JP2005308707A - Manufacturing method for index of timepiece - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reduce production man-hours for a timepiece index, as to a manufacturing method for an index such as a numeral, a mark and a sign provided in a dial used in a timepiece or the like. <P>SOLUTION: This manufacturing method for the timepiece index wherein the index for the timepiece 2 is formed on a surface of a conductive base material 110 by an electrocasting plating technique, wherein the index 2 is separation-transferred to a pressure-sensitive adhesive layer 24 of a support material 25 provided with the pressure-sensitive adhesive layer 24, wherein a fixing adhesive layer 28 is formed further in a reverse face side of the index, and wherein the index 2 is bonded onto the dial 1 for the timepiece via the fixing adhesive layer 28 while separating the index 2 from the support material 25 is a manufacturing method for the timepiece index using the conductive base material 110 with a metal sheet 112 bonded on a resin base plate 111 via a temporary adhesive layer 113. The production man-hours are reduced and a production cost for the index 2 is reduced, by recovering the resin base plate 111 to be used recyclingly, in the production of the timepiece index. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a method for manufacturing indicators such as numerals, marks and symbols provided on a dial used in a timepiece or the like.

  The background art will be described below with reference to FIGS. 9 is a perspective view of a timepiece dial provided with an index, FIG. 10 is a plan view when the index is formed on the surface of the conductive base material, and FIG. 11 is a cross-sectional view of the conductive base material used in the electroforming method. FIG. 12 is a manufacturing process diagram when an index is formed by an electroforming method, and FIG. 13 is a perspective view taken along the line AA in FIG. 10 in the step (d) of FIG.

As shown in FIG. 9, the timepiece dial is provided with an index 2 made of metal or plastic on a flat dial 1. As a method of manufacturing this index, the following three methods are roughly classified. There is.
1) Electroforming method: A method of producing an index by electroforming using a plated metal on a metal plate, and then transferring and bonding the indicator to a dial.
2) Coining method: Using a press machine or the like, create a footing index with a foot that is made of a highly stretched metal such as pure copper or brass, and cut the upper surface or side surface with a diamond tool to make it shiny. A method of fitting the foot into a small hole provided in the dial and crimping it.
3) Cutting method: A method in which an index cut by an NC machine or the like is made from a plastic or metal material, and the index is fixed to a dial with an adhesive.
The manufacturing method of the timepiece index of the present invention belongs to the electroforming method. One of the background arts as a method for producing an index using an electroforming technique is a technique disclosed in Patent Document 1 below.

Japanese Patent Publication No. 8-27597

  Hereinafter, the process until the index 2 is formed by the electroforming method based on Patent Document 1 and the index 2 is attached to the dial 1 will be described mainly with reference to FIG. Since the index 2 is formed on the conductive substrate 10, the description of the conductive substrate 10 is first started.

  As shown in FIG. 11, the conductive base material 10 conventionally used is a laminate in which a conductive coating 12 is provided on the surface of a metal substrate 11 such as stainless steel. When this multilayer conductive substrate 10 is used, it is possible to prevent the index image from scattering when the index 2 is transferred from the conductive substrate 10 to the support substrate 25 in a post-production process. The conductive coating 12 is a flexible thin film having conductivity, such as a conductive metal thin film, a conductive paint film, a conductive polymer thin film, etc. formed by electrolytic plating (electrodeposition) or electroless plating. However, a conductive metal thin film by electrodeposition was preferably used. The film thickness of the conductive metal coating is usually 20-30 μm. Since the conductive coating is peeled off from the surface of the metal substrate 11 in a subsequent process, a release treatment such as surface oxidation is performed on the surface of the metal substrate 11 in order to facilitate peeling. When the conductive substrate 10 is used and the steps (a) to (d) in FIG. 12 are performed, the intermediate product 20 shown in FIGS. 10 and 13 is completed.

  FIG. 10 is a plan view showing a state in which the index 2 is formed on the surface of the conductive substrate 10, and FIG. 13 is a perspective view taken along the line AA in FIG. 10 in step (d) of FIG. On the surface of the conductive base material 10, the electrode 2 and the linear electrodeposition 5 surrounding the index 2 and the guide electrodeposition 6 provided with the guide holes 6a are formed. By forming the linear electrodeposition 5 around the index 2, excessive electrodeposition of the index 2 on the outer peripheral end can be prevented. The guide hole 6a provided in the guide electrodeposition 6 is used for positioning when the index 2 is transferred and adhered to the dial 1 in the final step. Since the linear electrodeposition 5 and the guide electrodeposition 6 are not used as products, hereinafter, the linear electrodeposition 5 and the guide electrodeposition 6 will be collectively referred to as “discarding electricity 3”.

