JP2005500655A5 - - Google Patents

Download PDF

Info

Publication number
JP2005500655A5
JP2005500655A5 JP2003522117A JP2003522117A JP2005500655A5 JP 2005500655 A5 JP2005500655 A5 JP 2005500655A5 JP 2003522117 A JP2003522117 A JP 2003522117A JP 2003522117 A JP2003522117 A JP 2003522117A JP 2005500655 A5 JP2005500655 A5 JP 2005500655A5
Authority
JP
Japan
Prior art keywords
actuator
thermal
movable
bistable
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003522117A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005500655A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2002/026439 external-priority patent/WO2003017301A1/en
Publication of JP2005500655A publication Critical patent/JP2005500655A/ja
Publication of JP2005500655A5 publication Critical patent/JP2005500655A5/ja
Pending legal-status Critical Current

Links

JP2003522117A 2001-08-20 2002-08-20 スナップアクション式熱スイッチ Pending JP2005500655A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US31378901P 2001-08-20 2001-08-20
PCT/US2002/026439 WO2003017301A1 (en) 2001-08-20 2002-08-20 Snap action thermal switch

Publications (2)

Publication Number Publication Date
JP2005500655A JP2005500655A (ja) 2005-01-06
JP2005500655A5 true JP2005500655A5 (enExample) 2006-01-05

Family

ID=23217148

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003522117A Pending JP2005500655A (ja) 2001-08-20 2002-08-20 スナップアクション式熱スイッチ

Country Status (7)

Country Link
US (1) US6768412B2 (enExample)
EP (1) EP1419511B1 (enExample)
JP (1) JP2005500655A (enExample)
KR (1) KR100929601B1 (enExample)
CN (1) CN100470697C (enExample)
DE (1) DE60212857T2 (enExample)
WO (1) WO2003017301A1 (enExample)

