JP2005534150A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2005534150A5 JP2005534150A5 JP2004523453A JP2004523453A JP2005534150A5 JP 2005534150 A5 JP2005534150 A5 JP 2005534150A5 JP 2004523453 A JP2004523453 A JP 2004523453A JP 2004523453 A JP2004523453 A JP 2004523453A JP 2005534150 A5 JP2005534150 A5 JP 2005534150A5
- Authority
- JP
- Japan
- Prior art keywords
- antenna
- passive
- field
- antenna device
- passive antenna
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000001939 inductive effect Effects 0.000 claims 20
- 238000000034 method Methods 0.000 claims 17
- 230000000694 effects Effects 0.000 claims 3
- 238000009832 plasma treatment Methods 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/200,833 US6842147B2 (en) | 2002-07-22 | 2002-07-22 | Method and apparatus for producing uniform processing rates |
| US10/200,833 | 2002-07-22 | ||
| PCT/US2003/022206 WO2004010457A1 (en) | 2002-07-22 | 2003-07-17 | Method and apparatus for producing uniform processing rates |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011279987A Division JP2012104496A (ja) | 2002-07-22 | 2011-12-21 | 均一な処理レートを作る方法および装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005534150A JP2005534150A (ja) | 2005-11-10 |
| JP2005534150A5 true JP2005534150A5 (enExample) | 2006-08-31 |
| JP4928077B2 JP4928077B2 (ja) | 2012-05-09 |
Family
ID=30769568
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004523453A Expired - Lifetime JP4928077B2 (ja) | 2002-07-22 | 2003-07-17 | プラズマ処理の均一性を改善する方法、プラズマ処理装置ならびにこれに用いるアンテナ装置 |
| JP2011279987A Withdrawn JP2012104496A (ja) | 2002-07-22 | 2011-12-21 | 均一な処理レートを作る方法および装置 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011279987A Withdrawn JP2012104496A (ja) | 2002-07-22 | 2011-12-21 | 均一な処理レートを作る方法および装置 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US6842147B2 (enExample) |
| EP (1) | EP1540694B1 (enExample) |
| JP (2) | JP4928077B2 (enExample) |
| KR (1) | KR100974844B1 (enExample) |
| CN (3) | CN102573265B (enExample) |
| AU (1) | AU2003256565A1 (enExample) |
| IL (1) | IL166342A (enExample) |
| TW (1) | TWI327875B (enExample) |
| WO (1) | WO2004010457A1 (enExample) |
Families Citing this family (40)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR200253559Y1 (ko) * | 2001-07-30 | 2001-11-22 | 주식회사 플라즈마트 | 회전방향으로 균일한 플라즈마 밀도를 발생시키는유도결합형 플라즈마 발생장치의 안테나구조 |
| JP2003323997A (ja) * | 2002-04-30 | 2003-11-14 | Lam Research Kk | プラズマ安定化方法およびプラズマ装置 |
| KR100486724B1 (ko) * | 2002-10-15 | 2005-05-03 | 삼성전자주식회사 | 사행 코일 안테나를 구비한 유도결합 플라즈마 발생장치 |
| US20050205211A1 (en) * | 2004-03-22 | 2005-09-22 | Vikram Singh | Plasma immersion ion implantion apparatus and method |
| KR100968132B1 (ko) * | 2008-02-29 | 2010-07-06 | (주)얼라이드 테크 파인더즈 | 안테나 및 이를 구비한 반도체 장치 |
| US8298949B2 (en) | 2009-01-07 | 2012-10-30 | Lam Research Corporation | Profile and CD uniformity control by plasma oxidation treatment |
| JP5506826B2 (ja) * | 2009-02-10 | 2014-05-28 | ヘリッセン,サール | 大面積プラズマ処理装置 |
| US9337004B2 (en) * | 2009-04-06 | 2016-05-10 | Lam Research Corporation | Grounded confinement ring having large surface area |
| JP5592098B2 (ja) * | 2009-10-27 | 2014-09-17 | 東京エレクトロン株式会社 | プラズマ処理装置及びプラズマ処理方法 |
| JP5757710B2 (ja) * | 2009-10-27 | 2015-07-29 | 東京エレクトロン株式会社 | プラズマ処理装置及びプラズマ処理方法 |
| US8741097B2 (en) | 2009-10-27 | 2014-06-03 | Tokyo Electron Limited | Plasma processing apparatus and plasma processing method |
| US9313872B2 (en) * | 2009-10-27 | 2016-04-12 | Tokyo Electron Limited | Plasma processing apparatus and plasma processing method |
| US8608903B2 (en) * | 2009-10-27 | 2013-12-17 | Tokyo Electron Limited | Plasma processing apparatus and plasma processing method |
| JP5451324B2 (ja) * | 2009-11-10 | 2014-03-26 | 株式会社日立ハイテクノロジーズ | プラズマ処理装置 |
