JP2005221368A - 観察装置及びその観察方法 - Google Patents
観察装置及びその観察方法 Download PDFInfo
- Publication number
- JP2005221368A JP2005221368A JP2004029320A JP2004029320A JP2005221368A JP 2005221368 A JP2005221368 A JP 2005221368A JP 2004029320 A JP2004029320 A JP 2004029320A JP 2004029320 A JP2004029320 A JP 2004029320A JP 2005221368 A JP2005221368 A JP 2005221368A
- Authority
- JP
- Japan
- Prior art keywords
- image data
- light
- sample
- confocal
- silicon wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 11
- 238000003384 imaging method Methods 0.000 claims abstract description 57
- 230000003287 optical effect Effects 0.000 claims description 59
- 230000001678 irradiating effect Effects 0.000 claims 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 161
- 229910052710 silicon Inorganic materials 0.000 abstract description 161
- 239000010703 silicon Substances 0.000 abstract description 161
- 239000000758 substrate Substances 0.000 abstract description 2
- 238000005498 polishing Methods 0.000 description 25
- 238000012937 correction Methods 0.000 description 22
- 238000010586 diagram Methods 0.000 description 17
- 238000005286 illumination Methods 0.000 description 16
- 238000005259 measurement Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 239000000284 extract Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000002194 synthesizing effect Effects 0.000 description 2
- 238000012217 deletion Methods 0.000 description 1
- 230000037430 deletion Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Images
Landscapes
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004029320A JP2005221368A (ja) | 2004-02-05 | 2004-02-05 | 観察装置及びその観察方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004029320A JP2005221368A (ja) | 2004-02-05 | 2004-02-05 | 観察装置及びその観察方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005221368A true JP2005221368A (ja) | 2005-08-18 |
| JP2005221368A5 JP2005221368A5 (enExample) | 2007-03-15 |
Family
ID=34997122
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004029320A Pending JP2005221368A (ja) | 2004-02-05 | 2004-02-05 | 観察装置及びその観察方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2005221368A (enExample) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7343064B2 (en) | 2006-03-07 | 2008-03-11 | Tecdia Co., Ltd. | Optical switch and optical add/drop multiplexer |
| WO2012081338A1 (ja) * | 2010-12-13 | 2012-06-21 | 株式会社日立ハイテクノロジーズ | 欠陥検査方法及びその装置 |
| KR101178055B1 (ko) * | 2009-08-14 | 2012-08-29 | 제주대학교 산학협력단 | 높이차 측정 장치 및 방법 |
| CN103376259A (zh) * | 2012-04-11 | 2013-10-30 | 百励科技股份有限公司 | 元件内部缺陷的检测装置及方法 |
| JP2016090410A (ja) * | 2014-11-06 | 2016-05-23 | 東レエンジニアリング株式会社 | 基板検査装置および方法 |
| CN111247423A (zh) * | 2017-10-20 | 2020-06-05 | 依视路国际公司 | 用于评估光学装置的外观缺陷的方法 |
| CN112198168A (zh) * | 2020-10-29 | 2021-01-08 | 罗建华 | 一种半导体检测装置及方法 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01221850A (ja) * | 1988-02-29 | 1989-09-05 | Shimadzu Corp | 赤外線散乱顕微鏡 |
| JPH05157701A (ja) * | 1991-03-11 | 1993-06-25 | Internatl Business Mach Corp <Ibm> | 光学的内部検査援助装置及びその方法 |
