WO2012115011A1 - Moistureproof insulation material - Google Patents

Moistureproof insulation material Download PDF

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Publication number
WO2012115011A1
WO2012115011A1 PCT/JP2012/053859 JP2012053859W WO2012115011A1 WO 2012115011 A1 WO2012115011 A1 WO 2012115011A1 JP 2012053859 W JP2012053859 W JP 2012053859W WO 2012115011 A1 WO2012115011 A1 WO 2012115011A1
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WO
WIPO (PCT)
Prior art keywords
moisture
insulating material
solvent
proof insulating
boiling point
Prior art date
Application number
PCT/JP2012/053859
Other languages
French (fr)
Japanese (ja)
Inventor
一彦 大賀
Original Assignee
昭和電工株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 昭和電工株式会社 filed Critical 昭和電工株式会社
Priority to CN201280010155.2A priority Critical patent/CN103392210B/en
Priority to KR1020137018133A priority patent/KR101477039B1/en
Priority to JP2013501010A priority patent/JP5893001B2/en
Publication of WO2012115011A1 publication Critical patent/WO2012115011A1/en

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/28Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances natural or synthetic rubbers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D109/00Coating compositions based on homopolymers or copolymers of conjugated diene hydrocarbons
    • C09D109/06Copolymers with styrene
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D153/00Coating compositions based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Coating compositions based on derivatives of such polymers
    • C09D153/02Vinyl aromatic monomers and conjugated dienes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D157/00Coating compositions based on unspecified polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C09D157/02Copolymers of mineral oil hydrocarbons
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H01B3/442Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from aromatic vinyl compounds
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon

Definitions

  • the present invention relates to a moisture-proof insulating material for an electronic component excellent in workability and quick drying property, and an electronic component insulated by the moisture-proof insulating material.
  • coating with an insulating film is performed for the purpose of protecting exposed metal parts such as mounting circuit boards and electrodes from moisture, dust, corrosive gas, and the like.
  • This coating material includes types such as an ultraviolet curable type, a moisture curable type, and a solvent dry type, and acrylic resin, silicone resin, styrene block copolymer resin, and the like are used, respectively.
  • Moisture-curing coating materials are excellent in moisture resistance of silicone resin itself, but have moisture permeability, so there is a problem that a thick coating material must be applied to protect the metal of circuits and electrodes. is there.
  • UV curable coating materials are widely used because they can be cured in a short time and have excellent productivity.
  • an ultraviolet curable coating material for example, a polyolefin polyol described in JP-A-2007-308681 and a urethane-modified acrylate compound derived from a polycarbonate polyol described in JP-A-2007-332279 are known. ing.
  • JP-A No. 2003-145687 discloses a composition comprising a styrene thermoplastic elastomer, a tackifier, and toluene.
  • a solvent having a smaller influence than toluene it is desired to use a solvent having a smaller influence than toluene.
  • JP-A-2005-126456, JP-A-2005-162986, JP-A-2006-16531, and JP-A-2006-45340 disclose styrenic thermoplastic elastomers, tackifiers, and silane coupling agents. And a composition consisting of ethylcyclohexane.
  • a solvent containing ethylcyclohexane as a main component if the solid content concentration is increased in order to increase the drying property, the viscosity of the composition increases, and as a result, workability (ie, potting performance) decreases.
  • the solvent-drying coating material does not involve a curing reaction, the necessary physical properties must be expressed only by coating and drying, and the molecular weight of the resin must be increased. However, as the molecular weight of the resin increases, the viscosity of the coating material increases and workability decreases. Alternatively, if the coating material is diluted to ensure workability, the thickness of the coating film after application / drying may be reduced, resulting in inferior moisture resistance. Since it took a long time, there was a problem that productivity decreased.
  • the solvent-drying type coating material be transferred to the next process in about 3 minutes or less after application, and quick drying is required.
  • the drying is too fast, the potting liquid may have a stringiness during potting, and if it is severe, problems such as clogging of the syringe tip will occur, so an appropriate drying property is required.
  • an aliphatic hydrocarbon solvent having a boiling point of 80 ° C. or more and less than 110 ° C. in a solvent-drying coating material containing a styrene-based thermoplastic elastomer. It has been found that by using a solvent composed of a dialkyl carbonate in combination with a main component of a solvent, an excellent moisture-proof insulating film having a low viscosity and sufficient solid content concentration and expressing quick drying properties can be obtained. The invention has been completed.
  • the present invention (I) is a moisture-proof insulating material containing a styrenic thermoplastic elastomer, a tackifier, and a solvent, wherein the solvent has an aliphatic hydrocarbon solvent having a boiling point of 80 ° C. or higher and lower than 110 ° C.
  • Formula (1) (In Formula (1), R 1 and R 2 each independently represents a methyl group or an ethyl group.) It is a moisture-proof insulating material characterized by including the solvent which consists of dialkyl carbonate represented by these.
  • the present invention (II) is an electronic component that has been insulated using the moisture-proof insulating material of the present invention (I).
