JP2005534803A5 - - Google Patents
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- Publication number
- JP2005534803A5 JP2005534803A5 JP2004505408A JP2004505408A JP2005534803A5 JP 2005534803 A5 JP2005534803 A5 JP 2005534803A5 JP 2004505408 A JP2004505408 A JP 2004505408A JP 2004505408 A JP2004505408 A JP 2004505408A JP 2005534803 A5 JP2005534803 A5 JP 2005534803A5
- Authority
- JP
- Japan
- Prior art keywords
- positive voltage
- signal
- target
- pulsed
- pulse
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 claims 8
- 239000011248 coating agent Substances 0.000 claims 4
- 238000000576 coating method Methods 0.000 claims 4
- 238000004544 sputter deposition Methods 0.000 claims 4
- 239000000758 substrate Substances 0.000 claims 3
- 150000002500 ions Chemical class 0.000 claims 2
- 238000005457 optimization Methods 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10222909A DE10222909A1 (de) | 2002-05-22 | 2002-05-22 | Sputterverfahren bzw. Vorrichtung zur Herstellung von eigenspannungsoptimierten Beschichtungen |
| PCT/EP2003/004572 WO2003097896A1 (de) | 2002-05-22 | 2003-04-30 | Sputterverfahren bzw. vorrichtung zur herstellung von eigenspannungsoptimierten beschichtungen |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005534803A JP2005534803A (ja) | 2005-11-17 |
| JP2005534803A5 true JP2005534803A5 (enExample) | 2006-06-22 |
Family
ID=29414081
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004505408A Pending JP2005534803A (ja) | 2002-05-22 | 2003-04-30 | 残留ストレス最適化被覆を形成するスパッタ方法及び装置 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US20070009670A9 (enExample) |
| EP (1) | EP1511877B1 (enExample) |
| JP (1) | JP2005534803A (enExample) |
| CN (1) | CN100577855C (enExample) |
| AT (1) | ATE481511T1 (enExample) |
| AU (1) | AU2003232242A1 (enExample) |
| DE (2) | DE10222909A1 (enExample) |
| TW (1) | TWI275655B (enExample) |
| WO (1) | WO2003097896A1 (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060278521A1 (en) * | 2005-06-14 | 2006-12-14 | Stowell Michael W | System and method for controlling ion density and energy using modulated power signals |
| KR101046520B1 (ko) | 2007-09-07 | 2011-07-04 | 어플라이드 머티어리얼스, 인코포레이티드 | 내부 챔버 상의 부산물 막 증착을 제어하기 위한 ｐｅｃｖｄ 시스템에서의 소스 가스 흐름 경로 제어 |
| DE102008060838A1 (de) | 2008-12-05 | 2010-06-10 | Zounek, Alexis, Dr. | Beschichtungsverfahren, Vorrichtung zur Durchführung des Verfahrens |
| US12297529B1 (en) | 2010-05-19 | 2025-05-13 | Corporation For National Research Initiatives | Method and system for controlling the state of stress in deposited thin films |
| DE102010034321B4 (de) * | 2010-08-09 | 2017-04-06 | Technische Universität Dresden | Verfahren zur Herstellung einer Hartstoffbeschichtung auf metallischen, keramischen oder hartmetallischen Bauteilen sowie eine mit dem Verfahren hergestellte Hartstoffbeschichtung |
| US8252680B2 (en) * | 2010-09-24 | 2012-08-28 | Intel Corporation | Methods and architectures for bottomless interconnect vias |
| US9399812B2 (en) * | 2011-10-11 | 2016-07-26 | Applied Materials, Inc. | Methods of preventing plasma induced damage during substrate processing |
| EP2867386A1 (en) | 2012-06-29 | 2015-05-06 | Oerlikon Advanced Technologies AG | Method of coating by pulsed bipolar sputtering |
| JP2021021120A (ja) * | 2019-07-29 | 2021-02-18 | 株式会社アルバック | スパッタリング方法及びスパッタリング装置 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06145975A (ja) * | 1992-03-20 | 1994-05-27 | Komag Inc | 炭素フィルムをスパタリングする方法及びその製造物 |
| JP2711503B2 (ja) * | 1993-07-07 | 1998-02-10 | アネルバ株式会社 | バイアススパッタによる薄膜形成方法 |
| DE4401986A1 (de) * | 1994-01-25 | 1995-07-27 | Dresden Vakuumtech Gmbh | Verfahren zum Betreiben eines Vakuumlichtbogenverdampfers und Stromversorgungseinrichtung dafür |
| JPH07224379A (ja) * | 1994-02-14 | 1995-08-22 | Ulvac Japan Ltd | スパッタ方法およびそのスパッタ装置 |
| JPH07243039A (ja) * | 1994-03-02 | 1995-09-19 | Chugai Ro Co Ltd | 直流マグネトロン型反応性スパッタ法 |
| JP3720061B2 (ja) * | 1994-03-24 | 2005-11-24 | 株式会社アルバック | 薄膜抵抗体の直流スパッタ成膜方法 |
| JP3585519B2 (ja) * | 1994-03-25 | 2004-11-04 | 株式会社アルバック | スパッタ装置及びスパッタ方法 |
| US5651865A (en) * | 1994-06-17 | 1997-07-29 | Eni | Preferential sputtering of insulators from conductive targets |
| JP2904263B2 (ja) * | 1995-12-04 | 1999-06-14 | 日本電気株式会社 | スパッタ装置 |
| US5770023A (en) * | 1996-02-12 | 1998-06-23 | Eni A Division Of Astec America, Inc. | Etch process employing asymmetric bipolar pulsed DC |
| DE19651811B4 (de) * | 1996-12-13 | 2006-08-31 | Unaxis Deutschland Holding Gmbh | Vorrichtung zum Belegen eines Substrats mit dünnen Schichten |
| US6086830A (en) * | 1997-09-23 | 2000-07-11 | Imperial Petroleum Recovery Corporation | Radio frequency microwave energy applicator apparatus to break oil and water emulsion |
| US6149778A (en) * | 1998-03-12 | 2000-11-21 | Lucent Technologies Inc. | Article comprising fluorinated amorphous carbon and method for fabricating article |
| US6620720B1 (en) * | 2000-04-10 | 2003-09-16 | Agere Systems Inc | Interconnections to copper IC's |
| US6506289B2 (en) * | 2000-08-07 | 2003-01-14 | Symmorphix, Inc. | Planar optical devices and methods for their manufacture |
-
2002
- 2002-05-22 DE DE10222909A patent/DE10222909A1/de not_active Withdrawn
-
2003
- 2003-04-30 EP EP03752719A patent/EP1511877B1/de not_active Expired - Lifetime
- 2003-04-30 DE DE50313095T patent/DE50313095D1/de not_active Expired - Lifetime
- 2003-04-30 AU AU2003232242A patent/AU2003232242A1/en not_active Abandoned
- 2003-04-30 AT AT03752719T patent/ATE481511T1/de active
- 2003-04-30 US US10/515,792 patent/US20070009670A9/en not_active Abandoned
- 2003-04-30 CN CN03811588A patent/CN100577855C/zh not_active Expired - Fee Related
- 2003-04-30 JP JP2004505408A patent/JP2005534803A/ja active Pending
- 2003-04-30 WO PCT/EP2003/004572 patent/WO2003097896A1/de not_active Ceased
- 2003-05-22 TW TW092113899A patent/TWI275655B/zh not_active IP Right Cessation
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