JP2005538210A5 - - Google Patents

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Publication number
JP2005538210A5
JP2005538210A5 JP2004534230A JP2004534230A JP2005538210A5 JP 2005538210 A5 JP2005538210 A5 JP 2005538210A5 JP 2004534230 A JP2004534230 A JP 2004534230A JP 2004534230 A JP2004534230 A JP 2004534230A JP 2005538210 A5 JP2005538210 A5 JP 2005538210A5
Authority
JP
Japan
Prior art keywords
thermal interface
interface material
compound
paste
material according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004534230A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005538210A (ja
Filing date
Publication date
Priority claimed from US10/242,139 external-priority patent/US6797382B2/en
Application filed filed Critical
Publication of JP2005538210A publication Critical patent/JP2005538210A/ja
Publication of JP2005538210A5 publication Critical patent/JP2005538210A5/ja
Pending legal-status Critical Current

Links

JP2004534230A 2002-09-09 2003-06-19 サーマルインターフェース材料 Pending JP2005538210A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/242,139 US6797382B2 (en) 1999-12-01 2002-09-09 Thermal interface materials
PCT/US2003/019665 WO2004022330A1 (en) 2002-09-09 2003-06-19 Thermal interface materials

Publications (2)

Publication Number Publication Date
JP2005538210A JP2005538210A (ja) 2005-12-15
JP2005538210A5 true JP2005538210A5 (https=) 2006-04-20

Family

ID=31977760

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004534230A Pending JP2005538210A (ja) 2002-09-09 2003-06-19 サーマルインターフェース材料

Country Status (7)

Country Link
US (1) US6797382B2 (https=)
EP (1) EP1542862A4 (https=)
JP (1) JP2005538210A (https=)
KR (4) KR100854178B1 (https=)
CN (1) CN1307048C (https=)
AU (1) AU2003243715A1 (https=)
WO (1) WO2004022330A1 (https=)

Families Citing this family (45)

