US20050075459A1 - Non-sticky water-based conformal coating material - Google Patents

Non-sticky water-based conformal coating material Download PDF

Info

Publication number
US20050075459A1
US20050075459A1 US10/954,273 US95427304A US2005075459A1 US 20050075459 A1 US20050075459 A1 US 20050075459A1 US 95427304 A US95427304 A US 95427304A US 2005075459 A1 US2005075459 A1 US 2005075459A1
Authority
US
United States
Prior art keywords
acrylic resin
coating material
parts
acrylate
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US10/954,273
Inventor
Masashi Hashimoto
Hideo Maeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tohpe Corp
Original Assignee
Tohpe Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tohpe Corp filed Critical Tohpe Corp
Assigned to TOHPE CORPORATION reassignment TOHPE CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HASHIMOTO, MASASHI, MAEDA, HIDEO
Publication of US20050075459A1 publication Critical patent/US20050075459A1/en
Priority to US11/399,468 priority Critical patent/US7642325B2/en
Abandoned legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/285Permanent coating compositions
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F265/00Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00
    • C08F265/04Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00 on to polymers of esters
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D151/00Coating compositions based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Coating compositions based on derivatives of such polymers
    • C09D151/003Coating compositions based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Coating compositions based on derivatives of such polymers grafted on to macromolecular compounds obtained by reactions only involving unsaturated carbon-to-carbon bonds
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/284Applying non-metallic protective coatings for encapsulating mounted components

