JP4654955B2 - Multi-strip wiring tape having slit position determination wiring and wiring tape thereof - Google Patents

Description

  The present invention relates to a multi-stripe wiring tape (particularly a TAB tape) having a slit position determination wiring and a wiring tape (particularly a TAB tape).

  Examples of wiring tapes for mounting electronic components include TAB (Tape Automated Bonding) tapes and COF (Chip On Film) tapes.

  For example, a conventional TAB tape having a three-layer structure (polymer film, adhesive, copper foil) has been manufactured by a process flow as shown in FIG.

  One of the reasons why the manufacturing method shown in FIG. 5 is adopted is that the polymer film 1 and the adhesive 4 are bonded before the copper foil 3 is bonded, rather than the method of etching the polymer film 1 as a method of forming the device hole 5. The method of punching a hole with a press and making a hole is less handling of chemicals.

  In the TAB tape industry, the width of the polymer film 1 to be used has been practically standardized to 35 mm, 48 mm, 70 mm, etc., and the position and size of the sprocket hole 2 has also been practically standardized. Yes. The sprocket holes 2 are holes for conveyance or alignment in TAB tape manufacturing, and a plurality of sprocket holes 2 are provided along both ends in the tape longitudinal direction.

  FIG. 6 is a plan view showing a state in the copper foil bonding step of FIG. 5, and FIG. 7 is a cross-sectional view taken along line B-B ′ of FIG. 8 is a plan view of the completed TAB tape, and FIG. 9 is a cross-sectional view taken along B-B ′ of FIG.

  First, a polymer film 1 such as a polyimide tape is prepared, and an adhesive 4 is applied and pasted, and then a device hole 5 and a sprocket hole 2 are drilled to bond the copper foil 3.

  Thereafter, the TAB tape 30 is completed through patterning of the signal / power wiring 7 and the like, a resist or coverlay 6, and electrolytic plating. Specifically, the signal / power wiring 7 and the like are generally formed by applying a liquid resist for patterning to the copper foil 3 and then exposing, developing, etching, and patterning resist film removal process, and then for insulation and protection. The resist or coverlay 6 is printed or pasted (see, for example, Patent Document 1).

  Thereafter, when electrolytic plating such as gold plating is performed, the electrolytic plating can be performed by supplying power from the plating power supply line 8. At this time, the resist or coverlay 6 functions to reduce the area of electrolytic plating as a function other than electrical insulation, and contributes to manufacturing a product at a low cost, particularly in the case of precious metal plating such as gold.

  The wiring protruding from the device hole 5 is etched while applying a backing resin from the polymer film 1 side before etching and preventing the etchant from entering from the back surface. Then, after the etching is finished, the backing resin is peeled off together with the patterning resist.

  According to the above-mentioned conventional manufacturing method and practical standards in the TAB tape industry, as shown in FIG. 6, the width of the copper foil is determined at both ends from the viewpoint of omitting unnecessary copper foil 3 and adhesive 4. It was set narrower than the inside-inside distance of the sprocket hole 2. Therefore, the plated feeder 8 and the signal / power wiring 7 shown in FIG. 8 are provided within the width of the copper foil 3.

  When such a TAB tape is manufactured by multiple strips, the width of the polymer film 1 is increased by multiples and the same as that of the TAB tape when the adhesive 4 and the copper foil 3 are manufactured one by one. Although it is desirable to stick in multiple widths, from the viewpoint of high technical difficulty and work efficiency, as shown in FIG. 10, a wide single width adhesive 4 or copper foil 3 is bonded and manufactured. It is common (see, for example, Patent Document 2).

  FIG. 11 is a cross-sectional view taken along B-B ′ of FIG. By etching the copper foil 3 from the state shown in FIG. 10, patterning is performed in the same shape as the two TAB tapes shown in FIG. 6, and the resist or coverlay 6 is processed. After the plating process, it is cut off from the slit position by the slit process, and each is manufactured as one TAB tape.

