JP2005303032A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2005303032A5 JP2005303032A5 JP2004117629A JP2004117629A JP2005303032A5 JP 2005303032 A5 JP2005303032 A5 JP 2005303032A5 JP 2004117629 A JP2004117629 A JP 2004117629A JP 2004117629 A JP2004117629 A JP 2004117629A JP 2005303032 A5 JP2005303032 A5 JP 2005303032A5
- Authority
- JP
- Japan
- Prior art keywords
- insulating film
- semiconductor
- semiconductor layer
- forming
- semiconductor substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 30
- 239000000758 substrate Substances 0.000 claims 9
- 238000005530 etching Methods 0.000 claims 6
- 239000012535 impurity Substances 0.000 claims 6
- 238000004519 manufacturing process Methods 0.000 claims 6
- 238000010438 heat treatment Methods 0.000 claims 4
- 239000000463 material Substances 0.000 claims 3
- 238000000034 method Methods 0.000 claims 3
- 238000001312 dry etching Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004117629A JP2005303032A (ja) | 2004-04-13 | 2004-04-13 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004117629A JP2005303032A (ja) | 2004-04-13 | 2004-04-13 | 半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005303032A JP2005303032A (ja) | 2005-10-27 |
| JP2005303032A5 true JP2005303032A5 (enExample) | 2007-05-31 |
Family
ID=35334169
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004117629A Pending JP2005303032A (ja) | 2004-04-13 | 2004-04-13 | 半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2005303032A (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8415765B2 (en) | 2009-03-31 | 2013-04-09 | Panasonic Corporation | Semiconductor device including a guard ring or an inverted region |
| KR101439805B1 (ko) | 2011-01-14 | 2014-09-11 | 미쓰비시덴키 가부시키가이샤 | 반도체 장치의 제조 방법 |
| CN114300348B (zh) * | 2021-12-31 | 2025-07-22 | 北海惠科半导体科技有限公司 | 掺杂半导体器件的制备方法及半导体器件 |
| CN114300358B (zh) * | 2021-12-31 | 2025-09-12 | 北海惠科半导体科技有限公司 | 二极管的制备方法及半导体器件 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61168270A (ja) * | 1985-01-18 | 1986-07-29 | Nec Kansai Ltd | 半導体装置の製造方法 |
| JP2879841B2 (ja) * | 1993-10-08 | 1999-04-05 | ローム株式会社 | プレーナ型ダイオードの製造方法 |
-
2004
- 2004-04-13 JP JP2004117629A patent/JP2005303032A/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2008244460A5 (enExample) | ||
| JPH10189966A5 (enExample) | ||
| JP2010251632A5 (enExample) | ||
| JP2008504679A5 (enExample) | ||
| JP2012516036A5 (enExample) | ||
| JP2010534935A5 (enExample) | ||
| JP2006524436A5 (enExample) | ||
| JP2005235858A5 (enExample) | ||
| TW200509740A (en) | Process for removing an organic layer during fabrication of an organic electronic device and the organic electronic device formed by the process | |
| JP2004282035A5 (enExample) | ||
| JP2007529112A5 (enExample) | ||
| JP2006173432A5 (enExample) | ||
| JP2005051149A5 (enExample) | ||
| JP2006013487A5 (enExample) | ||
| JP2005072236A5 (enExample) | ||
| JP2011060901A5 (enExample) | ||
| JP2006019429A5 (enExample) | ||
| JP2004158663A5 (enExample) | ||
| JP2006054425A5 (enExample) | ||
| JP2006013136A5 (enExample) | ||
| CN104733299A (zh) | 交错地形成镍硅和镍锗结构 | |
| JP2005303032A5 (enExample) | ||
| JP2005123360A5 (enExample) | ||
| JP2020107678A5 (enExample) | ||
| JP2005142481A5 (enExample) |