JP4664140B2 - レーザ加工方法 - Google Patents

レーザ加工方法 Download PDF

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Publication number
JP4664140B2
JP4664140B2 JP2005209073A JP2005209073A JP4664140B2 JP 4664140 B2 JP4664140 B2 JP 4664140B2 JP 2005209073 A JP2005209073 A JP 2005209073A JP 2005209073 A JP2005209073 A JP 2005209073A JP 4664140 B2 JP4664140 B2 JP 4664140B2
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JP
Japan
Prior art keywords
workpiece
region
laser
crack
laser beam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2005209073A
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English (en)
Japanese (ja)
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JP2005313238A5 (enExample
JP2005313238A (ja
Inventor
文嗣 福世
憲志 福満
直己 内山
敏光 和久田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hamamatsu Photonics KK
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Hamamatsu Photonics KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Hamamatsu Photonics KK filed Critical Hamamatsu Photonics KK
Priority to JP2005209073A priority Critical patent/JP4664140B2/ja
Publication of JP2005313238A publication Critical patent/JP2005313238A/ja
Publication of JP2005313238A5 publication Critical patent/JP2005313238A5/ja
Application granted granted Critical
Publication of JP4664140B2 publication Critical patent/JP4664140B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Dicing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Laser Beam Processing (AREA)
JP2005209073A 2000-09-13 2005-07-19 レーザ加工方法 Expired - Lifetime JP4664140B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005209073A JP4664140B2 (ja) 2000-09-13 2005-07-19 レーザ加工方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000278306 2000-09-13
JP2005209073A JP4664140B2 (ja) 2000-09-13 2005-07-19 レーザ加工方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2004318326A Division JP3751970B2 (ja) 2000-09-13 2004-11-01 レーザ加工装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2006056671A Division JP3867108B2 (ja) 2000-09-13 2006-03-02 レーザ加工装置

Publications (3)

Publication Number Publication Date
JP2005313238A JP2005313238A (ja) 2005-11-10
JP2005313238A5 JP2005313238A5 (enExample) 2009-02-19
JP4664140B2 true JP4664140B2 (ja) 2011-04-06

Family

ID=35441202

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005209073A Expired - Lifetime JP4664140B2 (ja) 2000-09-13 2005-07-19 レーザ加工方法

Country Status (1)

Country Link
JP (1) JP4664140B2 (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10562130B1 (en) 2018-12-29 2020-02-18 Cree, Inc. Laser-assisted method for parting crystalline material
US10576585B1 (en) 2018-12-29 2020-03-03 Cree, Inc. Laser-assisted method for parting crystalline material
US10611052B1 (en) 2019-05-17 2020-04-07 Cree, Inc. Silicon carbide wafers with relaxed positive bow and related methods
US11024501B2 (en) 2018-12-29 2021-06-01 Cree, Inc. Carrier-assisted method for parting crystalline material along laser damage region

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007165850A (ja) 2005-11-16 2007-06-28 Denso Corp ウェハおよびウェハの分断方法
JP4655915B2 (ja) * 2005-12-15 2011-03-23 セイコーエプソン株式会社 層状基板の分割方法
JP5232375B2 (ja) * 2006-10-13 2013-07-10 アイシン精機株式会社 半導体発光素子の分離方法
JP5269356B2 (ja) * 2006-07-03 2013-08-21 浜松ホトニクス株式会社 レーザ加工方法
US7897487B2 (en) * 2006-07-03 2011-03-01 Hamamatsu Photonics K.K. Laser processing method and chip
JP2011223041A (ja) * 2011-08-05 2011-11-04 Toyoda Gosei Co Ltd 半導体発光素子の分離方法
JP6189066B2 (ja) * 2013-03-27 2017-08-30 株式会社ディスコ ウエーハの加工方法
JP7467208B2 (ja) * 2020-04-06 2024-04-15 浜松ホトニクス株式会社 レーザ加工装置、及び、レーザ加工方法
CN112518141B (zh) * 2020-11-24 2022-07-15 无锡光导精密科技有限公司 一种激光诱导切割方法及装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0688149B2 (ja) * 1987-03-04 1994-11-09 株式会社半導体エネルギ−研究所 光加工方法
JP3660741B2 (ja) * 1996-03-22 2005-06-15 株式会社日立製作所 電子回路装置の製造方法
JP3532100B2 (ja) * 1997-12-03 2004-05-31 日本碍子株式会社 レーザ割断方法
JP3604550B2 (ja) * 1997-12-16 2004-12-22 日亜化学工業株式会社 窒化物半導体素子の製造方法
JP2000015467A (ja) * 1998-07-01 2000-01-18 Shin Meiwa Ind Co Ltd 光による被加工材の加工方法および加工装置
JP2000219528A (ja) * 1999-01-18 2000-08-08 Samsung Sdi Co Ltd ガラス基板の切断方法及びその装置

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10562130B1 (en) 2018-12-29 2020-02-18 Cree, Inc. Laser-assisted method for parting crystalline material
US10576585B1 (en) 2018-12-29 2020-03-03 Cree, Inc. Laser-assisted method for parting crystalline material
US11024501B2 (en) 2018-12-29 2021-06-01 Cree, Inc. Carrier-assisted method for parting crystalline material along laser damage region
US11219966B1 (en) 2018-12-29 2022-01-11 Wolfspeed, Inc. Laser-assisted method for parting crystalline material
US11826846B2 (en) 2018-12-29 2023-11-28 Wolfspeed, Inc. Laser-assisted method for parting crystalline material
US11901181B2 (en) 2018-12-29 2024-02-13 Wolfspeed, Inc. Carrier-assisted method for parting crystalline material along laser damage region
US11911842B2 (en) 2018-12-29 2024-02-27 Wolfspeed, Inc. Laser-assisted method for parting crystalline material
US10611052B1 (en) 2019-05-17 2020-04-07 Cree, Inc. Silicon carbide wafers with relaxed positive bow and related methods
US11034056B2 (en) 2019-05-17 2021-06-15 Cree, Inc. Silicon carbide wafers with relaxed positive bow and related methods
US11654596B2 (en) 2019-05-17 2023-05-23 Wolfspeed, Inc. Silicon carbide wafers with relaxed positive bow and related methods

Also Published As

Publication number Publication date
JP2005313238A (ja) 2005-11-10

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