JP2012059980A - Manufacturing method for wiring board and wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wiring board which can restrain deformation and defection of a flying reed and which is improved in stability of a projection distance and accuracy of a tip position.SOLUTION: A manufacturing method for a wiring board of a roll-to-roll method includes patterning a conductor layer on a base material 1 to form wiring 3 including a flying reed 3f projecting to a device hole 5b which penetrates the base material 1. The flying reed 3f is formed in no less than two processes, and at least in one of the processes, the conductor layer and the base material are penetrated to form an opening 5a to fix the tip position of the flying reed 3f within the region scheduled for the device hole 5b to be formed.

Description

  The present invention relates to a method for manufacturing a wiring board having flying leads and a wiring board.

  As the wiring board, a wiring board such as a TAB (Tape Automated Bonding) method or a TCP (Tape Carrier Package) method in which a wiring pattern is formed on a flexible base material using a copper foil or the like (hereinafter referred to as a TAB as a representative). ). Currently, TAB is being used and mass-produced in some applications such as IC packages.

  The above-mentioned TAB has, for example, a device hole penetrating the base material, and the wiring on the base material has a flying lead protruding into the device hole. The IC chip mounted on the TAB is connected to the flying lead and mounted on the device hole. As a method for forming a TAB having a flying lead, three methods are mainly known.

  In the first method, as shown in FIG. 3A, first, a device hole, a sprocket hole, or the like is formed in a base material made of polyimide or the like by punching (S51). Next, a copper foil is bonded to the substrate via an adhesive or the like (S52). Thereafter, the copper foil is patterned by a photolithography etching method or the like to form wiring including flying leads (S53). Finally, plating is performed to improve the reliability of the wiring, and TAB is manufactured (S54). Such a technique is disclosed in Patent Document 1 and Patent Document 2, for example.

  In the second method, as shown in FIG. 3B, a copper foil is bonded to a base material formed by punching device holes, sprocket holes, etc. (S61) (S62), and the copper foil is patterned to provide wiring. Form (S63). At this time, the leads protruding from both ends to the device hole are kept connected. Thereafter, after performing a plating process or the like (S64), the connected leads are cut and separated by punching or the like (S65).

  In the third method, as shown in FIG. 3C, for example, a sprocket hole or the like is formed by punching (S71). At this time, no device hole is formed. Next, a copper foil is bonded to the substrate (S72), and the copper foil is patterned to form a wiring including flying leads (S73). Thereafter, a part of the substrate is removed by wet etching or the like to form a device hole (S74), and finally a plating process or the like is performed (S75). Such a technique is disclosed in Patent Document 3, for example.

JP 2010-027906 A JP 7-1111279 A JP-A-6-260534

However, each of the three methods listed above has problems. In the first method, since the flying lead is formed at a relatively early stage, there is a case where a defective deformation occurs in the flying lead through a plurality of processes thereafter. Further, in the second method, there is no part to be pressed when the flying lead is cut, so the flying lead may be pushed down and deformed during cutting, or a stable cutting shape may not be obtained and burrs may occur. there were. In addition, it is difficult to maintain the accuracy of the cutting position, and there is a problem that the stability of the protruding distance of the lead to the device hole and the accuracy of the tip position are lacking. Further, in the third method, unless other methods are combined, the formation of the flying lead cannot be the final process, and there is a concern of a deformation defect in the intermediate process. Furthermore, a device hole must be formed from the back side in accordance with the wiring pattern formed on the surface of the base material, which may cause a problem of positional accuracy.

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a method of manufacturing a wiring board and a wiring board that can suppress the deformation defect of the flying lead and improve the stability of the protruding distance and the accuracy of the tip position.

  According to the first aspect of the present invention, a wiring board is manufactured by a roll-to-roll method, in which a conductor layer on a base material is patterned to form a wiring including a flying lead protruding into a device hole penetrating the base material. The flying lead is formed in two or more steps, and in at least one of the steps, the conductor layer and the base material are penetrated, and the flying lead is formed in a region where the device hole is to be formed. A method of manufacturing a wiring board that forms an opening for determining a tip position is provided.

  According to the second aspect of the present invention, in at least one of the steps of forming the flying lead, the opening formed in the substrate is widened, and a protruding distance of the flying lead to the device hole is predetermined. A method for manufacturing a wiring board according to a first aspect is provided in which the device holes are formed so as to have a length of.

  According to a third aspect of the present invention, the device hole has a rectangular shape, and the length of at least one of the sides is longer than 0.3 mm. A manufacturing method is provided.

