JP2005536590A - 改良された貯蔵寿命を有するエポキシ組成物およびそれらを含む物品 - Google Patents

改良された貯蔵寿命を有するエポキシ組成物およびそれらを含む物品 Download PDF

Info

Publication number
JP2005536590A
JP2005536590A JP2004529504A JP2004529504A JP2005536590A JP 2005536590 A JP2005536590 A JP 2005536590A JP 2004529504 A JP2004529504 A JP 2004529504A JP 2004529504 A JP2004529504 A JP 2004529504A JP 2005536590 A JP2005536590 A JP 2005536590A
Authority
JP
Japan
Prior art keywords
composition
shelf life
epoxy
extended shelf
hydroxyl
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004529504A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005536590A5 (https=
Inventor
アール. メイヤー,スコット
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of JP2005536590A publication Critical patent/JP2005536590A/ja
Publication of JP2005536590A5 publication Critical patent/JP2005536590A5/ja
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62Alcohols or phenols
    • C08G59/621Phenols
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35Heat-activated
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • C08L2666/16Addition or condensation polymers of aldehydes or ketones according to C08L59/00 - C08L61/00; Derivatives thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/14Layer or component removable to expose adhesive

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Sealing Material Composition (AREA)
  • Paints Or Removers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2004529504A 2002-08-19 2003-08-18 改良された貯蔵寿命を有するエポキシ組成物およびそれらを含む物品 Pending JP2005536590A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/223,493 US7094843B2 (en) 2002-08-19 2002-08-19 Epoxy compositions having improved shelf life and articles containing the same
PCT/US2003/025712 WO2004016703A1 (en) 2002-08-19 2003-08-18 Epoxy compositions having improved shelf life and articles containing the same

Publications (2)

Publication Number Publication Date
JP2005536590A true JP2005536590A (ja) 2005-12-02
JP2005536590A5 JP2005536590A5 (https=) 2006-10-05

Family

ID=31715163

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004529504A Pending JP2005536590A (ja) 2002-08-19 2003-08-18 改良された貯蔵寿命を有するエポキシ組成物およびそれらを含む物品

Country Status (9)

Country Link
US (1) US7094843B2 (https=)
EP (1) EP1530617B1 (https=)
JP (1) JP2005536590A (https=)
KR (1) KR20050044798A (https=)
CN (1) CN100387668C (https=)
AT (1) ATE331008T1 (https=)
AU (1) AU2003263863A1 (https=)
DE (1) DE60306386T2 (https=)
WO (1) WO2004016703A1 (https=)