Families Citing this family (59)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6640646B2 (en) * 2001-10-19 2003-11-04 Honeywell International, Inc. Force measurement of bimetallic thermal disc
JP2003062798A (ja) * 2001-08-21 2003-03-05 Advantest Corp アクチュエータ及びスイッチ
US20030075992A1 (en) * 2001-10-19 2003-04-24 Kouns Heath Elliot Utilizing feedback for control of switch actuators
AU2003295613A1 (en) * 2002-11-18 2004-06-15 Washington State University Thermal switch, methods of use and manufacturing methods for same
US7417315B2 (en) * 2002-12-05 2008-08-26 International Business Machines Corporation Negative thermal expansion system (NTEs) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging
FR2848331B1 (fr) * 2002-12-10 2005-03-11 Commissariat Energie Atomique Commutateur micro-mecanique et procede de realisation
WO2004066326A2 (en) * 2003-01-17 2004-08-05 The Regents Of The University Of California Electro-thermally actuated lateral contact microrelay and associated manufacturing process
US7034375B2 (en) * 2003-02-21 2006-04-25 Honeywell International Inc. Micro electromechanical systems thermal switch
FR2857153B1 (fr) * 2003-07-01 2005-08-26 Commissariat Energie Atomique Micro-commutateur bistable a faible consommation.
US20050109973A1 (en) * 2003-11-21 2005-05-26 Glime William H. Valve diaphragm
DE10355333B3 (de) * 2003-11-27 2005-06-30 Infineon Technologies Ag Einrichtung und Verfahren zum Nachweis einer Überhitzung eines Halbleiter-Bauelements
FR2865724A1 (fr) * 2004-02-04 2005-08-05 St Microelectronics Sa Microsysteme electromecanique pouvant basculer entre deux positions stables
FR2868591B1 (fr) * 2004-04-06 2006-06-09 Commissariat Energie Atomique Microcommutateur a faible tension d'actionnement et faible consommation
US20060055499A1 (en) * 2004-09-16 2006-03-16 Bolle Cristian A Fuse arrangement
US7283030B2 (en) * 2004-11-22 2007-10-16 Eastman Kodak Company Doubly-anchored thermal actuator having varying flexural rigidity
US7691723B2 (en) * 2005-01-07 2010-04-06 Honeywell International Inc. Bonding system having stress control
US7258010B2 (en) * 2005-03-09 2007-08-21 Honeywell International Inc. MEMS device with thinned comb fingers
US7358740B2 (en) * 2005-03-18 2008-04-15 Honeywell International Inc. Thermal switch with self-test feature
JP4498181B2 (ja) * 2005-03-22 2010-07-07 東京エレクトロン株式会社 スイッチアレイ
US7339454B1 (en) * 2005-04-11 2008-03-04 Sandia Corporation Tensile-stressed microelectromechanical apparatus and microelectromechanical relay formed therefrom
US7566582B2 (en) * 2005-10-25 2009-07-28 The Charles Stark Draper Laboratory, Inc. Systems, methods and devices relating to actuatably moveable machines
US20070090732A1 (en) * 2005-10-25 2007-04-26 The Charles Stark Draper Laboratory, Inc. Systems, methods and devices relating to actuatably moveable machines
TW200728605A (en) * 2006-01-20 2007-08-01 Univ Tamkang Thermo-buckled micro-actuator unit made of polymer with high thermal expansion coefficient
US7486854B2 (en) * 2006-01-24 2009-02-03 Uni-Pixel Displays, Inc. Optical microstructures for light extraction and control
US7621190B2 (en) * 2006-02-21 2009-11-24 Cisco Technology, Inc. Method and apparatus for strain monitoring of printed circuit board assemblies
US20070205473A1 (en) * 2006-03-03 2007-09-06 Honeywell International Inc. Passive analog thermal isolation structure
US7401515B2 (en) * 2006-03-28 2008-07-22 Honeywell International Inc. Adaptive circuits and methods for reducing vibration or shock induced errors in inertial sensors
EP1852687A1 (en) * 2006-05-04 2007-11-07 Koninklijke Philips Electronics N.V. Integrated temperature sensor
US8120133B2 (en) * 2006-09-11 2012-02-21 Alcatel Lucent Micro-actuator and locking switch
KR100837741B1 (ko) 2006-12-29 2008-06-13 삼성전자주식회사 미세 스위치 소자 및 미세 스위치 소자의 제조방법
US7626484B2 (en) 2007-09-26 2009-12-01 Honeywell International Inc. Disc seat for thermal switch
JP5001129B2 (ja) * 2007-12-17 2012-08-15 ホーチキ株式会社 熱センサ
US7920037B2 (en) * 2008-05-08 2011-04-05 Cooper Technologies Company Fault interrupter and load break switch
US7952461B2 (en) * 2008-05-08 2011-05-31 Cooper Technologies Company Sensor element for a fault interrupter and load break switch
US8004377B2 (en) * 2008-05-08 2011-08-23 Cooper Technologies Company Indicator for a fault interrupter and load break switch
US7936541B2 (en) 2008-05-08 2011-05-03 Cooper Technologies Company Adjustable rating for a fault interrupter and load break switch
US8187902B2 (en) 2008-07-09 2012-05-29 The Charles Stark Draper Laboratory, Inc. High performance sensors and methods for forming the same
US8153916B2 (en) * 2008-08-14 2012-04-10 Cooper Technologies Company Tap changer switch
US8013263B2 (en) * 2008-08-14 2011-09-06 Cooper Technologies Company Multi-deck transformer switch
AU2009322358B2 (en) * 2008-12-04 2015-04-09 Eaton Intelligent Power Limited Low force low oil trip mechanism
US8173915B2 (en) * 2008-12-10 2012-05-08 Honeywell International Inc. Ignition key switch apparatus with improved snap action mechanism
EP2282320A1 (de) * 2009-08-01 2011-02-09 Limitor GmbH Bimetall-Schnappscheibe
US20110063068A1 (en) * 2009-09-17 2011-03-17 The George Washington University Thermally actuated rf microelectromechanical systems switch
US8779886B2 (en) * 2009-11-30 2014-07-15 General Electric Company Switch structures
US8547626B2 (en) * 2010-03-25 2013-10-01 Qualcomm Mems Technologies, Inc. Mechanical layer and methods of shaping the same
JP6024269B2 (ja) * 2011-09-20 2016-11-16 株式会社デンソー 光走査装置
US9010409B2 (en) * 2011-11-18 2015-04-21 Palo Alto Research Center Incorporated Thermal switch using moving droplets
US9349558B2 (en) * 2011-12-06 2016-05-24 Palo Alto Research Center Incorporated Mechanically acuated heat switch
KR20140107430A (ko) 2011-12-23 2014-09-04 사노피-아벤티스 도이칠란트 게엠베하 약제 포장용기용 센서 장치
FR2998417A1 (fr) * 2012-11-16 2014-05-23 St Microelectronics Rousset Procede de realisation d'un element pointu de circuit integre, et circuit integre correspondant
DE202013012412U1 (de) * 2013-02-21 2016-10-18 Phoenix Contatct GmbH & Co. KG DC-geeignete thermische Schaltvorrichtung (S) zur Absicherung von einem oder mehreren elektronischen Bauteilen (EC)
CN103258686A (zh) * 2013-05-20 2013-08-21 东南大学 基于微机械悬臂梁结构的温度保护器件
US10643810B2 (en) * 2015-08-20 2020-05-05 Northeastern University Zero power plasmonic microelectromechanical device
DE102015221123A1 (de) * 2015-10-29 2017-05-04 Bayerische Motoren Werke Aktiengesellschaft Bedienelement
US10145906B2 (en) 2015-12-17 2018-12-04 Analog Devices Global Devices, systems and methods including magnetic structures
US10865000B2 (en) 2017-08-28 2020-12-15 Harris Corporation Satellite with a thermal switch and associated methods
EP3748318B1 (en) * 2019-06-06 2022-07-27 Mitsubishi Electric R&D Centre Europe B.V. Device for protecting an electronic switch from an over-temperature event
US12055927B2 (en) 2021-02-26 2024-08-06 Honeywell International Inc. Thermal metamaterial for low power MEMS thermal control
IT202300007161A1 (it) * 2023-04-14 2024-10-14 Humar Tiziano Attuatore elettromeccanico a matrice polimerica

