JP2005501753A5 - - Google Patents

Download PDF

Info

Publication number
JP2005501753A5
JP2005501753A5 JP2003526634A JP2003526634A JP2005501753A5 JP 2005501753 A5 JP2005501753 A5 JP 2005501753A5 JP 2003526634 A JP2003526634 A JP 2003526634A JP 2003526634 A JP2003526634 A JP 2003526634A JP 2005501753 A5 JP2005501753 A5 JP 2005501753A5
Authority
JP
Japan
Prior art keywords
polishing
polishing surface
head
substrate
chemical solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2003526634A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005501753A (ja
JP4054306B2 (ja
Filing date
Publication date
Priority claimed from US10/234,780 external-priority patent/US6887132B2/en
Application filed filed Critical
Publication of JP2005501753A publication Critical patent/JP2005501753A/ja
Publication of JP2005501753A5 publication Critical patent/JP2005501753A5/ja
Application granted granted Critical
Publication of JP4054306B2 publication Critical patent/JP4054306B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

JP2003526634A 2001-09-10 2002-09-09 化学的機械研磨装置用のスラリー分配装置および該スラリー分配装置を用いる方法 Expired - Fee Related JP4054306B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US32311701P 2001-09-10 2001-09-10
US10/234,780 US6887132B2 (en) 2001-09-10 2002-09-03 Slurry distributor for chemical mechanical polishing apparatus and method of using the same
PCT/US2002/028787 WO2003022519A2 (en) 2001-09-10 2002-09-09 Slurry distributor for chemical mechanical polishing apparatus and method of using the same

Publications (3)

Publication Number Publication Date
JP2005501753A JP2005501753A (ja) 2005-01-20
JP2005501753A5 true JP2005501753A5 (https=) 2006-01-05
JP4054306B2 JP4054306B2 (ja) 2008-02-27

Family

ID=26928275

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003526634A Expired - Fee Related JP4054306B2 (ja) 2001-09-10 2002-09-09 化学的機械研磨装置用のスラリー分配装置および該スラリー分配装置を用いる方法

Country Status (4)

Country Link
US (2) US6887132B2 (https=)
JP (1) JP4054306B2 (https=)
AU (1) AU2002326867A1 (https=)
WO (1) WO2003022519A2 (https=)