Definitions

  • the present invention relates to a conformal coating material (hereinafter referred to as coating material) that forms an insulating moisture-proof membrane, in which cracking and peeling from the substrate tend not to occur and which does not apply excessive stress to the lead pin of electronic parts.
  • coating material a conformal coating material that forms an insulating moisture-proof membrane, in which cracking and peeling from the substrate tend not to occur and which does not apply excessive stress to the lead pin of electronic parts.
  • circuit boards loaded with electronic parts have come to be used in household electric products and automobiles. Also, solvent coating materials having moisture resistance and insulating properties have come to be applied, in order to protect circuit boards from sudden temperature change, humidity, water and dust.
  • water-based coating materials that do not contain a solvent have been considered.
  • coating materials contain 5 to 10% of a solvent.
  • Young's modulus when the Young's modulus is low, the membrane remains sticky and problems occur, such as adhesion of dirt and blocking when handling.
  • coating materials having less stickiness are not sufficient, as these have large Young's modulus and apply large load to the substrate. As a result, peeling of solder and deformation of the lead pin may occur, due to expansion and contraction of the membrane caused by increase and decrease in the environmental temperature.
  • the present invention aims to provide a non-sticky water-based coating material that solves the above problems and forms a membrane having favorable adhesive properties, moisture resistance and insulating properties.
  • Tg hard resin having high glass transition temperature
  • the present invention relates to a non-sticky water-based conformal coating material comprising a resin wherein a flexible acrylic resin having glass transition temperature of at most 0° C. is the main chain and a vinyl polymer having a glass transition temperature of at least 20° C. is grafted to the flexible acrylic resin; the content of the vinyl polymer being 10 to 70% by weight based on the flexible acrylic resin.
  • the coating material of the present invention is a conformal coating material that is applied to the face of a circuit board that is loaded with electronic parts, which comes into contact with the outside environment.
  • conformal coating refers to a coating for providing moisture resistance and insulation of a circuit board.
  • the coating material can be formed into a film at room temperature without using a coalescence, because the acrylic resin that composes the main chain has low Tg of at most 0° C. Also, the coating material does not cause peeling of solder and deformation of the lead pin of the substrate due to expansion and contraction when heating or cooling, as the membrane obtained therefrom is flexible and has low Young's modulus and small contraction stress after being formed into a film.
  • the upper limit of Tg of the above acrylic resin is 0° C., preferably ⁇ 5° C. and the lower limit is preferably ⁇ 55° C., more preferably ⁇ 35° C. When Tg is higher than 0° C., film-forming properties are poor and flexibility decreases when applied under low temperatures.
  • a coating material obtained by graft polymerizing monomers that form a vinyl polymer (hard resin) having high Tg of at least 20° C. and excellent water resistance does not have the surface stickiness of flexible resin, does not collect dust and exhibits excellent moisture resistance.
  • the upper limit of Tg of the above vinyl polymer is preferably 150° C., more preferably 120° C. and the lower limit is 20° C., preferably 50° C.
  • Tg is lower than 20° C., controlling the stickiness of the membrane surface is difficult and dust may adhere.
  • the non-sticky water-based coating material of the present invention is obtained by first, polymerizing the flexible acrylic monomer in a water-based medium and then, graft polymerizing a monomer that forms hard resin with the flexible acrylic resin, in an amount that is suitable depending on the composition of the acrylic resin.
  • the non-sticky water-based coating material can be formed into a film at room temperature without using a coalescence and the film obtained therefrom is flexible, has low Young's modulus and is excellent in insulating properties and moisture resistance. Usually, when stickiness is improved, that is stickiness is decreased, the Young's modulus becomes extremely high and high stress is applied to solder of the substrate and lead pins.
  • polymers of at least one kind of alkyl acrylate or alkoxy acrylate or copolymers composed mainly of these monomers, to which other acrylate or vinyl monomers having high Tg, within the range that Tg is at most 0° C., are copolymerized, can be used.
  • Examples of the other acrylate or vinyl monomer having high Tg are methyl methacrylate, ethyl methacrylate, butyl methacrylate, tertial butyl methacrylate, cyclohexyl methacrylate, cyclohexyl acrylate, 2-ethylhexyl methacrylate, methoxyethyl methacrylate, ethoxyethyl methacrylate and butoxyethyl methacrylate.
  • Tg at most 0° C.
  • acrylate containing an unsaturated group can be used, such as dicyclopentenyl (meth)acrylate, cyclopentenyloxyethyl (meth)acrylate and dihydrodicyclopentenyl (meth)acrylate.
  • dicyclopentenyl (meth)acrylate cyclopentenyloxyethyl (meth)acrylate
  • dihydrodicyclopentenyl (meth)acrylate dicyclopentenyloxyethyl (meth)acrylate
  • cyclopentenyloxyethyl acrylate is preferable.
  • the amount of the grafting agent is preferably 1 to 10% by weight based on the flexible acrylic resin.
  • the amount of the grafting agent is less than 1% by weight based on the flexible acrylic resin, the number of graft sites is too small and stickiness may remain.
  • the amount is more than 10% by weight, the properties of the membrane tend to degrade.
  • Examples of the monomer that graft polymerizes with the flexible acrylic resin and forms hard resin are styrene, ⁇ -methylstyrene, methyl methacrylate, butyl methacrylate, tertial butyl methacrylate, acrylonitirile, methacrylonitrile, cyclohexyl methacrylate and cyclohexylacrylate. Of these, in view of water resistance, weather resistance and thermal discoloring resistance, styrene is preferable.
  • the content of hard resin is 10 to 70% by weight based on the flexible acrylic resin and can be suitably selected within the above range, according to the composition of the flexible acrylic resin and hard resin which are to be combined. More preferably, the content is 20 to 50% by weight. When the content is less than 10% by weight, surface stickiness remains and when the content is more than 70% by weight, film-forming properties are poor and cracks tend to develop in the membrane surface.
  • aqueous azo compounds can be used, such as V-30, V-50, VA-545, VA546, VA041 and VA-044 (all available from Wako Pure Chemical Industries, Ltd.). From the viewpoint of reactivity and storage stability, V-50 is preferable.
