JP2005135993A - 光センサ - Google Patents
光センサ Download PDFInfo
- Publication number
- JP2005135993A JP2005135993A JP2003367771A JP2003367771A JP2005135993A JP 2005135993 A JP2005135993 A JP 2005135993A JP 2003367771 A JP2003367771 A JP 2003367771A JP 2003367771 A JP2003367771 A JP 2003367771A JP 2005135993 A JP2005135993 A JP 2005135993A
- Authority
- JP
- Japan
- Prior art keywords
- film
- fesi
- substrate
- optical sensor
- iron silicide
- Prior art date
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- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 92
- 239000000758 substrate Substances 0.000 claims abstract description 63
- 229910052742 iron Inorganic materials 0.000 claims abstract description 36
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 30
- 238000009792 diffusion process Methods 0.000 claims abstract description 23
- 229910021332 silicide Inorganic materials 0.000 claims abstract description 21
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 claims abstract description 21
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000010703 silicon Substances 0.000 claims abstract description 14
- 239000010409 thin film Substances 0.000 claims abstract description 8
- 239000010408 film Substances 0.000 claims description 161
- 229910006585 β-FeSi Inorganic materials 0.000 claims description 91
- 230000003287 optical effect Effects 0.000 claims description 58
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 23
- 229910052760 oxygen Inorganic materials 0.000 claims description 12
- 229910052717 sulfur Inorganic materials 0.000 claims description 12
- 230000002265 prevention Effects 0.000 claims description 8
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 abstract description 13
- 238000004519 manufacturing process Methods 0.000 description 14
- 239000000463 material Substances 0.000 description 13
- 238000002474 experimental method Methods 0.000 description 11
- 238000004891 communication Methods 0.000 description 8
- 239000000835 fiber Substances 0.000 description 7
- 239000012535 impurity Substances 0.000 description 7
- 239000010453 quartz Substances 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 238000007740 vapor deposition Methods 0.000 description 7
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 6
- 238000004544 sputter deposition Methods 0.000 description 6
- 238000011160 research Methods 0.000 description 5
- 230000003667 anti-reflective effect Effects 0.000 description 4
- 229910052785 arsenic Inorganic materials 0.000 description 4
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000013307 optical fiber Substances 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 3
