JP2005260015A5 - - Google Patents
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- Publication number
- JP2005260015A5 JP2005260015A5 JP2004070051A JP2004070051A JP2005260015A5 JP 2005260015 A5 JP2005260015 A5 JP 2005260015A5 JP 2004070051 A JP2004070051 A JP 2004070051A JP 2004070051 A JP2004070051 A JP 2004070051A JP 2005260015 A5 JP2005260015 A5 JP 2005260015A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- held
- disposed
- plasma
- gas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 21
- 238000007664 blowing Methods 0.000 claims 4
- 230000002093 peripheral effect Effects 0.000 claims 3
- 238000005507 spraying Methods 0.000 claims 2
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004070051A JP4459666B2 (ja) | 2004-03-12 | 2004-03-12 | 除去装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004070051A JP4459666B2 (ja) | 2004-03-12 | 2004-03-12 | 除去装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005260015A JP2005260015A (ja) | 2005-09-22 |
| JP2005260015A5 true JP2005260015A5 (cg-RX-API-DMAC7.html) | 2007-04-26 |
| JP4459666B2 JP4459666B2 (ja) | 2010-04-28 |
Family
ID=35085444
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004070051A Expired - Fee Related JP4459666B2 (ja) | 2004-03-12 | 2004-03-12 | 除去装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4459666B2 (cg-RX-API-DMAC7.html) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101218114B1 (ko) * | 2005-08-04 | 2013-01-18 | 주성엔지니어링(주) | 플라즈마 식각 장치 |
| JP2009302401A (ja) * | 2008-06-16 | 2009-12-24 | Tokyo Seimitsu Co Ltd | チャックテーブル洗浄方法、チャックテーブル洗浄装置及び半導体ウェーハ平面加工装置 |
| JP4696165B2 (ja) * | 2009-02-03 | 2011-06-08 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理方法 |
| WO2020102085A1 (en) | 2018-11-14 | 2020-05-22 | Lam Research Corporation | Methods for making hard masks useful in next-generation lithography |
| CN113227909B (zh) | 2018-12-20 | 2025-07-04 | 朗姆研究公司 | 抗蚀剂的干式显影 |
| TWI869221B (zh) | 2019-06-26 | 2025-01-01 | 美商蘭姆研究公司 | 利用鹵化物化學品的光阻顯影 |
| KR102431292B1 (ko) | 2020-01-15 | 2022-08-09 | 램 리써치 코포레이션 | 포토레지스트 부착 및 선량 감소를 위한 하부층 |
| EP4235757A3 (en) | 2020-07-07 | 2023-12-27 | LAM Research Corporation | Integrated dry processes for patterning radiation photoresist patterning |
| CN115152008A (zh) | 2020-11-13 | 2022-10-04 | 朗姆研究公司 | 用于干法去除光致抗蚀剂的处理工具 |
| WO2024006938A1 (en) | 2022-07-01 | 2024-01-04 | Lam Research Corporation | Cyclic development of metal oxide based photoresist for etch stop deterrence |
| US12474640B2 (en) | 2023-03-17 | 2025-11-18 | Lam Research Corporation | Integration of dry development and etch processes for EUV patterning in a single process chamber |
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2004
- 2004-03-12 JP JP2004070051A patent/JP4459666B2/ja not_active Expired - Fee Related