  • a surfactant When conducting polymerization, a surfactant is used.
  • the surfactant common surfactants such as polyoxyethylene alkyl ether, polyoxyethylene styrenated phenyl ether and polyoxyethylene polyoxypropylene block polymer can be used.
  • a reactive surfactant is preferable.
  • ADEKA REASOAP ER-10, ER-20, ER-30 and ER-40 are preferable.
  • the conformal coating material of the present invention can contain other components such as water, a defoaming agent, a thickener and a leveling agent.
  • ADEKA REASOAP ER-20 20 parts by weight (hereinafter referred to as parts) of ADEKA REASOAP ER-20 (available from Asahi Denka Co., Ltd.), 150 parts of butyl acrylate, 150 parts of butyl methacrylate, 16 parts of cyclopentenyloxyethyl acrylate, 2 parts of acrylic acid, 1 part of V-50 (available from Wako Pure Chemical Industries, Inc.) and 200 parts of deionized water were processed in a homomixer to obtain an emulsion.
  • parts 20 parts by weight (hereinafter referred to as parts) of ADEKA REASOAP ER-20 (available from Asahi Denka Co., Ltd.), 150 parts of butyl acrylate, 150 parts of butyl methacrylate, 16 parts of cyclopentenyloxyethyl acrylate, 2 parts of acrylic acid, 1 part of V-50 (available from Wako Pure Chemical Industries, Inc.) and 200 parts of deionized water were
  • a colben was charged with 350 parts of deionized water and after the temperature was adjusted to 70° C., 10% of the above emulsion was added to start the reaction. Thereafter, the temperature was adjusted to 80° C. and the rest of the emulsion was dropped over 120 minutes.
  • the Tg of the obtained acrylic resin was ⁇ 19° C.
  • the temperature was maintained at 80° C.
  • 0.2 part of V-50 was added and reaction was conducted while dropping 80 parts of styrene over 60 minutes.
  • the temperature was maintained at 80° C. for 60 minutes to finish the reaction and after cooling, the pH was adjusted with 1 part of 28% ammonium water and 34.8 parts of deionized water to obtain a graft copolymer.
  • the styrene resin content of the obtained graft copolymer was 25.2% by weight based on the acrylic resin.
  • the Tg of polystyrene was 100° C.
  • a colben was charged with 350 parts of deionized water and after the temperature was adjusted to 70° C., 10% of the above emulsion was added to start the reaction. Thereafter, the temperature was adjusted to 80° C. and the rest of the emulsion was dropped over 120 minutes.
  • the Tg of the obtained acrylic resin was ⁇ 19° C.
  • the temperature was maintained at 80° C. Then, 0.2 part of V-50 was added and reaction was conducted while dropping 40 parts of styrene over 60 minutes. The temperature was maintained at 80° C. for 60 minutes to finish the reaction and after cooling, the pH was adjusted with 1 part of 28% ammonium water and 34.8 parts of deionized water to obtain a graft copolymer.
  • the styrene resin content of the obtained graft copolymer was 12.6% by weight based on the acrylic resin.
  • a colben was charged with 350 parts of deionized water and after the temperature was adjusted to 70° C., 10% of the above emulsion was added to start the reaction. Thereafter, the temperature was adjusted to 80° C. and the rest of the emulsion was dropped over 120 minutes.
  • the Tg of the obtained acrylic resin was ⁇ 19° C.
  • the temperature was maintained at 80° C. Then, 0.2 part of V-50 was added and reaction was conducted while dropping 160 parts of styrene over 60 minutes. The temperature was maintained at 80° C. for 60 minutes to finish the reaction and after cooling, the pH was adjusted with 1 part of 28% ammonium water and 34.8 parts of deionized water to obtain a graft copolymer.
  • the styrene resin content of the obtained graft copolymer was 50.3% by weight based on the acrylic resin.
  • ADEKA REASOAP ER-20 20 parts of ADEKA REASOAP ER-20, 150 parts of butyl acrylate, 150 parts of butyl methacrylate, 80 parts of styrene, 16 parts of cyclopentenyloxyethyl acrylate, 2 parts of acrylic acid, 1 part of V-50 and 200 parts of deionized water were processed in a homomixer to obtain an emulsion.
  • a colben was charged with 350 parts of deionized water and after the temperature was adjusted to 70° C., 10% of the above emulsion was added to start the reaction. Thereafter, the temperature was adjusted to 80° C. and the rest of the emulsion was dropped over 150 minutes. The temperature was maintained at 80° C. for 60 minutes to finish the reaction and after cooling, the pH was adjusted with 1 part of 28% ammonium water and 30 parts of deionized water to obtain a random copolymer.
  • the cured membranes obtained using the above copolymers were evaluated in the following manner. Unless indicated otherwise, measurement was conducted under an environment of 23° C. and 50% RH.
  • the coating material was tested in the range of ⁇ 10 to 50° C. by a temperature gradient testing machine (made by Tester Sangyo Co., Ltd.) and the minimum temperature at which a normal film is formed was measured.
  • the sample was applied by an applicator to prepare a film having thickness of 80 to 90 ⁇ m.
  • Tensile strength, elongation and Young's modulus of a die-cut specimen were measured using an all-purpose tensile and compression testing machine (made by Minebea Co., Ltd.), under the conditions of pulling speed rate of 100 mm/minute for tensile strength and elongation and 1 mm/minute for Young's modulus.
  • the sample was applied to JIS II model comb-type substrate and after drying for 30 minutes at 90° C., the insulation resistance was measured by applying DC.100 V using a high-resistance tester (made by Yokogawa Hewlett Packard, Ltd.).
  • the sample was applied to JIS II model comb-type substrate and dried for 30 minutes at 90° C.
  • the specimen was placed in a constant temperature and humidity chamber (atmosphere inside chamber: 85° C., 85 to 90% RH) and after 168 hours, the insulation resistance was measured by applying DC.100 V using a high-insulation measuring machine (made by Yokogawa Hewlett Packard, Ltd.).
  • the sample was flow-coated on a glass board and dried for 30 minutes at 90° C. to obtain a membrane.
  • the membrane was evaluated by touch as ⁇ when the membrane did not feel sticky, ⁇ when the membrane felt somewhat sticky but was not largely distorted and X when the membrane felt sticky.
  • the membrane formed on the JIS II model comb-type substrate was tested by the 1 mm spacing cross-cut test method (according o JIS K5600-5-6) and the number of remaining squares that were not flaked was represented in a number value. The number of squares that were cut was 100.
  • the coating material of the present invention can be formed into a film at room temperature without using a coalescence, does not contain a solvent and forms a membrane having flexibility, low Young's modulus, favorable adhesive properties, moisture resistance and insulating properties.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Paints Or Removers (AREA)
  • Graft Or Block Polymers (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Laminated Bodies (AREA)