In this case, the cured adhesive 4 remains in the section from the slit position shown in FIG. 10 to the sprocket hole 2 even if the copper foil is etched away as shown in FIG. Further, when the number of strips is three or more, the adhesive 4 remains in the vicinity of the sprocket holes 2 on both sides of the TAB tape located on both sides other than the two ends. Compared with the TAB tape shown in FIG. 8 manufactured one by one, this difference has no usability problem except in some cases, for example, when resin molding is performed by sandwiching with a mold.
Japanese Patent No. 3460696 JP 2002-190501 A

  However, when slitting the conventional multi-strip TAB tape into each strip, there has been a problem of slit displacement. For example, the slit position deviation is determined based on one side outside the sprocket hole 2, and the distance to the slit end face is determined.

  Of these, what occurs continuously can be determined by sampling and measuring the longitudinal end of the TAB tape, but what occurs partially cannot be determined by measuring the longitudinal end, and is called sprocket hole 2 Since it was based on one side of a square punching hole of less than 2 mm, it was difficult to understand by visual inspection including a magnifying glass over the entire length.

  Further, if the slit processing is performed while recognizing the wiring pattern, wiring of a certain length or more is required in parallel with the longitudinal direction of the TAB tape. For this reason, slits while recognizing a wiring pattern are difficult for an electroless-plated TAB tape without a power supply line or a TAB tape without a wiring pattern having a length required in the longitudinal direction of the TAB tape.

  Further, when the TAB tape is subjected to electrolytic plating, the power supply line 8 is provided inside the sprocket hole 2, and therefore, the power supply / signal wiring 7 corresponds to the width of the power supply line 8 (for example, 0.4 mm / line). The width of the effective wiring area for placing the circuit has been reduced. Therefore, when the effective wiring area width is insufficient, the width of the TAB tape has to be increased by one size, such as 35 mm width → 48 mm width. This was also the cause of increasing the waste of the polymer film (TAB tape was used by punching the used part into individual pieces and discarding the remaining part) at the same time as the cost increase. There is also a problem that few users have the same amount of processing capability for all TAB tape widths.

  Accordingly, an object of the present invention is to provide a multi-stripe wiring tape that can be easily determined visually or using a magnifying glass, regardless of whether the slit displacement is continuous or partial, and the slit processed wiring tape. It is to provide. In addition, an object of the present invention is to provide a multi-stripe wiring tape capable of being slit regardless of electrolytic plating / electroless plating and regardless of the direction of the wiring pattern of the product, and the slit taped wiring tape. There is. Furthermore, an object of the present invention is to provide a multi-stripe wiring tape that has a low environmental load and can be manufactured at a reduced cost, and a wiring tape that has been slit.

In order to achieve the above object, the present invention is a multi-stripe wiring tape which is processed at a slit position and becomes a wiring tape for mounting two or more electronic components having sprocket holes, the slit position on the wiring pattern forming surface The multi-stripe wiring tape is characterized in that slit position determination wiring is formed in the longitudinal direction between both sides or one side of the slit and between the slit position and the side existing on the slit position side of the sprocket hole. .

  In order to achieve the above object, the present invention provides a wiring tape obtained by slitting the multi-stripe wiring tape according to the present invention.

  According to the present invention, it is possible to provide a multi-stripe wiring tape that can be easily determined by visual observation or using a magnifying glass regardless of whether the slit displacement is continuous or partial, and a wiring tape that has been slit. be able to. In addition, according to the present invention, there are provided a multi-strip wiring tape capable of slitting regardless of electrolytic plating / electroless plating and regardless of the direction of the wiring pattern of the product, and the wiring tape subjected to the slit processing. be able to. Furthermore, according to the present invention, it is possible to provide a multi-stripe wiring tape that has a low environmental load and can be manufactured at a reduced cost, and a wiring tape that has been slit.

[First embodiment of the present invention]
(Configuration of multi-strip TAB tape)
FIG. 1 is a plan view showing a schematic configuration of a multi-strip TAB tape according to the first embodiment of the present invention. FIG. 2 is a cross-sectional view taken along the line BB ′ of FIG.