- 239000013078 crystal Substances 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- -1 In-Ga-P Inorganic materials 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000011949 advanced processing technology Methods 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000011859 microparticle Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
- H01L31/10—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by potential barriers, e.g. phototransistors
- H01L31/101—Devices sensitive to infrared, visible or ultraviolet radiation
- H01L31/102—Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier
- H01L31/108—Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier the potential barrier being of the Schottky type
- H01L31/1085—Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier the potential barrier being of the Schottky type the devices being of the Metal-Semiconductor-Metal [MSM] Schottky barrier type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
- H01L31/10—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by potential barriers, e.g. phototransistors
- H01L31/101—Devices sensitive to infrared, visible or ultraviolet radiation
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Light Receiving Elements (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
Abstract
【解決手段】ケイ素基板1の一方の面上に鉄拡散防止緩衝層2とベータ鉄シリサイド半導体薄膜3を形成し、他方の面上に無反射誘電体層5を形成する。入射光6の可視光領域をケイ素で、また赤外光領域をベータ鉄シリサイドで受光し、電極11、31間に出力電圧が発生する。
【選択図】図1
Description
真空槽内の真空度 10−8〜10−10torr
基板の材料と温度 n-型Si:300〜600°C
緩衝層の材料と膜厚 SiO2:10nm以下
第1のβ-FeSi2膜 Si;406nm、Fe;120nm。反応後 n-β-FeSi2:383nm
無反射誘電体層 ZnO:600nm、SiO2:270nm
真空槽内の真空度 10−8〜10−10torr
基板の材料と温度 n-型Si:300〜600°C
緩衝層の材料と膜厚 SiO2;10nm以下
第1のβ-FeSi2膜 Si:237nm、Fe;70nm。反応後 n-β-FeSi2:223nm
第2のβ-FeSi2膜 Si:406nm、Fe;120nm。反応後 p-β-FeSi2:383nm
無反射誘電体層 ZnO:600nm、SiO2:270nm
真空槽内の真空度 10−8〜10−10torr
基板の材料と温度 n-型Si:300〜600°C
第1のβ-FeSi2膜 Si:406nm、Fe;120nm。反応後 p-β-FeSi2:383nm
緩衝層の材料と膜厚 SiO2;10nm以下
Si膜 n-Si:406nm
無反射誘電体層 ZnO:600nm、SiO2:270nm
真空槽内の真空度 10−8〜10−10torr
基板の材料と温度 p-型Si:450〜600°C
第1のβ-FeSi2膜 Si:237nm、Fe;70nm。反応後 n-β-FeSi2:223nm
第2のβ-FeSi2膜 Si:406nm、Fe;120nm。反応後 p-β-FeSi2:383nm
無反射誘電体層 n-Zn(S,O):100nm
Claims (13)
- ケイ素(Si)基板と該基板上に形成されたベータ鉄シリサイド(β-FeSi2)膜を有する光センサ。
- 請求項1記載の光センサにおいて、上記ベータ鉄シリサイド膜の上に更に第2のベータ鉄シリサイド膜が設けられ、上記ベータ鉄シリサイド膜と上記第2のベータ鉄シリサイド膜の間にn−型/p−型接合面又はp−型/n−型接合面が形成されていることを特徴とする光センサ。
- 請求項1又は2記載の光センサにおいて、上記基板と上記ベータ鉄シリサイド膜の間にFe拡散防止緩衝層が設けられていることを特徴とする光センサ。
- 請求項3記載の光センサにおいて、上記Fe拡散防止緩衝層はSiO2またはTiNを含むことを特徴とする光センサ。
- 請求項1又は2記載の光センサにおいて、上記ベータ鉄シリサイド膜と反対側の上記基板の面に無反射誘電体膜が設けられていることを特徴とする光センサ。
- 請求項5記載の光センサにおいて、上記無反射誘電体膜はZn(S,O)、SiO2、ITO膜またはこれら薄膜を組み合わせた多層膜を含むことを特徴とする光センサ。
- ケイ素(Si)基板と該基板上に形成されたベータ鉄シリサイド(β-FeSi2)膜と該ベータ鉄シリサイド膜上に形成されたケイ素(Si)膜とを有する光センサ。
- 請求項7記載の光センサにおいて、上記ベータ鉄シリサイド膜と上記ケイ素(Si)膜の間にFe拡散防止緩衝層が設けられていることを特徴とする光センサ。
- 請求項8記載の光センサにおいて、上記Fe拡散防止緩衝層はSiO2またはTiNを含むことを特徴とする光センサ。
- 請求項7記載の光センサにおいて、上記ケイ素(Si)膜の上に無反射誘電体膜が設けられていることを特徴とする光センサ。
- 請求項10記載の光センサにおいて、上記無反射誘電体膜はZn(S,O)、SiO2、ITO膜またはこれら薄膜を組み合わせた多層膜を含むことを特徴とする光センサ。