Abstract

The present invention provides a non-sticky water-based coating material, which can be formed into a film at room temperature without using a coalescence, does not contain a solvent and forms a membrane having flexibility, low Young's modulus, favorable adhesive properties, moisture resistance and insulating properties. Specifically, the present invention relates to a non-sticky water-based conformal coating material comprising a resin wherein a flexible acrylic resin having glass transition temperature of at most 0° C. is the main chain and a vinyl polymer having a glass transition temperature of at least 20° C. is grafted to the flexible acrylic resin; the content of the vinyl polymer being 10 to 70% by weight based on the flexible acrylic resin.

Description

    BACKGROUND OF THE INVENTION
  • The present invention relates to a conformal coating material (hereinafter referred to as coating material) that forms an insulating moisture-proof membrane, in which cracking and peeling from the substrate tend not to occur and which does not apply excessive stress to the lead pin of electronic parts.
  • Due to widespread use of computers, circuit boards loaded with electronic parts have come to be used in household electric products and automobiles. Also, solvent coating materials having moisture resistance and insulating properties have come to be applied, in order to protect circuit boards from sudden temperature change, humidity, water and dust.
  • In recent years, along with increase in social awareness regarding environmental problems, a coating material has been developed, in which ethyl acetate, methyl acetate and butyl acetate are used instead of aromatic hydrocarbon solvents such as toluene and xylene, which are high in toxicity (see JP-A-2002-146266). However, this coating material lets out a great deal of solvent when applied and therefore, has many problems such as danger of fire, foul odor generated by the evaporated solvent and health management of workers to poisoning. Furthermore, depending on the locational conditions of the working area, measures against the Foul Smell Control Law may become necessary.
  • Also, water-based coating materials that do not contain a solvent have been considered. However, because film-forming properties and durability of the coating film are not sufficient, at present, coating materials contain 5 to 10% of a solvent. In such water-based coating materials containing a solvent, when the Young's modulus is low, the membrane remains sticky and problems occur, such as adhesion of dirt and blocking when handling. Also, coating materials having less stickiness are not sufficient, as these have large Young's modulus and apply large load to the substrate. As a result, peeling of solder and deformation of the lead pin may occur, due to expansion and contraction of the membrane caused by increase and decrease in the environmental temperature.
  • SUMMARY OF THE INVENTION
  • The present invention aims to provide a non-sticky water-based coating material that solves the above problems and forms a membrane having favorable adhesive properties, moisture resistance and insulating properties.
  • As a result of intensive studies to solve the above problems, by grafting a hard resin having high glass transition temperature (hereinafter referred to as Tg) to an acrylic resin main chain having low Tg and high flexibility, a non-sticky water-based coating material, which does not contain a solvent and has small Young's modulus and large insulation resistance, has been successfully developed.
  • That is, the present invention relates to a non-sticky water-based conformal coating material comprising a resin wherein a flexible acrylic resin having glass transition temperature of at most 0° C. is the main chain and a vinyl polymer having a glass transition temperature of at least 20° C. is grafted to the flexible acrylic resin; the content of the vinyl polymer being 10 to 70% by weight based on the flexible acrylic resin.
  • DETAILED DESCRIPTION
  • The coating material of the present invention is a conformal coating material that is applied to the face of a circuit board that is loaded with electronic parts, which comes into contact with the outside environment. Herein, conformal coating refers to a coating for providing moisture resistance and insulation of a circuit board.
  • The coating material can be formed into a film at room temperature without using a coalescence, because the acrylic resin that composes the main chain has low Tg of at most 0° C. Also, the coating material does not cause peeling of solder and deformation of the lead pin of the substrate due to expansion and contraction when heating or cooling, as the membrane obtained therefrom is flexible and has low Young's modulus and small contraction stress after being formed into a film. The upper limit of Tg of the above acrylic resin is 0° C., preferably −5° C. and the lower limit is preferably −55° C., more preferably −35° C. When Tg is higher than 0° C., film-forming properties are poor and flexibility decreases when applied under low temperatures.
  • Also, a coating material obtained by graft polymerizing monomers that form a vinyl polymer (hard resin) having high Tg of at least 20° C. and excellent water resistance does not have the surface stickiness of flexible resin, does not collect dust and exhibits excellent moisture resistance.
  • The upper limit of Tg of the above vinyl polymer is preferably 150° C., more preferably 120° C. and the lower limit is 20° C., preferably 50° C. When Tg is lower than 20° C., controlling the stickiness of the membrane surface is difficult and dust may adhere.