Families Citing this family (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7255637B2 (en) * 2000-09-08 2007-08-14 Applied Materials, Inc. Carrier head vibration damping
US7086933B2 (en) * 2002-04-22 2006-08-08 Applied Materials, Inc. Flexible polishing fluid delivery system
US20040214508A1 (en) * 2002-06-28 2004-10-28 Lam Research Corporation Apparatus and method for controlling film thickness in a chemical mechanical planarization system
US6884152B2 (en) 2003-02-11 2005-04-26 Micron Technology, Inc. Apparatuses and methods for conditioning polishing pads used in polishing micro-device workpieces
US6939210B2 (en) * 2003-05-02 2005-09-06 Applied Materials, Inc. Slurry delivery arm
US7108497B2 (en) * 2004-01-12 2006-09-19 Omnimold, Llc Interchangeable blow mold parison closing apparatus
JP2005271151A (ja) * 2004-03-25 2005-10-06 Toshiba Corp 研磨装置及び研磨方法
JP2006147773A (ja) * 2004-11-18 2006-06-08 Ebara Corp 研磨装置および研磨方法
US20070032180A1 (en) * 2005-08-08 2007-02-08 Taiwan Semiconductor Manufacturing Co., Ltd. Slurry residence time enhancement system
US20070131562A1 (en) * 2005-12-08 2007-06-14 Applied Materials, Inc. Method and apparatus for planarizing a substrate with low fluid consumption
US20070181442A1 (en) * 2006-02-03 2007-08-09 Applied Materials, Inc. Method and apparatus for foam removal in an electrochemical mechanical substrate polishing process
JP4901301B2 (ja) * 2006-05-23 2012-03-21 株式会社東芝 研磨方法及び半導体装置の製造方法
US7452264B2 (en) * 2006-06-27 2008-11-18 Applied Materials, Inc. Pad cleaning method
JP5080769B2 (ja) * 2006-09-15 2012-11-21 株式会社東京精密 研磨方法及び研磨装置
JP2008279539A (ja) * 2007-05-10 2008-11-20 Nomura Micro Sci Co Ltd 研磨液の回収方法、及び研磨液の回収装置
WO2012082126A1 (en) * 2010-12-16 2012-06-21 Araca, Inc. Method and device for the injection of cmp slurry
US8197306B2 (en) 2008-10-31 2012-06-12 Araca, Inc. Method and device for the injection of CMP slurry
US8845395B2 (en) * 2008-10-31 2014-09-30 Araca Inc. Method and device for the injection of CMP slurry
KR101067608B1 (ko) * 2009-03-30 2011-09-27 다이닛뽕스크린 세이조오 가부시키가이샤 기판처리장치 및 기판처리방법
CN103648738B (zh) 2010-12-30 2017-04-26 美国石膏公司 浆料分配器、系统及其使用方法
US10076853B2 (en) 2010-12-30 2018-09-18 United States Gypsum Company Slurry distributor, system, and method for using same
WO2012092534A1 (en) 2010-12-30 2012-07-05 United States Gypsum Company Slurry distribution system and method
US9999989B2 (en) * 2010-12-30 2018-06-19 United States Gypsum Company Slurry distributor with a profiling mechanism, system, and method for using same
US9296124B2 (en) 2010-12-30 2016-03-29 United States Gypsum Company Slurry distributor with a wiping mechanism, system, and method for using same
AR088520A1 (es) 2011-10-24 2014-06-18 United States Gypsum Co Distribuidor de lechada, sistema y metodo para su uso
CN103857499B (zh) 2011-10-24 2016-12-14 美国石膏公司 用于浆料分配的多腿排出靴
WO2013063080A2 (en) 2011-10-24 2013-05-02 United States Gypsum Company Multi-piece mold and method of making slurry distributor
JP6139188B2 (ja) * 2013-03-12 2017-05-31 株式会社荏原製作所 研磨装置および研磨方法
US10059033B2 (en) 2014-02-18 2018-08-28 United States Gypsum Company Cementitious slurry mixing and dispensing system with pulser assembly and method for using same
JP6468147B2 (ja) * 2015-02-05 2019-02-13 東京エレクトロン株式会社 研磨装置、塗布膜形成装置、塗布膜形成方法及び記憶媒体
WO2016125408A1 (ja) * 2015-02-05 2016-08-11 東京エレクトロン株式会社 研磨装置、塗布膜形成装置、塗布膜形成方法、記憶媒体、パターン形成方法及びパターン形成装置
US11077536B2 (en) * 2016-06-24 2021-08-03 Applied Materials, Inc. Slurry distribution device for chemical mechanical polishing
JP2019029562A (ja) * 2017-08-01 2019-02-21 株式会社荏原製作所 基板処理装置
JP7083722B2 (ja) 2018-08-06 2022-06-13 株式会社荏原製作所 研磨装置、及び、研磨方法
JP7162465B2 (ja) 2018-08-06 2022-10-28 株式会社荏原製作所 研磨装置、及び、研磨方法
CN109562505A (zh) * 2018-10-24 2019-04-02 长江存储科技有限责任公司 具有刮擦固定装置的化学机械抛光设备
TWI885783B (zh) 2019-02-20 2025-06-01 美商應用材料股份有限公司 化學機械拋光裝置及化學機械拋光方法
TWI912098B (zh) 2019-08-13 2026-01-11 美商應用材料股份有限公司 化學機械研磨系統
US11897079B2 (en) 2019-08-13 2024-02-13 Applied Materials, Inc. Low-temperature metal CMP for minimizing dishing and corrosion, and improving pad asperity
KR102835295B1 (ko) * 2020-03-06 2025-07-18 가부시키가이샤 에바라 세이사꾸쇼 연마 장치, 처리 시스템 및 연마 방법
JP7492854B2 (ja) * 2020-05-11 2024-05-30 株式会社荏原製作所 研磨装置及び研磨方法
JP2022151237A (ja) * 2021-03-26 2022-10-07 株式会社東京精密 Ｃｍｐ装置
KR102880334B1 (ko) * 2021-11-26 2025-10-31 삼성전자주식회사 웨이퍼 연마 장치 및 이를 이용한 반도체 장치의 제조 방법
WO2024049719A2 (en) * 2022-08-29 2024-03-07 Rajeev Bajaj Advanced fluid delivery
US12521840B2 (en) * 2024-03-07 2026-01-13 Wolfspeed, Inc. Two component chemical mechanical polishing

