JP2005513775A5 - - Google Patents

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Publication number
JP2005513775A5
JP2005513775A5 JP2003553603A JP2003553603A JP2005513775A5 JP 2005513775 A5 JP2005513775 A5 JP 2005513775A5 JP 2003553603 A JP2003553603 A JP 2003553603A JP 2003553603 A JP2003553603 A JP 2003553603A JP 2005513775 A5 JP2005513775 A5 JP 2005513775A5
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JP
Japan
Prior art keywords
sensor
laser
detector
wafer
laser source
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2003553603A
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English (en)
Japanese (ja)
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JP4303120B2 (ja
JP2005513775A (ja
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Publication date
Application filed filed Critical
Priority claimed from PCT/US2002/040104 external-priority patent/WO2003052800A2/en
Publication of JP2005513775A publication Critical patent/JP2005513775A/ja
Publication of JP2005513775A5 publication Critical patent/JP2005513775A5/ja
Application granted granted Critical
Publication of JP4303120B2 publication Critical patent/JP4303120B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2003553603A 2001-12-17 2002-12-16 半導体ウェハキャリア用マッピングセンサ Expired - Fee Related JP4303120B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US34149401P 2001-12-17 2001-12-17
PCT/US2002/040104 WO2003052800A2 (en) 2001-12-17 2002-12-16 Semiconductor wafer carrier mapping sensor

Publications (3)

Publication Number Publication Date
JP2005513775A JP2005513775A (ja) 2005-05-12
JP2005513775A5 true JP2005513775A5 (enExample) 2006-02-09
JP4303120B2 JP4303120B2 (ja) 2009-07-29

Family

ID=23337807

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003553603A Expired - Fee Related JP4303120B2 (ja) 2001-12-17 2002-12-16 半導体ウェハキャリア用マッピングセンサ

Country Status (7)

Country Link
US (1) US7095763B2 (enExample)
JP (1) JP4303120B2 (enExample)
KR (1) KR20040070216A (enExample)
CN (1) CN100397557C (enExample)
AU (1) AU2002357241A1 (enExample)
DE (1) DE10297565T5 (enExample)
WO (1) WO2003052800A2 (enExample)

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US6825486B1 (en) * 2001-07-13 2004-11-30 Cyberoptics Corporation System for mapping wafers using predictive dynamic lighting
US6897463B1 (en) * 2001-07-13 2005-05-24 Cyberoptics Semiconductor, Inc. Wafer carrier mapping sensor assembly
US7418016B2 (en) * 2003-02-13 2008-08-26 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Method and apparatus for modifying the spread of a laser beam
US20050086024A1 (en) * 2003-09-19 2005-04-21 Cyberoptics Semiconductor Inc. Semiconductor wafer location sensing via non contact methods
WO2005088681A1 (en) * 2004-03-09 2005-09-22 Cyberoptics Semiconductor, Inc. Wireless substrate-like sensor
CN101517701B (zh) * 2006-09-29 2011-08-10 赛博光学半导体公司 衬底形的粒子传感器
CN101206181B (zh) * 2006-12-22 2010-05-19 中芯国际集成电路制造(上海)有限公司 检测晶圆边缘洗边效果的装置及方法
JP2013093389A (ja) * 2011-10-24 2013-05-16 Hitachi High-Technologies Corp 光学式検査装置及びエッジ検査装置
DE102016101942B4 (de) 2016-02-04 2022-07-21 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zum Herstellen einer optoelektronischen Leuchtvorrichtung
KR102181121B1 (ko) * 2016-09-20 2020-11-20 주식회사 원익아이피에스 기판 이송 장치 및 기판 이송 장치의 제어 방법
KR102342264B1 (ko) * 2021-06-03 2021-12-22 정병철 반도체 웨이퍼의 티칭을 위한 측정기
KR102342270B1 (ko) * 2021-06-03 2021-12-22 정병철 측정기를 이용한 반도체 웨이퍼의 티칭을 위한 측정방법
TWI831162B (zh) * 2022-03-24 2024-02-01 上銀科技股份有限公司 裝載埠及其映射裝置

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US3815998A (en) * 1972-10-30 1974-06-11 Ibm Surface contrast system and method
US4304467A (en) * 1979-05-29 1981-12-08 International Business Machines Corporation Focussed laser beam optical system
JPS5917139A (ja) * 1982-07-20 1984-01-28 Matsushita Electric Ind Co Ltd 反射率測定方法
US4701928A (en) * 1985-10-02 1987-10-20 Board Of Trustees, Leland J. Stanford University Diode laser pumped co-doped laser
US4786816A (en) * 1985-11-05 1988-11-22 Canon Kabushiki Kaisha Wafer detecting device wherein light receiver has an effective surface larger than the dimensional range covering all the wafers being detected
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JP3278896B2 (ja) 1992-03-31 2002-04-30 キヤノン株式会社 照明装置及びそれを用いた投影露光装置
US5225691A (en) * 1992-05-18 1993-07-06 Avalon Engineering, Inc. Semiconductor wafer cassette mapper with emitter and detector arrays for slot interrogation
JPH0677307A (ja) * 1992-08-24 1994-03-18 Tokyo Electron Tohoku Ltd 透明基板検出装置及び基板検出装置
US5479252A (en) * 1993-06-17 1995-12-26 Ultrapointe Corporation Laser imaging system for inspection and analysis of sub-micron particles
JP3057998B2 (ja) * 1994-02-16 2000-07-04 キヤノン株式会社 照明装置及びそれを用いた投影露光装置
US5504345A (en) * 1994-04-14 1996-04-02 Hama Laboratories, Inc. Dual beam sensor and edge detection system and method
US5546179A (en) * 1994-10-07 1996-08-13 Cheng; David Method and apparatus for mapping the edge and other characteristics of a workpiece
US5710424A (en) * 1995-10-18 1998-01-20 Imra America, Inc. Multiple field of view detector with background cancellation
US5943130A (en) * 1996-10-21 1999-08-24 Insitec, Inc. In situ sensor for near wafer particle monitoring in semiconductor device manufacturing equipment
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US6100976A (en) * 1998-09-21 2000-08-08 The Board Of Regents For Oklahoma State University Method and apparatus for fiber optic multiple scattering suppression
US6177989B1 (en) * 1999-03-01 2001-01-23 Advanced Micro Devices Laser induced current for semiconductor defect detection
US6091488A (en) * 1999-03-22 2000-07-18 Beltronics, Inc. Method of and apparatus for automatic high-speed optical inspection of semi-conductor structures and the like through fluorescent photoresist inspection
TW409285B (en) * 1999-04-13 2000-10-21 United Microelectronics Corp Wafer position mapping device
JP2001091873A (ja) * 1999-09-24 2001-04-06 Toshiba Tec Corp 光走査装置
US7509048B2 (en) * 2001-07-20 2009-03-24 Essex Corporation Method and apparatus for optical signal processing using an optical tapped delay line
US6560265B2 (en) * 2001-09-11 2003-05-06 Applied Optoelectronics, Inc. Method and apparatus for polarizing light in a VCSEL
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