JP2005333063A - クランプ部材、成膜装置、成膜方法、半導体装置の製造方法 - Google Patents

クランプ部材、成膜装置、成膜方法、半導体装置の製造方法 Download PDF

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Publication number
JP2005333063A
JP2005333063A JP2004151953A JP2004151953A JP2005333063A JP 2005333063 A JP2005333063 A JP 2005333063A JP 2004151953 A JP2004151953 A JP 2004151953A JP 2004151953 A JP2004151953 A JP 2004151953A JP 2005333063 A JP2005333063 A JP 2005333063A
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JP
Japan
Prior art keywords
wafer
substrate
rotating member
clamp ring
clamp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2004151953A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005333063A5 (https=
Inventor
Kenji Shirakawa
憲次 白川
Nobuhiro Nishizaki
展弘 西崎
Koichi Sekiya
晃一 関谷
Kazuo Iwami
和男 岩見
Masato Toyoda
正人 豊田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Technology Corp
Original Assignee
Renesas Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Technology Corp filed Critical Renesas Technology Corp
Priority to JP2004151953A priority Critical patent/JP2005333063A/ja
Priority to US11/133,452 priority patent/US20050257746A1/en
Publication of JP2005333063A publication Critical patent/JP2005333063A/ja
Publication of JP2005333063A5 publication Critical patent/JP2005333063A5/ja
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7608—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2004151953A 2004-05-21 2004-05-21 クランプ部材、成膜装置、成膜方法、半導体装置の製造方法 Withdrawn JP2005333063A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2004151953A JP2005333063A (ja) 2004-05-21 2004-05-21 クランプ部材、成膜装置、成膜方法、半導体装置の製造方法
US11/133,452 US20050257746A1 (en) 2004-05-21 2005-05-20 Clamp member, film deposition apparatus, film deposition method, and semiconductor device manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004151953A JP2005333063A (ja) 2004-05-21 2004-05-21 クランプ部材、成膜装置、成膜方法、半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JP2005333063A true JP2005333063A (ja) 2005-12-02
JP2005333063A5 JP2005333063A5 (https=) 2007-06-21

Family

ID=35373981

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004151953A Withdrawn JP2005333063A (ja) 2004-05-21 2004-05-21 クランプ部材、成膜装置、成膜方法、半導体装置の製造方法

Country Status (2)

Country Link
US (1) US20050257746A1 (https=)
JP (1) JP2005333063A (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010225740A (ja) * 2009-03-23 2010-10-07 Tokyo Electron Ltd 基板処理方法および基板処理装置
KR20190090690A (ko) 2018-01-25 2019-08-02 에이블릭 가부시키가이샤 반도체 제조 장치 및 반도체 장치의 성막 방법

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI470110B (zh) * 2012-09-07 2015-01-21 Manz Taiwan Ltd 用於化學沉積設備的夾固裝置
JP6870531B2 (ja) * 2017-08-21 2021-05-12 三菱電機株式会社 パワーモジュールおよび電力変換装置
CN107937881B (zh) * 2017-11-20 2019-07-05 深圳市华星光电半导体显示技术有限公司 基板夹紧装置
US11996315B2 (en) * 2020-11-18 2024-05-28 Applied Materials, Inc. Thin substrate handling via edge clamping
USD1038049S1 (en) 2020-11-18 2024-08-06 Applied Materials, Inc. Cover ring for use in semiconductor processing chamber
CN113903649B (zh) * 2021-09-23 2024-04-12 北京北方华创微电子装备有限公司 半导体工艺设备

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5513594A (en) * 1993-10-20 1996-05-07 Mcclanahan; Adolphus E. Clamp with wafer release for semiconductor wafer processing equipment
US5437757A (en) * 1994-01-21 1995-08-01 Applied Materials, Inc. Clamp ring for domed pedestal in wafer processing chamber
DE4420050C1 (de) * 1994-06-08 1995-08-24 Weidmueller Interface Abisoliervorrichtung
JP3471543B2 (ja) * 1996-11-07 2003-12-02 大日本スクリーン製造株式会社 回転式基板乾燥装置
US5922133A (en) * 1997-09-12 1999-07-13 Applied Materials, Inc. Multiple edge deposition exclusion rings
US6699375B1 (en) * 2000-06-29 2004-03-02 Applied Materials, Inc. Method of extending process kit consumable recycling life
JP4488646B2 (ja) * 2001-04-23 2010-06-23 株式会社トプコン ウェーハ保持装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010225740A (ja) * 2009-03-23 2010-10-07 Tokyo Electron Ltd 基板処理方法および基板処理装置
KR20190090690A (ko) 2018-01-25 2019-08-02 에이블릭 가부시키가이샤 반도체 제조 장치 및 반도체 장치의 성막 방법

Also Published As

Publication number Publication date
US20050257746A1 (en) 2005-11-24

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