JP2005317901A - 回路部品モジュールおよびその製造方法 - Google Patents
回路部品モジュールおよびその製造方法 Download PDFInfo
- Publication number
- JP2005317901A JP2005317901A JP2004336053A JP2004336053A JP2005317901A JP 2005317901 A JP2005317901 A JP 2005317901A JP 2004336053 A JP2004336053 A JP 2004336053A JP 2004336053 A JP2004336053 A JP 2004336053A JP 2005317901 A JP2005317901 A JP 2005317901A
- Authority
- JP
- Japan
- Prior art keywords
- resin layer
- wiring
- circuit component
- hole
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 51
- 229920005989 resin Polymers 0.000 claims abstract description 234
- 239000011347 resin Substances 0.000 claims abstract description 234
- 239000000758 substrate Substances 0.000 claims description 89
- 238000000034 method Methods 0.000 claims description 65
- 239000002245 particle Substances 0.000 claims description 63
- 230000002093 peripheral effect Effects 0.000 claims description 17
- 238000007747 plating Methods 0.000 claims description 17
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 16
- 239000004020 conductor Substances 0.000 claims description 15
- 238000002788 crimping Methods 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 238000005530 etching Methods 0.000 claims description 9
- 229910052786 argon Inorganic materials 0.000 claims description 8
- 230000000149 penetrating effect Effects 0.000 claims description 6
- 238000010030 laminating Methods 0.000 claims description 4
- 230000035515 penetration Effects 0.000 claims 1
- 239000010410 layer Substances 0.000 description 242
- 239000010949 copper Substances 0.000 description 21
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 20
- 238000000605 extraction Methods 0.000 description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- 239000011787 zinc oxide Substances 0.000 description 10
- 230000015572 biosynthetic process Effects 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 239000003822 epoxy resin Substances 0.000 description 7
- 229920000647 polyepoxide Polymers 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 238000007731 hot pressing Methods 0.000 description 4
- 239000002923 metal particle Substances 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 229910052814 silicon oxide Inorganic materials 0.000 description 4
- 238000001039 wet etching Methods 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 230000001678 irradiating effect Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- -1 for example Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 150000004968 peroxymonosulfuric acids Chemical class 0.000 description 1
- 229920001690 polydopamine Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000002230 thermal chemical vapour deposition Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Images
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004336053A JP2005317901A (ja) | 2004-03-31 | 2004-11-19 | 回路部品モジュールおよびその製造方法 |
| US11/090,812 US20050218491A1 (en) | 2004-03-31 | 2005-03-25 | Circuit component module and method of manufacturing the same |
| CNA2005100626675A CN1678175A (zh) | 2004-03-31 | 2005-03-31 | 电路部件模块及其制造方法 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004101609 | 2004-03-31 | ||
| JP2004336053A JP2005317901A (ja) | 2004-03-31 | 2004-11-19 | 回路部品モジュールおよびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005317901A true JP2005317901A (ja) | 2005-11-10 |
| JP2005317901A5 JP2005317901A5 (https=) | 2007-03-01 |
Family
ID=35444967
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004336053A Withdrawn JP2005317901A (ja) | 2004-03-31 | 2004-11-19 | 回路部品モジュールおよびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2005317901A (https=) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008131037A (ja) * | 2006-11-21 | 2008-06-05 | Samsung Electro Mech Co Ltd | 印刷回路基板の製造方法 |
| WO2008065896A1 (en) * | 2006-11-28 | 2008-06-05 | Kyushu Institute Of Technology | Method for manufacturing semiconductor device having dual-face electrode structure and semiconductor device manufactured by the method |
| JP2008305895A (ja) * | 2007-06-06 | 2008-12-18 | Sumitomo Metal Mining Package Materials Co Ltd | 半導体実装基板の製造方法 |
| JP2009004744A (ja) * | 2007-06-20 | 2009-01-08 | Samsung Electro Mech Co Ltd | プリント基板 |
| JP2009111332A (ja) * | 2007-10-26 | 2009-05-21 | Samsung Electro-Mechanics Co Ltd | 印刷回路基板の製造方法 |
| WO2009118925A1 (ja) * | 2008-03-27 | 2009-10-01 | イビデン株式会社 | 電子部品内蔵配線板及びその製造方法 |
| JP2020088188A (ja) * | 2018-11-27 | 2020-06-04 | 日東電工株式会社 | 配線回路基板およびその製造方法 |
| CN115151031A (zh) * | 2021-03-31 | 2022-10-04 | 三星电机株式会社 | 印刷电路板 |
| WO2024089744A1 (ja) * | 2022-10-24 | 2024-05-02 | 株式会社レゾナック | 配線構造体の製造方法 |
-
2004
- 2004-11-19 JP JP2004336053A patent/JP2005317901A/ja not_active Withdrawn
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008131037A (ja) * | 2006-11-21 | 2008-06-05 | Samsung Electro Mech Co Ltd | 印刷回路基板の製造方法 |
| WO2008065896A1 (en) * | 2006-11-28 | 2008-06-05 | Kyushu Institute Of Technology | Method for manufacturing semiconductor device having dual-face electrode structure and semiconductor device manufactured by the method |
| JP2008305895A (ja) * | 2007-06-06 | 2008-12-18 | Sumitomo Metal Mining Package Materials Co Ltd | 半導体実装基板の製造方法 |
| US8080741B2 (en) | 2007-06-20 | 2011-12-20 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board |
| JP2009004744A (ja) * | 2007-06-20 | 2009-01-08 | Samsung Electro Mech Co Ltd | プリント基板 |
| JP2009111332A (ja) * | 2007-10-26 | 2009-05-21 | Samsung Electro-Mechanics Co Ltd | 印刷回路基板の製造方法 |
| US8347493B2 (en) | 2008-03-27 | 2013-01-08 | Ibiden Co., Ltd. | Wiring board with built-in electronic component and method of manufacturing same |
| JPWO2009118925A1 (ja) * | 2008-03-27 | 2011-07-21 | イビデン株式会社 | 電子部品内蔵配線板及びその製造方法 |
| WO2009118925A1 (ja) * | 2008-03-27 | 2009-10-01 | イビデン株式会社 | 電子部品内蔵配線板及びその製造方法 |
| JP2020088188A (ja) * | 2018-11-27 | 2020-06-04 | 日東電工株式会社 | 配線回路基板およびその製造方法 |
| WO2020110552A1 (ja) * | 2018-11-27 | 2020-06-04 | 日東電工株式会社 | 配線回路基板およびその製造方法 |
| JP7448309B2 (ja) | 2018-11-27 | 2024-03-12 | 日東電工株式会社 | 配線回路基板およびその製造方法 |
| US12273997B2 (en) | 2018-11-27 | 2025-04-08 | Nitto Denko Corporation | Wiring circuit board |
| CN115151031A (zh) * | 2021-03-31 | 2022-10-04 | 三星电机株式会社 | 印刷电路板 |
| US12439512B2 (en) | 2021-03-31 | 2025-10-07 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board |
| WO2024089744A1 (ja) * | 2022-10-24 | 2024-05-02 | 株式会社レゾナック | 配線構造体の製造方法 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20070111 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20070111 |
|
| A761 | Written withdrawal of application |
Effective date: 20090612 Free format text: JAPANESE INTERMEDIATE CODE: A761 |