| JPH07294422A (ja) * | 1994-04-27 | 1995-11-10 | Mitsubishi Materials Corp | 表面近傍結晶欠陥の検出方法およびその装置 |
| JP2000088563A (ja) * | 1998-09-08 | 2000-03-31 | Hitachi Ltd | 外観検査方法および外観検査装置 |
| JP2005049294A (ja) * | 2003-07-31 | 2005-02-24 | Olympus Corp | 対象物の観察方法及びその装置 |
-
2004
- 2004-02-05 JP JP2004029320A patent/JP2005221368A/ja active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01221850A (ja) * | 1988-02-29 | 1989-09-05 | Shimadzu Corp | 赤外線散乱顕微鏡 |
| JPH05157701A (ja) * | 1991-03-11 | 1993-06-25 | Internatl Business Mach Corp <Ibm> | 光学的内部検査援助装置及びその方法 |
| JPH07294422A (ja) * | 1994-04-27 | 1995-11-10 | Mitsubishi Materials Corp | 表面近傍結晶欠陥の検出方法およびその装置 |
| JP2000088563A (ja) * | 1998-09-08 | 2000-03-31 | Hitachi Ltd | 外観検査方法および外観検査装置 |
| JP2005049294A (ja) * | 2003-07-31 | 2005-02-24 | Olympus Corp | 対象物の観察方法及びその装置 |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7343064B2 (en) | 2006-03-07 | 2008-03-11 | Tecdia Co., Ltd. | Optical switch and optical add/drop multiplexer |
| KR101178055B1 (ko) * | 2009-08-14 | 2012-08-29 | 제주대학교 산학협력단 | 높이차 측정 장치 및 방법 |
| WO2012081338A1 (ja) * | 2010-12-13 | 2012-06-21 | 株式会社日立ハイテクノロジーズ | 欠陥検査方法及びその装置 |
| US9239283B2 (en) | 2010-12-13 | 2016-01-19 | Hitachi High-Technologies Corporation | Defect inspection method and device therefor |
| CN103376259A (zh) * | 2012-04-11 | 2013-10-30 | 百励科技股份有限公司 | 元件内部缺陷的检测装置及方法 |
| JP2016090410A (ja) * | 2014-11-06 | 2016-05-23 | 東レエンジニアリング株式会社 | 基板検査装置および方法 |
| CN111247423A (zh) * | 2017-10-20 | 2020-06-05 | 依视路国际公司 | 用于评估光学装置的外观缺陷的方法 |
| CN112198168A (zh) * | 2020-10-29 | 2021-01-08 | 罗建华 | 一种半导体检测装置及方法 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US11726126B2 (en) | Apparatus, method and computer program product for defect detection in work pieces | |
| TWI558997B (zh) | 缺陷觀察方法及其裝置 | |
| JP3404134B2 (ja) | 検査装置 | |
| KR101338576B1 (ko) | 화상 해석에 의해서 결함 검사를 실시하는 결함검사장치 | |
| JP5703609B2 (ja) | 顕微鏡及び領域判定方法 | |
| US20110025838A1 (en) | Method and apparatus for inspecting defects in wafer | |
| JP5725501B2 (ja) | 検査装置 | |
| JP2009532732A (ja) | 発光ダイオード2次元アレイを有する共焦点顕微鏡 | |
| JP6230957B2 (ja) | 検査装置及び検査方法 | |
| JP2014137229A (ja) | 検査装置及び欠陥検査方法 | |
| CN110082360A (zh) | 一种基于阵列相机的序列光学元件表面缺陷在线检测装置及方法 | |
| JP4674382B1 (ja) | 検査装置及び欠陥検査方法 | |
| JP2005221368A (ja) | 観察装置及びその観察方法 | |
| JP2007327836A (ja) | 外観検査装置及び方法 | |
| JP2007294604A (ja) | 外観検査装置及び外観検査方法 | |
| JP5114808B2 (ja) | 検査装置及び欠陥検査方法 | |
| JP4136635B2 (ja) | 分析装置 | |
| JP2005315792A (ja) | 欠陥検査分類装置 | |
| JP3847422B2 (ja) | 高さ測定方法及びその装置 | |
| KR100913508B1 (ko) | 공초점을 이용한 3차원 스캐닝 장치 및 스캐닝 방법 | |
| WO2006123641A1 (ja) | 走査型観察装置 | |
| JPH07128032A (ja) | 板状材の表面うねり検査方法及び装置 | |
| JP2005098970A (ja) | 異物識別方法及び異物識別装置 | |
| JP2010164635A (ja) | 共焦点顕微鏡 | |
| US12495221B2 (en) | Lens flare elimination method, image capturing apparatus, and image measuring apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20070126 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20070126 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20090729 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20090811 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20091215 |