According to a fourth aspect of the present invention, there is provided the method for manufacturing a wiring board according to any one of the first to third aspects, wherein an opening area of the device hole is larger than 20 mm ² .

  According to a fifth aspect of the present invention, in the first aspect, the device hole is formed by any one of laser processing, press processing, and chemical etching processing, or a combination of any two or more. A method for manufacturing a wiring board according to any of the fourth to fourth aspects is provided.

  According to the sixth aspect of the present invention, the conductor layer is composed of a conductor including a metal that can be etched and plated, and the base material is composed of an organic resin having electrical insulation as a component. A method for manufacturing a wiring board according to any one of the fifth aspect to the fifth aspect is provided.

  According to a seventh aspect of the present invention, the substrate is composed of polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyphenylene sulfide (PPS), polyamideimide (PAI), liquid crystal polymer (LCP). ), A wiring board production method according to any one of the first to sixth aspects, which is a film containing any one of aramid and glass epoxy resin as a component.

  According to an eighth aspect of the present invention, the conductor layer is formed on the substrate by any one of a laminating method, a pressing method, a casting method, a sputtering method, a vapor deposition method, and a wet plating method. A method for manufacturing a wiring board according to any one of the seventh to seventh aspects is provided.

  According to a ninth aspect of the present invention, there is provided the wiring board manufacturing method according to any one of the first to eighth aspects, wherein at least a part of the wiring is plated.

  According to a tenth aspect of the present invention, in any one of the first to ninth aspects, the thickness of the base material is 4 μm or more and 125 μm or less, and the thickness of the wiring is 3 μm or more and 35 μm or less. A method for manufacturing the described wiring board is provided.

  According to an eleventh aspect of the present invention, the wiring is patterned by a photolithography method, and a single exposure range when the wiring pattern is projected and exposed is a range of 80 mm × 80 mm, or a range wider than 80 mm × 80 mm. A method for manufacturing a wiring board according to any one of the first to tenth aspects is provided.

According to a twelfth aspect of the present invention, a substrate, a rectangular device hole penetrating the substrate, and a wiring including a flying lead protruding into the device hole, the device hole includes at least A wiring board having a length of any one side longer than 0.3 mm and an opening area of the device hole larger than 20 mm ² is provided.

  ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method and wiring board of a wiring board which can suppress the deformation | transformation defect of a flying lead and can improve the stability of a protrusion distance and the precision of a front-end | tip position are provided.

It is a flowchart which shows each process of the manufacturing method of the wiring board which concerns on one Embodiment of this invention. It is a figure which shows each process of the manufacturing method of the wiring board which concerns on one Embodiment of this invention, Comprising: (a1)-(g1) is sectional drawing of a wiring board, (a2)-(g2) is wiring board's It is a top view which shows a part. It is a flowchart which shows each process of the manufacturing method of the wiring board which concerns on a prior art.

[One Embodiment]
A method for manufacturing a wiring board and a wiring board according to an embodiment of the present invention will be described below.
<Manufacturing method of wiring board>
The manufacturing method which concerns on one Embodiment of this invention is used for manufacture of TAB which has a flying lead protruded to the device hole which penetrates a base material. The manufacturing method according to this embodiment will be described below with reference to FIGS. FIG. 1 is a flowchart showing each step of the method for manufacturing a wiring board according to the present embodiment. FIG. 2 is a view showing each step of the method for manufacturing a wiring board according to the present embodiment, wherein (a1) to (g1) are cross-sectional views of the wiring board, and (a2) to (g2) are wiring boards. It is a top view which shows a part of.

  The manufacturing method according to the present embodiment is performed on the base material 1 on which the adhesive 2 shown in FIG. The substrate 1 is, for example, a polyimide film. Specific examples include Kapton (registered trademark) manufactured by Toray DuPont and Upilex (registered trademark) manufactured by Ube Industries. As the base material 1, for example, a material wound in a roll shape with a width of 100 mm or more and a length of 10 m or more can be used. Can be used. The thickness of the substrate 1 can be, for example, 4 μm or more and 125 μm or less, and preferably 12 μm or more and 75 μm or less. As a general combination according to the thickness of the base material 1, the thickness of the adhesive 2 can be set to, for example, 8 μm or more and 15 μm or less. For example, a product made by Toray or Yodogawa Paper is used.

