JP2005197007A5 - - Google Patents
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- Publication number
- JP2005197007A5 JP2005197007A5 JP2003435757A JP2003435757A JP2005197007A5 JP 2005197007 A5 JP2005197007 A5 JP 2005197007A5 JP 2003435757 A JP2003435757 A JP 2003435757A JP 2003435757 A JP2003435757 A JP 2003435757A JP 2005197007 A5 JP2005197007 A5 JP 2005197007A5
- Authority
- JP
- Japan
- Prior art keywords
- metal fine
- fine particle
- particles
- containing resin
- particle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010419 fine particle Substances 0.000 claims 16
- 239000002184 metal Substances 0.000 claims 16
- 239000011347 resin Substances 0.000 claims 12
- 229920005989 resin Polymers 0.000 claims 12
- 239000002245 particle Substances 0.000 claims 10
- 108091008695 photoreceptors Proteins 0.000 claims 3
- 239000004020 conductor Substances 0.000 claims 2
- 239000000463 material Substances 0.000 claims 2
- 239000011159 matrix material Substances 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003435757A JP2005197007A (ja) | 2003-12-26 | 2003-12-26 | 金属微粒子含有樹脂粒子および金属微粒子含有樹脂層の形成方法 |
| TW093137960A TW200521171A (en) | 2003-12-26 | 2004-12-08 | Resin particles and resin layer containing metal micro particles, its forming method and circuit base board |
| US11/018,473 US7939171B2 (en) | 2003-12-26 | 2004-12-22 | Metal-containing resin particle, metal-containing resin layer, method of forming metal-containing resin layer, and substrate for electronic circuit |
| KR1020040111799A KR100612170B1 (ko) | 2003-12-26 | 2004-12-24 | 금속 미립자 함유 수지 입자, 금속 미립자 함유 수지층,금속 미립자 함유 수지층의 형성 방법 및 전자 회로 기판 |
| CNA2004101034389A CN1649471A (zh) | 2003-12-26 | 2004-12-27 | 含有金属微粒的树脂颗粒、树脂层、其形成方法以及电路基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003435757A JP2005197007A (ja) | 2003-12-26 | 2003-12-26 | 金属微粒子含有樹脂粒子および金属微粒子含有樹脂層の形成方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005197007A JP2005197007A (ja) | 2005-07-21 |
| JP2005197007A5 true JP2005197007A5 (enrdf_load_stackoverflow) | 2005-09-02 |
Family
ID=34815725
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003435757A Pending JP2005197007A (ja) | 2003-12-26 | 2003-12-26 | 金属微粒子含有樹脂粒子および金属微粒子含有樹脂層の形成方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2005197007A (enrdf_load_stackoverflow) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4445448B2 (ja) * | 2005-09-16 | 2010-04-07 | 株式会社東芝 | 回路基板の製造方法 |
| JP4811066B2 (ja) * | 2006-03-17 | 2011-11-09 | 株式会社村田製作所 | 回路形成用荷電性粉末およびその製造方法ならびに回路パターンを有するガラス基板の製造方法 |
| CN105573076A (zh) * | 2016-03-11 | 2016-05-11 | 中物院成都科学技术发展中心 | 一种用于打印导电图案的粉末的制备方法 |
| JP2018170446A (ja) * | 2017-03-30 | 2018-11-01 | 日立化成株式会社 | 回路部品の製造方法 |
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2003
- 2003-12-26 JP JP2003435757A patent/JP2005197007A/ja active Pending