  • a moisture-proof insulating material comprising a solvent comprising a dialkyl carbonate represented by the formula: [2] The moisture-proof insulating material according to [1], wherein the solvent further includes an aliphatic hydrocarbon solvent having a boiling point of 110 ° C.
  • the mass ratio of the aliphatic hydrocarbon solvent having a boiling point of 80 ° C. or higher and lower than 110 ° C. contained in the moisture-proof insulating material to the aliphatic hydrocarbon solvent having a boiling point of 110 ° C. or higher and lower than 140 ° C. is 65:35.
  • the moisture-proof insulating material according to any one of [1] to [3], wherein the mass ratio of the solvent comprising dialkyl carbonate represented by the formula is in the range of 85:15 to 98: 2.
  • the total amount of the styrene-based thermoplastic elastomer and the tackifier is 20 to 40% by mass and the total amount of the solvent is 60 to 80% by mass with respect to the total mass of the moisture-proof insulating material.
  • the total amount of the solvent composed of the dialkyl carbonate represented by the formula (1) is 65% by mass or more based on the total amount of the solvent, and the moisture-proof insulating material has a viscosity at 25 ° C. of 1.2 Pa ⁇ s or less.
  • the moisture-proof insulating material according to any one of [1] to [6], wherein [8]
  • the styrene thermoplastic elastomer is selected from the group consisting of a styrene-butadiene block copolymer elastomer, a styrene-isoprene block copolymer elastomer, a styrene-ethylene / butylene block copolymer elastomer, and a styrene-ethylene / propylene block copolymer elastomer.
  • the moisture-proof insulating material according to any one of claims 1 to 7, wherein the moisture-proof insulating material is at least one selected.
  • the content of structural units derived from styrene contained in the styrenic thermoplastic elastomer is 15 to 50% by mass based on the total amount of the styrenic thermoplastic elastomer [1] to [8]
  • the moisture-proof insulating material of the present invention has a low viscosity and a sufficient solid content concentration, and is excellent in workability, adhesion to a substrate, moisture-proof, and insulation reliability. Thus, an electronic component that is highly moisture-proof and insulated can be obtained.
  • the present invention will be specifically described below. First, the moisture-proof insulating material of the present invention (I) will be described.
  • the present invention (I) is a moisture-proof insulating material containing a styrenic thermoplastic elastomer, a tackifier, and a solvent, wherein the solvent has an aliphatic hydrocarbon solvent having a boiling point of 80 ° C. or higher and lower than 110 ° C. and a formula
  • a moisture-proof insulating material comprising a solvent comprising a dialkyl carbonate represented by 1).
  • R 1 and R 2 each independently represents a methyl group or an ethyl group.
  • thermoplastic elastomer described in the present specification is flowable by heating and can be molded in the same manner as ordinary thermoplastics, and exhibits rubber elasticity (that is, remarkable elastic recovery) at room temperature. This is a high-molecular compound with properties. Details are described in “Edition Committee for Physicochemical Dictionary”, “All about Thermoplastic Elastomers”, first edition, first edition, published by Industrial Research Co., Ltd., December 20, 2003. ing.
  • thermoplastic elastomer described in the present specification means a thermoplastic elastomer having a structural unit derived from styrene in the molecular structure.
  • the styrene thermoplastic elastomer used for the moisture-proof insulating material of the present invention (I) is excellent in moisture resistance and insulation reliability.
  • styrenic thermoplastic elastomers include styrene-butadiene block copolymer elastomers, styrene-isoprene block copolymer elastomers, styrene-ethylene / butylene block copolymer elastomers, styrene-ethylene / propylene block copolymer elastomers, and the like. it can.
  • styrenic thermoplastic elastomers include D1101, D1102, D1155, DKX405, DKX410, DKX415, D1192, D1161, D1171, G1652, and G1730 (above, Kraton Polymer Co., Ltd.), Tufprene (registered trademark) A TUFPRENE (registered trademark) 125, TUFPRENE (registered trademark) 126S, TUFTEC (registered trademark) H1141, TUFTECH (registered trademark) H1041, TUFTECH (registered trademark) H1043, TUFTEC (registered trademark) H1052, (above, Asahi Kasei Chemicals Corporation Manufactured). These can be used alone or in combination of two or more.
  • the content of structural units derived from styrene contained in the styrene-based thermoplastic elastomer is preferably 15 to 50% by mass, more preferably 18 to 45% by mass, based on the total amount of the styrene-based thermoplastic elastomer. More preferably, it is 19 to 43% by mass.
  • the content of the structural unit derived from styrene contained in the styrene-based thermoplastic elastomer is less than 15% by mass with respect to the total amount of the styrene-based thermoplastic elastomer, the cohesive force of the elastomer may be insufficient, which is preferable. That's not true.
  • the tackifier used in the present invention is a substance that is added to a polymer compound typified by an elastomer having rubber elasticity to give an adhesive function.
  • the molecular weight is much smaller and is generally a compound in an oligomer region having a molecular weight of several hundred to several thousand, and has a property of not exhibiting rubber elasticity by itself in a glass state at room temperature.
  • tackifier a petroleum resin tackifier, a terpene resin tackifier, a rosin resin tackifier, a coumarone indene resin tackifier, a styrene resin tackifier, or the like can be generally used.