(Punching process S1)
First, the punching step S <b> 1 shown in FIG. 1 is performed on the substrate 1 and the adhesive 2. Specifically, as shown in FIG. 2 (b1), for example, punching by pressing is performed to provide the sprocket holes 4 and module positioning holes (not shown). The sprocket holes 4 are arranged at the end of the substrate 1 as shown in FIG. The sprocket holes 4 may be provided at both ends of the substrate 1. In the manufacturing process of the wiring board, the base material 1 is conveyed and positioned using the sprocket holes 4. In the subsequent plan views, the sprocket hole 4 is omitted.

(Copper foil bonding step S2)
Next, the copper foil bonding step S2 shown in FIG. 1 is performed on the base material 1 provided with the sprocket holes 4 and the like. Specifically, as shown in FIG. 2 (c1), a copper foil 3 as a conductor layer, which will be a material of a wiring 3p described later, is bonded to almost the entire surface of the base material 1 with an adhesive 2 interposed therebetween. Hereinafter, the wiring 3p formed by patterning the copper foil 3 may be referred to as a conductor layer. That is, the conductor layer includes the copper foil 3, the patterned wiring 3p, and the like. For the copper foil 3, for example, a rolled copper foil or an electrolytic copper foil whose back surface is subjected to treatment such as corrosion prevention or roughening can be used. The thickness of the copper foil 3 can be, for example, 3 μm or more and 35 μm or less. Bonding of the copper foil 3 is performed by, for example, pressing and heating using a laminating method using a roll laminator. At that time, in order to keep the heat history to the adhesive 2 constant, it is desirable to perform lamination in one step regardless of single-strand or multi-strand. After bonding the copper foil 3, the adhesive 2 is cured. Bonding of the copper foil 3 and curing of the adhesive 2 are performed under predetermined conditions according to the adhesive to be used.

(Opening step S3)
Then, opening formation process S3 shown in FIG. 1 is performed with respect to the base material 1 on which the copper foil 3 is bonded. That is, as shown in FIG. 2 (d1), for example, punching by press working is performed, and the copper foil 3 and the base material 1 are penetrated to form the opening 5a. At this time, an opening 5a is formed in a region where a device hole 5b described later is to be formed. Specifically, for example, the opening 5a is rectangular as shown in FIG. 2 (d2), and when viewed on the paper surface of FIG. 2 (d2), the left and right widths of the opening 5a are the widths of the device holes 5b to be formed later. The opening 5a is formed inside the region where the device hole 5b is to be formed so as to be narrower than the left and right widths. At this time, when viewed on the paper surface of FIG. 2 (d2), the upper and lower widths of the opening 5a are, for example, the same as the upper and lower widths of the device hole 5b. When the opening 5a is formed in this way, the positions of both the left and right sides (outer edges) of the opening 5a provided inside the device hole 5b are the tip positions of the flying leads 3f to be formed later. That is, by forming the opening 5a, the tip position of the flying lead 3f is determined. As described above, the opening 5a is formed in the region where the device hole is to be formed so that at least part or all of the outer edge of the opening having an arbitrary shape is formed inside the outer edge of the device hole.

  In this embodiment, since the copper foil 3 is penetrated with the base material 1, it can suppress that the copper foil 3 of the part used as the flying lead 3f later deform | transforms at the time of a cutting | disconnection, and a fixed cross-sectional shape is obtained. Cheap.

(Wiring pattern forming step S4)
Next, as shown in FIG. 1, a wiring pattern forming step S <b> 4 is performed on the copper foil 3. That is, as shown in FIGS. 2E1 and 2E2, the copper foil 3 is patterned using, for example, a photolithography technique and an etching technique to form the wiring 3p. Specifically, first, for example, a photoresist is applied to the entire surface of the copper foil 3. As the photoresist, either a positive type or a negative type can be used. Alternatively, a dry film can be used instead of the photoresist. Next, the pattern of the wiring 3p including the portion to be the flying lead 3f is projected and developed to obtain a photoresist pattern. At this time, a single exposure range is set to a range of, for example, 80 mm × 80 mm or wider. Next, wiring 3p is formed by etching on the copper foil 3 on which the photoresist pattern is formed. Specifically, the copper foil 3 is patterned using an etchant such as ferric chloride (FeCl ₃ ) or cupric chloride (CuCl ₂ ). At this time, a portion that later becomes the flying lead 3f is also formed. After the wiring 3p is formed, the photoresist is removed. Specifically, an alkali solution such as sodium hydroxide (NaOH) is used and removed while applying a physical force with an alkaline solution shower, or dissolved in an alkali solution and removed. In the series of steps in the wiring pattern forming step S4, the peripheral conditions can be adjusted based on the recommended conditions of the photoresist material manufacturer.