First, each step up to step (d) will be described with reference to FIG.
Step (a): A photoresist 22 is laminated on the surface of the conductive substrate 10, and an index 2 image and a discarded electricity 3 image are covered with a mask film 23 produced by printing or photography, and then the photoresist 22. The exposure 4 is irradiated on the top.
Step (b): After the development after exposure, only the unexposed portion of the photoresist 22 is removed, and then the exposed portion of the conductive substrate 10 (the portion without the photoresist coating) is subjected to a release treatment. .
Step (c): Further, plating is performed by using an electrodeposition method to form an indicator 2 made of plated metal and a discarded electrode 3.
Step (d): Subsequently, the exposed photoresist is removed by immersion in a stripping solution.
Through the above steps, as shown in FIG. 10, the indicator 2 made of plated metal and the discarded electricity 3 are formed on the conductive substrate 10.

Next, a process until the intermediate product 20 is attached to the dial 1 will be described with reference to FIGS. 12 (e) to 12 (g).
Step (e): The index 2 is temporarily transferred onto the support substrate 25 through the pressure-sensitive adhesive layer 24 made of a pressure-sensitive adhesive. At this time, the conductive film 12 remains adhered to the index 2 and is separated from the metal substrate 11.
Step (f); removing the conductive film 12. A fixing adhesive layer 28 made of a fixing adhesive is provided on the index 2 and the waste electricity 3 is pulled away and removed.
Step (g): The dial 2 fixed on the jig 26 is pressed while being positioned by the guide pins 27, and the support base 25 and the pressure-sensitive adhesive layer 24 are peeled off to fix the index 2. It is fixed to the dial 1 via the adhesive layer 28.

  As described above, in the case of the conventional electroforming method, the index 2 is manufactured on the upper surface of the conductive base material 10 that is electroplated on the metal substrate 11. When the step of transferring to the support base material 25 provided with the adhesive layer 24 (step (e) in FIG. 12) is finished, the metal substrate 11 is separated from the manufacturing step. The metal substrate 11 is reused after being subjected to electrolytic plating again, but the electrolytic plating process takes a lot of time. Further, since the non-conductive material is attached to the recovered metal substrate 11 and a high-quality plated film cannot be formed as it is, it is necessary to spend a long time (for example, about 10 minutes) and polish it before electrolytic plating. Further, since the metal substrate 11 is warped once it is used, it is necessary to correct the metal substrate 11, but the metal substrate 11 has high rigidity and is difficult to correct.

  The present invention has been made to solve the above problems. As a means for solving the problem, the invention according to claim 1 of the present invention is the pressure sensitive adhesion of the supporting base material in which the index is formed on the surface of the conductive base material by the electroforming plating method and the pressure sensitive adhesive layer is provided. The indicator is peeled and transferred to the adhesive layer, and an adhesive layer for fixing is formed on the back side of the indicator, and the indicator is attached to the timepiece dial via the adhesive layer for fixing while peeling from the support substrate. In the method for manufacturing an indicator for a watch, the conductive base material is formed by bonding a metal sheet on a resin substrate via a temporary adhesive layer, and the resin substrate is used after recycling the metal sheet. This is a method for manufacturing a timepiece index.

  The invention according to claim 2 of the present invention is characterized in that the metal sheet is made of a non-adhesive copper-clad laminate (two-layer CCL) or a composite material obtained by bonding a copper foil and a polyester film. It is a manufacturing method of an index.

  According to a third aspect of the present invention, there is provided a timepiece index manufacturing method, wherein the resin substrate is made of a bakelite resin or an acrylic resin.

  The invention according to claim 4 of the present invention is a method for producing a timepiece index, wherein the temporary adhesive layer is made of a photo-curing adhesive, a thermosetting adhesive, or a heat-peeling adhesive. is there.

  The invention according to claim 5 of the present invention is the timepiece index manufacturing method characterized in that the temporary adhesive layer is provided on the entire upper surface or the outer edge of the upper surface of the resin substrate.

  In the invention according to claim 6 of the present invention, the indicator is formed on the surface of the conductive substrate by electroforming plating method, and the pressure-sensitive adhesive layer of the supporting substrate on which the pressure-sensitive adhesive layer is provided The timepiece index is peeled and transferred, and further, an adhesive layer for fixing is formed on the back side of the index, and the index is attached to the timepiece dial via the adhesive layer for fixing while peeling off the index from the supporting substrate. In the manufacturing method, the conductive base material is composed of a non-conductive sheet on which a conductive thin film is formed, and the conductive base material is immersed in a plating bath liquid layer under tension and electroplated by the electroforming plating method. A timepiece index manufacturing method characterized in that an index is formed on a conductive thin film.

