JPH08109491A - Production of electrodeposited image - Google Patents

Abstract

PURPOSE: To inexpensively and easily produce electrodeposited images by transferring the electrodeposited images as well as wire-shaped electrodepositions and island-shaped electrodepositions formed on the surface of a conductive base material to a pressure sensitive adhesive layer, and further, sticking these electrodeposited images and electrodepositions onto the surface of an adherend via an adhesive layer for fixing. CONSTITUTION: The desired electrodeposited images 2, the wire-shaped electrodepositions 3 which enclose these images, the island-shaped electrodepositions 4 which are enclosed by the wire-shaped electrodepositions 4 and are connected to the wire-shaped electrodepositions 3 in the parts exclusive of the electrodeposited images, and the electrodepositions 6 for guiding are formed on the surface of the conductive base material 1 consisting of a metallic plate 1a and the conductive thin film 1b. These electrodepositions 2 to 6 are then stripped and transferred onto the pressure sensitive adhesive layer 16 formed on the supporting base material 15 and, thereafter, the adhesive layer 17 for fixing is formed. The pressure sensitive adhesive layer 16 is thereafter cured by irradiation with, for example, UV rays to weaken the adhesive powder, following which the wire-shaped electrodepositions 3 and the island- shaped electrodepositions 4 are removed together with the adhesive layers 17 for fixing thereon. While the electrodeposited images 2 are stuck to the surface of the adherend 19 placed on a holding plate 20 via the remaining adhesive layers 17 for fixing, the images are peeled from the supporting base material 15.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention forms an image of, for example, rose letters for a watch or a decorative part by an electrodeposition method, transfers the image (electrodeposited image) to a support such as a film, and then displays the watch. The present invention relates to a method for producing an electrodeposition image that is attached to an adherend such as a plate.

[0002]

2. Description of the Related Art In recent years, in the case of articles having minute and complicated shapes, such as rose letters and decorative parts for watches, a resist film is formed on the surface of a metal plate except for these image forming portions. By forming, a conductive portion along the shape of these images is formed on the surface of the metal plate, and a metal is deposited on the conductive portion by an electrodeposition method to form an electrodeposited image. Is temporarily transferred to a supporting substrate such as a film via an adhesive and held, and then the electrodeposited image is peeled off from the supporting substrate and transferred again to an adherend such as a timepiece display panel via an adhesive. It is widely done.

For example, Japanese Unexamined Patent Publication No. Sho 59-16989 (JP-B-63-18874) discloses that a resist is applied to a metal plate, electroformed thereon, and an electroformed product is taped with a weak adhesive. In the method of manufacturing loose letters by electroforming in which the resist is separated from the metal plate and an adhesive is applied to the peeled surface, a discarded electrodeposit provided to prevent excessive electrodeposition of the outer peripheral edge of the letters and the like is bonded to the letters. A method for producing rose letters by electroforming, which is used as a mask for applying an agent and then thrown away. "

[0004] However, in this method, since the discarded electrodeposit as a mask must be formed over a large area, the cost of the electrodeposition material, the cost of electric power, and the like increase, and the electrodeposition takes a long time. There was a problem.

Japanese Patent Application Laid-Open No. 3-107496 (Japanese Patent Publication No. 4-43988) discloses that an electrodeposited image and a linear electrodeposition surrounding the electrodeposited image are formed on the surface of a metal plate to form a weak adhesive. The electrodeposited image and the linear electrodeposition are peeled off from the metal plate by sticking and peeling the surface of the adhesive of the sheet coated with the metal plate to the metal plate, and the linear electrodeposition is removed from the sheet. There is taught a method of manufacturing an electrodeposited image in which a portion having a slightly larger opening than the electrodeposited image is covered with a mask on the sheet other than the electrodeposited image and an adhesive is applied to the electrodeposited image.