- ケイ素(Si)基板と該基板上に形成された第1のベータ鉄シリサイド(β-FeSi2)膜と該第1のベータ鉄シリサイド(β-FeSi2)膜の上に設けられた第2のベータ鉄シリサイド(β-FeSi2)膜とを有し、上記基板と上記第1のベータ鉄シリサイド(β-FeSi2)膜の間及び上記基板と上記第2のベータ鉄シリサイド(β-FeSi2)膜の間には、それぞれn−型/p−型接合面又はp−型/n−型接合面が形成されていることを特徴とする光センサ。
- 請求項12記載の光センサにおいて、上記第1及び第2のベータ鉄シリサイド膜と反対側の上記基板の面にZn(S,O)からなる層が設けられていることを特徴とする光センサ。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003367771A JP2005135993A (ja) | 2003-10-28 | 2003-10-28 | 光センサ |
DE102004052858A DE102004052858A1 (de) | 2003-10-28 | 2004-10-26 | Optischer Sensor |
US10/973,251 US7235304B2 (en) | 2003-10-28 | 2004-10-27 | Optical sensor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003367771A JP2005135993A (ja) | 2003-10-28 | 2003-10-28 | 光センサ |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2005135993A true JP2005135993A (ja) | 2005-05-26 |
Family
ID=34510311
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003367771A Pending JP2005135993A (ja) | 2003-10-28 | 2003-10-28 | 光センサ |
Country Status (3)
Country | Link |
---|---|
US (1) | US7235304B2 (ja) |
JP (1) | JP2005135993A (ja) |
DE (1) | DE102004052858A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101191481B1 (ko) | 2011-03-24 | 2012-10-15 | 성균관대학교산학협력단 | 금속산화물 나노구조체를 구비한 투명 자외선 센서 및 이를 응용한 화재경보장치 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8614396B2 (en) * | 2007-09-28 | 2013-12-24 | Stion Corporation | Method and material for purifying iron disilicide for photovoltaic application |
US8058092B2 (en) * | 2007-09-28 | 2011-11-15 | Stion Corporation | Method and material for processing iron disilicide for photovoltaic application |
WO2019018039A2 (en) * | 2017-04-20 | 2019-01-24 | The Trustees Of Dartmouth College | HOT NANOPHOTONIC ELECTRON ELECTRON DEVICES FOR INFRARED LIGHT DETECTION |
Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5517461A (en) * | 1978-07-24 | 1980-02-06 | Sharp Corp | Wavelength detector using photo semiconductor device |
JPS61115355A (ja) * | 1984-11-12 | 1986-06-02 | Toshiba Corp | 受光装置 |
JPS61182271A (ja) * | 1985-02-08 | 1986-08-14 | Toshiba Corp | 半導体受光素子 |
JPH07169735A (ja) * | 1993-12-13 | 1995-07-04 | Nec Corp | 半導体装置の製造方法 |
JPH1070302A (ja) * | 1996-08-26 | 1998-03-10 | Fuji Xerox Co Ltd | 半導体受光素子及びその製造方法 |
JPH11330535A (ja) * | 1998-03-11 | 1999-11-30 | Seiko Epson Corp | フォトダイオードおよび光通信システム |
JP2000261026A (ja) * | 1999-03-05 | 2000-09-22 | Hitachi Ltd | 光伝送受信機 |
JP2001502477A (ja) * | 1996-10-24 | 2001-02-20 | ユニバーシティ オブ サリー | 光電式半導体デバイス |
JP2001102641A (ja) * | 1999-09-29 | 2001-04-13 | Agency Of Ind Science & Technol | 半導体デバイスおよびその製造方法 |
JP2002043644A (ja) * | 2000-07-24 | 2002-02-08 | Matsushita Electric Ind Co Ltd | 薄膜圧電素子 |
JP2002057368A (ja) * | 2000-03-24 | 2002-02-22 | Mitsubishi Materials Corp | 光材料及びこれを用いた光素子 |
JP2002170983A (ja) * | 2000-11-30 | 2002-06-14 | Nec Corp | 受光半導体デバイス |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
