JP2005520220A - 電界を使用して光硬化可能な組成物内にナノスケール・パターンを作製するための方法およびシステム - Google Patents

電界を使用して光硬化可能な組成物内にナノスケール・パターンを作製するための方法およびシステム Download PDF

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Publication number
JP2005520220A
JP2005520220A JP2004566379A JP2004566379A JP2005520220A JP 2005520220 A JP2005520220 A JP 2005520220A JP 2004566379 A JP2004566379 A JP 2004566379A JP 2004566379 A JP2004566379 A JP 2004566379A JP 2005520220 A JP2005520220 A JP 2005520220A
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Prior art keywords
polymerizable composition
substrate
template
electric field
liquid
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Japanese (ja)
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JP2005520220A5 (cg-RX-API-DMAC10.html
Inventor
ウィルソン，シイ・グラント
スリーニヴァサン，エス・ブイ
ボンネケイゼ，ロジャー・ティ
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The University of Texas System
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The University of Texas System
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Publication of JP2005520220A publication Critical patent/JP2005520220A/ja
Publication of JP2005520220A5 publication Critical patent/JP2005520220A5/ja
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping

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  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mathematical Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Polymerisation Methods In General (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Moulding By Coating Moulds (AREA)
JP2004566379A 2001-05-16 2002-05-16 電界を使用して光硬化可能な組成物内にナノスケール・パターンを作製するための方法およびシステム Pending JP2005520220A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US29166401P 2001-05-16 2001-05-16
PCT/US2002/015551 WO2004063815A2 (en) 2001-05-16 2002-05-16 Method and system for fabricating nanoscale patterns in light curable compositions using an electric field

Publications (2)

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JP2005520220A true JP2005520220A (ja) 2005-07-07
JP2005520220A5 JP2005520220A5 (cg-RX-API-DMAC10.html) 2006-01-05

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JP2004566379A Pending JP2005520220A (ja) 2001-05-16 2002-05-16 電界を使用して光硬化可能な組成物内にナノスケール・パターンを作製するための方法およびシステム

Country Status (7)

Country Link
EP (1) EP1512048B1 (cg-RX-API-DMAC10.html)
JP (1) JP2005520220A (cg-RX-API-DMAC10.html)
CN (1) CN1729428A (cg-RX-API-DMAC10.html)
AT (1) ATE356374T1 (cg-RX-API-DMAC10.html)
AU (1) AU2002368430A1 (cg-RX-API-DMAC10.html)
DE (1) DE60218755T2 (cg-RX-API-DMAC10.html)
WO (1) WO2004063815A2 (cg-RX-API-DMAC10.html)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006148055A (ja) * 2004-11-19 2006-06-08 Kofukin Seimitsu Kogyo (Shenzhen) Yugenkoshi 熱間エンボシングリソグラフィーを行う方法
JP2006310566A (ja) * 2005-04-28 2006-11-09 Asahi Glass Co Ltd 加工基板の製造方法
JP2006310565A (ja) * 2005-04-28 2006-11-09 Asahi Glass Co Ltd 加工基板の製造方法
JP2007073939A (ja) * 2005-08-12 2007-03-22 Canon Inc インプリント装置およびインプリント方法
JP2007139752A (ja) * 2005-10-18 2007-06-07 Canon Inc パターン形成装置、パターン形成方法およびパターン形成用モールド
JP2008516450A (ja) * 2004-10-07 2008-05-15 ヒューレット−パッカード デベロップメント カンパニー エル．ピー． リソグラフィマスクアライメント
JP2012060141A (ja) * 2011-10-21 2012-03-22 Toshiba Mach Co Ltd 転写用の型
KR101322133B1 (ko) * 2006-11-24 2013-10-25 엘지디스플레이 주식회사 임프린트 리소그래피용 스탬프 및 이를 이용한 임프린트리소그래피 방법
JP2015139888A (ja) * 2014-01-27 2015-08-03 大日本印刷株式会社 インプリントモールド及び半導体デバイスの製造方法
JP2019067917A (ja) * 2017-09-29 2019-04-25 キヤノン株式会社 インプリント装置、インプリント方法および物品の製造方法
JP2021526972A (ja) * 2018-06-08 2021-10-11 キューレイヤーズ・ホールディング・ベー・フェー ベース構造へのコーティングの付加