  • Examples of petroleum resin tackifiers include aliphatic petroleum resins, aromatic petroleum resins, aliphatic-aromatic copolymer petroleum resins, alicyclic petroleum resins, dicyclopentadiene resins, and hydrogenated products thereof. Of the modified product.
  • the synthetic petroleum resin may be C5 or C9.
  • terpene resin tackifier examples include ⁇ -pinene resin, ⁇ -pinene resin, terpene-phenol resin, aromatic modified terpene resin, hydrogenated terpene resin and the like. Many of these terpene resins are resins having no polar group.
  • Rosin resin tackifiers include rosins such as gum rosin, tall oil rosin, wood rosin; hydrogenated rosin, disproportionated rosin, polymerized rosin, modified rosin such as maleated rosin; rosin glycerin ester, hydrogenated rosin ester, water Examples thereof include rosin esters such as rosin glycerol ester. These rosin resins have polar groups.
  • tackifiers petroleum resin tackifiers and terpene resin tackifiers are preferred. Furthermore, a petroleum resin tackifier is preferable.
  • tackifiers can be used alone or in combination of two or more.
  • the total blending amount of the styrenic thermoplastic elastomer and the tackifier is 20 to 40% by mass, preferably 22 with respect to the total mass of the moisture-proof insulating material. It is -35 mass%, More preferably, it is 23-33 mass%. If the total amount of the styrene-based thermoplastic elastomer and the tackifier is less than 20% by mass with respect to the total mass of the moisture-proof insulating material, the thickness of the coating material becomes thin, and sufficient moisture-proof properties and film strength can be obtained. There may not be.
  • the blending ratio of the styrenic thermoplastic elastomer and the tackifier is in the range of 2: 1 to 10: 1, preferably in the range of 2.5: 1 to 9.5: 1, by mass ratio.
  • the range is preferably 3: 1 to 9: 1. If the blending ratio of the styrene-based thermoplastic elastomer and the tackifier is greater than 10: 1 by mass ratio, it may not be possible to develop a sufficient adhesion function, which is not preferable. On the other hand, if the blending ratio of the styrene-based thermoplastic elastomer and the tackifier is less than 2: 1 by mass ratio, the tensile (breaking) strength of the coating after application and drying may be significantly reduced.
  • the moisture-proof insulating material of the present invention (I) contains an aliphatic hydrocarbon solvent having a boiling point of 80 ° C. or higher and lower than 110 ° C. as an essential component.
  • the boiling point refers to the boiling point at 1 atmosphere.
  • aliphatic hydrocarbon solvent means a solvent composed of only aliphatic hydrocarbons or a solvent containing approximately 80% or more of aliphatic hydrocarbons.
  • Examples of the aliphatic hydrocarbon solvent having a boiling point of 80 ° C. or higher and lower than 110 ° C. include n-heptane (boiling point 98.4 ° C.), cyclohexane (boiling point 80.7 ° C.), methylcyclohexane (boiling point 101.1 ° C.). Etc. Of these, preferred are cyclohexane and methylcyclohexane. Most preferred is methylcyclohexane.
  • the moisture-proof insulating material of the present invention (I) contains a solvent composed of a dialkyl carbonate represented by the formula (1) as an essential component.
  • R 1 and R 2 each independently represents a methyl group or an ethyl group.
  • Examples of the solvent comprising the dialkyl carbonate represented by the formula (1) include dimethyl carbonate, methyl ethyl carbonate, and diethyl carbonate. Of these, diethyl carbonate is most preferable in consideration of the balance between quick drying and spinnability.
  • the moisture-proof insulating material of the present invention (I) further includes an aliphatic hydrocarbon solvent having a boiling point of 110 ° C. or higher and lower than 140 ° C.
  • an aliphatic hydrocarbon solvent having a boiling point of 110 ° C. or higher and lower than 140 ° C examples of the aliphatic hydrocarbon solvent having a boiling point of 110 ° C. or higher and lower than 140 ° C.
  • n-octane (boiling point 125.7 ° C.), cis-1,2-dimethylcyclohexane (boiling point 129.7 ° C.), cis- 1,3-dimethylcyclohexane (boiling point 120.1 ° C.), cis-1,4-dimethylcyclohexane (boiling point 124.3 ° C.), trans-1,2-dimethylcyclohexane (boiling point 123.4 ° C.), trans-1, Examples thereof include 3-dimethylcyclohexane (boiling point 124.5 ° C.), trans-1,4-dimethylcyclohexane (boiling point 119.4 ° C.), ethylcyclohexane (boiling point 132 ° C.), and the like.
  • cis-1,2-dimethylcyclohexane preferred are cis-1,2-dimethylcyclohexane, cis-1,3-dimethylcyclohexane, cis-1,4-dimethylcyclohexane, trans-1,2-dimethylcyclohexane, trans-1, 3-Dimethylcyclohexane, trans-1,4-dimethylcyclohexane, and ethylcyclohexane.
  • ethylcyclohexane is most preferable.