  Further, the invention according to claim 7 of the present invention is characterized in that the conductive substrate is tensioned by fixing the conductive substrate to a tension frame while being pulled from four sides. It is a manufacturing method of a clock index.

  In the invention according to claim 8 of the present invention, the conductive base material is composed of two rollers having a constant distance while supporting both ends of the belt-like conductive base material. It is a manufacturing method of the timepiece index, which is characterized by being in a state of tension by pressurizing.

  The invention according to claim 9 of the present invention is the timepiece index manufacturing method, wherein the conductive thin film has a glossy surface.

  The invention according to claim 10 of the present invention is the timepiece indicator manufacturing method, wherein the conductive thin film is made of stainless steel.

  As an effect of the invention, the use of the metal sheet according to claim 1 eliminates the need for a time-consuming plating process for a metal substrate. Further, by using the resin substrate according to claim 1, it is not necessary to polish the substrate when the substrate is recycled and the production process is repeated. Also, the correction of the warped substrate is easier than the metal substrate.

  Further, since the metal sheet according to claim 2 has a mirror surface and good electrical conductivity, it is easy to plate, and gloss appears on the index formed by the electroforming technique, giving a high-class feeling. In addition, inexpensive commercial products can be easily obtained.

  Further, the resin substrate according to claim 3 has a moderate rigidity as a substrate, and can be easily corrected even if it is warped once.

  Further, by using the temporary adhesive according to the fourth aspect, the connection between the metal sheet and the resin substrate can be easily changed according to the necessity in the manufacturing process.

  In addition, by providing the temporary adhesive layer according to claim 5 on the entire upper surface of the resin substrate or on the outer edge of the upper surface, the metal sheet can be tensioned and affixed. Can be tailored to a better shape. Moreover, it becomes easy to perform an adhesion | attachment operation | work and a peeling operation | work especially by providing in the outer edge part of a resin substrate.

  In addition, under the manufacturing method according to claims 6, 7, and 8, the metal substrate that has been conventionally used is not required, and the metal substrate peeling process is not required, so that the manufacturing process can be shortened and the manufacturing cost can be reduced. Produces a reduction effect.

  Further, by making the conductive thin film according to claim 9 a glossy surface, gloss appears on the index formed by the electroforming plating technique, and a high-grade feeling is brought about.

  Further, under the manufacturing method according to the tenth aspect, the releasability is improved, and the release can be easily performed without applying the release agent.

  Next, the best mode for carrying out the present invention will be described below with reference to FIGS. Here, the illustration will be briefly described. 1, 2, and 3 illustrate a timepiece index manufacturing method according to the first embodiment of the present invention, and FIG. 1A is used for the index manufacturing method according to the first embodiment of the present invention. FIG. 1B is a cross-sectional view of another embodiment, FIG. 2 is a manufacturing process diagram in the index manufacturing method of the present invention, and FIG. 3 is a step (d) of FIG. It is a principal part cross-sectional perspective view of the intermediate product in. FIG. 4 shows a plan view when an index is formed on the surface of the conductive substrate in the second embodiment of the present invention. FIG. 5 is a process diagram illustrating a manufacturing process according to the second embodiment of the index manufacturing method of the present invention, and FIG. 6 is a cross-sectional perspective view of the main part of the intermediate product in the process (d) of FIG. . FIG. 7 shows an explanatory diagram when performing electroforming plating in the step (c) of FIG. FIG. 8 shows an explanatory view for explaining a method of tensioning another embodiment of a method of tensioning a conductive substrate. In addition, the same code | symbol is attached | subjected and demonstrated to the same component as the component demonstrated by background art.

  Initially, the manufacturing method of the parameter | index which concerns on 1st Embodiment of this invention is demonstrated using FIGS. 1-3. As shown in FIG. 1A, the conductive base material 110 used in the index manufacturing method of the present invention is composed of a resin substrate 111, a metal sheet 112, and a temporary adhesive layer 113 that connects between the resin substrate 111 and the metal sheet 112. A detailed description thereof will be described later, and a method for manufacturing a timepiece index using the conductive substrate 110 of the present invention will be described first.

First, in step (a), a photoresist film 22 is formed on the surface of the conductive substrate 110 by a method such as printing, and a mask film 23 in which two images of indicators and three discarded images are printed or photographed from above. Then, the exposure 4 is irradiated on the photoresist 22. As described in the background art, the discarded power 3 here is a linear electrodeposition 5 formed around the index 2 and a guide electrodeposition used when the index 2 is transferred and adhered to the dial 1 in the final step. 6.
Next, in step (b), after the development after exposure, only the unexposed portion of the photoresist 22 is removed, and then the exposed portion of the conductive substrate 110 (the portion without the photoresist 22 coating) is removed. Perform mold release treatment.
Next, in step (c), plating is performed using an electroforming plating method to form the indicator 2 made of plated metal and the discarded electricity 3. In the figure, only the linear electrodeposition 5 of the discarded power 3 is shown.
Next, in the step (d), the exposed photoresist 22 is subsequently removed by immersion in a stripping solution.
After the above steps, as shown in FIG. 3, the indicator 2 made of plated metal and the discarded electric power 3 (linear electrodeposition which is one of the discarded electric power 3 in FIG. 3) are formed on the conductive substrate 110. An intermediate product 120 is obtained in which only 5 is drawn.