  • The non-sticky water-based coating material of the present invention is obtained by first, polymerizing the flexible acrylic monomer in a water-based medium and then, graft polymerizing a monomer that forms hard resin with the flexible acrylic resin, in an amount that is suitable depending on the composition of the acrylic resin. The non-sticky water-based coating material can be formed into a film at room temperature without using a coalescence and the film obtained therefrom is flexible, has low Young's modulus and is excellent in insulating properties and moisture resistance. Usually, when stickiness is improved, that is stickiness is decreased, the Young's modulus becomes extremely high and high stress is applied to solder of the substrate and lead pins.
  • As the flexible acrylic resin, polymers of at least one kind of alkyl acrylate or alkoxy acrylate or copolymers composed mainly of these monomers, to which other acrylate or vinyl monomers having high Tg, within the range that Tg is at most 0° C., are copolymerized, can be used. Specific examples are methyl acrylate, ethyl acrylate, propyl acrylate, butyl acrylate, pentyl acrylate, hexyl acrylate, 2-ethylhexyl acrylate, octyl acrylate, nonyl acrylate, decyl acrylate, isobutyl acrylate, isomyristyl acrylate, lauryl acrylate, methoxyethyl acrylate, ethoxyethyl acrylate, butoxyethyl acrylate and ethoxypropyl acrylate. Examples of the other acrylate or vinyl monomer having high Tg are methyl methacrylate, ethyl methacrylate, butyl methacrylate, tertial butyl methacrylate, cyclohexyl methacrylate, cyclohexyl acrylate, 2-ethylhexyl methacrylate, methoxyethyl methacrylate, ethoxyethyl methacrylate and butoxyethyl methacrylate. Of these, from the viewpoints of reactivity, storage stability and weather resistance, a system in which alkyl acrylate is the main component and alkyl methacrylate is added, with Tg of at most 0° C., is preferable.
  • As a grafting agent, acrylate containing an unsaturated group can be used, such as dicyclopentenyl (meth)acrylate, cyclopentenyloxyethyl (meth)acrylate and dihydrodicyclopentenyl (meth)acrylate. Of these, in view of reactivity and graft efficiency, cyclopentenyloxyethyl acrylate is preferable.
  • The amount of the grafting agent is preferably 1 to 10% by weight based on the flexible acrylic resin. When the amount of the grafting agent is less than 1% by weight based on the flexible acrylic resin, the number of graft sites is too small and stickiness may remain. When the amount is more than 10% by weight, the properties of the membrane tend to degrade.
  • Examples of the monomer that graft polymerizes with the flexible acrylic resin and forms hard resin are styrene, α-methylstyrene, methyl methacrylate, butyl methacrylate, tertial butyl methacrylate, acrylonitirile, methacrylonitrile, cyclohexyl methacrylate and cyclohexylacrylate. Of these, in view of water resistance, weather resistance and thermal discoloring resistance, styrene is preferable.
  • The content of hard resin is 10 to 70% by weight based on the flexible acrylic resin and can be suitably selected within the above range, according to the composition of the flexible acrylic resin and hard resin which are to be combined. More preferably, the content is 20 to 50% by weight. When the content is less than 10% by weight, surface stickiness remains and when the content is more than 70% by weight, film-forming properties are poor and cracks tend to develop in the membrane surface.
  • As the polymerization initiator, aqueous azo compounds can be used, such as V-30, V-50, VA-545, VA546, VA041 and VA-044 (all available from Wako Pure Chemical Industries, Ltd.). From the viewpoint of reactivity and storage stability, V-50 is preferable.
  • When conducting polymerization, a surfactant is used. As the surfactant, common surfactants such as polyoxyethylene alkyl ether, polyoxyethylene styrenated phenyl ether and polyoxyethylene polyoxypropylene block polymer can be used. However, from the viewpoint that water resistance is excellent and the surfactant does not bleed to the membrane surface, a reactive surfactant is preferable. Particularly, in view of polymerization stability and thermal discoloring resistance, ADEKA REASOAP ER-10, ER-20, ER-30 and ER-40 (all available from Asahi Denka Co., Ltd.) are preferable.
  • Besides the acrylic resin to which vinyl polymers are grafted, the conformal coating material of the present invention can contain other components such as water, a defoaming agent, a thickener and a leveling agent.
  • Hereinafter, the coating material of the present invention is explained by means of Examples.
  • EXAMPLE 1
  • 20 parts by weight (hereinafter referred to as parts) of ADEKA REASOAP ER-20 (available from Asahi Denka Co., Ltd.), 150 parts of butyl acrylate, 150 parts of butyl methacrylate, 16 parts of cyclopentenyloxyethyl acrylate, 2 parts of acrylic acid, 1 part of V-50 (available from Wako Pure Chemical Industries, Inc.) and 200 parts of deionized water were processed in a homomixer to obtain an emulsion.
  • A colben was charged with 350 parts of deionized water and after the temperature was adjusted to 70° C., 10% of the above emulsion was added to start the reaction. Thereafter, the temperature was adjusted to 80° C. and the rest of the emulsion was dropped over 120 minutes. The Tg of the obtained acrylic resin was −19° C.
  • For 30 minutes after dropping, the temperature was maintained at 80° C. Then, 0.2 part of V-50 was added and reaction was conducted while dropping 80 parts of styrene over 60 minutes. The temperature was maintained at 80° C. for 60 minutes to finish the reaction and after cooling, the pH was adjusted with 1 part of 28% ammonium water and 34.8 parts of deionized water to obtain a graft copolymer. The styrene resin content of the obtained graft copolymer was 25.2% by weight based on the acrylic resin. The Tg of polystyrene was 100° C.
  • EXAMPLE 2
  • 20 parts of ADEKA REASOAP ER-20, 150 parts of butyl acrylate, 150 parts of butyl methacrylate, 16 parts of cyclopentenyloxyethyl acrylate, 2 parts of acrylic acid, 1 part of V-50 and 200 parts of deionized water were processed in a homomixer to obtain an emulsion.