However, in this method, since the fixing adhesive is applied after removing the linear electrodeposition, a large amount of adhesive is applied around the electrodeposited image, and it is difficult to peel off the electrodeposited image. There is a problem that the adhesive becomes sticky or sticks out to the adherend, and then the adhesive protrudes from the electrodeposited image and becomes hard to see.
Further, in this method, if there is a pinhole in the photoresist, a minute electrodeposit may be formed in this portion, and the minute electrodeposit may impair the appearance of the adherend.

[0007]

SUMMARY OF THE INVENTION It is an object of the present invention to provide a method for producing an electro-deposited image capable of forming the electro-deposited image at a low cost.

Further, according to the present invention, when the electrodeposition image is attached to the adherend, the electrodeposition image can be easily peeled off from the supporting substrate, and the adhesive is prevented from protruding after being attached to the adherend. It is an object of the present invention to provide a method for producing such an electrodeposited image.

Another object of the present invention is to prevent the formation of pinhole-shaped fine electrodeposits.

[0010]

SUMMARY OF THE INVENTION To achieve the above object, a method for producing an electrodeposition image according to the present invention comprises an electrodeposition image, a linear electrodeposition surrounding the electrodeposition image, and the line on the surface of a conductive substrate. The pressure-sensitive support substrate provided with a pressure-sensitive adhesive layer, which is surrounded by the electrodeposition electrodeposition and has an island electrodeposition formed by connecting with the linear electrodeposition in a portion other than the electrodeposition image. Retaining the electrodeposition image, the linear electrodeposition and the island electrodeposition by peeling and transferring the electrodeposition image, the linear electrodeposition and the island electrodeposition from the conductive base material to the adhesive layer. A fixing adhesive layer is formed on the entire side surface, the linear electrodeposition and the island electrodeposition are removed, and the electrodeposition image is peeled off from the supporting base material while the fixing adhesive layer is interposed. It is characterized in that the electrodeposition image is attached to the surface of the adherend.

Here, the conductive base material is preferably a multi-layer base material composed of a metal plate and a conductive thin film formed on the metal plate. Preferably, the pressure-sensitive adhesive layer is made of an ultraviolet-curable pressure-sensitive adhesive.

According to the present invention configured as described above, since the island-shaped electrodeposition is formed, it is possible to prevent the formation of pinhole-shaped fine electrodeposits. When the adhesive layer for fixing is provided on the electrodeposition image, the adhesive layer is formed on the electrodeposition image and the linear electrodeposition and island electrodeposition surrounding the electrodeposition image, and then the linear electrodeposition and the island electrodeposition are formed. The adhesive does not remain in the vicinity of the electro-deposited image. Therefore, the electrodeposited image can be easily peeled off from the supporting substrate, and the adhesive after sticking to the adherend can be prevented from protruding.

[0013]

DETAILED DESCRIPTION OF THE INVENTION Hereinafter, embodiments of the present invention will be described more specifically with reference to the drawings. In the present embodiment, an example is shown in which rose characters for a watch are used as an electro-deposited image and are attached to the surface of a display plate (adherend) for a watch, but the present invention is not limited to the rose characters for a watch. It can be applied to the production of various decorative characters and symbols.

First, as shown in FIG. 1, on the surface of a conductive base material 1, an electro-deposited image 2 forming rose letters 3, 6, 9 and 12 for a watch and a linear shape surrounding the electro-deposited image 2 are formed. The electrodeposition 3 and the part surrounded by the linear electrodeposition 3 and the part other than the electrodeposition image 2 are covered with the island-shaped electrodeposition 4 which is connected to the linear electrodeposition 3 and surrounds them. It is bent to form a guide electrodeposition 6 having a guide hole 5.