| JP5723130B2 (ja) | 2010-09-28 | 2015-05-27 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| JP5916044B2 (ja) * | 2010-09-28 | 2016-05-11 | 東京エレクトロン株式会社 | プラズマ処理装置及びプラズマ処理方法 |
| JP5639866B2 (ja) * | 2010-12-03 | 2014-12-10 | 株式会社日立ハイテクノロジーズ | プラズマ処理装置 |
| JP5781349B2 (ja) * | 2011-03-30 | 2015-09-24 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| US10271416B2 (en) * | 2011-10-28 | 2019-04-23 | Applied Materials, Inc. | High efficiency triple-coil inductively coupled plasma source with phase control |
| US20130256271A1 (en) * | 2012-04-03 | 2013-10-03 | Theodoros Panagopoulos | Methods and apparatuses for controlling plasma in a plasma processing chamber |
| JP6248562B2 (ja) * | 2013-11-14 | 2017-12-20 | 東京エレクトロン株式会社 | プラズマ処理装置及びプラズマ処理方法 |
| CN104684235B (zh) * | 2013-11-28 | 2017-07-07 | 中微半导体设备(上海)有限公司 | 一种电感线圈组及电感耦合等离子体处理装置 |
| CN105719928A (zh) * | 2014-12-03 | 2016-06-29 | 中微半导体设备(上海)有限公司 | Icp刻蚀中对刻蚀速率非均匀性进行补偿的装置和方法 |
| JP6603999B2 (ja) * | 2015-02-13 | 2019-11-13 | 日新電機株式会社 | プラズマ処理装置 |
| US10297457B2 (en) | 2015-03-19 | 2019-05-21 | Mattson Technology, Inc. | Controlling azimuthal uniformity of etch process in plasma processing chamber |
| JP6053881B2 (ja) * | 2015-07-15 | 2016-12-27 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| US10128083B2 (en) * | 2016-06-01 | 2018-11-13 | Vebco Instruments Inc. | Ion sources and methods for generating ion beams with controllable ion current density distributions over large treatment areas |
| US9899193B1 (en) * | 2016-11-02 | 2018-02-20 | Varian Semiconductor Equipment Associates, Inc. | RF ion source with dynamic volume control |
| CN108271309B (zh) * | 2016-12-30 | 2020-05-01 | 中微半导体设备(上海)股份有限公司 | 一种电感耦合等离子处理装置 |
| JP2021527534A (ja) * | 2018-06-17 | 2021-10-14 | スコープ マグネティック レゾナンス テクノロジーズ アーゲーSkope Magnetic Resonance Technologies Ag | 磁気共鳴(mr)用途のためのシース波バリア |
| US11078570B2 (en) * | 2018-06-29 | 2021-08-03 | Lam Research Corporation | Azimuthal critical dimension non-uniformity for double patterning process |
| GB2590613B (en) * | 2019-12-16 | 2023-06-07 | Dyson Technology Ltd | Method and apparatus for use in generating plasma |
| GB2590614B (en) * | 2019-12-16 | 2022-09-28 | Dyson Technology Ltd | Method and apparatus for use in generating plasma |
| TW202230440A (zh) * | 2020-10-06 | 2022-08-01 | 日商東京威力科創股份有限公司 | 電漿處理裝置及電漿處理用線圈 |
| JP7515423B2 (ja) * | 2021-01-22 | 2024-07-12 | 東京エレクトロン株式会社 | プラズマ処理装置の異常検知方法及びプラズマ処理装置 |
| CN114845453A (zh) * | 2021-02-01 | 2022-08-02 | 江苏菲沃泰纳米科技股份有限公司 | Icp反应装置和icp发生器 |
| CN114599142A (zh) * | 2022-03-07 | 2022-06-07 | 盛吉盛(宁波)半导体科技有限公司 | 等离子体调节装置、方法、生成装置和半导体加工装置 |
| CN115238541B (zh) * | 2022-07-06 | 2025-08-19 | 南华大学 | 一种应用于玄龙-50装置的双鞍型天线的设计方法 |
| US12074390B2 (en) | 2022-11-11 | 2024-08-27 | Tokyo Electron Limited | Parallel resonance antenna for radial plasma control |
| KR102874571B1 (ko) * | 2023-11-20 | 2025-10-22 | 충남대학교산학협력단 | 셀프 플라즈마 챔버의 가시창 오염 억제 및 제거 시스템 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5401350A (en) * | 1993-03-08 | 1995-03-28 | Lsi Logic Corporation | Coil configurations for improved uniformity in inductively coupled plasma systems |
| US5731565A (en) * | 1995-07-27 | 1998-03-24 | Lam Research Corporation | Segmented coil for generating plasma in plasma processing equipment |
| US5907221A (en) * | 1995-08-16 | 1999-05-25 | Applied Materials, Inc. | Inductively coupled plasma reactor with an inductive coil antenna having independent loops |
| US5759280A (en) * | 1996-06-10 | 1998-06-02 | Lam Research Corporation | Inductively coupled source for deriving substantially uniform plasma flux |
| US5897712A (en) * | 1996-07-16 | 1999-04-27 | Applied Materials, Inc. | Plasma uniformity control for an inductive plasma source |