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US4782377A (en) * | 1986-09-30 | 1988-11-01 | Colorado State University Research Foundation | Semiconducting metal silicide radiation detectors and source |
DE4136511C2 (de) | 1991-11-06 | 1995-06-08 | Forschungszentrum Juelich Gmbh | Verfahren zur Herstellung einer Si/FeSi¶2¶-Heterostruktur |
DE19503641A1 (de) * | 1995-02-06 | 1996-08-08 | Forschungszentrum Juelich Gmbh | Schichtstruktur mit einer Silicid-Schicht, sowie Verfahren zur Herstellung einer solchen Schichtstruktur |
JP3914350B2 (ja) * | 1999-04-27 | 2007-05-16 | 日本オプネクスト株式会社 | 半導体レーザ装置 |
JP2001230443A (ja) | 2000-02-16 | 2001-08-24 | Fujitsu Ltd | 光半導体装置 |
JP4193384B2 (ja) * | 2001-07-30 | 2008-12-10 | 株式会社Sumco | 鉄シリサイド層を有した半導体基板及び光半導体装置並びにこれらの製造方法 |
JP3979115B2 (ja) * | 2002-02-13 | 2007-09-19 | 三菱マテリアル株式会社 | 鉄シリサイド層の製造方法並びに半導体基板及び光半導体装置 |
JP4143324B2 (ja) * | 2002-04-25 | 2008-09-03 | キヤノン株式会社 | 発光素子、光電子集積装置、電気機器、及び光伝送システム |
-
2003
- 2003-10-28 JP JP2003367771A patent/JP2005135993A/ja active Pending
-
2004
- 2004-10-26 DE DE102004052858A patent/DE102004052858A1/de not_active Withdrawn
- 2004-10-27 US US10/973,251 patent/US7235304B2/en not_active Expired - Fee Related
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5517461A (en) * | 1978-07-24 | 1980-02-06 | Sharp Corp | Wavelength detector using photo semiconductor device |
JPS61115355A (ja) * | 1984-11-12 | 1986-06-02 | Toshiba Corp | 受光装置 |
JPS61182271A (ja) * | 1985-02-08 | 1986-08-14 | Toshiba Corp | 半導体受光素子 |
JPH07169735A (ja) * | 1993-12-13 | 1995-07-04 | Nec Corp | 半導体装置の製造方法 |
JPH1070302A (ja) * | 1996-08-26 | 1998-03-10 | Fuji Xerox Co Ltd | 半導体受光素子及びその製造方法 |
JP2001502477A (ja) * | 1996-10-24 | 2001-02-20 | ユニバーシティ オブ サリー | 光電式半導体デバイス |
JPH11330535A (ja) * | 1998-03-11 | 1999-11-30 | Seiko Epson Corp | フォトダイオードおよび光通信システム |
JP2000261026A (ja) * | 1999-03-05 | 2000-09-22 | Hitachi Ltd | 光伝送受信機 |
JP2001102641A (ja) * | 1999-09-29 | 2001-04-13 | Agency Of Ind Science & Technol | 半導体デバイスおよびその製造方法 |
JP2002057368A (ja) * | 2000-03-24 | 2002-02-22 | Mitsubishi Materials Corp | 光材料及びこれを用いた光素子 |
JP2002043644A (ja) * | 2000-07-24 | 2002-02-08 | Matsushita Electric Ind Co Ltd | 薄膜圧電素子 |
JP2002170983A (ja) * | 2000-11-30 | 2002-06-14 | Nec Corp | 受光半導体デバイス |
Non-Patent Citations (1)
Title |
---|
黒田涼 他: "β−FeSi2テンプレート層によるFeのSi基板中への拡散抑制効果", 応用物理学関係連合講演会講演予稿集, vol. 50, no. 3, JPN6008003742, March 2003 (2003-03-01), JP, pages 1455, ISSN: 0000970296 * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101191481B1 (ko) | 2011-03-24 | 2012-10-15 | 성균관대학교산학협력단 | 금속산화물 나노구조체를 구비한 투명 자외선 센서 및 이를 응용한 화재경보장치 |
Also Published As
Publication number | Publication date |
---|---|
US7235304B2 (en) | 2007-06-26 |
US20050087264A1 (en) | 2005-04-28 |
DE102004052858A1 (de) | 2005-08-18 |
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