  • A colben was charged with 350 parts of deionized water and after the temperature was adjusted to 70° C., 10% of the above emulsion was added to start the reaction. Thereafter, the temperature was adjusted to 80° C. and the rest of the emulsion was dropped over 120 minutes. The Tg of the obtained acrylic resin was −19° C.
  • For 30 minutes after dropping, the temperature was maintained at 80° C. Then, 0.2 part of V-50 was added and reaction was conducted while dropping 40 parts of styrene over 60 minutes. The temperature was maintained at 80° C. for 60 minutes to finish the reaction and after cooling, the pH was adjusted with 1 part of 28% ammonium water and 34.8 parts of deionized water to obtain a graft copolymer. The styrene resin content of the obtained graft copolymer was 12.6% by weight based on the acrylic resin.
  • EXAMPLE 3
  • 20 parts of ADEKA REASOAP ER-20, 150 parts of butyl acrylate, 150 parts of butyl methacrylate, 16 parts of cyclopentenyloxyethyl acrylate, 2 parts of acrylic acid, 1 part of V-50 and 200 parts of deionized water were processed in a homomixer to obtain an emulsion.
  • A colben was charged with 350 parts of deionized water and after the temperature was adjusted to 70° C., 10% of the above emulsion was added to start the reaction. Thereafter, the temperature was adjusted to 80° C. and the rest of the emulsion was dropped over 120 minutes. The Tg of the obtained acrylic resin was −19° C.
  • For 30 minutes after dropping, the temperature was maintained at 80° C. Then, 0.2 part of V-50 was added and reaction was conducted while dropping 160 parts of styrene over 60 minutes. The temperature was maintained at 80° C. for 60 minutes to finish the reaction and after cooling, the pH was adjusted with 1 part of 28% ammonium water and 34.8 parts of deionized water to obtain a graft copolymer. The styrene resin content of the obtained graft copolymer was 50.3% by weight based on the acrylic resin.
  • COMPARATIVE EXAMPLE 1
  • 20 parts of ADEKA REASOAP ER-20, 150 parts of butyl acrylate, 150 parts of butyl methacrylate, 80 parts of styrene, 16 parts of cyclopentenyloxyethyl acrylate, 2 parts of acrylic acid, 1 part of V-50 and 200 parts of deionized water were processed in a homomixer to obtain an emulsion.
  • A colben was charged with 350 parts of deionized water and after the temperature was adjusted to 70° C., 10% of the above emulsion was added to start the reaction. Thereafter, the temperature was adjusted to 80° C. and the rest of the emulsion was dropped over 150 minutes. The temperature was maintained at 80° C. for 60 minutes to finish the reaction and after cooling, the pH was adjusted with 1 part of 28% ammonium water and 30 parts of deionized water to obtain a random copolymer.
  • The cured membranes obtained using the above copolymers were evaluated in the following manner. Unless indicated otherwise, measurement was conducted under an environment of 23° C. and 50% RH.
  • (1) Film-Forming Temperature
  • The coating material was tested in the range of −10 to 50° C. by a temperature gradient testing machine (made by Tester Sangyo Co., Ltd.) and the minimum temperature at which a normal film is formed was measured.
  • (2) Tensile Strength, Elongation and Young's Modulus
  • The sample was applied by an applicator to prepare a film having thickness of 80 to 90 μm. Tensile strength, elongation and Young's modulus of a die-cut specimen were measured using an all-purpose tensile and compression testing machine (made by Minebea Co., Ltd.), under the conditions of pulling speed rate of 100 mm/minute for tensile strength and elongation and 1 mm/minute for Young's modulus.
  • (3) Insulation Resistance
  • The sample was applied to JIS II model comb-type substrate and after drying for 30 minutes at 90° C., the insulation resistance was measured by applying DC.100 V using a high-resistance tester (made by Yokogawa Hewlett Packard, Ltd.).
  • (4) Insulating Properties in High Temperature and High Humidity
  • The sample was applied to JIS II model comb-type substrate and dried for 30 minutes at 90° C. The specimen was placed in a constant temperature and humidity chamber (atmosphere inside chamber: 85° C., 85 to 90% RH) and after 168 hours, the insulation resistance was measured by applying DC.100 V using a high-insulation measuring machine (made by Yokogawa Hewlett Packard, Ltd.).
  • (5) Non-Stickiness
  • The sample was flow-coated on a glass board and dried for 30 minutes at 90° C. to obtain a membrane. The membrane was evaluated by touch as ο when the membrane did not feel sticky, Δ when the membrane felt somewhat sticky but was not largely distorted and X when the membrane felt sticky.
  • (6) Adhesive Properties
  • The membrane formed on the JIS II model comb-type substrate was tested by the 1 mm spacing cross-cut test method (according o JIS K5600-5-6) and the number of remaining squares that were not flaked was represented in a number value. The number of squares that were cut was 100.
  • The evaluation results are shown in Table 1.
    TABLE 1
    Com.
    Ex. 1 Ex. 2 Ex. 3 Ex. 1
    Film-forming <0 <0 <0 <0
    temperature (° C.)
    Tensile strength (MPa) 5.6 1.8 7.6 7.8
    Elongation (%) 385 520 285 360
    Non-stickiness Δ X
    Insulating properties (Ω) 1.9 × 1011 2.6 × 1011 2.7 × 1011 7.0 × 1010
    Insulating properties in 5.8 × 109  2.6 × 109  5.4 × 109  1.1 × 109 
    high humidity (Ω)
    Young's modulus (MPa) 1.2 0.4 20.2 17.6
    Adhesive properties 100/100 100/100 100/100 100/100
  • The resin of Comparative Example 1 obtained by random polymerization, in which the hard resin was not grafted to the flexible acrylic resin main chain by two-step polymerization, tends to exhibit stickiness, although the composition is the same, and also, the Young's modulus tends to be high.
  • The coating material of the present invention can be formed into a film at room temperature without using a coalescence, does not contain a solvent and forms a membrane having flexibility, low Young's modulus, favorable adhesive properties, moisture resistance and insulating properties.