| US6177646B1 (en) * | 1997-03-17 | 2001-01-23 | Matsushita Electric Industrial Co, Ltd. | Method and device for plasma treatment |
| US6237526B1 (en) * | 1999-03-26 | 2001-05-29 | Tokyo Electron Limited | Process apparatus and method for improving plasma distribution and performance in an inductively coupled plasma |
| US6310577B1 (en) * | 1999-08-24 | 2001-10-30 | Bethel Material Research | Plasma processing system with a new inductive antenna and hybrid coupling of electronagnetic power |
| US6320320B1 (en) * | 1999-11-15 | 2001-11-20 | Lam Research Corporation | Method and apparatus for producing uniform process rates |
| US6341574B1 (en) * | 1999-11-15 | 2002-01-29 | Lam Research Corporation | Plasma processing systems |
| US6508198B1 (en) * | 2000-05-11 | 2003-01-21 | Applied Materials Inc. | Automatic tuning in a tapped RF transformer inductive source of a plasma reactor for processing a semiconductor wafer |
| US6414648B1 (en) * | 2000-07-06 | 2002-07-02 | Applied Materials, Inc. | Plasma reactor having a symmetric parallel conductor coil antenna |
| JP2003234338A (ja) * | 2002-02-08 | 2003-08-22 | Tokyo Electron Ltd | 誘導結合プラズマ処理装置 |
-
2002
- 2002-07-22 US US10/200,833 patent/US6842147B2/en not_active Expired - Lifetime
-
2003
- 2003-07-17 CN CN201110437893.2A patent/CN102573265B/zh not_active Expired - Lifetime
- 2003-07-17 KR KR1020057001224A patent/KR100974844B1/ko not_active Expired - Lifetime
- 2003-07-17 JP JP2004523453A patent/JP4928077B2/ja not_active Expired - Lifetime
- 2003-07-17 CN CN200810178065XA patent/CN101460002B/zh not_active Expired - Lifetime
- 2003-07-17 CN CN038225794A patent/CN1689132B/zh not_active Expired - Lifetime
- 2003-07-17 WO PCT/US2003/022206 patent/WO2004010457A1/en not_active Ceased
- 2003-07-17 AU AU2003256565A patent/AU2003256565A1/en not_active Abandoned
- 2003-07-17 EP EP03765610.5A patent/EP1540694B1/en not_active Expired - Lifetime
- 2003-07-22 TW TW092120008A patent/TWI327875B/zh not_active IP Right Cessation
-
2005
- 2005-01-17 IL IL166342A patent/IL166342A/en not_active IP Right Cessation
-
2011
- 2011-12-21 JP JP2011279987A patent/JP2012104496A/ja not_active Withdrawn
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2005534150A5 (enExample) | ||
| CN1316547C (zh) | 等离子体反应器线圈磁体系统 | |
| TW200405768A (en) | Method and apparatus for producing uniform processing rates | |
| TW439110B (en) | Magnetically-enhanced plasma chamber with non-uniform magnetic field | |
| JP5642181B2 (ja) | 基体を処理する装置及び基体の処理方法 | |
| JP4145248B2 (ja) | 永久磁石式磁界発生装置 | |
| US10115566B2 (en) | Method and apparatus for controlling a magnetic field in a plasma chamber | |
| US9396900B2 (en) | Radio frequency (RF) power coupling system utilizing multiple RF power coupling elements for control of plasma properties | |
| JP2009544168A5 (enExample) | ||
| KR100600177B1 (ko) | 마그네트론 플라즈마 처리 장치 | |
| JP2001118834A (ja) | 調整可能な一様性及び統計的電子過熱を有し、ガス・クラッキングを低減する高密度プラズマ・ツール | |
| JP2021503686A (ja) | 製造プロセスにおける超局所化及びプラズマ均一性制御 | |
| KR20100035170A (ko) | 플라즈마의 방사상 불균일성을 최소화하기 위한 유도성 엘리먼트들의 어레이 | |
| CN101490792B (zh) | 离子沉积设备 | |
| US20070144440A1 (en) | Plasma producing method and apparatus as well as plasma processing apparatus | |
| TW202044403A (zh) | 特高頻(vhf)電漿處理系統及方法 | |
| JP6580830B2 (ja) | プラズマ処理装置 | |
| KR20140126351A (ko) | 다기능 동작을 위한 리본 안테나 및 효율적인 rf 파워 결합 | |
| TW201349334A (zh) | 等離子體處理裝置及其電感耦合線圈 | |
| JP3804574B2 (ja) | 高周波誘導結合プラズマ生成装置およびプラズマ処理装置 | |
| KR20110006070U (ko) | 자화된 유도결합형 플라즈마 처리장치 | |
| KR101468656B1 (ko) | 유도 결합 플라즈마 처리 장치 | |
| KR101013729B1 (ko) | 콘 형상의 3차원 헬릭스 인덕티브 코일을 가지는 플라즈마 반응장치 | |
| CN109148073A (zh) | 线圈组件、等离子体发生装置及等离子体设备 | |
| KR102901240B1 (ko) | Vhf 플라즈마 공정을 위한 시스템 및 방법 |