JP2005159267A - 半導体装置及びワイヤボンディング方法 - Google Patents

半導体装置及びワイヤボンディング方法 Download PDF

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Publication number
JP2005159267A
JP2005159267A JP2004084048A JP2004084048A JP2005159267A JP 2005159267 A JP2005159267 A JP 2005159267A JP 2004084048 A JP2004084048 A JP 2004084048A JP 2004084048 A JP2004084048 A JP 2004084048A JP 2005159267 A JP2005159267 A JP 2005159267A
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JP
Japan
Prior art keywords
wire
bonding
bond point
pad
capillary
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004084048A
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English (en)
Japanese (ja)
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JP2005159267A5 (https=
Inventor
Tatsunari Mitsui
竜成 三井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP2004084048A priority Critical patent/JP2005159267A/ja
Priority to US10/978,553 priority patent/US20050092815A1/en
Publication of JP2005159267A publication Critical patent/JP2005159267A/ja
Publication of JP2005159267A5 publication Critical patent/JP2005159267A5/ja
Priority to US11/582,665 priority patent/US20070029367A1/en
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07553—Controlling the environment, e.g. atmosphere composition or temperature changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
JP2004084048A 2003-10-30 2004-03-23 半導体装置及びワイヤボンディング方法 Pending JP2005159267A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2004084048A JP2005159267A (ja) 2003-10-30 2004-03-23 半導体装置及びワイヤボンディング方法
US10/978,553 US20050092815A1 (en) 2003-10-30 2004-11-01 Semiconductor device and wire bonding method
US11/582,665 US20070029367A1 (en) 2003-10-30 2006-10-16 Semiconductor device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003370323 2003-10-30
JP2004084048A JP2005159267A (ja) 2003-10-30 2004-03-23 半導体装置及びワイヤボンディング方法

Publications (2)

Publication Number Publication Date
JP2005159267A true JP2005159267A (ja) 2005-06-16
JP2005159267A5 JP2005159267A5 (https=) 2006-07-27

Family

ID=34554743

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004084048A Pending JP2005159267A (ja) 2003-10-30 2004-03-23 半導体装置及びワイヤボンディング方法

Country Status (2)

Country Link
US (2) US20050092815A1 (https=)
JP (1) JP2005159267A (https=)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100808510B1 (ko) * 2005-06-28 2008-02-29 가부시키가이샤 신가와 와이어 본딩 방법
WO2008047665A1 (fr) * 2006-10-16 2008-04-24 Kaijo Corporation Dispositif semi-conducteur
JP2011176280A (ja) * 2010-01-27 2011-09-08 Shinkawa Ltd 半導体装置の製造方法並びにワイヤボンディング装置
US9263418B2 (en) 2014-03-12 2016-02-16 Kabushiki Kaisha Toshiba Semiconductor device and manufacturing method thereof
CN105977174A (zh) * 2016-07-07 2016-09-28 力成科技（苏州）有限公司 指纹产品封装结构的金线打线方法
KR20170073003A (ko) * 2015-12-17 2017-06-28 삼성전자주식회사 반도체 장치의 강화된 강성을 갖는 전기적 연결부 및 그 형성방법

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Publication number Priority date Publication date Assignee Title
EP1722409B1 (en) 2005-05-09 2012-08-08 Kaijo Corporation Wire bonding method
US8016182B2 (en) 2005-05-10 2011-09-13 Kaijo Corporation Wire loop, semiconductor device having same and wire bonding method
CH697970B1 (de) * 2006-03-30 2009-04-15 Oerlikon Assembly Equipment Ag Verfahren zur Herstellung einer Wedge Wedge Drahtbrücke.
TWI506710B (zh) * 2009-09-09 2015-11-01 瑞薩電子股份有限公司 半導體裝置之製造方法
WO2013049965A1 (en) * 2011-10-08 2013-04-11 Sandisk Semiconductor (Shanghai) Co., Ltd. Dragonfly wire bonding
US9093515B2 (en) * 2013-07-17 2015-07-28 Freescale Semiconductor, Inc. Wire bonding capillary with working tip protrusion
US9082753B2 (en) * 2013-11-12 2015-07-14 Invensas Corporation Severing bond wire by kinking and twisting
US9087815B2 (en) * 2013-11-12 2015-07-21 Invensas Corporation Off substrate kinking of bond wire
US12057431B2 (en) * 2020-12-18 2024-08-06 Kulicke And Soffa Industries, Inc. Methods of forming wire interconnect structures and related wire bonding tools
US12538833B2 (en) * 2023-02-24 2026-01-27 Texas Instruments Incorporated Ball bonding for semiconductor devices

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5172851A (en) * 1990-09-20 1992-12-22 Matsushita Electronics Corporation Method of forming a bump electrode and manufacturing a resin-encapsulated semiconductor device
US5485949A (en) * 1993-04-30 1996-01-23 Matsushita Electric Industrial Co., Ltd. Capillary for a wire bonding apparatus and a method for forming an electric connection bump using the capillary
DE69739125D1 (de) * 1996-10-01 2009-01-02 Panasonic Corp Kapillare zum Drahtverbinden zur Herstellung von Höckerelektroden
JP3344235B2 (ja) * 1996-10-07 2002-11-11 株式会社デンソー ワイヤボンディング方法
JP2000082717A (ja) * 1998-09-07 2000-03-21 Shinkawa Ltd ワイヤボンディング方法
JP3584930B2 (ja) * 2002-02-19 2004-11-04 セイコーエプソン株式会社 半導体装置及びその製造方法、回路基板並びに電子機器
JP3573133B2 (ja) * 2002-02-19 2004-10-06 セイコーエプソン株式会社 半導体装置及びその製造方法、回路基板並びに電子機器
KR20030075860A (ko) * 2002-03-21 2003-09-26 삼성전자주식회사 반도체 칩 적층 구조 및 적층 방법
US7229906B2 (en) * 2002-09-19 2007-06-12 Kulicke And Soffa Industries, Inc. Method and apparatus for forming bumps for semiconductor interconnections using a wire bonding machine
JP2004172477A (ja) * 2002-11-21 2004-06-17 Kaijo Corp ワイヤループ形状、そのワイヤループ形状を備えた半導体装置、ワイヤボンディング方法及び半導体製造装置
JP3854232B2 (ja) * 2003-02-17 2006-12-06 株式会社新川 バンプ形成方法及びワイヤボンディング方法
US6815836B2 (en) * 2003-03-24 2004-11-09 Texas Instruments Incorporated Wire bonding for thin semiconductor package
KR100536898B1 (ko) * 2003-09-04 2005-12-16 삼성전자주식회사 반도체 소자의 와이어 본딩 방법
US7494042B2 (en) * 2003-10-02 2009-02-24 Asm Technology Singapore Pte. Ltd. Method of forming low wire loops and wire loops formed using the method
US7064433B2 (en) * 2004-03-01 2006-06-20 Asm Technology Singapore Pte Ltd Multiple-ball wire bonds
US7214606B2 (en) * 2004-03-11 2007-05-08 Asm Technology Singapore Pte Ltd. Method of fabricating a wire bond with multiple stitch bonds
JP4298665B2 (ja) * 2005-02-08 2009-07-22 株式会社新川 ワイヤボンディング方法

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100808510B1 (ko) * 2005-06-28 2008-02-29 가부시키가이샤 신가와 와이어 본딩 방법
WO2008047665A1 (fr) * 2006-10-16 2008-04-24 Kaijo Corporation Dispositif semi-conducteur
JP2008098549A (ja) * 2006-10-16 2008-04-24 Kaijo Corp 半導体装置
JP2011176280A (ja) * 2010-01-27 2011-09-08 Shinkawa Ltd 半導体装置の製造方法並びにワイヤボンディング装置
US8123108B2 (en) 2010-01-27 2012-02-28 Shinkawa Ltd. Method of manufacturing semiconductor device and wire bonding apparatus
US8196803B2 (en) 2010-01-27 2012-06-12 Shinkawa Ltd. Method of manufacturing semiconductor device and wire bonding apparatus
US9263418B2 (en) 2014-03-12 2016-02-16 Kabushiki Kaisha Toshiba Semiconductor device and manufacturing method thereof
KR20170073003A (ko) * 2015-12-17 2017-06-28 삼성전자주식회사 반도체 장치의 강화된 강성을 갖는 전기적 연결부 및 그 형성방법
KR102443487B1 (ko) 2015-12-17 2022-09-16 삼성전자주식회사 반도체 장치의 강화된 강성을 갖는 전기적 연결부 및 그 형성방법
CN105977174A (zh) * 2016-07-07 2016-09-28 力成科技（苏州）有限公司 指纹产品封装结构的金线打线方法

Also Published As

Publication number Publication date
US20050092815A1 (en) 2005-05-05
US20070029367A1 (en) 2007-02-08

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