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2798130A (en) * 1953-05-22 1957-07-02 Cutler Hammer Inc Electric switch devices
US5065978A (en) * 1988-04-27 1991-11-19 Dragerwerk Aktiengesellschaft Valve arrangement of microstructured components
US4826131A (en) * 1988-08-22 1989-05-02 Ford Motor Company Electrically controllable valve etched from silicon substrates
US5058856A (en) * 1991-05-08 1991-10-22 Hewlett-Packard Company Thermally-actuated microminiature valve
DE4119955C2 (de) * 1991-06-18 2000-05-31 Danfoss As Miniatur-Betätigungselement
US5164558A (en) * 1991-07-05 1992-11-17 Massachusetts Institute Of Technology Micromachined threshold pressure switch and method of manufacture
US5650568A (en) 1993-02-10 1997-07-22 The Charles Stark Draper Laboratory, Inc. Gimballed vibrating wheel gyroscope having strain relief features
US5325880A (en) * 1993-04-19 1994-07-05 Tini Alloy Company Shape memory alloy film actuated microvalve
DE59403742D1 (de) * 1993-05-27 1997-09-18 Fraunhofer Ges Forschung Mikroventil
US5463233A (en) 1993-06-23 1995-10-31 Alliedsignal Inc. Micromachined thermal switch
US5619061A (en) * 1993-07-27 1997-04-08 Texas Instruments Incorporated Micromechanical microwave switching
US5536963A (en) * 1994-05-11 1996-07-16 Regents Of The University Of Minnesota Microdevice with ferroelectric for sensing or applying a force
US5467068A (en) * 1994-07-07 1995-11-14 Hewlett-Packard Company Micromachined bi-material signal switch
US5771321A (en) * 1996-01-04 1998-06-23 Massachusetts Institute Of Technology Micromechanical optical switch and flat panel display
FR2766962B1 (fr) * 1997-07-29 1999-10-15 Sgs Thomson Microelectronics Microinterrupteur thermique compatible avec un circuit integre
SE9703969L (sv) * 1997-10-29 1999-04-30 Gert Andersson Anordning för mekanisk omkoppling av signaler
FR2772512B1 (fr) 1997-12-16 2004-04-16 Commissariat Energie Atomique Microsysteme a element deformable sous l'effet d'un actionneur thermique
US6143583A (en) 1998-06-08 2000-11-07 Honeywell, Inc. Dissolved wafer fabrication process and associated microelectromechanical device having a support substrate with spacing mesas
US6100477A (en) * 1998-07-17 2000-08-08 Texas Instruments Incorporated Recessed etch RF micro-electro-mechanical switch
DE19849700C2 (de) * 1998-10-28 2001-06-28 Festo Ag & Co Mikroventilanordnung
US6188301B1 (en) * 1998-11-13 2001-02-13 General Electric Company Switching structure and method of fabrication
US6391675B1 (en) * 1998-11-25 2002-05-21 Raytheon Company Method and apparatus for switching high frequency signals
DE10080131D2 (de) 1999-01-25 2002-04-25 Gfd Ges Fuer Diamantprodukte M Mikroschaltkontakt
US6239685B1 (en) * 1999-10-14 2001-05-29 International Business Machines Corporation Bistable micromechanical switches
US6504447B1 (en) * 1999-10-30 2003-01-07 Hrl Laboratories, Llc Microelectromechanical RF and microwave frequency power limiter and electrostatic device protection
US6359374B1 (en) * 1999-11-23 2002-03-19 Mcnc Miniature electrical relays using a piezoelectric thin film as an actuating element
US6355534B1 (en) * 2000-01-26 2002-03-12 Intel Corporation Variable tunable range MEMS capacitor
US6561224B1 (en) * 2002-02-14 2003-05-13 Abbott Laboratories Microfluidic valve and system therefor

