JP2005313238A5 - - Google Patents

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Publication number
JP2005313238A5
JP2005313238A5 JP2005209073A JP2005209073A JP2005313238A5 JP 2005313238 A5 JP2005313238 A5 JP 2005313238A5 JP 2005209073 A JP2005209073 A JP 2005209073A JP 2005209073 A JP2005209073 A JP 2005209073A JP 2005313238 A5 JP2005313238 A5 JP 2005313238A5
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JP
Japan
Prior art keywords
workpiece
distance
irradiating
laser beam
forming
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Application number
JP2005209073A
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English (en)
Japanese (ja)
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JP4664140B2 (ja
JP2005313238A (ja
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Priority to JP2005209073A priority Critical patent/JP4664140B2/ja
Priority claimed from JP2005209073A external-priority patent/JP4664140B2/ja
Publication of JP2005313238A publication Critical patent/JP2005313238A/ja
Publication of JP2005313238A5 publication Critical patent/JP2005313238A5/ja
Application granted granted Critical
Publication of JP4664140B2 publication Critical patent/JP4664140B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2005209073A 2000-09-13 2005-07-19 レーザ加工方法 Expired - Lifetime JP4664140B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005209073A JP4664140B2 (ja) 2000-09-13 2005-07-19 レーザ加工方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000278306 2000-09-13
JP2005209073A JP4664140B2 (ja) 2000-09-13 2005-07-19 レーザ加工方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2004318326A Division JP3751970B2 (ja) 2000-09-13 2004-11-01 レーザ加工装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2006056671A Division JP3867108B2 (ja) 2000-09-13 2006-03-02 レーザ加工装置

Publications (3)

Publication Number Publication Date
JP2005313238A JP2005313238A (ja) 2005-11-10
JP2005313238A5 true JP2005313238A5 (enExample) 2009-02-19
JP4664140B2 JP4664140B2 (ja) 2011-04-06

Family

ID=35441202

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005209073A Expired - Lifetime JP4664140B2 (ja) 2000-09-13 2005-07-19 レーザ加工方法

Country Status (1)

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JP (1) JP4664140B2 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007165850A (ja) 2005-11-16 2007-06-28 Denso Corp ウェハおよびウェハの分断方法
JP4655915B2 (ja) * 2005-12-15 2011-03-23 セイコーエプソン株式会社 層状基板の分割方法
JP5232375B2 (ja) * 2006-10-13 2013-07-10 アイシン精機株式会社 半導体発光素子の分離方法
JP5269356B2 (ja) * 2006-07-03 2013-08-21 浜松ホトニクス株式会社 レーザ加工方法
US7897487B2 (en) * 2006-07-03 2011-03-01 Hamamatsu Photonics K.K. Laser processing method and chip
JP2011223041A (ja) * 2011-08-05 2011-11-04 Toyoda Gosei Co Ltd 半導体発光素子の分離方法
JP6189066B2 (ja) * 2013-03-27 2017-08-30 株式会社ディスコ ウエーハの加工方法
US10562130B1 (en) 2018-12-29 2020-02-18 Cree, Inc. Laser-assisted method for parting crystalline material
US10576585B1 (en) 2018-12-29 2020-03-03 Cree, Inc. Laser-assisted method for parting crystalline material
US11024501B2 (en) 2018-12-29 2021-06-01 Cree, Inc. Carrier-assisted method for parting crystalline material along laser damage region
US10611052B1 (en) 2019-05-17 2020-04-07 Cree, Inc. Silicon carbide wafers with relaxed positive bow and related methods
JP7467208B2 (ja) * 2020-04-06 2024-04-15 浜松ホトニクス株式会社 レーザ加工装置、及び、レーザ加工方法
CN112518141B (zh) * 2020-11-24 2022-07-15 无锡光导精密科技有限公司 一种激光诱导切割方法及装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0688149B2 (ja) * 1987-03-04 1994-11-09 株式会社半導体エネルギ−研究所 光加工方法
JP3660741B2 (ja) * 1996-03-22 2005-06-15 株式会社日立製作所 電子回路装置の製造方法
JP3532100B2 (ja) * 1997-12-03 2004-05-31 日本碍子株式会社 レーザ割断方法
JP3604550B2 (ja) * 1997-12-16 2004-12-22 日亜化学工業株式会社 窒化物半導体素子の製造方法
JP2000015467A (ja) * 1998-07-01 2000-01-18 Shin Meiwa Ind Co Ltd 光による被加工材の加工方法および加工装置
JP2000219528A (ja) * 1999-01-18 2000-08-08 Samsung Sdi Co Ltd ガラス基板の切断方法及びその装置

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