  In addition, in the conventional methods such as the first method and the second method described above, since the device hole is formed in advance, the back surface (device hole side) is exposed at the portion that becomes the flying lead when patterning the wiring. It has become. Therefore, in order to prevent the flying lead portion from being etched from the back surface, the wiring patterning is generally performed after sealing with a backing resin. However, in the present embodiment, since the entire wiring 3p including the portion that becomes the flying lead 3f is still held by the base material 1 at the time of patterning the wiring 3, it is sealed with a backing resin and after etching. The step of removing the backing resin can be omitted.

  Here, as necessary, a solder resist or a coverlay is provided as a protective film for the wiring 3p.

(Plating process S5)
Subsequently, a plating treatment step S5 shown in FIG. 1 is performed. Specifically, as shown in FIG. 2 (f1), gold (Au), tin (Sn), or the like is plated on the surface of the patterned wiring 3p. As a plating method, electroplating, electroless plating, or the like can be used. The connection reliability of the wiring 3 with the IC chip or another wiring board can be enhanced by the plating process. In the case where the above-described coverlay is provided, the plating process may be performed only on portions exposed from the coverlay, such as the flying leads 3f and connection terminals (not shown).

  As described above, in the second conventional method, the plating process is performed with the flying leads connected. For this reason, the plating process was performed even to the unnecessary part cut | disconnected later, and the gold plating etc. for that part were consumed wastefully. However, in this embodiment, useless consumption of plating can be suppressed and cost can be reduced.

(Device hole forming step S6)
Next, a device hole forming step S6 shown in FIG. 1 is performed to form a device hole 5b having a predetermined shape. That is, as shown in FIG. 2 (g1), the opening 5a formed in the base material 1 is widened by, for example, laser processing from the back surface of the base material 1 to form the device hole 5b. Specifically, the device hole 5b is formed in a rectangle as shown in FIG. 2 (g2), for example, and the opening 5a is widened to the left and right to the position of the left and right width of the device hole 5b. At this time, the vertical width of the opening 5a formed to be the same as the vertical width of the device hole 5b is not widened. With the wiring 3 on the base material 1 left, mainly by retracting only the base material 1 left and right, the left and right wirings 3p protrude from the tip to the device hole 5b by a predetermined distance. Flying leads 3f protruding from the left and right to the device hole 5b are formed. That is, by forming the device hole 5b having a target shape, the protruding distance of the flying lead 3f to the device hole 5b becomes a predetermined length. As described above, when the opening is widened, at least a part or the whole of the outer edge of the opening having an arbitrary shape is widened, and the wiring 3 in the part is connected to the device hole 5.
It can be projected into b. Here, the protruding distance is, for example, the length from the left and right sides (outer edges) of the device hole 5b to the tip of the flying lead 3f protruding to the device hole 5b. At this time, when the device hole 5b to be formed is rectangular, the length of one side can be formed longer than, for example, 0.3 mm. Further, while the opening area of the conventional device hole is about 6 mm ² (0.6 mm × 10 mm), for example, according to the manufacturing method as described above, the opening area of the device hole 5b is from 20 mm ^2, for example. Can be formed larger. As described above, the wiring board according to this embodiment is manufactured.

  As described above, when the device hole 5b is formed, the opening 5a provided in advance can be used as the reference position, so that the protruding distance of the flying lead 3f can be easily controlled, and the accuracy of the tip position of the flying lead 3f is also obtained. It is easy to be done. Therefore, the device hole 5b can be made to have a relatively large size as described above without worrying about the deformation defect or the tip position defect of the flying lead 3f. Further, since the device hole 5b is not formed until the latter half of the manufacturing process of the wiring substrate, and the entire wiring 3p is held by the base material 1, deformation defects are hardly generated in the intermediate process.

<Effect according to one embodiment>
According to this embodiment, at least one or more of the following effects can be obtained.

(A) According to this embodiment, there are two main processes for forming the flying lead 3f. That is, the tip position of the flying lead 3f is determined in the opening forming step S3, and the protruding distance of the flying lead 3f to the device hole 5b is set to a predetermined length in the device hole forming step S6. Thereby, the stability of the protruding distance of the flying lead 3f and the accuracy of the tip position can be improved.

(B) Moreover, according to this embodiment, the copper foil 3 and the base material 1 are penetrated, and the opening 5a is formed. As a result, it is possible to suppress deformation of the copper foil 3 in the portion that will later become the flying lead 3f during cutting, and to improve the stability of the cross-sectional shape.