As the conductive base material 1, a metal plate such as stainless steel, or a laminated body (hereinafter also referred to as a multi-layer base material 1) in which a conductive coating 1b is provided on the surface of such a metal plate 1a. Used (see Figure 2). In the present invention,
In particular, it is preferable to use, as the conductive base material 1, a multilayer base material in which the conductive coating 1b is provided on the surface of the metal plate 1a. By using such a multilayer substrate 1, it is possible to prevent the electrodeposition image from scattering when transferring the electrodeposition image to the supporting substrate. In the following examples, the case where the multilayer base material 1 is used will be described as an example.

The conductive film 1b of the multi-layer substrate 1 is a flexible thin film having conductivity. Such a conductive film 1b
As the conductive metal thin film formed by electrolytic plating (electrodeposition) or electroless plating, a conductive coating film, a conductive polymer thin film, or the like, a conductive metal thin film formed by electrodeposition is preferably used. The thickness of the conductive film 1b is not particularly limited, but is usually 10 to 50 μm, preferably about 20 to 30 μm.

The conductive film 1b is peeled from the surface of the metal plate 1a in a later step. Therefore, in order to facilitate the peeling of the conductive coating 1b, it is preferable to perform a mold release treatment on the surface of the metal plate 1a prior to the formation of the conductive coating 1b. The mold release treatment is performed, for example, by surface oxidation by anodic electrolysis, or by treating the surface of the metal plate 1a with a surfactant or the like.

Then, an electrodeposition image 2 is formed on the surface of the conductive coating 1b.
And a linear electrodeposition 3 surrounding the electrodeposition image 2, and an island that is surrounded by the linear electrodeposition 3 and covers a portion other than the electrodeposition image 2 and is connected to the linear electrodeposition 3. The electrodeposition electrode 4 is formed. This specific method is described in JP-A-3-107496. Although not particularly limited, a general method for forming the electrodeposition image 2, the linear electrodeposition 3 and the island electrodeposition 4 will be described below.

In this example, a rose character for a watch is used as an electro-deposited image and is attached to the surface of a watch display plate (adherend). First, as shown in FIG. Negative or positive photomask film for electro-deposited image 7
To create a photo or print.

What is shown in the figure is a positive film,
On this film 7, a target image FIG. 8 constituting roses 3, 6, 9 and 12 for a watch, a linear image FIG. 9 surrounding the target image FIG. 8 and the linear image diagram An image of an island-shaped image 10 surrounded by 9 and covering a portion other than the target image of FIG. 8 and a rectangular frame-shaped guide image of FIG. 11 that surrounds these portions are drawn in black ink or the like. In addition, the guide mark 12 is drawn in white at a predetermined position inside the guide image FIG. 11. Although the width of the linear image FIG. 9 depends on the shape and size of the target image FIG. 8, it is usually about 0.5 to 5 mm. The distance between the target image FIG. 8 and the linear image FIG. 9 is usually about 0.3 to 0.5 mm. The island-shaped image FIG. 10 is formed by connecting the linear images 9, is surrounded by the linear images 9, and is formed in a portion other than the target image FIG. 8. That is, the island-shaped image FIG. 10 is a portion surrounded by the linear image FIG. 9 and is formed in a portion other than the target image FIG. 8 (hereinafter, referred to as “blank portion” of this portion). is there). Preferably, the island-shaped image FIG. 10 is formed in the center of the blank portion and is 40 to 7 with respect to the entire area of the blank portion.
The area ratio is preferably 0%, preferably about 50 to 60%.

On the other hand, as shown in FIG. 4, a photoresist 13 such as a liquid resist, a dry film resist or a printing resist ink is applied on the upper surface of the conductive film 1b of the multilayer substrate 1 and baked. Be prepared.

Then, as shown in FIG. 5, the film 7 is placed on the conductive film 1b with the photoresist 13 interposed therebetween, and in this state, exposure is carried out by an exposure machine or the like. The shaded area in 7 is
(This is a part that blocks light corresponding to the target image FIG. 8, the linear image FIG. 9, the island image FIG. 10 and the guide image FIG. 11).

