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004184397A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006011573A5 (enExample
Inventor
Takafumi Okayama
尚文 岡山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Orion Electric Co Ltd
Original Assignee
Orion Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Orion Electric Co Ltd filed Critical Orion Electric Co Ltd
Priority to JP2004184397A priority Critical patent/JP2006011573A/ja
Priority to US11/157,822 priority patent/US20050284653A1/en
Publication of JP2006011573A publication Critical patent/JP2006011573A/ja
Publication of JP2006011573A5 publication Critical patent/JP2006011573A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10515—Stacked components

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
JP2004184397A 2004-06-23 2004-06-23 配線基板設計における条件表示方法及び配線基板 Pending JP2006011573A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2004184397A JP2006011573A (ja) 2004-06-23 2004-06-23 配線基板設計における条件表示方法及び配線基板
US11/157,822 US20050284653A1 (en) 2004-06-23 2005-06-22 Condition display method and wiring board for wiring board design

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004184397A JP2006011573A (ja) 2004-06-23 2004-06-23 配線基板設計における条件表示方法及び配線基板

Publications (2)

Publication Number Publication Date
JP2006011573A true JP2006011573A (ja) 2006-01-12
JP2006011573A5 JP2006011573A5 (enExample) 2007-03-15

Family

ID=35504373

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004184397A Pending JP2006011573A (ja) 2004-06-23 2004-06-23 配線基板設計における条件表示方法及び配線基板

Country Status (2)

Country Link
US (1) US20050284653A1 (enExample)
JP (1) JP2006011573A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4763486B2 (ja) * 2006-03-17 2011-08-31 株式会社日立製作所 ケーブルカード装着装置及びテレビジョン受信機
JP4681527B2 (ja) * 2006-09-28 2011-05-11 富士通株式会社 高さ制限領域情報作成装置、高さ制限領域情報作成方法および高さ制限領域情報作成プログラム
CN104133967A (zh) * 2014-08-01 2014-11-05 浪潮集团有限公司 一种PCB封装丝印设置及pin脚丝印定位检查方法
US12342469B2 (en) * 2020-03-16 2025-06-24 Fuji Corporation Management device, mounting system, and management method

Also Published As

Publication number Publication date
US20050284653A1 (en) 2005-12-29

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