  As described above, in the conventional second method of cutting the connected lead last, there is no part that becomes a pressing part at the time of cutting, and the flying lead may be deformed or a burr may be generated in the cross-section part. there were. However, in the present embodiment, since the opening 5a is formed by penetrating the copper foil 3 together with the base material 1, deformation and burrs of the flying lead 3f during cutting can be suppressed.

(C) Moreover, according to this embodiment, since the device hole 5b is formed in the second half of the manufacturing process of the wiring board, the entire wiring 3p is held by the base material 1 until then. Thereby, deformation defects of the flying lead 3f in the intermediate process can be suppressed.

  As described above, in the first conventional method in which the device hole is formed first, the flying lead may be deformed by handling or the like during a plurality of subsequent steps. Such a deformation failure can also occur in the second method in which a very thin copper foil is not supported and undergoes a plurality of steps, or in the third method in which the formation of flying leads cannot be the final step.

  However, in this embodiment, since the state in which the entire wiring 3p including the portion that will later become the flying lead 3f is held by the base material 1 is maintained until the final device hole forming step S6, such deformation defects are suppressed. Can do. In particular, it is possible to improve the yield of non-defective products as the deformation defects of flying leads that have been miniaturized and narrowed in pitch due to the miniaturization of IC chips become serious.

(D) Further, according to the present embodiment, since the entire wiring 3p is held by the base material 1 at the time of patterning the wiring 3p, sealing with a backing resin is not necessary, and the number of processes is reduced. Can be simplified.

(E) Moreover, according to this embodiment, the opening 5a is expanded and the device hole 5b is formed. That is, in forming the device hole 5b, the opening 5a is used as a reference position. Thereby, the protruding distance and the tip position of the predetermined flying lead 3f can be obtained with high accuracy.

  As described above, in the conventional third method, it is necessary to form a device hole from the back surface of the base material in accordance with the position of the wiring pattern already formed on the top surface of the base material. There is no reference point that directly indicates. For this reason, it is difficult to obtain the tip position and protrusion distance of a predetermined flying lead, and variations among wiring boards are likely to occur.

  However, in the present embodiment, the tip position of the flying lead 3f is determined in the opening forming step S3, and the device hole 5b is formed with the opening 5a as a reference position. For this reason, the controllability of the protruding distance of the flying lead 3f and the accuracy of the tip position can be improved.

(F) According to the present embodiment, the device hole 5b has a rectangular shape in which the length of one side is longer than 0.3 mm and the opening area is larger than 20 mm ² . By applying the present invention, it is possible to employ the device hole 5b having a relatively large size as described above.

  In the past, flying lead deformation defects and positional accuracy problems were particularly likely to occur with large device holes. However, in the present embodiment, the occurrence of such a problem can be suppressed even if the device hole 5b has a large size.

(G) According to the present embodiment, in the plating process S5, only the necessary part of the wiring 3p is plated. Thereby, the consumption and cost of plating can be reduced as compared with the second method in which the unnecessary portion is plated.

[Other embodiments]
As mentioned above, although embodiment of this invention was described concretely, this invention is not limited to the above-mentioned embodiment, It can change variously in the range which does not deviate from the summary.

  For example, in the above-described embodiment, the wiring pattern forming step S4 is performed after the opening forming step S3. However, the order of the steps may be reversed, and the opening 5a may be formed after the wiring 3p is patterned. In this case, patterning is performed in a state where the wiring 3p is connected without interruption in the region where the device hole 5b is to be formed, and then the wiring 3p as the conductor layer and the base material 1 are penetrated to cross the wiring 3p. Opening 5a is formed.

  In the above-described embodiment, the plating process S5 is performed before the device hole forming process S6. However, the order of the processes may be reversed, and the plating process may be performed after forming the device hole 5b. . In this case, the rear surface (the device hole 5b side) of the flying lead 3f is also plated, and the connection reliability of the wiring 3p can be further improved.

In the above-described embodiment, the wiring 3p in which the flying leads 3f protrude from the left and right ends of the device hole 5b is shown. However, the pattern of the flying leads 3f and the wiring 3p is not limited to this, for example, the flying lead 3f is only on one side. Or a shape protruding from any of a plurality of directions of up, down, left and right.

  Moreover, in the above-mentioned embodiment, although the opening 5a and the device hole 5b were made into the rectangle, it is not restricted to this. In particular, when the device hole 5b has a complicated shape, the predetermined device hole 5b may be formed by performing the device hole forming step S6 in a plurality of times.

