JP2005112919A - 非粘着性水系コンフォーマルコーティング材 - Google Patents
非粘着性水系コンフォーマルコーティング材 Download PDFInfo
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- JP2005112919A JP2005112919A JP2003345953A JP2003345953A JP2005112919A JP 2005112919 A JP2005112919 A JP 2005112919A JP 2003345953 A JP2003345953 A JP 2003345953A JP 2003345953 A JP2003345953 A JP 2003345953A JP 2005112919 A JP2005112919 A JP 2005112919A
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- acrylic resin
- film
- acrylate
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000011248 coating agent Substances 0.000 title claims abstract description 30
- 238000000576 coating method Methods 0.000 title claims abstract description 29
- 239000004925 Acrylic resin Substances 0.000 claims abstract description 28
- 229920000178 Acrylic resin Polymers 0.000 claims abstract description 28
- 239000011347 resin Substances 0.000 claims abstract description 16
- 229920005989 resin Polymers 0.000 claims abstract description 16
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 11
- 230000009477 glass transition Effects 0.000 claims abstract description 7
- 239000000463 material Substances 0.000 claims description 21
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 229920000642 polymer Polymers 0.000 abstract description 4
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 abstract description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 19
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 18
- LXEKPEMOWBOYRF-UHFFFAOYSA-N [2-[(1-azaniumyl-1-imino-2-methylpropan-2-yl)diazenyl]-2-methylpropanimidoyl]azanium;dichloride Chemical compound Cl.Cl.NC(=N)C(C)(C)N=NC(C)(C)C(N)=N LXEKPEMOWBOYRF-UHFFFAOYSA-N 0.000 description 16
- 239000000839 emulsion Substances 0.000 description 12
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 10
- 238000009413 insulation Methods 0.000 description 10
- 238000006243 chemical reaction Methods 0.000 description 9
- 239000002904 solvent Substances 0.000 description 8
- -1 alkoxy acrylate Chemical compound 0.000 description 7
- 239000000178 monomer Substances 0.000 description 7
- 229920000578 graft copolymer Polymers 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- URYHQMZOXSKGRF-UHFFFAOYSA-N 2-(cyclopenten-1-yloxy)ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC1=CCCC1 URYHQMZOXSKGRF-UHFFFAOYSA-N 0.000 description 5
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 5
- 238000001816 cooling Methods 0.000 description 5
- 239000000344 soap Substances 0.000 description 5
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 4
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 4
- 206010040844 Skin exfoliation Diseases 0.000 description 4
- 235000011114 ammonium hydroxide Nutrition 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 239000000428 dust Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000004094 surface-active agent Substances 0.000 description 4
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 230000009257 reactivity Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 2
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 2
- 125000005250 alkyl acrylate group Chemical group 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 238000002845 discoloration Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000010559 graft polymerization reaction Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- DJKKWVGWYCKUFC-UHFFFAOYSA-N 2-butoxyethyl 2-methylprop-2-enoate Chemical compound CCCCOCCOC(=O)C(C)=C DJKKWVGWYCKUFC-UHFFFAOYSA-N 0.000 description 1
- PTJDGKYFJYEAOK-UHFFFAOYSA-N 2-butoxyethyl prop-2-enoate Chemical compound CCCCOCCOC(=O)C=C PTJDGKYFJYEAOK-UHFFFAOYSA-N 0.000 description 1
- SFPNZPQIIAJXGL-UHFFFAOYSA-N 2-ethoxyethyl 2-methylprop-2-enoate Chemical compound CCOCCOC(=O)C(C)=C SFPNZPQIIAJXGL-UHFFFAOYSA-N 0.000 description 1
