JP2005136016A - Multiple tape carrier, printed circuit board and its producing process - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain a multiple tape carrier in which the lifetime of a cutter for cutting the multiple tape carrier is prolonged by preventing it from deteriorating in the early stage, and short circuit is prevented during use by preventing adhesion of a conductive chip to the circuit. <P>SOLUTION: The multiple tape carrier 17 has two printed circuit board forming parts A divided in stripe in the width direction. At each printed circuit board forming part, a constitutional unit circuit 18 is formed in a row at a specified interval in the length direction of a tape. At the opposite side parts B of the printed circuit board forming part, sprocket holes 13a and 13b are formed and parts 19a and 19b for reinforcing the sprocket holes, respectively, are formed while leaving a conductive layer 12. Furthermore, a slit 20 is formed to divide mutual reinforcing part 19b between adjacent printed circuit board forming parts. Finally, opposite side edges of the conductive layer 12 provided on an insulating film substrate 11 are removed. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a multi-stripe tape carrier for obtaining a plurality of printed circuit boards such as a TAB (Tape Automated Bonding) tape carrier and a COF (Chip On Film) tape carrier. The present invention also relates to a printed circuit board obtained from the multi-stripe tape carrier and a method for manufacturing the printed circuit board.

  A conventional printed circuit board 9 is shown in FIG. The printed circuit board 9 had a tape width of, for example, 35 mm, 48 mm, 70 mm or the like.

  The printed circuit board 9 was provided with a printed circuit board forming portion A for forming the circuit 5 of the structural unit in one row at a predetermined interval in the length direction of the tape.

  On both side portions B of the printed circuit board forming portion A, the sprocket holes 3 were formed, and the reinforcing portions 6 formed by leaving the conductive layer 1 were provided.

  Such a printed circuit board 9 is mounted on the surface of the insulating film base 2 with electronic components mounted on the mounting position E of the circuit 5 and then punched for each circuit 5 from a tape to form a package. Was.

  However, since the printed circuit board 9 of the example shown above has only one circuit 5 in the tape width direction, the package production efficiency is poor. Therefore, there has been a multi-stripe tape carrier that can obtain a plurality of printed circuit boards in order to increase the package production efficiency. An example of the manufacturing method of the multi-stripe tape carrier is shown in FIG.

  As a preparation, as shown in FIG. 7A, the conductive layer 1 is provided on the surface of the insulating film substrate 2 such as 70 mm, 96 mm, 140 mm, etc., whose tape width is twice as large as, for example, 35 mm, 48 mm, and 70 mm. Prepare things.

  First, for example, by punching with a mold, the insulating film substrate 2 is punched together with the conductive layer 1 to form the sprocket holes 3a and the sprocket holes 3b on both sides of the material, as shown in FIG. 7B. In addition, two sets of sprocket holes 3a and 3b are formed in two rows.

  Next, a reinforcing part and a circuit pattern are formed by etching, leaving appropriate portions of the conductive layer 1 on the surface of the insulating film substrate 2. In order to form those reinforcing portions and circuit patterns, for example, a photoresist is applied to the surface and side surfaces of the insulating film substrate 2 via the conductive layer 1, and then the photoresist is cured, and then the insulating film base is formed. After irradiating light from the surface side of the material 2 through a mask (not shown), the exposed photoresist is decomposed and exposed, and then immersed in a developer to remove the decomposed photoresist. Development is performed to leave a photoresist corresponding to the circuit pattern and the reinforcing portion, and a resist pattern 4 is formed with the photoresist as shown in FIG.

  Thereafter, etching is performed, that is, the resist pattern 4 is exfoliated by swelling the resist pattern 4 with a chemical solution such as caustic soda after being immersed in an etching solution to elute the conductive layer 1 where there is no resist pattern 4. Thus, the multi-strip tape carrier 7 shown in FIGS. 7D and 8 was obtained.

  The multi-stripe tape carrier 7 had a tape width of 70 mm, 96 mm, 140 mm, etc., which is twice as large as, for example, 35 mm, 48 mm, and 70 mm.