  In the above-described embodiment, the device hole 5b is formed by laser processing. However, etching using a chemical solution such as polyimide etching solution, punching by pressing, Pinnacle blade (Thomson blade, engraving blade) It is also possible to form it by a push-off method or the like. Or some of these methods may be combined. The formation of the sprocket holes 4 and the like in the punching step S1 and the formation of the opening 5a in the opening forming step S3 can be formed not only by pressing but also by any one of the above methods or a combination thereof.

  Moreover, in the above-mentioned embodiment, although the copper foil 3 shall be bonded together by the laminating method by a roll laminator, a roll laminator may be a pressure reduction type. It is also possible to use techniques such as a press method using a double belt press or a reduced pressure press, a casting method, a sputtering method, a vapor deposition method, and a wet plating method.

  In the above-described embodiment, the photoresist used for patterning the wiring 3p is exposed by projection exposure, but proximity exposure or contact exposure can also be used. In addition, a dedicated photosensitive film can be formed instead of the photoresist, and direct drawing can be performed by laser light.

  In the above-described embodiment, the copper foil 3 is used as the material of the wiring 3p. However, any other material may be used as long as it is a conductor layer made of a conductor containing a metal that can be etched or plated. It is also possible.

  Moreover, in the above-mentioned embodiment, although the base material 1 was made into the polyimide-type film, besides a polyimide (PI), a polyethylene terephthalate (PET), a polyethylene naphthalate (PEN), a polyphenylene sulfide (PPS), a polyamideimide ( PAI), a liquid crystal polymer (LCP), an aramid, a material containing an organic resin such as a glass epoxy resin can be used.

DESCRIPTION OF SYMBOLS 1 Base material 2 Adhesive 3 Copper foil 3p Wiring 3f Flying lead 4 Sprocket hole 5a Opening 5b Device hole

Claims (12)

A method of manufacturing a wiring board by a roll-to-roll method, wherein a wiring including a flying lead protruding to a device hole penetrating the base material by patterning a conductor layer on the base material,
The flying lead is formed in two or more steps, and in at least one of the steps,
A method for manufacturing a wiring board, comprising: penetrating the conductor layer and the base material; and forming an opening for determining a tip position of the flying lead in a region where the device hole is to be formed. In at least one of the steps of forming the flying lead,
2. The wiring board according to claim 1, wherein the opening formed in the base material is widened, and the device hole is formed so that a protruding distance of the flying lead to the device hole becomes a predetermined length. Production method. The method for manufacturing a wiring board according to claim 1, wherein the device hole has a rectangular shape, and the length of at least one side is longer than 0.3 mm. The method for manufacturing a wiring board according to claim 1, wherein an opening area of the device hole is larger than 20 mm ² . The device hole is
The wiring board according to any one of claims 1 to 4, wherein the wiring board is formed by any one of laser processing, press processing, and etching processing with a chemical solution, or a combination of any two or more thereof. Manufacturing method. The conductor layer is composed of a conductor containing a metal that can be etched and plated,
6. The method for manufacturing a wiring board according to claim 1, wherein the base material contains an organic resin having electrical insulation as a component. The substrate is any one of polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyphenylene sulfide (PPS), polyamideimide (PAI), liquid crystal polymer (LCP), aramid, glass epoxy resin. The method for manufacturing a wiring board according to claim 1, wherein the film is a film containing a resin as a component. The conductor layer is
The wiring according to any one of claims 1 to 7, wherein the wiring is formed on the substrate by any one of a laminating method, a pressing method, a casting method, a sputtering method, a vapor deposition method, and a wet plating method. A method for manufacturing a substrate. The method for manufacturing a wiring board according to claim 1, wherein at least a part of the wiring is plated. The thickness of the said base material is 4 micrometers or more and 125 micrometers or less, and the thickness of the said wiring is 3 micrometers or more and 35 micrometers or less, The manufacturing method of the wiring board in any one of Claims 1-9 characterized by the above-mentioned. The wiring is patterned by photolithography,
The wiring board according to any one of claims 1 to 10, wherein a single exposure range when projecting and exposing a wiring pattern is 80 mm x 80 mm or wider than 80 mm x 80 mm. Manufacturing method. A substrate;
A rectangular device hole penetrating the substrate;
A wiring including a flying lead protruding into the device hole,
The device hole has a length of at least one side longer than 0.3 mm,
The wiring board according to claim 1, wherein an opening area of the device hole is larger than 20 mm ² .

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