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6310400B1 (en) * 1997-12-29 2001-10-30 Intel Corporation Apparatus for capacitively coupling electronic devices
US6620501B1 (en) * 2000-08-07 2003-09-16 L&L Products, Inc. Paintable seal system
US7473715B2 (en) 2001-05-02 2009-01-06 Zephyros, Inc. Two component (epoxy/amine) structural foam-in-place material
US6682818B2 (en) * 2001-08-24 2004-01-27 L&L Products, Inc. Paintable material
US20030050352A1 (en) * 2001-09-04 2003-03-13 Symyx Technologies, Inc. Foamed Polymer System employing blowing agent performance enhancer
US6846559B2 (en) * 2002-04-01 2005-01-25 L&L Products, Inc. Activatable material
US7004536B2 (en) * 2002-07-29 2006-02-28 L&L Products, Inc. Attachment system and method of forming same
US7125461B2 (en) 2003-05-07 2006-10-24 L & L Products, Inc. Activatable material for sealing, baffling or reinforcing and method of forming same
US7199165B2 (en) 2003-06-26 2007-04-03 L & L Products, Inc. Expandable material
US20050221046A1 (en) * 2004-04-01 2005-10-06 L&L Products, Inc. Sealant material
US8070994B2 (en) 2004-06-18 2011-12-06 Zephyros, Inc. Panel structure
US7838589B2 (en) * 2004-07-21 2010-11-23 Zephyros, Inc. Sealant material
US7521093B2 (en) * 2004-07-21 2009-04-21 Zephyros, Inc. Method of sealing an interface
US20060099360A1 (en) * 2004-11-05 2006-05-11 Pepsico, Inc. Dip, spray, and flow coating process for forming coated articles
US20080226866A1 (en) * 2007-03-15 2008-09-18 Zephyros, Inc. Sealant material
GB0806434D0 (en) 2008-04-09 2008-05-14 Zephyros Inc Improvements in or relating to structural adhesives
GB0916205D0 (en) 2009-09-15 2009-10-28 Zephyros Inc Improvements in or relating to cavity filling
WO2011109699A1 (en) 2010-03-04 2011-09-09 Zephyros, Inc. Structural composite laminate
EP2368955A1 (de) 2010-03-26 2011-09-28 Sika Technology AG Formgedächtnis-Material auf Basis eines Strukturklebstoffs
US20120006439A1 (en) * 2010-07-08 2012-01-12 Lmk Enterprises, Inc. Method and means for forming a liner
GB201012595D0 (en) 2010-07-27 2010-09-08 Zephyros Inc Oriented structural adhesives
RU2599399C2 (ru) 2010-12-30 2016-10-10 Юнайтед Стэйтс Джипсум Компани Распределитель суспензии, система и способ для их использования
US9999989B2 (en) 2010-12-30 2018-06-19 United States Gypsum Company Slurry distributor with a profiling mechanism, system, and method for using same
EP2658694B1 (en) 2010-12-30 2017-08-02 United States Gypsum Company Slurry distribution system and method
US10076853B2 (en) 2010-12-30 2018-09-18 United States Gypsum Company Slurry distributor, system, and method for using same
US10052793B2 (en) 2011-10-24 2018-08-21 United States Gypsum Company Slurry distributor, system, and method for using same
EP2688970A4 (en) * 2011-03-22 2014-09-17 Nano & Advanced Materials Inst Ltd NANO MATERIALS WITH HIGH PERFORMANCE CHIP APPLICATIONS FOR LEDS OF HIGH BRIGHTNESS
AR088522A1 (es) 2011-10-24 2014-06-18 United States Gypsum Co Molde para multiples piezas y metodo para construir un distribuidor de lechada
DK2771158T3 (en) 2011-10-24 2017-01-09 United States Gypsum Co DISCHARGE DISTRIBUTION PIPE FOR SUSPENSION DISTRIBUTION
KR20150143533A (ko) * 2013-04-17 2015-12-23 쓰리엠 이노베이티브 프로퍼티즈 컴파니 에폭시 접착제용 다중 가속화제계
CN105722933A (zh) 2013-07-26 2016-06-29 泽费罗斯股份有限公司 热固性粘合膜的改进或涉及它的改进
KR101488719B1 (ko) * 2013-11-15 2015-02-23 대한민국 (관리부서:국립문화재연구소) 절삭특성이 우수한 문화재 복원용 에폭시 퍼티 조성물
US10059033B2 (en) 2014-02-18 2018-08-28 United States Gypsum Company Cementitious slurry mixing and dispensing system with pulser assembly and method for using same
GB201417985D0 (en) 2014-10-10 2014-11-26 Zephyros Inc Improvements in or relating to structural adhesives
EP3218157A1 (en) 2014-11-14 2017-09-20 Zephyros Inc. Multi-shot injection molded method and product
EP3170657B1 (en) 2015-11-19 2020-09-09 3M Innovative Properties Company Multilayer structural adhesive film
US10695962B2 (en) 2016-03-18 2020-06-30 Zephyros, Inc. Members for directing expandable material for baffling, sealing, reinforcing
CN107962847B (zh) 2016-10-19 2020-06-26 泽费罗斯股份有限公司 声学吸收体复合隔板组件
WO2020194076A1 (en) 2019-03-28 2020-10-01 3M Innovative Properties Company Epoxide microcapsules with pickering emulsifiers
EP3947582A1 (en) 2019-03-28 2022-02-09 3M Innovative Properties Company Structural bonding tape with epoxide microcapsules
CN110408002A (zh) * 2019-08-27 2019-11-05 黄山五环科技有限公司 基于汽车轮毂涂膜用环氧树脂的制备方法