Next, a process until the intermediate product 120 is attached to the dial 1 will be described with reference to FIGS. 2 (e) to 2 (i).
In the step (e), the index 2 and the discarded electricity 3 are once transferred onto the film-like support base material 25 through the pressure-sensitive adhesive layer 24 made of a pressure-sensitive adhesive. The metal sheet 112 is adhered to the side of the index 2 and the discarded electric power 3 (in the drawing, only the linear electrodeposition 5 that is one of the discarded electric power 3 is shown), and the resin substrate 111 is adhered. Separate from the side.
Next, in the step (f), the metal sheet 112 is peeled and removed from the side of the index 2 and the discarded power 3 (in the figure, only the linear electrodeposition 5 which is one of the discarded power 3 is shown). To do.
Next, in the step (g), a method such as printing on the fixing surface of the index 2 and the discarded electricity 3 (in the figure, only the linear electrodeposition 5 which is one of the discarded electricity 3 is shown) The fixing adhesive layer 28 is provided.
Next, in the step (h), the linear electrodeposition 5 which is one of the discarded power 3 is peeled and removed.
Next, in step (i), after the adhesive force of the pressure-sensitive adhesive layer 24 is weakened, the guide hole of the electrodeposition guide 6 is inserted into the guide pin 27 and positioned to support the index 2 The base material 25 is pressed against the dial 1 fixed on the jig 26, the index 2 is peeled off from the support base 25 and the pressure sensitive adhesive layer 24, and the adhesive plate 28 for fixing to the timepiece dial 1. Paste through. The index 2 is formed through the above steps, and the index 2 is pasted on the timepiece dial 1.

  In the present invention, the metal sheet 112 is pasted on the resin substrate 111 via the temporary adhesive layer 113 as the conductive base material. The temporary adhesive forming the temporary adhesive layer 113 is an adhesive whose adhesive force is changed by performing a physicochemical treatment such as heating. When the index 2 is transferred to the support base material 25 side, Peel between the metal sheets 112. Since the resin substrate 111 constituting the conductive base material 110 is recycled and used in the production of the timepiece index, each component of the conductive base material 110 will be individually described below.

  The resin substrate 111 forms a substrate of the conductive base 110 and has a function as a structural material that supports the thin metal sheet 112 provided on the surface. Therefore, while a certain degree of rigidity is required, it is required to have an appropriate flexibility and facilitate the peeling operation. A bakelite resin is suitable for satisfying these demands.

  In the case where the index 2 is formed on the surface of the conductive substrate 110 by electroforming, in order to make the surface of the index formed by electroforming plating gloss, and in order to improve the peelability in the subsequent process, the conductivity is increased. The surface of the substrate 110 needs to be in a mirror state as well as the conductivity. Further, when the index 2 is transferred to the support base 25, it is necessary to prevent the index 2 from being scattered by transferring the index 2 together with the index 2 while maintaining the position of the index 2. As a method for realizing these conditions, the metal sheet 112 is used in the present invention. This metal sheet 112 is a laminate film having a metal foil on the surface, and there is a two-layer CCL (non-adhesive copper-clad laminate) as a laminate film not using an adhesive. As the two-layer CCL, one produced by a casting method in which a polyimide precursor solution is applied on a copper foil and dried and cured (Espanex of Nippon Steel Chemical Co., Ltd.) was used.

  The adhesive or the like used for the temporary adhesive layer 113 is also required to be easily peeled at the same time as a firm adhesive force. In order to satisfy these conditions, an adhesive tape (Rivalfa from Nitto Denko Corporation) was used in this embodiment. This is a heat-peeling adhesive tape in which an adhesive layer is provided on a polyester film substrate. Thermally expandable microcapsules are mixed in the pressure-sensitive adhesive, and the surface of the pressure-sensitive adhesive is made uneven by heating and foaming, thereby reducing the adhesion area with the adherend. Although the thermal peeling temperature varies depending on the product type, the adhesive strength becomes zero in a short time when heated at 90 ° C. to 170 ° C.