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY144124A (en) * 2002-07-11 2011-08-15 Molecular Imprints Inc Step and repeat imprint lithography systems
US7077992B2 (en) 2002-07-11 2006-07-18 Molecular Imprints, Inc. Step and repeat imprint lithography processes
US6871558B2 (en) 2002-12-12 2005-03-29 Molecular Imprints, Inc. Method for determining characteristics of substrate employing fluid geometries
US7122079B2 (en) 2004-02-27 2006-10-17 Molecular Imprints, Inc. Composition for an etching mask comprising a silicon-containing material
DE102006007800B3 (de) * 2006-02-20 2007-10-04 MAX-PLANCK-Gesellschaft zur Förderung der Wissenschaften e.V. Strukturierungsverfahren und Bauteil mit einer strukturierten Oberfläche
CN101496106A (zh) * 2006-07-28 2009-07-29 国际商业机器公司 用于使聚合物层的表面图案化的器件和方法
CN101446762B (zh) * 2008-12-31 2011-07-27 西安交通大学 非接触式模板约束下的电场诱导微复型方法
CN102253435A (zh) * 2011-07-11 2011-11-23 西安交通大学 一种利用电场诱导制造聚合物柱面微透镜的微加工方法
CN109188862A (zh) 2018-10-11 2019-01-11 京东方科技集团股份有限公司 压印结构及其制造方法、压印模板

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1068535B (it) * 1975-11-03 1985-03-21 Ibm Apparecchio e processo elettrolito grafico
WO2000021689A1 (en) * 1998-10-09 2000-04-20 The Trustees Of Princeton University Microscale patterning and articles formed thereby
CA2395760A1 (en) * 1999-12-23 2001-06-28 University Of Massachusetts Methods and apparatus for forming submicron patterns on films

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008516450A (ja) * 2004-10-07 2008-05-15 ヒューレット−パッカード デベロップメント カンパニー エル．ピー． リソグラフィマスクアライメント
JP2006148055A (ja) * 2004-11-19 2006-06-08 Kofukin Seimitsu Kogyo (Shenzhen) Yugenkoshi 熱間エンボシングリソグラフィーを行う方法
JP2006310566A (ja) * 2005-04-28 2006-11-09 Asahi Glass Co Ltd 加工基板の製造方法
JP2006310565A (ja) * 2005-04-28 2006-11-09 Asahi Glass Co Ltd 加工基板の製造方法
JP2007073939A (ja) * 2005-08-12 2007-03-22 Canon Inc インプリント装置およびインプリント方法
JP2007139752A (ja) * 2005-10-18 2007-06-07 Canon Inc パターン形成装置、パターン形成方法およびパターン形成用モールド
KR101322133B1 (ko) * 2006-11-24 2013-10-25 엘지디스플레이 주식회사 임프린트 리소그래피용 스탬프 및 이를 이용한 임프린트리소그래피 방법
JP2012060141A (ja) * 2011-10-21 2012-03-22 Toshiba Mach Co Ltd 転写用の型
JP2015139888A (ja) * 2014-01-27 2015-08-03 大日本印刷株式会社 インプリントモールド及び半導体デバイスの製造方法
JP2019067917A (ja) * 2017-09-29 2019-04-25 キヤノン株式会社 インプリント装置、インプリント方法および物品の製造方法
JP2021526972A (ja) * 2018-06-08 2021-10-11 キューレイヤーズ・ホールディング・ベー・フェー ベース構造へのコーティングの付加

Also Published As

Publication number Publication date
AU2002368430A1 (en) 2004-08-10
WO2004063815A2 (en) 2004-07-29
CN1729428A (zh) 2006-02-01
EP1512048A2 (en) 2005-03-09
WO2004063815A3 (en) 2004-12-29
ATE356374T1 (de) 2007-03-15
EP1512048B1 (en) 2007-03-07
DE60218755T2 (de) 2007-11-15
DE60218755D1 (de) 2007-04-19

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