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5679170A (en) * 1979-11-28 1981-06-29 Yokohama Rubber Co Ltd:The Adhesive composition
JPS6270415A (ja) * 1985-07-31 1987-03-31 ザ ダウ ケミカル カンパニ− エポキシ樹脂組成物
JPH01254731A (ja) * 1988-04-04 1989-10-11 Fuji Kasei Kogyo Kk 一成分系加熱硬化性エポキシ樹脂組成物
JPH03195791A (ja) * 1989-12-25 1991-08-27 Lion Corp 一液型接着剤
JPH05121465A (ja) * 1991-10-28 1993-05-18 Hitachi Chem Co Ltd 導電性樹脂ペースト組成物およびこの組成物を用いた半導体装置
JPH05255654A (ja) * 1992-03-11 1993-10-05 Hitachi Chem Co Ltd 接着剤組成物
JPH10130370A (ja) * 1996-10-31 1998-05-19 Dainippon Ink & Chem Inc エポキシ樹脂組成物及び半導体封止材料
JPH11100563A (ja) * 1997-09-29 1999-04-13 Hitachi Chem Co Ltd 非導電性樹脂ペーストおよび半導体装置
JP2001106767A (ja) * 1999-10-07 2001-04-17 Sumitomo Bakelite Co Ltd 半導体用樹脂ペースト及びそれを用いた半導体装置

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3032527A (en) * 1958-08-29 1962-05-01 Greenlee Sylvan Owen Curable epoxide composition containing polyhydric phenol and cured product thereof
US3329737A (en) * 1964-03-09 1967-07-04 Minnesota Mining & Mfg Curable composition containing a polyepoxide and an allylic polyphenolic novolac, free of methylol groups
US3519576A (en) * 1966-11-23 1970-07-07 Minnesota Mining & Mfg Latent curing epoxy compositions containing a crystalline polyphenate salt of a polyamine and 2,4,4-trimethyl-2,4,7-trihydroxyflavan
US3779950A (en) * 1972-01-03 1973-12-18 Gen Electric Epoxy resin compositions
US4318766A (en) * 1975-09-02 1982-03-09 Minnesota Mining And Manufacturing Company Process of using photocopolymerizable compositions based on epoxy and hydroxyl-containing organic materials
JPH01272619A (ja) * 1987-07-22 1989-10-31 Mitsubishi Gas Chem Co Inc エポキシ樹脂組成物
US5086088A (en) * 1989-03-09 1992-02-04 Minnesota Mining And Manufacturing Company Epoxy-acrylate blend pressure-sensitive thermosetting adhesives
US5385990A (en) * 1992-11-02 1995-01-31 Lord Corporation Structural adhesive composition having high temperature resistance
US5527839A (en) * 1994-12-13 1996-06-18 Air Products And Chemicals, Inc. Self-emulsifying epoxy curing agent based on the reaction product of epoxy resin and polyether polyol
US5688905A (en) * 1995-09-20 1997-11-18 Air Products And Chemicals, Inc. Primary-tertiary diamines mixed with polyamines as epoxy resin hardeners
US5717011A (en) * 1995-12-14 1998-02-10 Minnesota Mining And Manufacturing Company Curing agent compositions and a method of making
US5733954A (en) * 1995-12-14 1998-03-31 Minnesota Mining And Manufacturing Company Epoxy resin curing agent made via aqueous dispersion of an epoxide and an imidazole
US5859153A (en) * 1996-06-21 1999-01-12 Minnesota Mining And Manufacturing Company Novolak compounds useful as adhesion promoters for epoxy resins
US5883193A (en) * 1997-07-01 1999-03-16 Minnesota Mining And Manufacturing Company Adhesive compositions with durability under conditions of high humidity
KR100635710B1 (ko) * 1997-08-01 2007-06-12 니폰 가야꾸 가부시끼가이샤 흑색 액정시일제 및 액정 셀
US5964979A (en) * 1997-08-15 1999-10-12 3M Innovative Properties Company Sealing method and article
US6136398A (en) * 1998-05-01 2000-10-24 3M Innovative Properties Company Energy cured sealant composition
US6486256B1 (en) 1998-10-13 2002-11-26 3M Innovative Properties Company Composition of epoxy resin, chain extender and polymeric toughener with separate base catalyst
US6248204B1 (en) * 1999-05-14 2001-06-19 Loctite Corporation Two part, reinforced, room temperature curable thermosetting epoxy resin compositions with improved adhesive strength and fracture toughness
US6855474B1 (en) * 2004-05-03 2005-02-15 Kodak Polychrome Graphics Llc Laser thermal color donors with improved aging characteristics