  In the embodiment of the present invention, the conductive sheet 110 is configured by pasting the metal sheet 112 on the resin substrate 111 using the temporary adhesive. Using this conductive substrate 110, the index 2 was manufactured in the manufacturing process shown in FIG. Further, the metal sheet 112 is made disposable during the production cycle, but the resin substrate 111 is recycled and used.

  Since the surface of the conductive substrate 110 needs to be a mirror surface, conventionally, the entire surface is plated on the stainless steel plate for a long time every recycling. However, when the manufacturing method of the present invention is used, a plating process is performed. Can be abolished. The metal sheet 112 used in the present invention is a mirror surface and has good conductivity, so that it is easy to plate and a commercially available product can be easily obtained. In addition, the resin substrate 111 used in the present invention has a moderate rigidity as a substrate, is elastic and easily peeled off, and does not need to be polished as in the case of a stainless steel plate because non-conductor does not adhere in the case of recycling. It can be easily corrected even if it warps once. As a result of these merits, it is possible to reduce the number of man-hours for producing timepiece indicators.

  In addition to the bakelite resin used in the embodiment, an acrylic resin may be used as the material of the resin substrate 111. Acrylic resins can also be easily peeled off during the production process, and substrates that have warped during recycling can be easily corrected.

  The metal sheet 112 may be a two-layer CCL produced by a sputtering / plating method. Moreover, as a copper-clad sheet using an adhesive, a composite material in which a copper foil and a polyester film are laminated is also commercially available, and this can be used. By using these metal sheets 112, as in the embodiment, it is possible to eliminate the plating process which took a long time in the production process and to eliminate the need for polishing like a stainless steel plate.

As the adhesive used for the temporary adhesive layer 113, the following types of adhesives can be used in addition to the adhesive tape described in the embodiment.
Thermosetting adhesive; When peeling off, the adhesive strength can be weakened by heating.
Photo-curable adhesive; for example, Adel Co., Ltd.'s photo-curable adhesive is in liquid form, and after application, the K series is cured by irradiation with visible light or ultraviolet light. The KM and KR series are visible. Cured by light irradiation or heat treatment. For stripping, a stripping solution made of water or an aqueous ethanol solution is used. If rust occurs, add a rust inhibitor.
These adhesives can also exhibit the effect of temporary adhesion as a component of the conductive substrate 110 of the present invention. Furthermore, when the metal sheet 112 is attached to the resin substrate 111 via the temporary adhesive layer 113, the metal sheet 112 is attached in a tensioned state so as not to cause wrinkles or the like. Thereby, the shape of the index formed by electroforming plating is also finished to a smooth surface shape.

  FIG. 1B shows another example in which the present embodiment takes a shape different from the cross-sectional shape of the conductive substrate 110 shown in FIG. In the embodiment shown in FIG. 1B, the temporary adhesive layer 133 is provided only on the outer edge portion 134 of the resin substrate 131. By using the conductive base material 130 in which the temporary adhesive layer 133 is provided only on the outer edge portion 134 of the resin substrate 131, it becomes easier to perform the bonding / peeling operation between the resin substrate 131 and the metal sheet 112. In addition, there is an effect of increasing the degree of freedom when selecting the type of adhesive forming the temporary adhesive layer 133. In the configuration of FIG. 1B, the outer edge portion 134 is lowered one step further and a groove 136 is provided between the inner side portion 135 and the outer edge portion 134 in order to improve the fit of the temporary adhesive layer 133. Even if it takes such a structure, a metal sheet can be stuck in a sufficiently tensioned state.

  Next, a timepiece index manufacturing method according to a second embodiment of the present invention will be described with reference to FIGS. Here, FIG. 4 shows a plan view when an index is formed on the surface of the conductive substrate in the second embodiment of the present invention, and hereinafter referred to as an intermediate product as in the first embodiment. I will explain. FIG. 5 is a process diagram illustrating a manufacturing process according to the second embodiment of the index manufacturing method of the present invention, and FIG. 6 is a cross-sectional perspective view of the main part of the intermediate product shown in FIG.

  As shown in FIG. 4, the intermediate product 150 is formed from a long conductive base material 140 in which indicators 2 for a plurality of dials and discarded electricity 43 are provided side by side. Here, the discarded electrode 43 is formed so as to face the sheet electrodeposition 45 formed in a sheet shape with the shape of the index 2 wrapped in an island shape and surrounding the sheet electrodeposition 45. It consists of a pair of guide electrodepositions 46 formed, and the planar electrodeposition 45 is provided for the purpose of preventing excessive electrodeposition due to excess current flowing through the index. Further, the planar electrodeposition 45 is connected to adjacent planar electrodepositions, and the workability is improved so that all the planar electrodepositions can be peeled at once in the peeling process of the planar electrodeposition 45. It has become. The pair of guide electrodepositions 46 are provided with positioning guide holes 46a for the purpose of positioning when an index is attached to the dial. The sheet electrodeposition 45 and the guide electrodeposition 46 are called discard electricity 43 because they are discarded (removed) in the process before and after the index 2 is pasted on the dial. The index 2, the surface electrodeposition 45, and the guide electrodeposition 46 are all formed by an electroforming plating method, that is, an electrolytic plating method that is immersed in a plating bath solution for a long time. The thickness of the plating can be arbitrarily set depending on the plating time, but is preferably in the range of 15 to 50 μm.