  • an aliphatic hydrocarbon solvent having a boiling point of 80 ° C. or more and less than 110 ° C. a solvent comprising a dialkyl carbonate represented by the formula (1), and an aliphatic hydrocarbon solvent having a boiling point of 110 ° C. or more and less than 140 ° C. It is possible to use these solvents in combination as long as the characteristics are not impaired.
  • solvents examples include hydrocarbon solvents having an alicyclic structure such as decahydronaphthalene, acetate esters such as n-propyl acetate, n-butyl acetate, isobutyl acetate, t-butyl acetate, isopropyl acetate, and ethyl acetate.
  • hydrocarbon solvents having an alicyclic structure such as decahydronaphthalene
  • acetate esters such as n-propyl acetate, n-butyl acetate, isobutyl acetate, t-butyl acetate, isopropyl acetate, and ethyl acetate.
  • Solvents such as ethylene glycol dimethyl ether, ethylene glycol diethyl ether, ethylene glycol monoethyl ether, propylene glycol dimethyl ether, propylene glycol monomethyl ether, alcohol solvents such as ethanol, 1-propanol, 2-propanol, acetone, methyl ethyl ketone, Examples thereof include ketone solvents such as methyl isobutyl ketone and petroleum naphtha.
  • the boiling point is desirably 140 ° C.
  • Acetate solvents such as isopropyl acetate, ethyl acetate, and n-propyl acetate are preferred, and n-propyl acetate, isobutyl acetate, t-butyl acetate, and n-butyl acetate are more preferred.
  • the total amount of the solvent contained in the moisture-proof insulating material is preferably 60 to 80% by mass, more preferably 65 to 78% by mass, and still more preferably 70 to 76% by mass with respect to the total mass of the moisture-proof insulating material. It is. When the total amount of the solvent is too large, the thickness of the coating material becomes thin and sufficient moisture resistance and film strength may not be obtained. Furthermore, when solid content concentration becomes low, time until the coating-film surface tack after application
  • the blending ratio is preferably a mass ratio. Is 65:35 to 97: 3, more preferably 68:32 to 95: 5.
  • the blending ratio of the aliphatic hydrocarbon solvent having a boiling point of 80 ° C. or more and less than 110 ° C. and the aliphatic hydrocarbon solvent having a boiling point of 110 ° C. or more and less than 140 ° C. is greater than 97: 3 by mass ratio, In the case of a composition having a high thermoplastic elastomer concentration, drying is too fast, the syringe of the dispenser may be clogged, and the coating solution may have spinnability, which is not preferable.
  • An aliphatic hydrocarbon solvent having a boiling point of 80 ° C. or more and less than 110 ° C. contained in the moisture-proof insulating material (when an aliphatic hydrocarbon solvent having a boiling point of 110 ° C. or more and less than 140 ° C. is used in combination, 80 ° C. or more and 110 ° C.
  • the mass ratio of the solvent comprising the dialkyl carbonate represented by the formula (1) is , Preferably in the range of 85:15 to 98: 2, and more preferably in the range of 88:12 to 97: 3. If the ratio of the solvent composed of dialkyl carbonate is too small, the coating solution may have spinnability when the solution is applied from the dispenser. On the other hand, if the ratio of the solvent composed of dialkyl carbonate is too large, the solubility of the heat-flexible elastomer may decrease.
  • the total amount of the solvent composed of the aliphatic hydrocarbon solvent having a boiling point of 80 ° C. or higher and lower than 110 ° C. contained in the moisture-proof insulating material and the dialkyl carbonate represented by the formula (1) is preferably relative to the total amount of the solvent. It is 65% by mass or more, more preferably 70 to 98% by mass. If the total amount of the solvent consisting of an aliphatic hydrocarbon solvent having a boiling point of 80 ° C. or more and less than 110 ° C.
  • the solubility in the thermoplastic elastomer, the liquid from the dispenser It is difficult to control in a well-balanced manner with respect to the four items of suppression of the spinnability of the coating liquid at the time of coating, the time until tackiness of the coating surface after application of the moisture-proof insulating material and the viscosity of the moisture-proof insulating material are eliminated. There is a tendency and it cannot be said that it is preferable.
  • the ratio of the aliphatic hydrocarbon solvent having a boiling point of 80 ° C. or higher and lower than 110 ° C. to the total solvent is preferably 65 to 95% by mass, more preferably 70 to 93% by mass.
  • the proportion of the solvent consisting of the dialkyl carbonate represented by the formula (1) in the total solvent is preferably 2 to 15% by mass, more preferably 2 to 10% by mass.
  • the ratio of the total amount of the solvent consisting of the above and the aliphatic hydrocarbon solvent having a boiling point of 110 ° C. or higher and lower than 140 ° C. to the total solvent is preferably 70 to 100% by mass.
  • the moisture-proof insulating material of the present invention has a viscosity at 25 ° C. of preferably 1.2 Pa ⁇ s or less, more preferably 1.1 Pa ⁇ s or less, and still more preferably 1. 0 Pa ⁇ s or less. Since it is generally applied using a dispenser, the pressure at the time of application increases when the viscosity of the moisture-proof insulating material at 25 ° C. is higher than 1.2 Pa ⁇ s in consideration of the pressure of the dispenser. When the moisture-proof insulating material is applied by a dispenser, the spread after the application is suppressed, and as a result, there is a concern that the thickness after drying becomes unnecessarily thick, which is not preferable.
