JP4054306B2 - 化学的機械研磨装置用のスラリー分配装置および該スラリー分配装置を用いる方法 - Google Patents

化学的機械研磨装置用のスラリー分配装置および該スラリー分配装置を用いる方法 Download PDF

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Publication number
JP4054306B2
JP4054306B2 JP2003526634A JP2003526634A JP4054306B2 JP 4054306 B2 JP4054306 B2 JP 4054306B2 JP 2003526634 A JP2003526634 A JP 2003526634A JP 2003526634 A JP2003526634 A JP 2003526634A JP 4054306 B2 JP4054306 B2 JP 4054306B2
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Prior art keywords
polishing
polishing surface
slurry
dispensing device
substrate
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JP2005501753A5 (https=
JP2005501753A (ja
Inventor
カジワラ、ジロー
モロニ、ジェラルド
リュー、ジュン
ヤン、ジュンシェン
サルダナ、アーネスト
ウォルシュ、コーマック
レイエス、アレジャンドロ
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マルチプレーナーテクノロジーズ インコーポレーテッド
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
JP2003526634A 2001-09-10 2002-09-09 化学的機械研磨装置用のスラリー分配装置および該スラリー分配装置を用いる方法 Expired - Fee Related JP4054306B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US32311701P 2001-09-10 2001-09-10
US10/234,780 US6887132B2 (en) 2001-09-10 2002-09-03 Slurry distributor for chemical mechanical polishing apparatus and method of using the same
PCT/US2002/028787 WO2003022519A2 (en) 2001-09-10 2002-09-09 Slurry distributor for chemical mechanical polishing apparatus and method of using the same

Publications (3)

Publication Number Publication Date
JP2005501753A JP2005501753A (ja) 2005-01-20
JP2005501753A5 JP2005501753A5 (https=) 2006-01-05
JP4054306B2 true JP4054306B2 (ja) 2008-02-27

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JP2003526634A Expired - Fee Related JP4054306B2 (ja) 2001-09-10 2002-09-09 化学的機械研磨装置用のスラリー分配装置および該スラリー分配装置を用いる方法

Country Status (4)

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US (2) US6887132B2 (https=)
JP (1) JP4054306B2 (https=)
AU (1) AU2002326867A1 (https=)
WO (1) WO2003022519A2 (https=)

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KR20200016184A (ko) 2018-08-06 2020-02-14 가부시키가이샤 에바라 세이사꾸쇼 연마 장치 및 연마 방법
US11642755B2 (en) 2018-08-06 2023-05-09 Ebara Corporation Apparatus for polishing and method for polishing
TWI806353B (zh) * 2016-06-24 2023-06-21 美商應用材料股份有限公司 用於化學機械拋光的漿體分佈設備

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US6884152B2 (en) 2003-02-11 2005-04-26 Micron Technology, Inc. Apparatuses and methods for conditioning polishing pads used in polishing micro-device workpieces
US6939210B2 (en) * 2003-05-02 2005-09-06 Applied Materials, Inc. Slurry delivery arm
US7108497B2 (en) * 2004-01-12 2006-09-19 Omnimold, Llc Interchangeable blow mold parison closing apparatus
JP2005271151A (ja) * 2004-03-25 2005-10-06 Toshiba Corp 研磨装置及び研磨方法
JP2006147773A (ja) * 2004-11-18 2006-06-08 Ebara Corp 研磨装置および研磨方法
US20070032180A1 (en) * 2005-08-08 2007-02-08 Taiwan Semiconductor Manufacturing Co., Ltd. Slurry residence time enhancement system
US20070131562A1 (en) * 2005-12-08 2007-06-14 Applied Materials, Inc. Method and apparatus for planarizing a substrate with low fluid consumption
US20070181442A1 (en) * 2006-02-03 2007-08-09 Applied Materials, Inc. Method and apparatus for foam removal in an electrochemical mechanical substrate polishing process
JP4901301B2 (ja) * 2006-05-23 2012-03-21 株式会社東芝 研磨方法及び半導体装置の製造方法
US7452264B2 (en) * 2006-06-27 2008-11-18 Applied Materials, Inc. Pad cleaning method
JP5080769B2 (ja) * 2006-09-15 2012-11-21 株式会社東京精密 研磨方法及び研磨装置
JP2008279539A (ja) * 2007-05-10 2008-11-20 Nomura Micro Sci Co Ltd 研磨液の回収方法、及び研磨液の回収装置
WO2012082126A1 (en) * 2010-12-16 2012-06-21 Araca, Inc. Method and device for the injection of cmp slurry
US8197306B2 (en) 2008-10-31 2012-06-12 Araca, Inc. Method and device for the injection of CMP slurry
US8845395B2 (en) * 2008-10-31 2014-09-30 Araca Inc. Method and device for the injection of CMP slurry
KR101067608B1 (ko) * 2009-03-30 2011-09-27 다이닛뽕스크린 세이조오 가부시키가이샤 기판처리장치 및 기판처리방법
CN103648738B (zh) 2010-12-30 2017-04-26 美国石膏公司 浆料分配器、系统及其使用方法
US10076853B2 (en) 2010-12-30 2018-09-18 United States Gypsum Company Slurry distributor, system, and method for using same
WO2012092534A1 (en) 2010-12-30 2012-07-05 United States Gypsum Company Slurry distribution system and method
US9999989B2 (en) * 2010-12-30 2018-06-19 United States Gypsum Company Slurry distributor with a profiling mechanism, system, and method for using same
US9296124B2 (en) 2010-12-30 2016-03-29 United States Gypsum Company Slurry distributor with a wiping mechanism, system, and method for using same
AR088520A1 (es) 2011-10-24 2014-06-18 United States Gypsum Co Distribuidor de lechada, sistema y metodo para su uso
CN103857499B (zh) 2011-10-24 2016-12-14 美国石膏公司 用于浆料分配的多腿排出靴
WO2013063080A2 (en) 2011-10-24 2013-05-02 United States Gypsum Company Multi-piece mold and method of making slurry distributor
JP6139188B2 (ja) * 2013-03-12 2017-05-31 株式会社荏原製作所 研磨装置および研磨方法
US10059033B2 (en) 2014-02-18 2018-08-28 United States Gypsum Company Cementitious slurry mixing and dispensing system with pulser assembly and method for using same
JP6468147B2 (ja) * 2015-02-05 2019-02-13 東京エレクトロン株式会社 研磨装置、塗布膜形成装置、塗布膜形成方法及び記憶媒体
WO2016125408A1 (ja) * 2015-02-05 2016-08-11 東京エレクトロン株式会社 研磨装置、塗布膜形成装置、塗布膜形成方法、記憶媒体、パターン形成方法及びパターン形成装置
JP2019029562A (ja) * 2017-08-01 2019-02-21 株式会社荏原製作所 基板処理装置
CN109562505A (zh) * 2018-10-24 2019-04-02 长江存储科技有限责任公司 具有刮擦固定装置的化学机械抛光设备
TWI885783B (zh) 2019-02-20 2025-06-01 美商應用材料股份有限公司 化學機械拋光裝置及化學機械拋光方法
TWI912098B (zh) 2019-08-13 2026-01-11 美商應用材料股份有限公司 化學機械研磨系統
US11897079B2 (en) 2019-08-13 2024-02-13 Applied Materials, Inc. Low-temperature metal CMP for minimizing dishing and corrosion, and improving pad asperity
KR102835295B1 (ko) * 2020-03-06 2025-07-18 가부시키가이샤 에바라 세이사꾸쇼 연마 장치, 처리 시스템 및 연마 방법
JP7492854B2 (ja) * 2020-05-11 2024-05-30 株式会社荏原製作所 研磨装置及び研磨方法
JP2022151237A (ja) * 2021-03-26 2022-10-07 株式会社東京精密 Ｃｍｐ装置
KR102880334B1 (ko) * 2021-11-26 2025-10-31 삼성전자주식회사 웨이퍼 연마 장치 및 이를 이용한 반도체 장치의 제조 방법
WO2024049719A2 (en) * 2022-08-29 2024-03-07 Rajeev Bajaj Advanced fluid delivery
US12521840B2 (en) * 2024-03-07 2026-01-13 Wolfspeed, Inc. Two component chemical mechanical polishing

