TW200602471A - Composition for polishing semiconductor - Google Patents
Composition for polishing semiconductorInfo
- Publication number
- TW200602471A TW200602471A TW094109782A TW94109782A TW200602471A TW 200602471 A TW200602471 A TW 200602471A TW 094109782 A TW094109782 A TW 094109782A TW 94109782 A TW94109782 A TW 94109782A TW 200602471 A TW200602471 A TW 200602471A
- Authority
- TW
- Taiwan
- Prior art keywords
- fumed silica
- polishing
- pad
- wafer
- semiconductor device
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title abstract 7
- 239000004065 semiconductor Substances 0.000 title abstract 3
- 239000000203 mixture Substances 0.000 title abstract 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 6
- 229910021485 fumed silica Inorganic materials 0.000 abstract 6
- 239000002245 particle Substances 0.000 abstract 3
- 230000002776 aggregation Effects 0.000 abstract 1
- 238000004220 aggregation Methods 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 239000006185 dispersion Substances 0.000 abstract 1
- -1 high polishing speed Chemical compound 0.000 abstract 1
- 239000007788 liquid Substances 0.000 abstract 1
- 230000007774 longterm Effects 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004096848A JP2005286046A (ja) | 2004-03-29 | 2004-03-29 | 半導体研磨用組成物 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200602471A true TW200602471A (en) | 2006-01-16 |
Family
ID=35056464
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094109782A TW200602471A (en) | 2004-03-29 | 2005-03-29 | Composition for polishing semiconductor |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2005286046A (zh) |
| TW (1) | TW200602471A (zh) |
| WO (1) | WO2005093803A1 (zh) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008235481A (ja) * | 2007-03-19 | 2008-10-02 | Nippon Chem Ind Co Ltd | 半導体ウエハ研磨用組成物、その製造方法、及び研磨加工方法 |
| JP5196819B2 (ja) * | 2007-03-19 | 2013-05-15 | ニッタ・ハース株式会社 | 研磨用組成物 |
| JP5325572B2 (ja) * | 2008-12-26 | 2013-10-23 | ニッタ・ハース株式会社 | 研磨組成物 |
| JP6846193B2 (ja) * | 2016-12-26 | 2021-03-24 | ニッタ・デュポン株式会社 | 研磨用スラリー |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3437900B2 (ja) * | 1995-11-10 | 2003-08-18 | 株式会社トクヤマ | 研磨剤 |
| JP3721497B2 (ja) * | 1999-07-15 | 2005-11-30 | 株式会社フジミインコーポレーテッド | 研磨用組成物の製造方法 |
| JP4156174B2 (ja) * | 2000-05-12 | 2008-09-24 | 花王株式会社 | 研磨液組成物 |
| JP3926293B2 (ja) * | 2002-08-28 | 2007-06-06 | 花王株式会社 | 研磨液組成物 |
| TWI307712B (en) * | 2002-08-28 | 2009-03-21 | Kao Corp | Polishing composition |
-
2004
- 2004-03-29 JP JP2004096848A patent/JP2005286046A/ja active Pending
-
2005
- 2005-03-28 WO PCT/JP2005/005767 patent/WO2005093803A1/ja active Application Filing
- 2005-03-29 TW TW094109782A patent/TW200602471A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2005093803A1 (ja) | 2005-10-06 |
| JP2005286046A (ja) | 2005-10-13 |
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