- FWWXYLGCHHIKNY-UHFFFAOYSA-N 2-ethoxyethyl prop-2-enoate Chemical compound CCOCCOC(=O)C=C FWWXYLGCHHIKNY-UHFFFAOYSA-N 0.000 description 1
- WDQMWEYDKDCEHT-UHFFFAOYSA-N 2-ethylhexyl 2-methylprop-2-enoate Chemical compound CCCCC(CC)COC(=O)C(C)=C WDQMWEYDKDCEHT-UHFFFAOYSA-N 0.000 description 1
- YXYJVFYWCLAXHO-UHFFFAOYSA-N 2-methoxyethyl 2-methylprop-2-enoate Chemical compound COCCOC(=O)C(C)=C YXYJVFYWCLAXHO-UHFFFAOYSA-N 0.000 description 1
- HFCUBKYHMMPGBY-UHFFFAOYSA-N 2-methoxyethyl prop-2-enoate Chemical compound COCCOC(=O)C=C HFCUBKYHMMPGBY-UHFFFAOYSA-N 0.000 description 1
- CFVWNXQPGQOHRJ-UHFFFAOYSA-N 2-methylpropyl prop-2-enoate Chemical compound CC(C)COC(=O)C=C CFVWNXQPGQOHRJ-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- KXKVLQRXCPHEJC-UHFFFAOYSA-N acetic acid trimethyl ester Natural products COC(C)=O KXKVLQRXCPHEJC-UHFFFAOYSA-N 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 150000005215 alkyl ethers Chemical class 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000012736 aqueous medium Substances 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- OIWOHHBRDFKZNC-UHFFFAOYSA-N cyclohexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCCCC1 OIWOHHBRDFKZNC-UHFFFAOYSA-N 0.000 description 1
- KBLWLMPSVYBVDK-UHFFFAOYSA-N cyclohexyl prop-2-enoate Chemical compound C=CC(=O)OC1CCCCC1 KBLWLMPSVYBVDK-UHFFFAOYSA-N 0.000 description 1
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical class C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- LUCXVPAZUDVVBT-UHFFFAOYSA-N methyl-[3-(2-methylphenoxy)-3-phenylpropyl]azanium;chloride Chemical compound Cl.C=1C=CC=CC=1C(CCNC)OC1=CC=CC=C1C LUCXVPAZUDVVBT-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 231100000572 poisoning Toxicity 0.000 description 1
- 230000000607 poisoning effect Effects 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 229920002503 polyoxyethylene-polyoxypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F265/00—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00
- C08F265/04—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00 on to polymers of esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D151/00—Coating compositions based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Coating compositions based on derivatives of such polymers
- C09D151/003—Coating compositions based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Coating compositions based on derivatives of such polymers grafted on to macromolecular compounds obtained by reactions only involving unsaturated carbon-to-carbon bonds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Life Sciences & Earth Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Paints Or Removers (AREA)
- Graft Or Block Polymers (AREA)
- Laminated Bodies (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
【解決手段】ガラス転位温度が0℃以下の柔軟性アクリル樹脂を主骨格とし、ガラス転位温度が20℃以上であるビニル系重合体が、前記柔軟性アクリル樹脂にグラフト化しており、前記ビニル系重合体の含有量が、前記柔軟性アクリル樹脂に対して10〜70重量%である樹脂からなる非粘着性水系コンフォーマルコーティング材。
【選択図】なし
Description
アデカリアソープER−20(旭電化工業(株)製)20重量部(以下、部と略す)、ブチルアクリレート150部、ブチルメタクリレート150部、シクロペンテニルオキシエチルアクリレート16部、アクリル酸2部、V−50(和光純薬工業(株)製)1部をイオン交換水200部と共にホモミキサーにかけ、エマルジョンを得た。
アデカリアソープER−20 20部、ブチルアクリレート150部、ブチルメタクリレート150部、シクロペンテニルオキシエチルアクリレート16部、アクリル酸2部、V−50 1部をイオン交換水200部と共にホモミキサーにかけ、エマルジョンを得た。
アデカリアソープER−20 20部、ブチルアクリレート150部、ブチルメタクリレート150部、シクロペンテニルオキシエチルアクリレート16部、アクリル酸2部、V−50 1部をイオン交換水200部と共にホモミキサーにかけ、エマルジョンを得た。
アデカリアソープER−20 20部、ブチルアクリレート150部、ブチルメタクリレート150部、スチレン80部、シクロペンテニルオキシエチルアクリレート16部、アクリル酸2部、V−50 1部をイオン交換水200部と共にホモミキサーにかけ、エマルジョンを得た。
温度勾配試験機(テスター産業(株)製)で−10から50℃の温度傾斜を作り、コーティング剤を塗布、乾燥させて、硬化したときの下限温度を測定した。
試料をアプリケータ−で塗布し、厚さ80〜90μm程度のフィルムを作製し、型抜きした試験片を、万能引張圧縮試験機(ミネベア(株)製)により、引張強さ及び伸び率は、引張り速度100mm/分、ヤング率は、1mm/分の条件で、引張り強さ、伸び率、ヤング率を測定した。
JISII型くし形基板に試料を塗布し、90℃で30分乾燥後、絶縁抵抗値を高絶縁計(横河ヒューレットパッカード(株)製)にて、100Vの直流電圧を印加して測定した。