  Here, the electroconductive base material 140 consists of what provided the electroconductive thin film on the nonelectroconductive sheet upper surface. That is, as shown in the process diagram of FIG. 5A and FIG. 6, the conductive base material 140 is constituted by the non-conductive sheet 141 and the conductive thin film 142 provided on the non-conductive sheet 141. doing. As the non-conductive sheet 141, a sheet having high heat resistance, water resistance, impact resistance, and chemical resistance, such as a polyethylene terephthalate film and a polyimide film, can be suitably selected. Moreover, since some rigidity is required, it is preferable to use the one having a thickness in the range of 100 to 300 μm. The conductive thin film 142 is a metal thin film having conductivity and a glossy surface. For example, a thin metal film formed by a vacuum deposition method, a sputtering method, or a metal foil film made of a glossy thin metal foil is used. To be elected. As a material for the metal film, a metal material such as nickel, copper, silver, gold, and stainless steel can be selected. In particular, it is preferable to use a stainless metal such as SUS304, SUS310, and SUS316. Since these stainless materials have good releasability from the plated metal, it is not necessary to use a release agent. When a metal film of a metal other than stainless steel is formed, it is necessary to perform a mold release treatment using a mold release agent. As described above, the conductive substrate 140 is made of a resin film having a metal thin film formed thereon, and thus has flexibility. As such a conductive substrate 140, a resin film provided with a metal vapor deposition film of SUS310, a resin film laminated with a metal foil film, and the like are already on the market, and these commercially available ones should be used directly. You can also. The conductive thin film 142 is not limited to the metal described above. For example, an ITO vapor-deposited film may be used, and the effect of the present invention will be sufficiently exhibited if it is a conductive thin film.

A method for manufacturing an index using the flexible conductive substrate 140 will be described with reference to the process chart shown in FIG.
First, in step (a) shown in FIG. 5, a photoresist 22 is formed on the surface of the conductive substrate 140 by a method such as printing. Then, the index 2 image and the discarded electric power 43 image are covered with a mask film 123 produced by printing or photography from above, and then exposure 4 is irradiated onto the photoresist 22. Here, the image of the discarded power 43 is an image composed of the planar electrodeposition 45 and the guide electrodeposition 46 as described above.
Next, in step (b), the unexposed portion of the photoresist 22 is removed through development after exposure. Further, when the conductive thin film 142 of the conductive substrate 140 is formed of a metal material other than stainless steel such as SUS304, SUS310, or SUS316, the release of chromium oxide on the exposed portion (portion where the photoresist 22 is not covered). A mold release process is performed by applying an agent. As described above, when the conductive base material 140 is formed with a stainless metal thin film such as SUS304, SUS310, or SUS316, the mold release process may not be performed.
Next, in step (c), nickel plating or the like is performed using an electroforming plating method to form the indicator 2 made of plated metal and the discarding electrode 43 (in the process diagram, the discarding electricity of the planar electrodeposition 45 is formed. Only shown). Here, since the conductive base material 140 has flexibility and the like, plating is performed with the conductive base material 140 in a tensioned state. The plating method is performed by the method shown in FIG. 7, and this plating method will be described in detail later.
Next, in the step (d), the exposed photoresist 22 is subsequently removed by immersion in a stripping solution.
Through the above steps, an intermediate product 150 is obtained in which the indicator 2 made of plated metal and the discarded electricity 43 are formed on the conductive substrate 140 shown in FIGS. 4 and 6.

Next, a process until the intermediate product 150 is attached to the dial 1 will be described with reference to FIGS. 5 (e) to 2 (i).
In the step (e), the pressure sensitive adhesive layer 24 made of a pressure sensitive adhesive is formed on the upper surface of the index 2 and the waste electricity 43 (in the process diagram, only the waste electricity of the surface electrodeposition 45 is shown). The provided film-like support base material 25 is affixed.
Then, in the step (f), the conductive substrate 140 is peeled off from the index 2 and the discarded electricity 43 (in the process diagram, only the discarded electricity of the planar electrodeposition 45 is shown).
Next, in the step (g), the fixing adhesive layer 28 is provided on the fixing surface of the index 2 and the surface electrodeposition 45 by a method such as printing.
Next, in the step (h), the planar electrodeposition 45, which is one of the discarded electricity 43, is peeled and removed.
Next, in step (i), after the adhesive force of the pressure-sensitive adhesive layer 24 is weakened, the guide hole of the guide electrodeposition 46 is inserted into the guide pin 27 and positioned to support the index 2 The base material 25 is pressed against the dial 1 fixed on the jig 26, the index 2 is peeled off from the support base 25 and the pressure sensitive adhesive layer 24, and the adhesive plate 28 for fixing to the timepiece dial 1. Paste through.
The index 2 is formed through the above steps, and the index 2 is pasted on the timepiece dial 1.