  The multi-strip (here 2 strips) take-up TAB tape 10 is composed of the same configuration and material as the conventional multi-strip take-up TAB tape, but differs in that it has a slit position determination wiring 9.

  The double strip TAB tape 10 has a slit position determination wiring 9 on each side of the slit position on the formation surface of the wiring pattern (signal / power supply wiring 7 and power supply wiring 8) and between the slit position and the sprocket hole 2. It is formed in the longitudinal direction of the tape 10. The slit position determination wiring 9 is continuously formed in parallel with the slit position.

  The slit position determination wiring 9 may be formed only on one side of the slit position, but it is desirable that the slit position determination wiring 9 be on both sides as shown in FIG. Further, the power supply lines 8 at the upper and lower ends in FIG. 1 do not need to be provided particularly when the electrolytic plating area is small or the electroless plating is performed.

  Regardless of the presence or absence of the sprocket hole 2, the slit position determination wiring 9 is desirably formed at a position where at least one end near the slit position is within a range of 1.50 mm or less from the slit position. For example, when the distance from the sprocket hole 2 to the slit position is 2.01 mm, the width of the slit position determination wiring 9 is set to 0.41 mm in order to maintain the contact stability with the feeding roll, and the sprocket hole 2 and the slit position determination wiring 9 are set. If a space of 0.1 mm is taken to prevent interference, the space from the slit position to one end of the slit position determination wiring 9 is 1.50 mm.

  The slit position determination wiring 9 sets the dimension from the slit position to one end of the wiring 9 near the slit position as the slit position management tolerance. Here, the slit position management tolerance means a tolerance that is independently set by the manufacturing department in consideration of process capability as an inner tolerance of a standard tolerance applied to product delivery. For example, if the delivery standard tolerance is ± 0.25 mm, the slit position management tolerance is set to 0.20 mm, which is narrower than that. When the slit position deviates from the management tolerance, the slit position reaches the upper or lower slit position determination wiring 9 in FIG. 1, so that the slit position is full of the management tolerance, such as by visual inspection or a magnifier. Can be detected by the method. As a result, products that deviate from the standard tolerance at the time of product delivery will not be shipped. In addition, automatic inspection of the slit position by image recognition is facilitated.

  The slit position determination wiring 9 can function as a power supply line for electrolytic plating. At this time, it is advantageous to reduce the width of the slit position determination wiring 9 to such an extent that the current capacity of electrolytic plating can be ensured, particularly in the case of noble metal plating such as gold plating.

(Manufacturing method of multi-strip TAB tape / TAB tape)
Next, a method for producing a multi-strip TAB tape / TAB tape will be described. Although it can be manufactured in substantially the same manner as the manufacturing process flow of the conventional TAB tape shown in FIG. 5, it is greatly different in that it includes a process of forming the slit position determination wiring 9.

  First, as the polymer film 1, for example, polyimide tape (thickness is 25 μm to 75 μm, width is more than n times the required TAB tape width) such as Upilex and Kapton (both are trade names) is selected as a suitable material. be able to.

  Next, a thermosetting type adhesive material 4, for example, an X-type adhesive material 4 manufactured by Yodogawa Paper Mill is laminated on the polymer film 1. The thickness of the adhesive 4 is made thicker than the maximum roughness of the back surface of the copper foil 3, but is preferably 12 μm or less from the viewpoint of warping of the TAB tape.

  Thereafter, the device hole 5 and the sprocket hole 2 are generally processed by a punching method using a mold. At that time, the entire cover tape is processed from the cover tape surface (not shown) of the adhesive 4 to prevent the adhesive 4 from being contaminated.