JISII型くし形基板に試料を塗布し、90℃で30分乾燥後、試験片を恒温恒湿度器(器内雰囲気85℃、85〜90%RH)に設置し、168時間経過後、絶縁抵抗値を高絶縁計(横河ヒューレットパッカード(株)製)にて、100Vの直流電圧を印加して測定した。
試料をガラス板に流し塗りし、90℃で30分間乾燥させた後の膜を、指触により、粘着性が感じられないものを○、やや粘着性が感じられるが、大きな膜変形が無いものを△、粘着性があるものを×として評価した。
JISII型くし形基板に形成された皮膜を、1mm巾クロスカット法(JISK5600−5−6に準拠)で試験し、剥離せずに残った枡目数を数値で示した。但し、カットする枡目の数は100である。
Claims (1)
- ガラス転位温度が0℃以下の柔軟性アクリル樹脂を主骨格とし、ガラス転位温度が20℃以上であるビニル系重合体が、前記柔軟性アクリル樹脂にグラフト化しており、前記ビニル系重合体の含有量が、前記柔軟性アクリル樹脂に対して10〜70重量%である樹脂からなる非粘着性水系コンフォーマルコーティング材。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003345953A JP4733919B2 (ja) | 2003-10-03 | 2003-10-03 | 非粘着性水系コンフォーマルコーティング材 |
US10/954,273 US20050075459A1 (en) | 2003-10-03 | 2004-10-01 | Non-sticky water-based conformal coating material |
CN200410080721.4A CN1613932B (zh) | 2003-10-03 | 2004-10-08 | 非粘着性水型保形涂料 |
US11/399,468 US7642325B2 (en) | 2003-10-03 | 2006-04-07 | Non-sticky water-based conformal coating material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003345953A JP4733919B2 (ja) | 2003-10-03 | 2003-10-03 | 非粘着性水系コンフォーマルコーティング材 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005112919A true JP2005112919A (ja) | 2005-04-28 |
JP4733919B2 JP4733919B2 (ja) | 2011-07-27 |
Family
ID=34386355
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003345953A Expired - Fee Related JP4733919B2 (ja) | 2003-10-03 | 2003-10-03 | 非粘着性水系コンフォーマルコーティング材 |
Country Status (3)
Country | Link |
---|---|
US (2) | US20050075459A1 (ja) |
JP (1) | JP4733919B2 (ja) |
CN (1) | CN1613932B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007154005A (ja) * | 2005-12-02 | 2007-06-21 | Somar Corp | 水性防湿絶縁用コート剤 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012115011A1 (ja) * | 2011-02-25 | 2012-08-30 | 昭和電工株式会社 | 防湿絶縁材料 |
CN102595771B (zh) * | 2012-01-11 | 2015-07-01 | 深圳创维数字技术有限公司 | 一种具有保护层的纸基印刷电路板及其制备方法 |
WO2014009765A1 (en) * | 2012-07-11 | 2014-01-16 | Omnova Solutions | Rheological agent, preparation methods and uses thereof |
CN114630018A (zh) * | 2020-12-14 | 2022-06-14 | 晋城三赢精密电子有限公司 | 镜头模组及电子装置 |
WO2023200993A1 (en) * | 2022-04-13 | 2023-10-19 | Actnano, Inc. | Conformal coating with low volatile organic compound content |
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JPS50143828A (ja) * | 1974-05-09 | 1975-11-19 | ||
JPS63117021A (ja) * | 1986-11-05 | 1988-05-21 | Dainippon Ink & Chem Inc | 非造膜性重合体エマルジヨンの製造方法 |
JPH02284977A (ja) * | 1989-03-16 | 1990-11-22 | Roehm Gmbh | 水性プラスチツク分散液、その製法、非ブロツク性被膜製造用の被覆剤、皮革の被覆法及び屋外用塗料 |
JPH08208779A (ja) * | 1994-11-04 | 1996-08-13 | Basf Ag | 水溶性ポリマー乳濁液、ポリマー、接着剤、被覆材料、含浸材料、水性着色剤配合物、水性塗料、含浸配合物および接着剤配合物、塗布されたか、含浸されたか、または接着された支持体、ならびに水性ポリマー乳濁液の製造法 |
JP2002012816A (ja) * | 2000-06-30 | 2002-01-15 | Nippon Paint Co Ltd | 水性塗料組成物 |
WO2002022691A2 (en) * | 2000-09-14 | 2002-03-21 | Rohm And Haas Company | Segmental copolymers and aqueous dispersions and films therefrom |
JP2002225491A (ja) * | 2001-01-31 | 2002-08-14 | Pentel Corp | 筆記具 |
JP2003096148A (ja) * | 2001-09-27 | 2003-04-03 | Dainippon Ink & Chem Inc | 重合体水性分散液およびその製造方法 |
JP2003226835A (ja) * | 2002-02-07 | 2003-08-15 | Kansai Paint Co Ltd | 上塗り塗料組成物 |
JP2004059622A (ja) * | 2002-07-25 | 2004-02-26 | Kansai Paint Co Ltd | 水性塗料組成物 |
Family Cites Families (8)
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BE622280A (ja) * | 1965-08-17 | |||
US3973321A (en) * | 1974-09-10 | 1976-08-10 | The Anaconda Company | Method of preparing circuit boards comprising inductors |
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Also Published As
Publication number | Publication date |
---|---|
US20050075459A1 (en) | 2005-04-07 |
US7642325B2 (en) | 2010-01-05 |
JP4733919B2 (ja) | 2011-07-27 |
US20060178479A1 (en) | 2006-08-10 |
CN1613932A (zh) | 2005-05-11 |
CN1613932B (zh) | 2011-10-19 |
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