After this exposure, development is performed to remove the unexposed photoresist 13a (see FIG. 5), whereby the target image shown in FIG. 8 is formed on the surface of the conductive film 1b as shown in FIG. A conductive portion 14 (also referred to as an electrodeposition image corresponding surface) having a shape along the shapes of the linear image FIG. 9, the island image 10 and the guide image FIG. 11 is formed. Next, if necessary, the surface of the conductive portion 14 (the surface corresponding to the electrodeposition image) is subjected to a mold release treatment. After the release treatment, the electro-deposited image 2, the linear electro-deposition 3 and the island-shaped electro-deposition 4 which will be formed later are removed from the conductive coating 1b.
Can be easily peeled off. This mold release process is performed by the same method as described above.

Next, as shown in FIG.
A metal is deposited on the surface of the electrode by an electrodeposition method (electrodeposition image method), and an electrodeposition image 2 having a shape along the shape of the target image shown in FIG.
And a linear electrodeposition 3 having a shape according to the shape of the linear image FIG. 9,
An island-shaped electrodeposition 4 having the shape of the island-shaped image FIG. 10 and a guide electrodeposition 6 having the shape of the guiding image FIG. 11 are formed. As described above, when the linear electrodeposition 3 is formed around the electrodeposition image 2, the metal to be deposited on the portion corresponding to the target image FIG. 8 can be dispersed to the portion corresponding to the linear image FIG. Excessive electrodeposition on the target image FIG. 8 is prevented. When the target image FIG. 8 has a sharp shape, the electrodeposited image is usually excessively deposited on the sharpened portion, so that there is a defect that the electrodeposited image is rounded, but according to the present invention, a linear shape is formed. Since the electrodeposition image 3 is formed to prevent excessive electrodeposition on the electrodeposition image 2, it is possible to obtain the electrodeposition image 2 having a sharp shape.

By the way, according to the conventional method, a photoresist is formed in a blank portion (a portion surrounded by the linear image FIG. 9 and other than the target image FIG. 8). If there are pinholes in this photoresist, electrodeposits will also be deposited in these pinholes, and minute electrodeposits will be formed. If such a minute electrodeposit is transferred to an adherend, the appearance of the adherend is significantly impaired. On the other hand, in the present invention, the island-shaped image diagram 10 is provided in the blank portion, and the island-shaped electrodeposition 4 is formed in this portion. Therefore, it is possible to prevent the minute electrodeposit from being formed in the blank portion. Moreover, since the island-shaped electrodeposition 4 is connected to the linear electrodeposition 3, the island-shaped electrodeposition 4 can be easily removed together with the linear electrodeposition 3 when removing the linear electrodeposition 3 described later.

The electrodeposited image 2 has the numbers 3, 6, 9 or 12 when viewed from the plane, but it is drawn as having these widths in the drawing. Also,
Inside the electrodeposition 6 for guide, the guide mark 12 is formed.
A guide hole (not shown) penetrating along the shape of is formed.

Here, as the metal forming the electrodeposition image 2, the linear electrodeposition 3, the island electrodeposition 4 and the guide electrodeposition 6,
For example, when nickel is used, nickel sulphate solution is used as the watt solution to electrodeposit nickel on the conductive portion 14, and the electrodeposition condition at this time is, for example, 150 mm × 150 mm electrodeposition. By applying a current of 3 A / dm ² to the effective deposition area, an electrodeposited image of 100 μm ± 10 μm can be obtained in 3 hours.

In addition to nickel, gold, silver, copper,
Needless to say, any metal such as iron or alloy may be deposited on the conductive portion 14 to form an electrodeposition image, and by changing the electrodeposition conditions, for example, 20 to 300 μm.
An electrodeposited image having an arbitrary thickness can be obtained within the range of the order.