Claims (1)

1. A non-sticky water-based conformal coating material comprising a resin wherein a flexible acrylic resin having glass transition temperature of at most 0° C. is the main chain and a vinyl polymer having a glass transition temperature of at least 20° C. is grafted to said flexible acrylic resin;
the content of said vinyl polymer being 10 to 70% by weight based on said flexible acrylic resin.
US10/954,273 2003-10-03 2004-10-01 Non-sticky water-based conformal coating material Abandoned US20050075459A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US11/399,468 US7642325B2 (en) 2003-10-03 2006-04-07 Non-sticky water-based conformal coating material

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003-345953 2003-10-03
JP2003345953A JP4733919B2 (en) 2003-10-03 2003-10-03 Non-adhesive aqueous conformal coating material

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US11/399,468 Division US7642325B2 (en) 2003-10-03 2006-04-07 Non-sticky water-based conformal coating material

Publications (1)

Publication Number Publication Date
US20050075459A1 true US20050075459A1 (en) 2005-04-07

Family

ID=34386355

Family Applications (2)

Application Number Title Priority Date Filing Date
US10/954,273 Abandoned US20050075459A1 (en) 2003-10-03 2004-10-01 Non-sticky water-based conformal coating material
US11/399,468 Expired - Fee Related US7642325B2 (en) 2003-10-03 2006-04-07 Non-sticky water-based conformal coating material

Family Applications After (1)

Application Number Title Priority Date Filing Date
US11/399,468 Expired - Fee Related US7642325B2 (en) 2003-10-03 2006-04-07 Non-sticky water-based conformal coating material

Country Status (3)

Country Link
US (2) US20050075459A1 (en)
JP (1) JP4733919B2 (en)
CN (1) CN1613932B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014009408A1 (en) * 2012-07-11 2014-01-16 Omnova Solutions Rheological agent, preparation methods and uses thereof

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4923291B2 (en) * 2005-12-02 2012-04-25 ソマール株式会社 Water-based moisture-proof insulation coating agent
WO2012115011A1 (en) * 2011-02-25 2012-08-30 昭和電工株式会社 Moistureproof insulation material
CN102595771B (en) * 2012-01-11 2015-07-01 深圳创维数字技术有限公司 Paper base printing circuit board with protective layer and preparation method thereof
CN114630018A (en) * 2020-12-14 2022-06-14 晋城三赢精密电子有限公司 Lens module and electronic device
WO2023200993A1 (en) * 2022-04-13 2023-10-19 Actnano, Inc. Conformal coating with low volatile organic compound content

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3454516A (en) * 1965-08-17 1969-07-08 Du Pont Dyadic polymeric products
US6395836B1 (en) * 1999-09-27 2002-05-28 Rohm And Haas Company Polymer useful for coating