  Next, a copper foil 3 having a back surface roughness suitable for the pitch of the wiring pattern formed by etching is selected and laminated. The thickness of the copper foil 3 is preferably about 9 μm to 35 μm in view of the workability of the laminate and the ease of etching. The laminating condition is to mainly adjust the temperature and the pressing pressure of the laminating roll according to the characteristics of the adhesive 4. If it is said structure, using a commercially available laminator, operation | work is possible for temperature and pressure at about 100 degreeC and about 0.3 MPa. Thereafter, the heat curing reaction of the adhesive 4 is completed while raising the temperature under the conditions recommended for the adhesive 4.

  Next, the surface of the copper foil 3 is mechanically or chemically polished as necessary, washed with sulfuric acid and further washed with water and dried cleanly, and then coated with a patterning liquid resist for baking the wiring pattern. Alternatively, a dry film is laminated on the copper surface.

  Next, a desired wiring pattern is printed using an exposure machine. At this time, the slit position determination wiring 9 which is a wiring that does not exist in the conventional multi-stripe TAB tape is formed. The slit position determination wiring 9 is designed so that one end thereof becomes a slit machining position management tolerance from the slit position (0.20 mm if the management tolerance is ± 0.20 mm). As a matter of course, this control tolerance is set more strictly according to the capability of the process than the final specification tolerance of the product. As for the exposure conditions of the exposure machine, an optimum value is obtained in advance by trial manufacture until the development process. As for the relative positioning of the mask of the exposure machine and the product, it may be mechanically positioned by the sprocket hole 2, but the image of the sprocket hole 2 is recognized, or another dedicated hole is made to recognize the image. Also good.

  Development is generally carried out by spraying at 30 ° C. and 1% sodium carbonate solution (desirably following the instructions of the manufacturer of each coating material and dry film material). The device hole 5 is protected from being etched by applying in advance a backing material that is not affected by the etching solution.

  Etching is performed, for example, by spraying a ferric chloride solution. After the etching, the coating material or the dry film material and the backing material are peeled off with 1% sodium carbonate solution, washed with sulfuric acid, washed with water and dried to a clean surface, and the formation of all wirings is completed.

  Thereafter, a multi-stripe TAB tape 10 is completed by applying a resist or coverlay 6 and performing final plating such as electrolytic gold plating.

  Thereafter, the multi-strip TAB tape 10 is slit into each strip, and a TAB tape having a desired width such as 35 mm width or 48 mm width is supplied.

[Second Embodiment of the Present Invention]
(Configuration of multi-strip TAB tape)
FIG. 3 is a plan view showing a schematic configuration of a multi-strip TAB tape according to the second embodiment of the present invention. FIG. 4 is an enlarged view (part 2) of part A in FIG.

  In the double strip TAB tape 20 according to the present embodiment, slit position determination wirings 9 are formed on both sides of the slit position, and these slit position determination wirings 9 are connected by a slit crossing wiring 11 that crosses the slit position. It is characterized by being. Other configurations and the like are the same as those of the two-strip TAB tape 10 according to the first embodiment described above.

  For example, as shown in FIG. 4A, the cross-slit wiring 11 has a step (for example, 0.05 mm) at a predetermined interval (for example, 0.05 mm) in the direction perpendicular to the slit position, or FIG. As shown by (), there is a notch 12 that functions as a scale at a predetermined interval (for example, an interval of 0.05 mm) in the direction perpendicular to the slit position.

  By adding the cross-slit wiring 11 that serves as a simple scale, the slit position can be more easily determined. The absolute value of the displacement of the slit position can be easily measured by the notch 12 or the like.

  In addition, when the slit position determination wiring 9 is used as a power supply line for electrolytic plating, the presence of the slit crossing wiring 11 can provide a margin for keeping the potential of each strip the same.

(Manufacturing method of multi-strip TAB tape / TAB tape)
It can be manufactured by the same method as in the first embodiment except that the slit crossing wiring 11 is provided when a desired wiring pattern is printed using an exposure machine.

[Other Embodiments of the Present Invention]
As an embodiment of the present invention, there are various forms in addition to the first and second embodiments described above, and examples thereof include the following forms.
(1) The present invention is not limited to two but can be similarly applied to three or more TAB tapes.