Next, as shown in FIG. 8, the photoresist 13 on the conductive film 1b is removed by immersing it in a stripping solution,
As shown in FIG. 1, on the surface of the conductive base material 1, an electrodeposition image 2 that forms the rose letters 3, 6, 9 and 12 for a watch, and a linear electrodeposition 3 that surrounds the electrodeposition image 2, Island-shaped electrodeposition 4 covering the blank area
Then, the periphery of these is bent to form the electrodeposition 6 for the guide in which the guide hole 5 is provided. The surface of the electrodeposited image 2 can be subjected to decoration (coloring) such as metal plating as a surface treatment, electrodeposition coating, spray coating, printing, electrostatic coating, or vacuum evaporation, if necessary.

In this way, after the electrodeposition image 2, the linear electrodeposition 3, the island electrodeposition 4 and the guide electrodeposition 6 are formed on the surface of the electroconductive substrate 1 by the electrodeposition method, as shown in FIG. As shown, these images are transferred onto the pressure sensitive adhesive layer 16 of a support substrate 15 such as a film. When the multi-layer substrate 1 is used, an electrodeposition image is formed on the conductive coating 1b. In this case, the conductive coating 1b is peeled off at the same time when the electrodeposition image is transferred. That is, peeling is performed at the interface between the conductive coating 1b and the metal plate 1a, and the electrodeposited image is peeled while being sandwiched between the conductive coating 1b and the supporting base material 15. As a result, scattering of the electrodeposited image is prevented, so that the electrodeposition image can be manufactured with high yield. Further, since the electrodeposition image and the metal plate can be peeled off with almost no deformation, no stress remains in the electrodeposition image and no deformation occurs even after being attached to the adherend. Further, there is an advantage that the metal plate can be repeatedly used. When a film having a high surface smoothness such as an electrolytic plating film (electrodeposition film) is used as the conductive film 1b,
The back surface of the electro-deposited image becomes smooth, and it can be reliably attached to the adherend. In addition, since the photoresist adheres to the conductive film 1b having a high surface smoothness, the occurrence of burrs can be prevented, and a high quality electrodeposited image can be obtained.

The pressure-sensitive adhesive layer 16 can be formed of, for example, a UV-curable pressure-sensitive adhesive, a heat-curable pressure-sensitive adhesive, or a time-curable pressure-sensitive adhesive. Here, as a typical example of the ultraviolet-curable pressure-sensitive adhesive, a photopolymerizable compound such as an addition polymerizable compound having two or more unsaturated bonds or an alkoxysilane having an epoxy group, a carbonyl compound or an organic sulfur compound, Examples thereof include a rubber pressure-sensitive adhesive compounded with a photopolymerization initiator such as a peroxide, an amine and an onium salt compound, and an acrylic pressure-sensitive adhesive agent (JP-A-60-1969).
No. 56). The amount of the photopolymerizable compound and the photopolymerization initiator to be compounded is 10 to 100 parts by weight of the base polymer, respectively.
Generally 500 parts by weight, 0.1 to 20 parts by weight.

Acrylic polymers are commonly used (Japanese Patent Publication No. 57-54068, Japanese Patent Publication No. 58-339).
(See Japanese Patent Publication No. Sho 61-56264) as well as those having a radical-reactive unsaturated group in the side chain.
Alternatively, those having an epoxy group in the molecule can also be used.

Examples of addition-polymerizable compounds having two or more unsaturated bonds include polyhydric alcohol-based esters and acrylic esters of acrylic acid and methacrylic acid, epoxy-based and urethane-based compounds.

Further, an epoxy group functional crosslinking agent having one or more epoxy groups in the molecule such as ethylene glycol diglycidyl ether may be additionally compounded to enhance the crosslinking effect.

When the pressure-sensitive adhesive layer 14 is formed by using an ultraviolet curable adhesive, it is necessary to use a transparent film or the like as the supporting base material 15 in order to enable the ultraviolet irradiation treatment.