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JP3010572B2 (ja) * 1994-09-29 2000-02-21 株式会社東京精密 ウェーハエッジの加工装置
KR970018240A (ko) * 1995-09-08 1997-04-30 모리시다 요이치 반도체 기판의 연마방법 및 그 장치
US5709593A (en) 1995-10-27 1998-01-20 Applied Materials, Inc. Apparatus and method for distribution of slurry in a chemical mechanical polishing system
US5645682A (en) * 1996-05-28 1997-07-08 Micron Technology, Inc. Apparatus and method for conditioning a planarizing substrate used in chemical-mechanical planarization of semiconductor wafers
US6139406A (en) 1997-06-24 2000-10-31 Applied Materials, Inc. Combined slurry dispenser and rinse arm and method of operation
US5997392A (en) 1997-07-22 1999-12-07 International Business Machines Corporation Slurry injection technique for chemical-mechanical polishing
JPH11114811A (ja) * 1997-10-15 1999-04-27 Ebara Corp ポリッシング装置のスラリ供給装置
US6429131B2 (en) 1999-03-18 2002-08-06 Infineon Technologies Ag CMP uniformity
US6283840B1 (en) 1999-08-03 2001-09-04 Applied Materials, Inc. Cleaning and slurry distribution system assembly for use in chemical mechanical polishing apparatus
US6284092B1 (en) 1999-08-06 2001-09-04 International Business Machines Corporation CMP slurry atomization slurry dispense system
US6468134B1 (en) 2000-06-30 2002-10-22 Lam Research Corporation Method and apparatus for slurry distribution
US6641468B2 (en) * 2002-03-05 2003-11-04 Promos Technologies Inc Slurry distributor

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI806353B (zh) * 2016-06-24 2023-06-21 美商應用材料股份有限公司 用於化學機械拋光的漿體分佈設備
US11986926B2 (en) 2016-06-24 2024-05-21 Applied Materials, Inc. Slurry distribution device for chemical mechanical polishing
KR20200016184A (ko) 2018-08-06 2020-02-14 가부시키가이샤 에바라 세이사꾸쇼 연마 장치 및 연마 방법
US11465256B2 (en) 2018-08-06 2022-10-11 Ebara Corporation Apparatus for polishing and method for polishing
US11642755B2 (en) 2018-08-06 2023-05-09 Ebara Corporation Apparatus for polishing and method for polishing

Also Published As

Publication number Publication date
WO2003022519A9 (en) 2004-04-29
US20030068959A1 (en) 2003-04-10
US6887132B2 (en) 2005-05-03
WO2003022519A2 (en) 2003-03-20
US20050130566A1 (en) 2005-06-16
JP2005501753A (ja) 2005-01-20
AU2002326867A1 (en) 2003-03-24
WO2003022519A3 (en) 2004-01-22

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