JP2005286046A - 半導体研磨用組成物 - Google Patents

半導体研磨用組成物 Download PDF

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Publication number
JP2005286046A
JP2005286046A JP2004096848A JP2004096848A JP2005286046A JP 2005286046 A JP2005286046 A JP 2005286046A JP 2004096848 A JP2004096848 A JP 2004096848A JP 2004096848 A JP2004096848 A JP 2004096848A JP 2005286046 A JP2005286046 A JP 2005286046A
Authority
JP
Japan
Prior art keywords
fumed silica
polishing
composition
polishing composition
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004096848A
Other languages
English (en)
Japanese (ja)
Inventor
Keiji Ota
慶治 太田
Yasuyuki Itai
康行 板井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitta DuPont Inc
Original Assignee
Nitta Haas Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitta Haas Inc filed Critical Nitta Haas Inc
Priority to JP2004096848A priority Critical patent/JP2005286046A/ja
Priority to PCT/JP2005/005767 priority patent/WO2005093803A1/fr
Priority to TW094109782A priority patent/TW200602471A/zh
Publication of JP2005286046A publication Critical patent/JP2005286046A/ja
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2004096848A 2004-03-29 2004-03-29 半導体研磨用組成物 Pending JP2005286046A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2004096848A JP2005286046A (ja) 2004-03-29 2004-03-29 半導体研磨用組成物
PCT/JP2005/005767 WO2005093803A1 (fr) 2004-03-29 2005-03-28 Composition pour polir un semi-conducteur
TW094109782A TW200602471A (en) 2004-03-29 2005-03-29 Composition for polishing semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004096848A JP2005286046A (ja) 2004-03-29 2004-03-29 半導体研磨用組成物

Publications (1)

Publication Number Publication Date
JP2005286046A true JP2005286046A (ja) 2005-10-13

Family

ID=35056464

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004096848A Pending JP2005286046A (ja) 2004-03-29 2004-03-29 半導体研磨用組成物

Country Status (3)

Country Link
JP (1) JP2005286046A (fr)
TW (1) TW200602471A (fr)
WO (1) WO2005093803A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008235491A (ja) * 2007-03-19 2008-10-02 Nitta Haas Inc 研磨用組成物
JP2008235481A (ja) * 2007-03-19 2008-10-02 Nippon Chem Ind Co Ltd 半導体ウエハ研磨用組成物、その製造方法、及び研磨加工方法
JP2010157618A (ja) * 2008-12-26 2010-07-15 Nitta Haas Inc 研磨組成物
JP2018104547A (ja) * 2016-12-26 2018-07-05 ニッタ・ハース株式会社 研磨用スラリー

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09193004A (ja) * 1995-11-10 1997-07-29 Tokuyama Corp 研磨剤
JP2001026771A (ja) * 1999-07-15 2001-01-30 Fujimi Inc 研磨用組成物の製造方法
US20040040217A1 (en) * 2002-08-28 2004-03-04 Shigeaki Takashina Polishing composition

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4156174B2 (ja) * 2000-05-12 2008-09-24 花王株式会社 研磨液組成物
JP3926293B2 (ja) * 2002-08-28 2007-06-06 花王株式会社 研磨液組成物

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09193004A (ja) * 1995-11-10 1997-07-29 Tokuyama Corp 研磨剤
JP2001026771A (ja) * 1999-07-15 2001-01-30 Fujimi Inc 研磨用組成物の製造方法
US20040040217A1 (en) * 2002-08-28 2004-03-04 Shigeaki Takashina Polishing composition

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008235491A (ja) * 2007-03-19 2008-10-02 Nitta Haas Inc 研磨用組成物
JP2008235481A (ja) * 2007-03-19 2008-10-02 Nippon Chem Ind Co Ltd 半導体ウエハ研磨用組成物、その製造方法、及び研磨加工方法
JP2010157618A (ja) * 2008-12-26 2010-07-15 Nitta Haas Inc 研磨組成物
JP2018104547A (ja) * 2016-12-26 2018-07-05 ニッタ・ハース株式会社 研磨用スラリー

Also Published As

Publication number Publication date
WO2005093803A1 (fr) 2005-10-06
TW200602471A (en) 2006-01-16

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