Typical examples of the heat-curable pressure-sensitive adhesive are polyisocyanate, melamine resin, amine-
A rubber system containing a cross-linking agent such as an epoxy resin, a peroxide or a metal chelate compound, and a cross-linking regulator composed of a polyfunctional compound such as divinylbenzene, ethylene glycol diacrylate or trimethylolpropane trimethacrylate, if necessary. Examples thereof include pressure sensitive adhesives and acrylic pressure sensitive adhesives.

Further, as a time-curable pressure-sensitive adhesive,
An example is one in which the adhesive force is lowered by evaporating the compounded solvent over time. After the electro-deposited image and the like (2, 3, 4, 6, etc.) are transferred to the pressure-sensitive adhesive layer 16 of the supporting base material 15 together with the conductive thin film 1b, the conductive thin film 1b is removed as shown in FIG. Then, the electro-deposited image or the like is exposed (hereinafter, this exposed surface may be referred to as the entire holding side). When the pressure-sensitive adhesive layer 16 is formed of a UV-curable pressure-sensitive adhesive, the pressure-sensitive adhesive layer 16 is irradiated with a small amount of ultraviolet light before removing the conductive thin film 1b. It is preferable to reduce the adhesive force of the pressure sensitive adhesive layer 16. Further, the adhesive force of the pressure-sensitive adhesive layer 16 can be reduced prior to the peeling of the metal plate 1a and the conductive thin film 1b (see FIG. 9). That is, since the adhesive force of the ultraviolet curable adhesive is as strong as 2400 g / 25 mm width, it is difficult to peel the conductive thin film 1b from the pressure sensitive adhesive layer 16 unless the adhesive force is reduced to some extent. This is because
Further, if the adhesive strength of the ultraviolet curable adhesive layer is excessively reduced, the electro-deposited image and the like are also peeled off when the conductive thin film 1b is removed, which is not preferable. Therefore, it is desirable that the adhesive force after irradiation with ultraviolet rays is about 300 to 600 g / 25 mm width, preferably about 400 to 500 g / 25 mm width.

Next, as shown in FIG. 11, the electrodeposition image 2,
An adhesive layer 17 for fixing is formed on the entire holding side of the linear electrodeposition 3, the island electrodeposition 4 and the guide electrodeposition 6. The fixing adhesive layer 17 preferably has a stronger adhesive force than the pressure-sensitive adhesive layer 16. After that, the release paper 18 is attached on the fixing adhesive layer 17 (see FIG. 12). Then, in this state, the adhesive force of the pressure-sensitive adhesive layer 16 is further reduced.

When the pressure-sensitive adhesive layer 16 is formed of a UV-curable pressure-sensitive adhesive, the release paper 18 is adhered to the supporting substrate 15 from the front side of the electrodeposited image 2, That is, from the side opposite to the holding side of the electrodeposited image 2, as shown in FIG.
By irradiating with ultraviolet rays, the adhesive force of the pressure-sensitive adhesive layer 16 is changed to an extremely weak adhesive force.

When the pressure-sensitive adhesive layer 16 is formed of a heat-curable pressure-sensitive adhesive, the supporting base material 15 is further heated to form a time-curable pressure-sensitive adhesive. In some cases, the adhesive force of the pressure-sensitive adhesive layer 16 is changed to an extremely weak adhesive force by giving a change over time.

By such a treatment, the pressure sensitive adhesive layer 16
Of 100 g / 25 mm width or less, preferably 30 to
It is desirable to reduce the width to about 50 g / 25 mm. Then, the release paper 18 is removed. After that, as shown in FIG. 14, the linear electrodeposition 3 and the island electrodeposition 4 are removed. As shown in FIG. 1, the linear electrodeposition 3 and the island electrodeposition 4 are connected to each other and can be continuously peeled off. As a result, the linear electrodeposition 3 and the island-shaped electrodeposition close to the electrodeposition image 2 are removed together with the fixing adhesive 17, so that the fixing adhesive hardly remains in the vicinity of the electrodeposition image 2. Therefore,
The electro-deposited image 2 can be easily peeled off from the supporting base material 15, and the adhesive can be prevented from squeezing out after being attached to the adherend. If the release paper 18 'is not used immediately, the release paper 18' is attached to the fixing adhesive layer 17 side as shown in FIG. 15, and the release paper 18 'is peeled off before use.