  The multi-stripe tape carrier 7 has two strip-shaped printed circuit board forming portions A. In each of the printed circuit board forming portions A, the structural unit circuits 5 are formed in a line at a predetermined interval in the tape length direction. Reinforcing portions 6a and 6b that reinforce the sprocket holes 3a and 3b are formed on both side portions B of the printed circuit board forming portion A, respectively.

  These reinforcing portions 6a and 6b were formed in a strip shape along the length direction of the tape so as to include the sprocket holes 3a and 3b, respectively. And since the insulating film base material 2 is reinforced with those reinforcement parts 6a and 6b, even when the thickness of the insulating film base material 2 is thin, when conveying using the sprocket holes 3a and 3b, the insulating film base material 2 Was prevented from breaking.

  Thereafter, as shown in FIG. 9 (A), the multi-stripping tape carrier 7 is cut in the longitudinal direction at substantially the center of the multi-stripping tape carrier 7 using a blade 8, and FIG. 9 (B) and As shown in FIG. 10, two printed circuit boards 9 each having reinforcing portions 6a and 6b formed by leaving the conductive layer 1 on both side portions B were obtained.

After that, the printed circuit board 9 is mounted on the surface of the insulating film base 2 with electronic components such as IC and LSI mounted on the mounting position E of the circuit 5, and then punched for each circuit 5. Was forming.
JP-A-6-236905 Japanese Patent Laid-Open No. 2000-223795 JP 2001-168149 A JP 2002-299385 A JP 2002-299390 A

  However, when the printed circuit board 9 is obtained from the multi-stripe tape carrier 7 as described above, the conductive layer 1 is hard when the insulating film substrate 2 and the conductive layer 1 are cut using the blade 8. There was a problem that the blade 8 deteriorated early and the life of the blade 8 was short. In addition, since the conductive layer 1 is cut, conductive waste is generated, and when the conductive waste adheres between the leads of the circuit 5, there is a problem that a short circuit occurs when the package is used.

  Accordingly, a first object of the present invention is a multi-stripping tape carrier, which prevents the blade that cuts the multi-stripping tape carrier from prematurely deteriorating, prolongs the life of the blade, and provides conductivity. This is to prevent the scraps from adhering to the circuit and to prevent a short circuit from occurring during use.

  By the way, when the printed circuit board 9 is obtained as described above, the conductive layer 1 exists on the edge of one of the tapes of the printed circuit board 9. With such a conductive layer 1, for example, when mounting electronic components while transporting the printed circuit board 9 in the transport system using the sprocket holes 3, the conductive layer 1 comes into contact with, for example, a guide in the transport system to conduct electricity. When conductive waste is generated and the conductive waste adheres between the leads of the circuit 5, there is a problem that a short circuit occurs when the package is used.

  Accordingly, a second object of the present invention is to provide a multi-strip tape carrier, which reliably prevents conductive waste from adhering to the circuit by contacting the transport system and causing a short circuit during use. It is to prevent this more reliably.

  A third object of the present invention is a method of manufacturing a printed circuit board, which prevents the blade for cutting the multi-stripping tape carrier from prematurely deteriorating, prolongs the life of the blade, The object is to prevent debris from adhering to the circuit and to prevent a short circuit from occurring during use.

  A fourth object of the present invention is to provide a printed circuit board manufacturing method with improved production efficiency.

  A fifth object of the present invention is to obtain a printed circuit board manufactured by a method for manufacturing a printed circuit board that achieves the third or fourth object.

Therefore, the invention described in claim 1 is to achieve the first object described above.
In a multi-stripe tape carrier that cuts in the length direction and obtains a plurality of printed circuit boards in which reinforcing portions are formed by leaving conductive layers on both sides,
A slit that divides each reinforcing portion is formed between adjacent printed circuit board forming portions along the cutting position.

The invention according to claim 2 is to achieve the second object described above.
In the multi-stripe tape carrier according to claim 1,
It is characterized in that both side edges of the conductive layer provided on the insulating film substrate are removed.

In order to achieve the third object described above, the invention described in claim 3
In a method for manufacturing a printed circuit board,
While forming the reinforcing part leaving the conductive layer on both sides of each printed circuit board forming part of the multi-stripe tape carrier,
After forming a slit that divides each reinforcing part between adjacent printed circuit board formation parts,
A plurality of printed circuit boards are obtained by cutting the multi-stripe tape carrier in the length direction along the slits,
It is characterized by that.