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US6673434B2 (en) * 1999-12-01 2004-01-06 Honeywell International, Inc. Thermal interface materials
US7608324B2 (en) * 2001-05-30 2009-10-27 Honeywell International Inc. Interface materials and methods of production and use thereof
DE10324156A1 (de) * 2003-05-22 2004-12-16 Siemens Ag Verfahren und Anordnung zum thermischen Schutz elektronischer Einheiten in einem elektronischen Gerät
TWI268526B (en) * 2003-12-05 2006-12-11 Au Optronics Corp Plasma display
US6927249B1 (en) * 2004-02-11 2005-08-09 Lg Chem, Ltd. Heat absorb-release plastic resin composition and molded product thereof
US7312261B2 (en) * 2004-05-11 2007-12-25 International Business Machines Corporation Thermal interface adhesive and rework
US20060014309A1 (en) * 2004-07-13 2006-01-19 Sachdev Krishna G Temporary chip attach method using reworkable conductive adhesive interconnections
US7269015B2 (en) * 2005-02-01 2007-09-11 Tyco Electronics Corporation Heat sink interface insert
US8384210B1 (en) 2005-06-07 2013-02-26 Advanced Micro Devices, Inc. Thermal interface material and semiconductor component including the thermal interface material
US20070051773A1 (en) * 2005-09-02 2007-03-08 Ruchert Brian D Thermal interface materials, methods of preparation thereof and their applications
EP1839469A2 (en) * 2005-11-01 2007-10-03 Techfilm, LLC Thermal interface material with multiple size distribution thermally conductive fillers
TWI291480B (en) * 2005-12-20 2007-12-21 Ind Tech Res Inst Composition for thermal interface materials
US20070178255A1 (en) * 2006-01-31 2007-08-02 Farrow Timothy S Apparatus, system, and method for thermal conduction interfacing
WO2008030910A1 (en) * 2006-09-08 2008-03-13 Lord Corporation Flexible microelectronics adhesive
US20080166552A1 (en) * 2006-11-06 2008-07-10 Arlon, Inc. Silicone based compositions for thermal interface materials
US8702919B2 (en) * 2007-08-13 2014-04-22 Honeywell International Inc. Target designs and related methods for coupled target assemblies, methods of production and uses thereof
US8143523B2 (en) 2008-10-21 2012-03-27 Baker Hughes Incorporated Downhole cable with thermally conductive polymer composites
US20100112360A1 (en) * 2008-10-31 2010-05-06 Delano Andrew D Layered thermal interface systems methods of production and uses thereof
US7816785B2 (en) * 2009-01-22 2010-10-19 International Business Machines Corporation Low compressive force, non-silicone, high thermal conducting formulation for thermal interface material and package
AU2009351622B2 (en) 2009-08-31 2013-03-14 Colgate-Palmolive Company Surface modified pigment
MX2012001942A (es) * 2009-08-31 2012-05-08 Colgate Palmolive Co Pigmento con modificacion de la superficie.
JP5218375B2 (ja) * 2009-11-04 2013-06-26 横浜ゴム株式会社 熱伝導性組成物
TWI475103B (zh) * 2009-12-15 2015-03-01 財團法人工業技術研究院 散熱結構
US10087351B2 (en) 2010-02-23 2018-10-02 Laird Technologies, Inc. Materials including thermally reversible gels
US9771508B2 (en) 2010-02-23 2017-09-26 Laird Technologies, Inc. Thermal interface materials including thermally reversible gels
US9260645B2 (en) * 2010-02-23 2016-02-16 Laird Technologies, Inc. Thermal interface materials including thermally reversible gels
US8471575B2 (en) 2010-04-30 2013-06-25 International Business Machines Corporation Methodologies and test configurations for testing thermal interface materials
US8686749B2 (en) * 2010-04-30 2014-04-01 International Business Machines Corporation Thermal interface material, test structure and method of use
CN103140561B (zh) * 2010-09-29 2016-08-10 英派尔科技开发有限公司 陶瓷纳米管合成物中的相变能量存储
US8916419B2 (en) 2012-03-29 2014-12-23 Taiwan Semiconductor Manufacturing Company, Ltd. Lid attach process and apparatus for fabrication of semiconductor packages
US9515004B2 (en) * 2013-03-15 2016-12-06 Laird Technologies, Inc. Thermal interface materials
US10174433B2 (en) 2013-12-05 2019-01-08 Honeywell International Inc. Stannous methanesulfonate solution with adjusted pH
EP3105300B1 (en) * 2014-02-13 2019-08-21 Honeywell International Inc. Compressible thermal interface materials
WO2016004565A1 (en) 2014-07-07 2016-01-14 Honeywell International Inc. Thermal interface material with ion scavenger
JP6542891B2 (ja) 2014-12-05 2019-07-10 ハネウェル・インターナショナル・インコーポレーテッドＨｏｎｅｙｗｅｌｌ Ｉｎｔｅｒｎａｔｉｏｎａｌ Ｉｎｃ． 低い熱インピーダンスを有する高性能熱界面材料
CA2980023A1 (en) 2015-03-18 2016-09-22 Blake Teipel Flexible and compliant thermal interface materials
ITUB20154204A1 (it) * 2015-10-07 2017-04-07 Bridgestone Corp Pneumatico con migliorata resistenza alla degradazione termica
US10312177B2 (en) 2015-11-17 2019-06-04 Honeywell International Inc. Thermal interface materials including a coloring agent
US10781349B2 (en) 2016-03-08 2020-09-22 Honeywell International Inc. Thermal interface material including crosslinker and multiple fillers
US10501671B2 (en) 2016-07-26 2019-12-10 Honeywell International Inc. Gel-type thermal interface material
US11041103B2 (en) * 2017-09-08 2021-06-22 Honeywell International Inc. Silicone-free thermal gel
US10428256B2 (en) 2017-10-23 2019-10-01 Honeywell International Inc. Releasable thermal gel
US11072706B2 (en) 2018-02-15 2021-07-27 Honeywell International Inc. Gel-type thermal interface material
WO2020190350A1 (en) * 2019-03-15 2020-09-24 Insolcorp, Llc Phase change material products
US11373921B2 (en) 2019-04-23 2022-06-28 Honeywell International Inc. Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing

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US5194480A (en) 1991-05-24 1993-03-16 W. R. Grace & Co.-Conn. Thermally conductive elastomer
BR9916210A (pt) * 1998-12-15 2001-11-06 Parker Hannifin Corp Método de aplicação de um material de interface térmica de mudança de fase
US6238596B1 (en) * 1999-03-09 2001-05-29 Johnson Matthey Electronics, Inc. Compliant and crosslinkable thermal interface materials
US5989459A (en) 1999-03-09 1999-11-23 Johnson Matthey, Inc. Compliant and crosslinkable thermal interface materials
US6451422B1 (en) * 1999-12-01 2002-09-17 Johnson Matthey, Inc. Thermal interface materials
US6673434B2 (en) 1999-12-01 2004-01-06 Honeywell International, Inc. Thermal interface materials

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