JP2005302969A5 - - Google Patents

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Publication number
JP2005302969A5
JP2005302969A5 JP2004116078A JP2004116078A JP2005302969A5 JP 2005302969 A5 JP2005302969 A5 JP 2005302969A5 JP 2004116078 A JP2004116078 A JP 2004116078A JP 2004116078 A JP2004116078 A JP 2004116078A JP 2005302969 A5 JP2005302969 A5 JP 2005302969A5
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JP
Japan
Prior art keywords
wiring board
metal foil
main surface
reinforcing frame
laminate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2004116078A
Other languages
English (en)
Japanese (ja)
Other versions
JP4342367B2 (ja
JP2005302969A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2004116078A priority Critical patent/JP4342367B2/ja
Priority claimed from JP2004116078A external-priority patent/JP4342367B2/ja
Publication of JP2005302969A publication Critical patent/JP2005302969A/ja
Publication of JP2005302969A5 publication Critical patent/JP2005302969A5/ja
Application granted granted Critical
Publication of JP4342367B2 publication Critical patent/JP4342367B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2004116078A 2004-04-09 2004-04-09 配線基板の製造方法 Expired - Fee Related JP4342367B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004116078A JP4342367B2 (ja) 2004-04-09 2004-04-09 配線基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004116078A JP4342367B2 (ja) 2004-04-09 2004-04-09 配線基板の製造方法

Publications (3)

Publication Number Publication Date
JP2005302969A JP2005302969A (ja) 2005-10-27
JP2005302969A5 true JP2005302969A5 (enExample) 2008-11-06
JP4342367B2 JP4342367B2 (ja) 2009-10-14

Family

ID=35334116

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004116078A Expired - Fee Related JP4342367B2 (ja) 2004-04-09 2004-04-09 配線基板の製造方法

Country Status (1)

Country Link
JP (1) JP4342367B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5120304B2 (ja) * 2008-09-30 2013-01-16 凸版印刷株式会社 スティフナー付きプリント配線板および放熱板付き半導体パッケージの製造方法
JP2014138017A (ja) * 2013-01-15 2014-07-28 Fujitsu Ltd 半導体装置及びその製造方法
JP2014168005A (ja) * 2013-02-28 2014-09-11 Kyocer Slc Technologies Corp 配線基板
KR102268781B1 (ko) 2014-11-12 2021-06-28 삼성전자주식회사 인쇄회로기판 및 이를 포함하는 반도체 패키지
WO2025134670A1 (ja) * 2023-12-18 2025-06-26 株式会社ジャパンディスプレイ 多層配線基板及びその作製方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000022045A (ja) * 1998-07-02 2000-01-21 Toshiba Microelectronics Corp 半導体装置
JP3635219B2 (ja) * 1999-03-11 2005-04-06 新光電気工業株式会社 半導体装置用多層基板及びその製造方法
JP3838232B2 (ja) * 2000-06-30 2006-10-25 日本電気株式会社 半導体パッケージ基板の製造方法及び半導体装置製造方法
JP3983146B2 (ja) * 2002-09-17 2007-09-26 Ｎｅｃエレクトロニクス株式会社 多層配線基板の製造方法

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