In order to achieve the above-mentioned fourth object, the invention according to claim 4
In the manufacturing method of the printed circuit board according to claim 3,
A slit is also formed at the same time when the reinforcing portion is formed.

In order to achieve the fifth object described above, the invention described in claim 5
In printed circuit boards,
It manufactures using the manufacturing method of Claim 3 or 4.

  According to the invention described in claim 1, in the multi-stripe tape carrier, slits that divide each reinforcing portion are formed between adjacent printed circuit board forming portions along the cutting position. When cutting the tape carrier, only the insulating film substrate is cut along the slit at the cutting position, and the blade is prevented from cutting the hard conductive layer. Can extend the lifespan.

  In addition, since the conductive layer is not cut by the blade, the generation of conductive scraps is prevented, thereby preventing the conductive scraps from adhering to the circuit of the multi-stripping tape carrier. It is possible to prevent a short circuit from occurring.

  According to the invention described in claim 2, in the multi-stripe tape carrier, both side edges of the conductive layer provided on the insulating film substrate are removed. Since the conductive layer can be prevented from coming into contact with the transport system and generating conductive waste, it is possible to reliably prevent the conductive waste from adhering to the multi-stripping tape carrier circuit, resulting in a short circuit during use. This can be prevented more reliably.

  According to invention of Claim 3, in the manufacturing method of a printed circuit board, while forming a reinforcement part, leaving a conductive layer in the both sides of each printed circuit board formation part of a multi-stripe tape carrier, it adjoins Since a slit that divides each reinforcing portion is formed between printed circuit board forming portions to be cut, a multi-stripe tape carrier is cut in the length direction along the slit to obtain a plurality of printed circuit boards. When cutting the strip tape carrier, only the insulating film substrate is cut along the slit that is the cutting position, and the hard conductive layer is not cut with the blade, so that the blade is prevented from premature deterioration, The life of the blade can be extended.

  In addition, since the conductive layer is not cut by the blade, the generation of conductive scraps is prevented, thereby preventing the conductive scraps from adhering to the circuit of the multi-stripping tape carrier. It is possible to prevent a short circuit from occurring.

  According to the invention described in claim 4, since the slit is formed at the same time when the reinforcing portion is formed, it is possible to provide a method for manufacturing a printed circuit board with improved productivity as compared with the case where the reinforcing portion is formed separately. .

  According to the invention described in claim 5, since the manufacturing method is used by using the manufacturing method described in claim 3 or 4, a printed circuit board having the effect described in claim 3 or claim 4 can be obtained.

The best mode for carrying out the present invention will be described below with reference to the drawings.
FIG. 1 shows in sequence the steps of an example of a method for manufacturing a multi-stripe tape carrier for forming two printed circuit boards according to the present invention. As preparation, as shown to FIG. 1 (A), what prepares the conductive layer 12 on the surface of the insulating film base material 11 which is tape shape and whose width is 70 mm, 96 mm, 140 mm etc. is prepared.

  For the insulating film substrate 11, for example, a polyimide resin, an epoxy resin, or a liquid crystal polymer having insulating properties and flexibility is used. On the other hand, a metal such as copper is used for the conductive layer 12.

  First, punching is performed using, for example, a mold, and the insulating film base material 11 is punched together with the conductive layer 12 to form the sprocket holes 13a on both sides of the material and the sprocket holes 13b on the center, and FIG. As shown in FIG. 2, two sets of sprocket holes 13a and 13b are formed in two rows by a sprocket hole 13a on both sides of the material and a sprocket hole 13b in the center.

  Next, the conductive layer 12 on the surface of the insulating film substrate 11 is left, and a reinforcing portion that reinforces the sprocket holes 13a13b, a circuit pattern that is configured by a circuit of a structural unit, and the like are formed.

