JP2005526234A - 液体噴出パターンを検出するための方法及び装置 - Google Patents
液体噴出パターンを検出するための方法及び装置 Download PDFInfo
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- JP2005526234A JP2005526234A JP2003562017A JP2003562017A JP2005526234A JP 2005526234 A JP2005526234 A JP 2005526234A JP 2003562017 A JP2003562017 A JP 2003562017A JP 2003562017 A JP2003562017 A JP 2003562017A JP 2005526234 A JP2005526234 A JP 2005526234A
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- Prior art keywords
- pattern
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- light beam
- liquid material
- liquid
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
- B05B12/02—Arrangements for controlling delivery; Arrangements for controlling the spray area for controlling time, or sequence, of delivery
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
- B05B12/004—Arrangements for controlling delivery; Arrangements for controlling the spray area comprising sensors for monitoring the delivery, e.g. by displaying the sensed value or generating an alarm
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
- B05B12/08—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means
- B05B12/082—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means responsive to a condition of the discharged jet or spray, e.g. to jet shape, spray pattern or droplet size
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B15/00—Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
- B05B15/50—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/028—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by measuring lateral position of a boundary of the object
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
- H05K13/0069—Holders for printed circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0469—Surface mounting by applying a glue or viscous material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
- B05B1/02—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops, or having an outlet of particular shape
- B05B1/04—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops, or having an outlet of particular shape in flat form, e.g. fan-like, sheet-like
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spray Control Apparatus (AREA)
- Coating Apparatus (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
Description
Claims (12)
- 吐出された液体物質のパターンを検出するための方法であって、
センサの側方に配置された第1の位置において、液体吐出器からあるパターンで液体物質を吐出する工程と、
該パターンの存否を該センサで検出する段階と、
該センサに対して該第1の位置と同一の側にある第2の位置へ該液体吐出器を移動させる工程と、
該パターンの存否を該センサで検出する工程と、
該第1の位置と該第2の位置とにおける検出結果に応じて、吐出された液体物質の該パターンの状態を決定する工程とを備えることを特徴とする方法。 - 吐出された液体物質のパターンを検出するための方法であって、
(a) 光ビームを送る工程と、
(b) 光ビームの側にある第1の位置へ吐出器を移動させて、あるパターンで液体物質を吐出する工程と、
(c) 光ビーム中におけるパターンの存否に応じて信号を発生させる工程と、
(d) 光ビームに対して第1の位置と同一の側にある第2の位置へ該吐出器を移動させて、液体物質を該パターンで吐出する工程と、
(e) 光ビーム中における該パターンの存否に応じて信号を発生させる工程と、
を備えることを特徴とする方法。 - 請求項2に記載の方法であって、前記あるパターンで液体物質を吐出する工程は、
該あるパターンは、第1及び第2の縁領域と、それぞれがある幅をもつ該第1の縁領域および該第2の縁領域の間に配置される中央の膜領域とを有するように、扇状パターンで物質を吐出する工程と、
第2の位置へ該吐出器を移動させる工程は、パターンの縁領域のうちのひとつの幅の半分以下である距離だけ、該吐出器を移動させる段階を含んでいることを特徴とする方法。 - 請求項3に記載の方法であって、該液体物質は透明であることを特徴とする方法。
- 請求項2に記載の方法であって、光ビームは、離間して配置された一対のバッフルを通って伝達され、パターン状に吐出される液体物質は、該バッフルの間に吐出されることを特徴とする方法。
- 請求項5に記載の方法であって、吐出された液体物質はW字形の輪郭を有し一対のバッフル間に延在してなるベースによって受容され、ベースを通った物質がパンに集められることを特徴とする方法。
- 請求項3に記載の方法であって、発生した信号に応じて、該パターンの状態を決定する工程をさらに備えることを特徴とする方法
- 吐出された液体物質のパターンを検出するための装置であって、
互いに離間して配置され、対向して取り付けられた伝送器と受信器とを含むセンサであって、該伝送器は光ビームを送り出し、該受信器は光ビームを受けて光ビームの存否に応じて信号を発生し、通常の動作条件の下で、吐出された液体物質のパターンは光ビームを通り抜けるようなセンサ、
W字形の輪郭を有するベースに取り付けられ、離間して配置される2枚のバッフルを含むバッフル組立体であって、該バッフル組立体は該伝送器と該受信器との間に配置され、それぞれのバッフルは光ビームが通り抜けられるような開口を有することを特徴とする装置。 - 請求項8に記載の装置であって、吐出された液体物質を受けるための開口を有しているドレンパンをさらに備え、該バッフル組立体は該ドレンパンの開口の中に配置され、該バッフル組立体は吐出された物質をドレンパンへ通り抜けさせるための開口を含んでいることを特徴とする装置。
- 請求項9に記載の装置であって、該伝送器と該受信器とを取り付けるための一対の取付ブラケット組立体をさらに含んでいることを特徴とする装置。
- 請求項10に記載の装置であって、該センサは、光ファイバセンサ、またはレーザであることを特徴とする装置。
- 請求項11に記載の装置であって、
該取付ブラケット組立体は、スロットと該スロットに連結された開口とを有するハウジングと、
該センサの光ファイバケーブルを該スロット内に着脱可能に保持し、該ケーブルの配列を該開口を用いて保持するためのクランプ組立体と、
該開口を覆うレンズと、
カバーとを備えることを特徴とする装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US35082702P | 2002-01-22 | 2002-01-22 | |
PCT/US2003/001414 WO2003062129A2 (en) | 2002-01-22 | 2003-01-16 | Method and apparatus for detecting a liquid spray pattern |
Publications (2)
Publication Number | Publication Date |
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JP2005526234A true JP2005526234A (ja) | 2005-09-02 |
JP4060275B2 JP4060275B2 (ja) | 2008-03-12 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2003562017A Expired - Fee Related JP4060275B2 (ja) | 2002-01-22 | 2003-01-16 | 液体噴出パターンを検出するための方法及び装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7188781B2 (ja) |
EP (1) | EP1432526B1 (ja) |
JP (1) | JP4060275B2 (ja) |
KR (1) | KR100761235B1 (ja) |
CN (1) | CN100509176C (ja) |
WO (1) | WO2003062129A2 (ja) |
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2003
- 2003-01-16 EP EP03702155A patent/EP1432526B1/en not_active Expired - Lifetime
- 2003-01-16 KR KR1020047011186A patent/KR100761235B1/ko active IP Right Grant
- 2003-01-16 CN CNB038025264A patent/CN100509176C/zh not_active Expired - Fee Related
- 2003-01-16 WO PCT/US2003/001414 patent/WO2003062129A2/en active Application Filing
- 2003-01-16 JP JP2003562017A patent/JP4060275B2/ja not_active Expired - Fee Related
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Also Published As
Publication number | Publication date |
---|---|
EP1432526A4 (en) | 2005-04-20 |
CN1620341A (zh) | 2005-05-25 |
JP4060275B2 (ja) | 2008-03-12 |
WO2003062129A2 (en) | 2003-07-31 |
KR20040077744A (ko) | 2004-09-06 |
EP1432526A2 (en) | 2004-06-30 |
EP1432526B1 (en) | 2011-12-07 |
US7188781B2 (en) | 2007-03-13 |
US20050023367A1 (en) | 2005-02-03 |
WO2003062129A3 (en) | 2003-10-16 |
KR100761235B1 (ko) | 2007-10-04 |
CN100509176C (zh) | 2009-07-08 |
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