  • the viscosity described in the present specification is a value measured at 25 ° C. and a rotation speed of 20 rpm using a DV-II + Pro viscometer small sample adapter (spindle model number: SC4-31) manufactured by Brookfield.
  • additives such as a leveling agent, an antifoaming agent, an antioxidant, a coloring agent, and a silane coupling agent can be used as necessary.
  • the leveling agent is not particularly limited as long as it is a material having a function of improving the leveling property of the coating film surface when added.
  • polyether-modified dimethylpolysiloxane copolymer, polyester-modified dimethylpolysiloxane copolymer, polyether-modified methylalkylpolysiloxane copolymer, aralkyl-modified methylalkylpolysiloxane copolymer, and the like can be used. These may be used alone or in combination of two or more. 0.01 to 3 parts by mass can be added to 100 parts by mass of the moisture-proof insulating material of the present invention (I).
  • the amount is less than 0.01 part by mass, the effect of adding the leveling agent may not be exhibited.
  • the amount is more than 3 parts by mass, the surface of the coating film may become sticky or the insulating properties may be deteriorated depending on the type of the leveling agent used.
  • the antifoaming agent is not particularly limited as long as it has an action of eliminating or suppressing bubbles generated or remaining when the moisture-proof insulating material of the present invention (I) is applied.
  • antifoaming agents used in the moisture-proof insulating material of the present invention (I) include known antifoaming agents such as silicone oils, fluorine-containing compounds, polycarboxylic acid compounds, polybutadiene compounds, and acetylenic diol compounds. .
  • Silicone defoaming agents such as Toray Dow Corning Co., Ltd., Dappo SN-348 (manufactured by San Nopco), Dappo SN-354 (manufactured by San Nopco), Dappo SN-368 (manufactured by San Nopco), Acetylene such as acrylic polymer antifoaming agents such as Disparon 230HF (manufactured by Enomoto Kasei Co., Ltd.), Surfinol DF-110D (manufactured by Nissin Chemical Industry Co., Ltd.), Surfynol DF-37 (manufactured by Nissin Chemical Industry Co., Ltd.) Diol-based antifoaming agent, FA-630 (Shin-Etsu Chemical) Business Co., Ltd.), a fluorine-containing silicone-based anti-foaming agent such as, etc.
  • Dappo SN-348 manufactured by San Nopco
  • Dappo SN-354
  • the moisture-proof insulating material of the present invention can be mentioned. These may be used alone or in combination of two or more. Usually, 0.001 to 5 parts by mass can be added to 100 parts by mass of the moisture-proof insulating material of the present invention (I). If the amount is less than 0.01 parts by mass, the effect of adding the antifoaming agent may not be exhibited. On the other hand, when the amount is more than 5 parts by mass, the surface of the coating film may become sticky or the insulating properties may be deteriorated depending on the type of antifoaming agent used.
  • the colorant used in the moisture-proof insulating material of the present invention (I) is preferably an oil-soluble dye.
  • Specific examples include, for example, OIL BLACK860 (manufactured by Orient Chemical Industry Co., Ltd.), OIL BLACK 803 (Orient Chemical Industry Co., Ltd.).
  • OIL BLUE 2N made by Orient Chemical Co., Ltd.
  • OIL BLUE 630 made by Orient Chemical Co., Ltd.
  • SOT Black made by Hodogaya Chemical Co., Ltd.
  • the added amount of these dyes can be 0.01 to 5 parts by mass with respect to 100 parts by mass of the moisture-proof insulating material of the present invention (I).
  • an antioxidant can be used and is preferable.
  • the antioxidant is not particularly limited as long as it is a compound capable of preventing thermal deterioration and discoloration of the moisture-proof insulating material of the present invention (I).
  • a phenol-based antioxidant can be used.
  • examples of phenolic antioxidants include compounds represented by the following formulas (2) to (12).
  • a silane coupling agent can be used when a strong adhesion to a glass or metal oxide of a coating film formed by applying the moisture-proof insulating material of the present invention (I) is required.
  • a silane coupling agent is an organosilicon compound having a functional group reactively bonded to an organic material and a functional group reactively bonded to an inorganic material in the molecule, and generally has a structure as shown in the following formula (13). Indicated.
  • Y is a functional group reactively bonded to an organic material, and representative examples thereof include a vinyl group, an epoxy group, an amino group, a substituted amino group, a (meth) acryloyl group, a mercapto group, and the like.
  • X is a functional group that reacts with an inorganic material and is hydrolyzed by water or moisture to produce silanol. This silanol reacts with the inorganic material.
  • Representative examples of X include an alkoxy group, an acetoxy group, a chlorine atom, and the like.
  • R 3 is a divalent organic group, and R 4 represents an alkyl group.