  In order to form these reinforcing portions and circuit patterns, for example, a photoresist is applied to the surface and side surfaces of the insulating film substrate 11 via the conductive layer 12, and after the photoresist is cured, the insulating film substrate After irradiating light through a mask (not shown) from the surface side of 11 and performing exposure to decompose the photoresist at the location exposed to light, development is performed by removing the decomposed photoresist by immersion in a developer. Then, as shown in FIG. 1C, a resist pattern 15 is formed with a photoresist. When the resist pattern 15 is formed, the photoresist at the position corresponding to the slit is removed.

  Alternatively, a photoresist is applied to the surface and side surfaces of the insulating film substrate 11 through the conductive layer 12, and then light is irradiated from the surface side of the insulating film substrate 11 through a mask (not shown). After performing exposure for curing the photoresist at the location, the photoresist that has not been cured is removed by immersion in a developer, and a resist pattern 15 is formed with the photoresist as shown in FIG. . Similarly, when the resist pattern 15 is formed, the photoresist at the position corresponding to the slit is removed.

  Thereafter, the resist pattern 15 is immersed in an etching solution such as ferric chloride, and etching is performed to elute the conductive layer 12 where the resist pattern 15 is not present. Then, the resist pattern 15 is exfoliated by swelling with a chemical solution such as caustic soda. Thus, the multi-stripe tape carrier 17 shown in FIG. 1 (D) and FIG. 3 is obtained.

  When forming the resist pattern 15, if the photoresist 14 is applied to the surface and side surfaces of the insulating film substrate 11, the photo resists on both side edges of the tape as shown in FIG. The resist 14 becomes thinner. When the resist pattern 15 is formed and then etched after being applied in this way, the etching solution enters from the thin resist pattern 15 on both side edges. Therefore, as shown in FIG. Thus, both side edges of the conductive layer 12 provided on the substrate 11 are removed.

  Therefore, when the multi-stripe tape carrier 17 to be described later is transported, it is possible to prevent the conductive layers 12 on both side edges from coming into contact with the transport system and generating conductive scraps. It is possible to reliably prevent the circuit 17 from adhering to the circuit 5 and prevent a short circuit from occurring during use.

  Now, the multi-stripe tape carrier 17 shown in FIG. 3 obtained as described above has a tape width of 70 mm, 96 mm, 140 mm or the like, which is twice each of 35 mm, 48 mm, and 70 mm, for example.

  The multi-stripe tape carrier 17 has two strip-shaped printed circuit board forming portions A. In each of the printed circuit board formation portions A, the circuit units 18 are formed in a line at a predetermined interval in the tape length direction. Reinforcing portions 19a and 19b for reinforcing the sprocket holes 13a and 13b are formed on both side portions B of the printed circuit board forming portion A, respectively.

  These reinforcing portions 19a and 19b are formed in a band shape along the length direction of the tape so as to include sprocket holes 13a and 13b, respectively. And since the insulating film base material 11 is reinforced with those reinforcement parts 19a and 19b, even when the thickness of the insulating film base material 11 is thin, when conveying using the sprocket holes 13a and 13b, the insulating film base material 11 Can be prevented from being broken.

  Further, in the middle of the two rows of sprocket holes 13b at the center, for example, a slit 20 is formed along the length direction of the tape to divide the reinforcing portions 19b between the adjacent printed circuit board forming portions A.

  When the multi-stripping tape carrier 17 is transported using the sprocket holes 13a, or when a printed circuit board (to be described later) is transported using the sprocket holes 13a and 13b, the teeth of the transport sprocket (not shown) are used as reinforcing parts. In order not to get caught in 19a, 19b, openings 16 that are slightly larger than the sprocket holes 13 are provided in the reinforcing portions 19a, 19b.

  Etching is performed as described above to form the reinforcing portions 19a and 19b while leaving the conductive layer 12 on both sides B of each printed circuit board forming portion A, and at the same time, between the adjacent printed circuit board forming portions A. A slit 20 for dividing the reinforcing portion 19b is formed.

  Next, as shown in FIG. 4 (A), the multi-stripe tape carrier 17 is moved along the slit 20 which is a cutting position using the blade 21 while being conveyed by the sprocket holes 13a on both sides of the tape carrier 17. The insulating film substrate 11 is cut in the length direction of the tape and divided in the width direction. As shown in FIGS. 4B and 5, the reinforcing portions 19a and 19b are formed by leaving the conductive layers 12 on both side portions B. Two formed printed circuit boards 23 are obtained.