Next, as shown in FIG. 16, the electro-deposited image 2 is formed on the surface of the adherend 19 through the fixing adhesive 17 applied to the electro-deposited image-holding side of the supporting substrate 15 by the supporting substrate. Material 1
Attach and fix while peeling from 5.

Here, as shown in FIGS. 16 to 17, a guide pin 21 is provided in a protruding manner on a holding plate 20 holding a timepiece display plate 19 'as an adherend 19, and the guide pin 21 is provided. The electrodeposition image 2 can be positioned with respect to the timepiece display plate 19 ′ through the guide hole 5 provided in the guide electrodeposition 6 and the guide electrode 5.

At this time, as described above, since the adhesive force of the pressure-sensitive adhesive layer 16 is lowered, the same state as that in which the electro-deposited image 2 is held by the weak adhesive is obtained, and the supporting substrate is 15
The electrodeposited image 2 can be attached to the surface of the timepiece display plate (adherend) 19 ′ while peeling off the electrodeposited image 2 from the supporting base material 15 through the adhesive 17 applied on the electrodeposition image holding side. .

The adhesive force at the interface between the pressure-sensitive adhesive layer 16 and the adhesive 17 for fixing is the one for the timepiece display plate 1.
By selecting both adhesives 16 and 17 so as to be larger than the adhesive force at the interface between 9'and the fixing adhesive 17, the fixing adhesive 17 is prevented from adhering to the timepiece display plate 19 '. be able to.

For example, when an acrylic pressure-sensitive adhesive containing a photopolymerizable compound and a photopolymerization initiator is used as the pressure-sensitive adhesive forming the pressure-sensitive adhesive layer 16, the fixing adhesive 17 is used. , An adhesive of the same kind as the pressure-sensitive adhesive forming the pressure-sensitive adhesive layer 16, that is, an acrylic pressure-sensitive adhesive is used only as a base polymer containing no photopolymerizable compound and a photopolymerization initiator. After coating, by aging for 9 hours in an atmosphere of 40 ° C., the adhesive force at the interface between the pressure-sensitive adhesive layer 16 and the fixing adhesive 17 is higher than that of the timepiece display plate 19 ′ and the fixing adhesive. It can be made larger than the bonding force at the interface with 17. Then, the adhesive other than the fixed portion can be removed without leaving any residue. As described above, the bonding force at the interface between the pressure-sensitive adhesive layer 16 and the fixing adhesive 17 after the adhesive force is lower than the bonding force at the interface between the adherend 19 and the fixing adhesive 17. By selecting both adhesives so that
It is also possible to apply the adhesive 17 for fixing to the entire surface of the electrodeposition image holding side and to simplify the process by eliminating the troublesome work of applying the adhesive only to the back surface of the electrodeposition image.

In the present invention, when the fixing adhesive layer 17 is formed, the adhesive is applied or sprayed through a mask having an opening slightly larger than the electrodeposition image 2, and the electrodeposition is performed. The fixing adhesive layer 17 may be formed only on the back surface of the image 2.

[0048]

According to the present invention, an electrodeposited image can be manufactured at low cost. Further, when the electrodeposited image is attached to the adherend, the electrodeposited image can be easily peeled off from the supporting base material, and the adhesive can be prevented from protruding after being attached to the adherend. Further, according to the present invention, it is possible to prevent the formation of pinhole-shaped fine electrodeposits.

[Brief description of drawings]

FIG. 1 is a plan view showing a state in which an electrodeposition image, linear electrodeposition, guide electrodeposition and island electrodeposition are formed on a surface of a conductive substrate.