(2) The present invention can be applied not only to a single-sided wiring TAB tape but also to a double-sided wiring TAB tape. In this case, the slit position determination wiring 9 is formed on at least one side.

(3) The present invention is not limited to the TAB tape, and can be similarly applied to other electronic component mounting wiring tapes such as a COF tape.

[Effect of the embodiment of the present invention]
According to the embodiment of the present invention, the following effects can be obtained.
(1) With respect to slit position deviation in slit processing of multi-strip TAB tape, by providing a wiring for determination in the vicinity of the slit position, whether the slit position deviation is continuous or partial, is visually or magnified. Can be easily determined using

(2) When performing slit processing while recognizing the wiring pattern, a multi-strip TAB tape that allows slit processing regardless of the direction of the wiring pattern of the product, regardless of whether it is electrolytic plating or electroless plating. Can supply. In addition, a multi-strip TAB tape that can be easily handled in the technology of slit processing while performing image recognition can be supplied without being concerned with slit processing relying on conventional sprocket holes.

(3) For TAB tape to be electroplated, it is possible to widen the effective wiring area in the TAB tape width direction than before by disposing the feeder line outside the sprocket hole, and discarding the TAB tape. Therefore, it is possible to supply an inexpensive multi-taken TAB tape that has few parts, that is, has a small environmental load and can reduce the cost.

It is a top view which shows schematic structure of the multi-stripe TAB tape which concerns on the 1st Embodiment of this invention. It is sectional drawing in B-B 'of FIG. It is a top view which shows schematic structure of the multi-stripe TAB tape which concerns on the 2nd Embodiment of this invention. It is an enlarged view (2 form) of the A section of FIG. It is a manufacturing process flowchart of the conventional TAB tape. The state in the copper foil bonding process of FIG. 5 is shown with the top view. It is sectional drawing in B-B 'of FIG. It is a top view of the completed TAB tape. It is sectional drawing in B-B 'of FIG. The state in the copper foil bonding process of the conventional multi-strip TAB tape is shown with the top view. It is sectional drawing in B-B 'of FIG.

Explanation of symbols

1: Polymer film 2: Sprocket hole 3: Copper foil 4: Adhesive material 5: Device hole 6: Resist or coverlay 7: Signal / power supply wiring 8: Feed line 9: Slit position determination wiring 10, 20: TAB tape ( Article 2)
11, 11A, 11B: Cross-slit wiring 12: Notch 30: TAB tape

Claims (8)

A multi-stripe wiring tape that is processed at a slit position and becomes a wiring tape for mounting two or more electronic components having sprocket holes, on both sides or one side of the slit position on a wiring pattern forming surface, and the slit position and the A multi-stripe wiring tape, characterized in that a slit position determination wiring is formed in the longitudinal direction between the sprocket hole and the side existing on the slit position side . The multi-stripe wiring tape according to claim 1, wherein the slit position determination wiring is formed at a position where at least one end thereof is within a range of 1.50 mm or less from the slit position.   3. The multi-stripe wiring tape according to claim 1, wherein the wiring tape is a single-sided wiring TAB (Tape Automated Bonding) tape.   3. The multi-stripe wiring tape according to claim 1, wherein the wiring tape is a double-sided wiring TAB tape and has the slit position determination wiring on at least one side. 4.   The multi-stripe wiring tape according to any one of claims 1 to 4, wherein the slit position determination wiring has a function as a power supply line for electrolytic plating.   6. The slit position determination wiring is formed on both sides of the slit position, and the slit position determination wiring is connected by a slit crossing wiring that crosses the slit position. The multi-stripe wiring tape according to claim 1.   The multi-stripe wiring tape according to claim 6, wherein the cross-slit wiring has a step or a notch at a predetermined interval in a direction perpendicular to the slit position.   A wiring tape obtained by slitting the multi-stripe wiring tape according to any one of claims 1 to 7.

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