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50143828A (en) * 1974-05-09 1975-11-19
US3973321A (en) * 1974-09-10 1976-08-10 The Anaconda Company Method of preparing circuit boards comprising inductors
JPS51111889A (en) * 1975-03-28 1976-10-02 Mitsubishi Electric Corp Preparation of a water-dispersed varnish for electrodeposition
JPS63117021A (en) * 1986-11-05 1988-05-21 Dainippon Ink & Chem Inc Production of non-film-forming polymer emulsion
DE3908615A1 (en) * 1989-03-16 1990-09-20 Roehm Gmbh AQUEOUS PLASTIC DISPERSION, METHOD FOR THEIR PRODUCTION AND APPLICATION
DE4439459A1 (en) * 1994-11-04 1995-05-04 Basf Ag Aqueous polymer dispersion
GB9506844D0 (en) * 1995-04-03 1995-05-24 Armitage Ian M Pharmaceutical microencapsulation
US6066693A (en) * 1995-06-26 2000-05-23 Basf Aktiengesellschaft Polymer composition for graft copolymers as well as mixtures thereof and thermoplastic compounds containing them
DE59604608D1 (en) * 1995-06-26 2000-04-13 Basf Ag NEW POLYMER COMPOSITIONS FOR GRAFT COPOLYMERS AND THEIR MIXTURES AND THERMOPLASTIC MEASURES CONTAINING THEM
JP2002012816A (en) * 2000-06-30 2002-01-15 Nippon Paint Co Ltd Aqueous coating material composition
WO2002022690A2 (en) * 2000-09-14 2002-03-21 Rohm And Haas Company A method of forming toughened thermoset articles and toughened thermoset articles produced thereby
JP2002146266A (en) 2000-11-09 2002-05-22 Air Braun Kk Environment-compatible, electronic part conformal coating agent
JP2002225491A (en) * 2001-01-31 2002-08-14 Pentel Corp Writing utensil
JP4888678B2 (en) * 2001-09-27 2012-02-29 Dic株式会社 Polymer aqueous dispersion and process for producing the same
JP2003226835A (en) * 2002-02-07 2003-08-15 Kansai Paint Co Ltd Top coating composition
JP2004059622A (en) * 2002-07-25 2004-02-26 Kansai Paint Co Ltd Water-based coating composition

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3454516A (en) * 1965-08-17 1969-07-08 Du Pont Dyadic polymeric products
US6395836B1 (en) * 1999-09-27 2002-05-28 Rohm And Haas Company Polymer useful for coating

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014009408A1 (en) * 2012-07-11 2014-01-16 Omnova Solutions Rheological agent, preparation methods and uses thereof
WO2014009765A1 (en) * 2012-07-11 2014-01-16 Omnova Solutions Rheological agent, preparation methods and uses thereof
US11041107B2 (en) 2012-07-11 2021-06-22 Omnova Solutions Rheological agent, preparation methods and uses thereof

Also Published As

Publication number Publication date
JP2005112919A (en) 2005-04-28
US20060178479A1 (en) 2006-08-10
CN1613932A (en) 2005-05-11
JP4733919B2 (en) 2011-07-27
US7642325B2 (en) 2010-01-05
CN1613932B (en) 2011-10-19

Similar Documents

Publication Publication Date Title
US7642325B2 (en) Non-sticky water-based conformal coating material
JP6504987B2 (en) Pressure-sensitive adhesive composition and pressure-sensitive adhesive sheet
US9714369B2 (en) Physically crosslinkable adhesive copolymer
Gower et al. The effect of varied monomer composition on adhesive performance and peeling master curves for acrylic pressure‐sensitive adhesives
US6538062B2 (en) Resin composition for aqueous paint
JP4880877B2 (en) Manufacturing method of flexible printed wiring board and process film with releasable release material used in the manufacturing method
JP2009084367A (en) Double-sided adhesive tape
CN105143384A (en) Pressure-sensitive adhesive composition and pressure-sensitive adhesive sheet using same
JP4521522B2 (en) Optical member and manufacturing method thereof
JP4763379B2 (en) Pressure-sensitive adhesive resin composition
JP2009525371A (en) Self-adhesive adhesive
KR101159536B1 (en) Graft copolymer, coating material, and method of forming coating film
US20060036024A1 (en) Release coating composition for tape
JP3216262B2 (en) Heat-curable anti-fog composition for vehicle lighting and vehicle lighting
JP5680339B2 (en) Adhesive and method for producing the same
JP4739742B2 (en) Film coating composition
EP1571165B1 (en) Compositions for the preparation of hydrophobic coatings
KR102625863B1 (en) Acrylic emulsion pressure snsitive adhesive composition
US11905353B2 (en) Pressure sensitive adhesive compositions and methods of making same
WO2016165039A1 (en) Single-component thermoplastic polyacrylate shape-preserving coating composition
JPH0726461A (en) Binder for nonwoven fabric
JP2021046463A (en) Heat-decomposable coating resin composition
CN115232580A (en) Pressure sensitive adhesive and protective film
KR20240045326A (en) Adhesive composition and methods of forming the same
JP2000239598A (en) Water-dispersible coating composition and its production

Legal Events

Date Code Title Description
AS Assignment

Owner name: TOHPE CORPORATION, JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:HASHIMOTO, MASASHI;MAEDA, HIDEO;REEL/FRAME:015863/0088

Effective date: 20040922

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION