JP2005150750A - 電気接点ボタンを有するインタポーザおよび方法 - Google Patents
電気接点ボタンを有するインタポーザおよび方法 Download PDFInfo
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- JP2005150750A JP2005150750A JP2004332214A JP2004332214A JP2005150750A JP 2005150750 A JP2005150750 A JP 2005150750A JP 2004332214 A JP2004332214 A JP 2004332214A JP 2004332214 A JP2004332214 A JP 2004332214A JP 2005150750 A JP2005150750 A JP 2005150750A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
- H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
- H05K7/1069—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting with spring contact pieces
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10378—Interposers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/308—Sacrificial means, e.g. for temporarily filling a space for making a via or a cavity or for making rigid-flexible PCBs
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
- H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
- Y10T29/49151—Assembling terminal to base by deforming or shaping
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
- Y10T29/49222—Contact or terminal manufacturing by assembling plural parts forming array of contacts or terminals
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Manufacture Of Switches (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
【解決手段】このインタポーザ102は、担体のバイアの中に犠牲柱を配置することによって形成される。電気接点ボタン120は、マスクを使用して所望のパターンに金属被覆する金属被覆プロセスによって犠牲柱の表面に形成される。犠牲柱は、担体124または電気接点ボタン120が変化しない程度の熱で熱分解する材料から作られる。
【選択図】図1
Description
102 LGAインタポーザ
104 PWB
106 MCMモジュール
108 ヒート・シンク
110 ばね
112 柱
114 電気接点
116 電気接点
120 電気接点ボタン
122 調節機構
124 担体
126 物理的下降止め
128 LGAフレーム
140 担体
144 物理マスク
146 物理マスクの開口
148 担体の穴
148P めっきスルー・ホール
154 金属コーティング
162 金属コーティング
165 フォトレジスト・コーティング
168 マスク
180 犠牲柱
188 金属コーティングまたは膜
190 物理マスク
196 鳥かご形接点
Claims (22)
- 電気絶縁担体の中に配置された導電材料の中空体を含むインタポーザ。
- 前記中空体が少なくとも1つの空隙を含む、請求項1に記載のインタポーザ。
- 前記中空体が複数の空隙を含む、請求項1に記載のインタポーザ。
- 前記中空体が、前記担体の両面に配置され互いに位置が重なった少なくとも2つの空隙を含む、請求項1に記載のインタポーザ。
- 前記担体が、複数の前記中空体がその中に配置された複数のバイアを含む、請求項1に記載のインタポーザ。
- プリント配線板にモジュールを接続するためのインタポーザであって、
少なくとも1つの導電性バイアを有し、前記バイアの位置と、前記モジュールのコネクタおよび前記プリント配線板のコネクタの位置とが重なり合うように配置された担体と、
前記バイアの中に配置され、前記モジュールのコネクタおよび前記プリント配線板のコネクタと電気接触する少なくとも1つの中空の電気接点ボタンと
を備えたインタポーザ。 - 前記電気接点ボタンが少なくとも1つの空隙を含む、請求項6に記載のインタポーザ。
- 前記電気接点ボタンが複数の空隙を含む、請求項6に記載のインタポーザ。
- 前記電気接点ボタンが、前記担体の両面に配置され互いに位置が重なった少なくとも2つの空隙を含む、請求項6に記載のインタポーザ。
- 前記担体が、複数の前記電気接点ボタンがその中に配置された複数の前記バイアを含む、請求項6に記載のインタポーザ。
- 電気接点ボタンを製造する方法であって、
犠牲柱を形成するステップと、
前記犠牲柱の表面に導電材料のパターンを形成するステップと、
前記犠牲柱を除去し、これによって前記電気接点ボタンを得るステップと
を含む方法。 - 前記導電材料が、銅、ニッケル、金、クロム、チタン、鉛、スズ、ビスマス、アンチモン、タングステン、モリブデンおよびこれらの合金からなるグループから選択された、請求項11に記載の方法。
- 前記導電材料の前記パターンが、物理マスキングとフォトレジストとからなるグループから選択されたプロセスによって前記犠牲柱に形成される、請求項11に記載の方法。
- 前記物理マスキング・プロセスが、真空付着と無電解めっきとからなるグループから選択された、請求項13に記載の方法。
- 前記フォトレジスト・プロセスが、金属アディティブ法と金属サブトラクティブ法とからなるグループから選択された、請求項13に記載の方法。
- 前記フォトレジスト・プロセスが、真空付着、スパッタリング、無電解めっき、積層箔および予め成形された金属薄板からなるグループから選択された、請求項13に記載の方法。
- 前記犠牲柱が、熱によって分解し蒸発する材料から形成される、請求項11に記載の方法。
- 前記犠牲柱の前記材料がポリマーである、請求項17に記載の方法。
- 前記犠牲柱の前記材料が、ポリメタクリル酸メチル、ポリα−メチルスチレン、ポリエチレンオキシド、ポリフェニレンオキシドおよびポリスチレンからなるグループから選択された、請求項17に記載の方法。
- 前記犠牲柱が熱分解によって除去される、請求項11に記載の方法。
- ランド・グリッド・アレイに複数の電気接点を製造する方法であって、
担体に、予め成形された接点ボタンの金属パターンを、前記担体の複数のバイアの位置と前記接点ボタンの位置とを合わせて積層するステップと、
前記接点ボタンと接点ボタンの間の前記担体から、積層した金属を除去するステップと
を含む方法。 - 前記パターンの金属が、箔と金属薄板とからなるグループから選択された、請求項21に記載の方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/715,288 US7137827B2 (en) | 2003-11-17 | 2003-11-17 | Interposer with electrical contact button and method |
Publications (2)
Publication Number | Publication Date |
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JP2005150750A true JP2005150750A (ja) | 2005-06-09 |
JP4074614B2 JP4074614B2 (ja) | 2008-04-09 |
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Application Number | Title | Priority Date | Filing Date |
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JP2004332214A Expired - Fee Related JP4074614B2 (ja) | 2003-11-17 | 2004-11-16 | インターポーザ及びこれの製造方法 |
Country Status (4)
Country | Link |
---|---|
US (4) | US7137827B2 (ja) |
JP (1) | JP4074614B2 (ja) |
KR (1) | KR100724841B1 (ja) |
CN (2) | CN1620236A (ja) |
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KR101058432B1 (ko) | 2009-05-22 | 2011-08-24 | 주식회사 이엠따블유 | 양면 도금이 용이한 사출 성형물 및 이를 포함한 내장형 안테나 |
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- 2004-10-20 CN CNA2004100864645A patent/CN1620236A/zh active Pending
- 2004-10-20 CN CNA2006101444166A patent/CN1941240A/zh active Pending
- 2004-11-16 JP JP2004332214A patent/JP4074614B2/ja not_active Expired - Fee Related
-
2005
- 2005-09-06 US US11/220,324 patent/US7823278B2/en not_active Expired - Fee Related
-
2006
- 2006-11-17 US US11/561,273 patent/US7648369B2/en not_active Expired - Fee Related
-
2008
- 2008-02-15 US US12/032,008 patent/US20090044405A1/en not_active Abandoned
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2019035392A1 (ja) * | 2017-08-14 | 2019-02-21 | ソニー株式会社 | 電子部品モジュール、その製造方法、内視鏡装置、および移動体カメラ |
CN110999550A (zh) * | 2017-08-14 | 2020-04-10 | 索尼公司 | 电子组件模块、其制造方法、内窥镜装置和移动相机 |
US11444049B2 (en) | 2017-08-14 | 2022-09-13 | Sony Corporation | Electronic component module, method for producing the same, endoscopic apparatus, and mobile camera |
US10531572B2 (en) | 2018-02-26 | 2020-01-07 | Fujitsu Limited | Substrate |
US10736220B2 (en) | 2018-02-26 | 2020-08-04 | Fujitsu Limited | Substrate |
Also Published As
Publication number | Publication date |
---|---|
US20090044405A1 (en) | 2009-02-19 |
CN1941240A (zh) | 2007-04-04 |
US7648369B2 (en) | 2010-01-19 |
US20070087588A1 (en) | 2007-04-19 |
US7823278B2 (en) | 2010-11-02 |
US7137827B2 (en) | 2006-11-21 |
CN1620236A (zh) | 2005-05-25 |
US20060009050A1 (en) | 2006-01-12 |
KR20050047466A (ko) | 2005-05-20 |
KR100724841B1 (ko) | 2007-06-04 |
US20050106902A1 (en) | 2005-05-19 |
JP4074614B2 (ja) | 2008-04-09 |
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