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3010572B2 (ja) * 1994-09-29 2000-02-21 株式会社東京精密 ウェーハエッジの加工装置
KR970018240A (ko) * 1995-09-08 1997-04-30 모리시다 요이치 반도체 기판의 연마방법 및 그 장치
US5709593A (en) 1995-10-27 1998-01-20 Applied Materials, Inc. Apparatus and method for distribution of slurry in a chemical mechanical polishing system
US5645682A (en) * 1996-05-28 1997-07-08 Micron Technology, Inc. Apparatus and method for conditioning a planarizing substrate used in chemical-mechanical planarization of semiconductor wafers
US6139406A (en) 1997-06-24 2000-10-31 Applied Materials, Inc. Combined slurry dispenser and rinse arm and method of operation
US5997392A (en) 1997-07-22 1999-12-07 International Business Machines Corporation Slurry injection technique for chemical-mechanical polishing
JPH11114811A (ja) * 1997-10-15 1999-04-27 Ebara Corp ポリッシング装置のスラリ供給装置
US6429131B2 (en) 1999-03-18 2002-08-06 Infineon Technologies Ag CMP uniformity
US6283840B1 (en) 1999-08-03 2001-09-04 Applied Materials, Inc. Cleaning and slurry distribution system assembly for use in chemical mechanical polishing apparatus
US6284092B1 (en) 1999-08-06 2001-09-04 International Business Machines Corporation CMP slurry atomization slurry dispense system
US6468134B1 (en) 2000-06-30 2002-10-22 Lam Research Corporation Method and apparatus for slurry distribution
US6641468B2 (en) * 2002-03-05 2003-11-04 Promos Technologies Inc Slurry distributor

Similar Documents

Publication Publication Date Title
JP2005501753A5 (https=)
JP4054306B2 (ja) 化学的機械研磨装置用のスラリー分配装置および該スラリー分配装置を用いる方法
KR100301646B1 (ko) 워크피스의표면연마장치및방법
CN104106125B (zh) 擦拭垫、使用该垫的喷嘴维护装置和涂覆处理装置
CN101844328A (zh) 用于清洗研磨布的装置和方法
JP2005178382A (ja) ローラ、胴、および印刷版の清掃装置
US6884152B2 (en) Apparatuses and methods for conditioning polishing pads used in polishing micro-device workpieces
JP2006167508A (ja) 塗布用ダイの清掃方法および清掃装置並びにディスプレイ用部材の製造方法および製造装置
KR20180083301A (ko) 유리판의 스크라이빙 방법 및 유리판의 스크라이빙 장치
CN100431837C (zh) 清洁印刷机滚筒的方法和装置
US9120317B2 (en) Liquid jetting apparatus
US6872128B1 (en) System, method and apparatus for applying liquid to a CMP polishing pad
KR101952311B1 (ko) 디지털 프린팅 머신용 이송벨트의 청결장치
TWI322717B (en) Coating device
JP2008006510A (ja) 研磨装置の研磨剤塗布装置
CN112547415B (zh) 涂布装置及涂布方法
CN112437711B (zh) 工件表面处理装置以及工件表面处理方法
CN100469546C (zh) 用于将粉料以预定图案分配到支承件上的设备
KR20140133497A (ko) 연마 패드 및 연마 장치
JP2002248436A (ja) 鏡面板の洗浄装置
EP1038674A1 (en) Blast cleaning apparatus for printing machines
JP2002355759A (ja) ウエハ研磨装置
JP2008229537A (ja) ダイヘッド及び積層体の製造方法
DE10308064B4 (de) Poliermittelzuführung bei CMP-Prozessen
JP4103123B2 (ja) 板状体の剥離方法及びその装置