  • a represents an integer of 1 to 3
  • silane coupling agent examples include 3-isocyanatopropyltriethoxysilane, 3-isocyanatopropyltrimethoxysilane, 3-isocyanatopropylmethyldiethoxysilane, 3-isocyanatopropylmethyldimethoxysilane, p-styryltrimethoxysilane, p -Styryltriethoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, vinyltriisopropoxysilane, vinyltris (2-methoxyethoxy) silane, 3-acryloyloxypropyltrimethoxysilane, 3-methacryloyloxypropyltrimethoxysilane, 3 -Acryloyloxypropyltriethoxysilane, 3-methacryloyloxypropyltriethoxysilane, 3-acryloyloxypropylmethyldi Toxisilane, 3-methacryloyloxyprop
  • silane coupling agents preferred are N-2- (aminoethyl) -3-aminopropylmethyldimethoxysilane, N- (2-aminoethyl) -3-aminopropyltrimethoxysilane, N -(2-aminoethyl) -3-aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-triethoxysilyl-N- (1,3-dimethyl-butylidene) propyl Amino group-containing silane coupling agents such as amines and N-phenyl-3-aminopropyltrimethoxysilane, mercapto group-containing silane coupling agents such as 3-mercaptopropyltrimethoxysilane and 3-mercaptopropyltriethoxysilane, 3- Acryloyloxypropyltriethoxys
  • Examples of commercially available products include KBM-503 (manufactured by Shin-Etsu Chemical Co., Ltd.), KBM-903 (manufactured by Shin-Etsu Chemical Co., Ltd.), and KBE-903 (stock of Shin-Etsu Chemical Co., Ltd.). Company-made), Z-6062 (manufactured by Toray Dow Corning Co., Ltd.), Z-6023 (manufactured by Toray Dow Corning Co., Ltd.), and the like. These can be used alone or in combination of two or more.
  • the amount of the silane coupling agent is 0.1 to 10 with respect to 100 parts by mass of the styrene thermoplastic elastomer.
  • the amount is preferably part by mass, and more preferably 0.5 to 8 parts by mass.
  • the present invention (II) is an electronic component that is insulated using the moisture-proof insulating material of the present invention (I).
  • electronic components include microcomputers, transistors, capacitors, resistors, relays, transformers, etc., and mounting circuit boards on which these are mounted, and lead wires, harnesses, and film substrates that are joined to these electronic components. Etc. can also be included.
  • the signal input part of flat panel display panels such as a liquid crystal display panel, a plasma display panel, an organic electroluminescent panel, and a field emission display panel, are also mentioned as an electronic component.
  • the moisture-proof insulating material of the present invention (I) can be preferably used in IC peripheral parts such as display boards for electronic parts, panel bonding parts, and the like.
  • the electronic component of the present invention (II) is manufactured by insulating the electronic component using a moisture-proof insulating material.
  • a specific method for producing the electronic component of the present invention (II) first, the above-described moisture-proof insulating material is applied to the electronic component by a generally known method such as dipping, brushing, spraying, or drawing.
  • the electronic component can be obtained by applying to the substrate and evaporating the organic solvent contained in the moisture-proof insulating material and drying the coating film.
  • Example 1 25 g of D1155 (made by Kraton Polymer Co., Ltd., styrene content 40% by mass) as a styrene-butadiene block copolymer elastomer, and Quinton (registered trademark) D100 (aliphatic-aromatic copolymer petroleum resin made by Nippon Zeon Co., Ltd.) as a tackifier 6.1 g, 71.0 g of methylcyclohexane (manufactured by Maruzen Petrochemical Co., Ltd., trade name: Suwaclean MCH) as a solvent, 5.8 g of ethylcyclohexane (manufactured by Maruzen Petrochemical Co., Ltd .: trade name: Suwaclean ECH), diethyl carbonate (Mitsui (Chemical Fine Co., Ltd.) 3.2g was mixed and it was set as the compound D1.
  • the viscosity of the formulation D1 at 25 ° C.
  • Example 2 22.5 g of D1155 (made by Kraton Polymer Co., Ltd., styrene content 40% by mass) as a styrene-butadiene block copolymer elastomer, 5.5 g of Quinton (registered trademark) D100 (made by Nippon Zeon Co., Ltd.) as a tackifier, and methylcyclohexane as a solvent (Maruzen Petrochemical Co., Ltd., trade name: Suwaclean MCH) 60.0 g, ethylcyclohexane (Maruzen Petrochemical Co., Ltd., trade name: Swaclean ECH) 8.0 g, diethyl carbonate (Mitsui Chemicals Fine Co., Ltd.) 4. 0 g was mixed to make Formulation D2. The viscosity of the formulation D2 at 25 ° C. was 0.67 Pa ⁇ s.