  For example, when the multi-stripping tape carrier 17 having a width of 70 mm, 96 mm, and 140 mm is cut, two printed circuit boards 23 having a width of 35 mm, 48 mm, and 70 mm can be obtained. In this example, two printed circuit boards 23 are obtained from the multi-stripe tape carrier 17, but the present invention is not limited thereto, and the width of the multi-stripe tape carrier 17 is appropriately widened. Two or more printed circuit boards 23 may be obtained. For example, if the multi-stripe tape carrier 17 having a width of 105 mm is manufactured, three 35 mm-wide printed circuit boards 23 can be obtained.

  After that, these printed circuit boards 23 are transported through the sprocket holes 13a and 13b on both sides of the printed circuit board 23, and on the surface of the insulating film substrate 11, at the mounting position 24 of the circuit 18, an electronic device such as an IC or LSI is provided. After each component is mounted and mounted, each circuit 18 is punched to form a package.

  Such a package is used by being mounted on, for example, another circuit board.

  In the above-described method for manufacturing the multi-stripe tape carrier 17, the multi-stripe tape carrier 17 was obtained by performing etching to form a circuit pattern and the like. After the circuit pattern was formed, the circuit pattern was formed. Surface treatment such as plating may be applied to a required portion of the conductive layer 12, a solder resist layer (not shown) for protecting the circuit pattern may be provided, or both of them may be provided, and a multi-stripping tape Carrier 17 may be obtained.

  Moreover, in the manufacturing method of the multi-stripe tape carrier 17 mentioned above, when forming the reinforcement parts 19a and 19b, it demonstrated by the example which forms the slit 20 simultaneously, but this invention is not limited to it, The reinforcement parts 19a and 19b are formed. After forming, the slit 20 may be formed, or after forming the slit 20, the reinforcing portions 19a and 19b may be formed. That is, not only the reinforcing portions 19a and 19b and the slit 20 are formed simultaneously, but also the reinforcing portions 19a and 19b and the slit 20 may be formed before and after the formation.

(A) thru | or (D) is explanatory drawing which shows an example of the manufacturing method of the multi-stripe tape carrier by this invention in order of a process. (A) And (B) is explanatory drawing of the edge part of the tape in the manufacturing method. It is a top view of the multiple strip tape carrier. (A) And (B) is explanatory drawing which shows an example of the manufacturing method which obtains a printed circuit board from the multi-stripe tape carrier in order of a process. It is a top view of the printed circuit board. It is a top view of the conventional printed circuit board. (A) thru | or (D) is explanatory drawing which shows an example of the manufacturing method of the conventional multi-stripe tape carrier in order of a process. It is a top view of the multiple strip tape carrier. (A) And (B) is explanatory drawing which shows an example of the manufacturing method which obtains a printed circuit board from the multi-stripe tape carrier in order of a process. It is a top view of the printed circuit board.

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 Insulation film base material 12 Conductive layer 13a, 13b Sprocket hole 17 Multi-stripping tape carrier 18 Circuit 19a, 19b Reinforcement part 20 Slit 21 Blade 23 Printed circuit board A Printed circuit board formation part B Both sides

Claims (5)

In a multi-stripe tape carrier that cuts in the length direction and obtains a plurality of printed circuit boards in which reinforcing portions are formed by leaving conductive layers on both sides,
A multi-stripping tape carrier characterized by forming slits for separating the reinforcing portions between adjacent printed circuit board forming portions along the cutting position.   The multi-stripe tape carrier according to claim 1, wherein both side edges of the conductive layer provided on the insulating film substrate are removed. While forming the reinforcing part leaving the conductive layer on both sides of each printed circuit board forming part of the multi-stripe tape carrier,
After forming a slit that divides each reinforcing portion between adjacent printed circuit board forming portions,
A plurality of printed circuit boards are obtained by cutting the multi-stripe tape carrier in the length direction along the slits,
A printed circuit board manufacturing method characterized by the above.   The method for manufacturing a printed circuit board according to claim 3, wherein the slit is formed at the same time when the reinforcing portion is formed. A printed circuit board manufactured using the manufacturing method according to claim 3.

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