FIG. 7 shows an explanatory diagram when performing electroforming plating in the step (c) of FIG. Since the conductive base material 140 has flexibility, when an electrodeposition film is formed, a plating stress (about 6 to 10 g / mm ² ) is generated and the electrodeposition film warps in a convex shape. As a result, the index formed by electrodeposition is convexly warped, and when attached to the dial, the adhesive strength is insufficient and the index is easily peeled off. In order not to generate the convex warp, it is necessary to apply a tension to the conductive substrate 140 to perform plating. In the electroforming plating method according to the present embodiment, as shown in FIG. 7, a long conductive base material 140 is disposed on the plating bath 200 and both sides of the conductive base material 140 are supported by support rollers 221. Tension Q is applied to both ends of the conductive substrate 140 to cause tension. Then, the conductive base material 140 is pressed from above with two pressing rollers 220 provided at a constant distance and placed in the plating bath liquid 210 of the plating bath layer 200, and the conductive base material 140 is further removed. Tension. The pressure P applied to the pressure roller 220 and the tensile force Q applied to both ends of the conductive base material 140 are set to forces adjusted so that the conductive base material 140 can obtain a proper tension. Then, electroforming plating is performed over a long time in this tensioned state. When plating is performed for a predetermined time and a predetermined thickness is obtained, the two pressing rollers 220 are lifted upward, the conductive base material 140 is taken out of the plating bath liquid 210, and one side of the conductive base material 140 is removed. Pull to shift the position.

  Here, the two pressing rollers 220 are made of a plastic material to which plating does not adhere, and are configured to freely rotate, and the surface of the roller 220 prevents the conductive base material 140 from being damaged. In order to achieve a smooth surface. The surface of the roller 220 may be coated with rubber or the like. The two pressing rollers 220 are arranged so as to come to a position where the intermediate products shown in FIG. 4 are in contact with each other. Further, the planar electrodeposition 45 is connected to all the products in line. Accordingly, a notch groove is provided at a portion corresponding to the connection portion of the planar electrodeposition 45 of the roller 220. By providing this groove, the electrodeposition plating can be attached to the connection portion of the planar electrodeposition 45. The two support rollers 221 are also configured to be freely rotatable, and the surface of the roller 220 is finished to be a smooth surface so that the conductive substrate 140 is not damaged.

  When electroforming plating is performed by the above method, plating is performed in a state where the conductive base material 140 is in tension. Therefore, even if plating stress is generated, it is erased and the shape without deformation is prepared. An electrodeposition film is formed. In this manner, the indicator 2 and the discarding electric power 43 are formed on the conductive thin film 142 of the conductive base material 140 by electroforming plating. The thicknesses of the index 2 and the discarded electricity 43 are preferably set in a range of 15 to 50 μm. However, when the surface of the conductive thin film 142 is a glossy surface, the surface of the index 2 and the discarded electricity 43 is also a glossy surface. Finished. When glossiness appears in index 2, a high-class appearance appears on the dial itself.

  As electroforming plating, nickel plating or copper plating is generally selected. When index 2 is finished by applying gold plating with a thickness of about flash after electroforming plating of nickel, a feeling of precious metal appears in index 2.

  Note that the method of tensioning the conductive substrate 140 is not limited to the method shown in FIG. For example, what is shown in FIG. 8 shows another method. The tension method shown in FIG. 8 is a method using a tension frame 300. The tension frames 300 made of plastic are arranged above and below the conductive base material 140, and the conductive base material 140 is tensioned by applying a tensile force in four or eight directions. In this state, the upper and lower tension frames 300 are firmly clamped and fixed in a tensioned state. As described above, even when electroforming plating is performed in a state of being tensioned by the tension frame 300, an index having the same shape as the index obtained by the method shown in FIG. 7 is obtained.

  In the second embodiment of the present invention described above, the resin substrate used in the first embodiment or the metal substrate used in the background art is not used at all. Therefore, it is not necessary to provide a resin substrate or metal substrate peeling step, and the manufacturing cost can be reduced by shortening the process, and the manufacturing cost of the resin substrate or metal substrate is not required. Moreover, since a commercially available thing can also be directly used for a conductive base material, it produces an effect also in time reduction.