  • Example 3 22.5 g of D1155 (made by Kraton Polymer Co., Ltd., styrene content 40% by mass) as a styrene-butadiene block copolymer elastomer, 5.5 g of Quinton (registered trademark) D100 (made by Nippon Zeon Co., Ltd.) as a tackifier, and methylcyclohexane as a solvent (Maruzen Petrochemical Co., Ltd., trade name: Suwaclean MCH) 56.0 g, ethylcyclohexane (Maruzen Petrochemical Co., Ltd., trade name: Suwaclean ECH) 8.0 g, dimethyl carbonate (Ube Industries, Ltd.) 4.0 g Then, 4.0 g of diethyl carbonate (manufactured by Mitsui Chemicals Fine Co., Ltd.) was mixed to obtain a formulation D3. The viscosity of the formulation D3 at 25 ° C. was 0.62 Pa
  • Example 4 22.5 g of D1155 (made by Kraton Polymer Co., Ltd., styrene content 40% by mass) as a styrene-butadiene block copolymer elastomer, 5.5 g of Quinton (registered trademark) D100 (made by Nippon Zeon Co., Ltd.) as a tackifier, and methylcyclohexane as a solvent (Maruzen Petrochemical Co., Ltd., trade name: Swaclean MCH) 68.0 g and diethyl carbonate (Mitsui Chemicals Fine Co., Ltd.) 4.0 g were mixed to obtain a compound D4.
  • the viscosity of the formulation D4 at 25 ° C. was 0.67 Pa ⁇ s.
  • Comparative Example 1 20 g of D1161 (manufactured by Kraton Polymer Co., Ltd., styrene content 15% by mass) as a styrene-isoprene block copolymer elastomer, and Imabe (registered trademark) P-100 (manufactured by Idemitsu Kosan Co., Ltd., based on C5 fraction as a tackifier) Hydrogenated petroleum resin of dicyclopentadiene / aromatic copolymer system, P grade has a hydrogenation (hydrogenation) rate higher than S grade) 10 g, N-2- (aminoethyl) -3 as silane coupling agent -Compound 1 was prepared by mixing 1 g of aminopropylmethyldimethoxysilane (trade name: KBM-602, manufactured by Shin-Etsu Chemical Co., Ltd.) and 70 g of ethylcyclohexane (trade name: Suwaclean ECH, manufactured by
  • Comparative Example 2 20 g of G1652 (manufactured by Kraton Polymer, styrene content 30% by mass) and 20 g of styrene-butadiene block copolymer elastomer D1101 (manufactured by Kraton Polymer, 31% by mass of styrene) as a styrene-ethylene / butylene block copolymer elastomer, tackifier 10 g of I-MAB (registered trademark) P-100 (manufactured by Idemitsu Kosan Co., Ltd., dicyclopentadiene / aromatic copolymer hydrogenated petroleum resin mainly containing C5 fraction), N-2- as a silane coupling agent 1 g of (aminoethyl) -3-aminopropylmethyldimethoxysilane (trade name: KBM-602, manufactured by Shin-Etsu Chemical Co., Ltd.) and 70 g of e
  • Comparative Example 3 25 g of D1155 (made by Kraton Polymer Co., Ltd., styrene content 40% by mass) as a styrene-butadiene block copolymer elastomer, and Quinton (registered trademark) D100 (aliphatic-aromatic copolymer petroleum resin made by Nippon Zeon Co., Ltd.) as a tackifier 6.1 g and 80 g of ethylcyclohexane (manufactured by Maruzen Petrochemical Co., Ltd., trade name: SWACLEAN ECH) as a solvent were mixed to obtain a formulation E3. The viscosity of the formulation E3 at 25 ° C. was 0.88 Pa ⁇ s.
  • Comparative Example 4 22.5 g of D1155 (made by Kraton Polymer Co., Ltd., styrene content 40% by mass) as a styrene-butadiene block copolymer elastomer, 5.5 g of Quinton (registered trademark) D100 (made by Nippon Zeon Co., Ltd.), and ethylcyclohexane as a solvent (Maruzen Petrochemical Co., Ltd., trade name: Swaclean ECH) 64 g and n-butyl acetate (Kyowa Hakko Chemical Co., Ltd., trade name: butyl acetate-P) 8 g were mixed to obtain a blend E4. The viscosity in 25 degreeC of the compound E4 was 0.66 Pa.s.
  • Comparative Example 5 22.5 g of D1155 (manufactured by Kraton Polymer Co., Ltd., styrene content 40 mass%) as a styrene-butadiene block copolymer elastomer, 3.0 g of Quinton (registered trademark) D100 (manufactured by Nippon Zeon Co., Ltd.) and Imabe (registered trademark) as a tackifier ) S-110 (manufactured by Idemitsu Kosan Co., Ltd., 2.5 g of dicyclopentadiene / aromatic copolymer hydrogenated petroleum resin mainly containing C5 fraction), ethylcyclohexane (manufactured by Maruzen Petrochemical Co., Ltd.) Name: Swaclean ECH) 64 g and n-butyl acetate (trade name: butyl acetate-P, manufactured by Kyowa Hakko Chemical Co., Ltd.) 8 g were mixed to obtain
  • Comparative Example 6 22.5 g of D1161 (manufactured by Kraton Polymer, styrene content: 15% by mass) as a styrene-isoprene block copolymer elastomer, 5.5 g of Quinton (registered trademark) D100 (manufactured by ZEON Corporation) as a tackifier, and ethylcyclohexane as a solvent (Maruzen Petrochemical Co., Ltd., trade name: Swaclean ECH) 67 g and n-butyl acetate (Kyowa Hakko Chemical Co., Ltd., trade name: butyl acetate-P) were mixed to obtain a formulation E6.