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5679170A (en) * 1979-11-28 1981-06-29 Yokohama Rubber Co Ltd:The Adhesive composition
JPS6270415A (ja) * 1985-07-31 1987-03-31 ザ ダウ ケミカル カンパニ− エポキシ樹脂組成物
JPH01254731A (ja) * 1988-04-04 1989-10-11 Fuji Kasei Kogyo Kk 一成分系加熱硬化性エポキシ樹脂組成物
JPH03195791A (ja) * 1989-12-25 1991-08-27 Lion Corp 一液型接着剤
JPH05121465A (ja) * 1991-10-28 1993-05-18 Hitachi Chem Co Ltd 導電性樹脂ペースト組成物およびこの組成物を用いた半導体装置
JPH05255654A (ja) * 1992-03-11 1993-10-05 Hitachi Chem Co Ltd 接着剤組成物
JPH10130370A (ja) * 1996-10-31 1998-05-19 Dainippon Ink & Chem Inc エポキシ樹脂組成物及び半導体封止材料
JPH11100563A (ja) * 1997-09-29 1999-04-13 Hitachi Chem Co Ltd 非導電性樹脂ペーストおよび半導体装置
JP2001106767A (ja) * 1999-10-07 2001-04-17 Sumitomo Bakelite Co Ltd 半導体用樹脂ペースト及びそれを用いた半導体装置

Also Published As

Publication number Publication date
DE60306386T2 (de) 2007-05-03
EP1530617B1 (en) 2006-06-21
US7094843B2 (en) 2006-08-22
EP1530617A1 (en) 2005-05-18
ATE331008T1 (de) 2006-07-15
WO2004016703A1 (en) 2004-02-26
CN100387668C (zh) 2008-05-14
KR20050044798A (ko) 2005-05-12
CN1675330A (zh) 2005-09-28
DE60306386D1 (de) 2006-08-03
AU2003263863A1 (en) 2004-03-03
US20040033324A1 (en) 2004-02-19

Similar Documents

Publication Publication Date Title
US7094843B2 (en) Epoxy compositions having improved shelf life and articles containing the same
US6057382A (en) Epoxy/thermoplastic photocurable adhesive composition
EP1075498B1 (en) Energy cured sealant composition
EP0620259B1 (en) Epoxy/polyester hot melt compositions
JP4870612B2 (ja) 溶融流動性材料および表面シーリング方法
CN104812860B (zh) 结构粘合剂膜
CN108350335B (zh) 具有改善的耐腐蚀性的结构粘合剂
TW201704407A (zh) 以具有連續聚合物相的黏著劑為特徵之膠帶
CN108138014B (zh) 用于结构性粘合的柔性压敏胶带
CA2823342A1 (en) Structural hybrid adhesives
JP2018532837A (ja) 構造用接着のための柔軟で接着性の平坦な形成物
JP5615519B2 (ja) 水性接着剤組成物
KR102532705B1 (ko) 저장 안정성, 반응성, 감압 접착 테이프
WO2011137241A1 (en) Metal panel assembly and method for making same
CN112175546B (zh) 热固化胶粘剂和由其制造的胶带
CN111902502A (zh) 基于环氧树脂组成的压敏性结构胶粘膜
CN113993959B (zh) 基于潜在反应性组合物的可压缩的压敏的结构性粘合膜
KR20040002942A (ko) 실링재 조성물, 실링재 및 그것을 함유하는 적층 구조체
JP2026504776A (ja) 低減されたvoc放出量を有する一成分系発泡性熱硬化性エポキシ組成物
MXPA97007754A (en) Materials that flow in a flowed form and a method for sealing superfic
JPH01282212A (ja) エポキシ樹脂組成物

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20060818

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20060818

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20100129

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20100223

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20100521

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20100528

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20101026