Similar Documents

Publication Publication Date Title
JP2005500655A5 (enExample)
JP3982080B2 (ja) 熱電モジュールの製造法と熱電モジュール
EP0923099B1 (en) Micro-relay and method for manufacturing the same
WO2003040338A3 (en) Micro-scale interconnect device with internal heat spreader and method for fabricating same
JP2006525677A5 (enExample)
JP2004336048A5 (enExample)
CN109427906A (zh) 半导体装置
EP4557350A3 (fr) Substrat pour un dispositif intégré radiofréquence et son procédé de fabrication
JP2008521205A5 (enExample)
JP3554861B2 (ja) 薄膜熱電対集積型熱電変換デバイス
US11611028B2 (en) Thermoelectric device and manufacturing method therefor
JP2005259944A (ja) 薄膜熱電半導体装置およびその製造方法
US7768102B2 (en) Semiconductor device
US11456137B2 (en) Electrostatic drive switch
JP2007520065A (ja) ピエゾアクチュエータならびにピエゾアクチュエータを製作する方法
JP2006165179A (ja) 半導体基板およびその製造方法
JP2004221424A (ja) 熱電半導体装置
JP2003158196A5 (enExample)
WO2017025347A1 (fr) Empilement pour la fabrication de plaques bipolaires pour piles a combustibles
JP2002200597A (ja) 半導体マイクロアクチュエータ及びこれを用いた半導体マイクロバルブ
JP2009212451A (ja) 可変容量素子
JP2002052499A (ja) アクチュエータ
JP4855585B2 (ja) 圧電トランス
JP3066006B1 (ja) 電子デバイス装置及びその製造方法
JP2008210640A (ja) 静電駆動素子およびそれを備えた静電駆動デバイス