  The industrial applicability of the watch index manufacturing method described so far is not limited to the watch index. The present invention is basically produced in a certain amount and exhibits the same effect in all industrial and consumer instrument measuring instruments using indicators.

Fig.1 (a) is sectional drawing of 1 Example of the electroconductive base material used for the parameter | index manufacturing method concerning 1st Embodiment of this invention, FIG.1 (b) is sectional drawing of another Example. It is a manufacturing-process figure in the parameter | index manufacturing method which concerns on 1st Embodiment of this invention. It is a principal part cross-sectional perspective view of the intermediate product in the process (d) of FIG. It is a top view when a parameter | index is formed on the surface of the electroconductive base material in the 2nd form of this invention. It is process drawing explaining the manufacturing process which concerns on 2nd Embodiment of the parameter | index manufacturing method of this invention. It is a principal part cross-sectional perspective view of the intermediate product in the process (d) of FIG. It is explanatory drawing when performing electroforming plating in the process (c) of FIG. It is explanatory drawing explaining the other method of the method of tensioning an electroconductive base material. It is a perspective view of the dial for timepieces with an index in the background art. It is a top view when a parameter | index is formed on the surface of an electroconductive base material by background art. It is sectional drawing of the electroconductive base material used for the electroforming method of background art. It is a manufacturing process figure when forming a parameter | index with the electroforming technique of background art. It is a perspective view in the AA cross section of FIG. 10 in the process (d) of FIG.

Explanation of symbols

1 Dial 2 Indexes 3 and 43 Discarded electricity 5 Linear electrodeposition 6 and 46 Electrodeposition for guide 22 Photoresist 23 and 123 Mask film 24 Pressure sensitive adhesive layer
25 Support base material 28 Adhesive layer 45 for fixing Planar electrodeposition 110, 130, 140 Conductive base material 111 Resin substrate
112 Metal sheet 113 Temporary adhesive layer 141 Non-conductive sheet 142 Conductive thin film 120, 150 Intermediate product 200 Plating bath 210 Plating bath liquid 220 Press roller 221 Support roller 300 Tension frame

Claims (10)

An indicator is formed on the surface of the conductive substrate by electroforming plating method, and the indicator is peeled and transferred to the pressure-sensitive adhesive layer of the supporting substrate on which the pressure-sensitive adhesive layer is provided. In the manufacturing method of a clock indicator, which is formed on a timepiece dial through the fixing adhesive layer while forming the adhesive layer for fixing and peeling the indicator from the supporting base material, the conductive base material is a metal sheet A method for producing an indicator for a watch, wherein the resin substrate is used by recycling the metal sheet after peeling off the metal sheet. The method for producing an indicator for a timepiece according to claim 1, wherein the metal sheet is made of a non-adhesive copper-clad laminate (two-layer CCL) or a composite material obtained by bonding a copper foil and a polyester fill. The timepiece index manufacturing method according to claim 1, wherein the resin substrate is made of a bakelite resin or an acrylic resin. 4. The timepiece index manufacturing method according to claim 1, wherein the temporary adhesive layer is made of a photo-curing adhesive, a thermosetting adhesive, or a heat-peeling adhesive. 5. 5. The timepiece index manufacturing method according to claim 1, wherein the temporary adhesive layer is provided on the entire upper surface or the outer edge of the upper surface of the resin substrate. An indicator is formed on the surface of the conductive substrate by electroforming plating method, and the indicator is peeled and transferred to the pressure-sensitive adhesive layer of the supporting substrate on which the pressure-sensitive adhesive layer is provided. In the method for manufacturing a timepiece indicator, which is formed by fixing an adhesive layer for adhesion and affixing to the timepiece dial via the adhesive layer for adhesion while peeling off the indicator from the supporting base material, the conductive base material is electrically conductive It is composed of a non-conductive sheet having a thin film formed thereon, and the conductive substrate is immersed in a plating bath liquid layer under tension, and an indicator is formed on the conductive thin film by an electroforming plating method. A method for manufacturing an indicator for a watch. The method for producing a timepiece index according to claim 6, wherein the tension of the conductive base material is set to a tension state by fixing the conductive base material to a tension frame in a state where the conductive base material is pulled from four directions. . The tension of the conductive base material was determined by pressing the conductive base material with two rollers having a certain distance while supporting both ends of the belt-shaped conductive base material. The method for manufacturing a timepiece index according to claim 6. 9. The timepiece index manufacturing method according to claim 6, wherein the conductive thin film has a glossy surface. The method for manufacturing a timepiece index according to claim 6, wherein the conductive thin film is made of stainless metal.

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