FIG. 2 is a cross-sectional view showing an example of a conductive base material (multilayer base material).

FIG. 3 is a plan view showing an example of a photomask film for electrodeposition image.

FIG. 4 is a sectional view showing a state in which a photoresist is laminated on the surface of a conductive base material.

FIG. 5 is a cross-sectional view showing a state during exposure.

FIG. 6 is a cross-sectional view showing a state of development after exposure.

FIG. 7 is a cross-sectional view showing a state in which electrodeposition is performed after development.

FIG. 8 is a cross-sectional view showing a state in which the photoresist has been removed after electrodeposition.

FIG. 9 is a cross-sectional view showing a state in which an electrodeposited image is transferred and held on a supporting substrate together with a conductive film.

FIG. 10 is a cross-sectional view showing a state where the conductive film is removed after irradiating a small amount of ultraviolet rays.

FIG. 11 is a cross-sectional view showing a state in which a fixing adhesive layer is formed on the entire holding side of an electrodeposition image, linear electrodeposition, island electrodeposition, and guide electrodeposition.

FIG. 12 is a cross-sectional view showing a state in which release paper is attached to an adhesive layer for fixing.

FIG. 13 is a cross-sectional view showing a state in which the adhesive force of the pressure-sensitive adhesive layer is reduced by ultraviolet irradiation.

FIG. 14 is a cross-sectional view showing a state in which linear electrodeposition and island electrodeposition are removed.

FIG. 15 is a cross-sectional view showing a state in which release paper is attached to the adhesive layer for fixing after the linear electrodeposition and the island electrodeposition are removed.

FIG. 16 is a cross-sectional view showing a state in which an electrodeposition image is being transferred onto an adherend while peeling the supporting base material.

FIG. 17 is a perspective view showing an adherend on which an electrodeposition image is adhered.

[Explanation of symbols]

1 ... Conductive substrate (multilayer substrate: 1a ... Metal plate, 1b ... Conductive thin film); 2 ... Electrodeposition image; 3 ... Linear electrodeposition; 4 ... Island electrodeposition; 5 ... Guide hole; 6 ... Electrodeposition for guide; 7 ... Photomask for electrodeposition image; 8 ... Target image figure; 9 ... Linear image figure; 10 ... Island image figure; 11 ... Guide image figure; 1
2 ... Guide mark; 13 ... Photoresist; 14 ...
Conductive part; 15 ... Supporting base material; 16 ... Pressure-sensitive adhesive layer; 1
7 ... Adhesive adhesive layer; 18 ... Release paper; 19 (19 ')
... Adherend (display for clock); 20 ... Holding plate; 21 ... Guide pin

Claims (3)

[Claims] 1. An electro-deposited image on the surface of a conductive substrate, a linear electrodeposition surrounding the electro-deposited image, and a line-shaped portion surrounded by the line-shaped electrodeposition and other than the electro-deposited image. The electrodeposition image, the linear electrodeposition, and the island shape are formed on the pressure-sensitive adhesive layer of the support substrate on which the pressure-sensitive adhesive layer is formed by forming an island-shaped electrodeposition that is connected to the electrodeposition. Electrodeposition is peeled and transferred from the conductive base material, and a fixing adhesive layer is formed on the entire holding side of the electrodeposition image, the linear electrodeposition and the island electrodeposition, and the linear electrodeposition and the Electrodeposition, wherein island-shaped electrodeposition is removed, and the electrodeposition image is attached to the surface of an adherend through the adhesive layer for fixing while peeling the electrodeposition image from the supporting base material. Image manufacturing method. 2. The method according to claim 1, wherein the conductive substrate comprises a metal plate and a conductive thin film formed thereon. 3. The method for producing an electrodeposited image according to claim 1, wherein the pressure-sensitive adhesive layer is made of UV-curable pressure-sensitive adhesive.