  • the viscosity in 25 degreeC of the compound E6 was 1.22 Pa.s.
  • Comparative Example 7 25 g of D1155 (made by Kraton Polymer Co., Ltd., styrene content 40% by mass) as a styrene-butadiene block copolymer elastomer, 6.1 g of Quinton (registered trademark) D100 (made by Nippon Zeon Co., Ltd.) as a tackifier, and ethylcyclohexane (Maruzen) as a solvent 98.5 g of Petrochemical Co., Ltd. trade name: SWACLEAN ECH) was mixed to prepare a compound E7. The viscosity in 25 degreeC of the compound E7 was 0.32 Pa.s.
  • Comparative Example 8 25 g of D1155 (made by Kraton Polymer Co., Ltd., styrene content 40% by mass) as a styrene-butadiene block copolymer elastomer, and Quinton (registered trademark) D100 (aliphatic-aromatic copolymer petroleum resin made by Nippon Zeon Co., Ltd.) as a tackifier 6.1 g and 80 g of methylcyclohexane (manufactured by Maruzen Petrochemical Co., Ltd., trade name: SWACLEAN MCH) as a solvent were mixed to obtain a formulation E8. The viscosity in 25 degreeC of the compound E8 was 0.72 Pa.s.
  • the viscosity was measured by the following method. Using a sample of 10 mL, using a viscometer (manufactured by Brookfield, model: DV-II + Pro), using a small sample adapter and a spindle of model number C4-31, at a temperature of 25.0 ° C. and a rotation speed of 20 rpm The value when the viscosity became almost constant was measured.
  • tack free time was evaluated by the following method.
  • Formulations D1 to D4 and Formulations E1 and E3 to E8 were each coated on glass using an automatic dispenser so that the thickness after drying was about 350 ⁇ m. After coating, the coating surface was checked for stickiness for 30 seconds. Each was confirmed by finger touch. The first time when stickiness disappeared was defined as tack-free time.
  • the tack free time is an index of quick drying property, and the shorter the free time, the better.
  • the formulation E2 was too high in viscosity and could not be applied with an automatic dispenser.
  • the adhesive force is fixed to a tensile tester (manufactured by Shimadzu Corporation, EZ Test / CE) so that the cured film peeled off from the glass plate forms an angle of 90 degrees, and the initial distance between chucks is 2.5 cm.
  • the 90-degree peel strength was measured at 23 ° C. at a speed of 50 mm / min.
  • X in “peelability” means that the cured film was cut during measurement of 90-degree peel strength
  • in “peelability” means 90-degree peel strength. It means that the cured film could be peeled off without being cut during the measurement.
  • a certain level of adhesion is necessary to maintain moisture resistance and insulation reliability, but if there is a defect in the LCD panel pre-shipment inspection, the glass panel will be reused (the flexible wiring board will be discarded).
  • the film can be peeled off without breaking the coating film.
  • the board (henceforth a "polyimide film sticking epoxy resin board") which bonded the surface in which this compound of polyimide film was not apply
  • the epoxy resin board containing glass cloth with the double-sided adhesive tape was produced.
  • the adhesive force is fixed to a tensile tester (manufactured by Shimadzu Corporation, EZ Test / CE) so that the cured film peeled off from the polyimide resin-attached epoxy resin plate forms an angle of 90 degrees.
  • peel strength was determined by measuring 90 ° at a speed of 50 mm / min at 23 ° C. and 2.5 cm. The results are shown in Table 1.
  • X in “peelability” means that the cured film was cut during measurement of 90-degree peel strength
  • in “peelability” means 90-degree peel strength. It means that the cured film could be peeled off without being cut during the measurement.
  • a self-supporting film was formed by overcoating the compounds D1 to D4 and the compounds E1 and E3 to E8 on a Teflon (registered trademark) plate using a bar coater so that the thickness after drying was about 130 ⁇ m. Produced. Using a moisture permeable cup jig (manufactured by Tester Sangyo Co., Ltd.), the moisture permeability of these free-standing films was measured in accordance with JIS Z0208. The test conditions for moisture permeability were a temperature of 40 ° C., a humidity of 90% RH, and 24 hours.
  • a substrate having a fine comb pattern shape described in JPCA-ET01, manufactured by etching a flexible copper-clad laminate (manufactured by Sumitomo Metal Mining Co., Ltd., grade name: Esperflex, copper thickness: 8 ⁇ m, polyimide thickness: 38 ⁇ m) (Copper wiring width / copper wiring width 15 ⁇ m / 15 ⁇ m)
  • the coatings D1 to D4, E1, and E3 to E8 were each applied to a flexible wiring board that had been subjected to tin plating so that the thickness after drying would be 100 ⁇ m. After being kept at room temperature for 10 minutes, it was dried at 70 ° C. for 1.5 hours.
  • composition D1 to D4 and E1, E3 to E8 are each dried to a thickness of 100 ⁇ m on a patterned electrode in which a comb-shaped ITO wiring having a line / space of 40 ⁇ m / 10 ⁇ m is formed on a glass substrate. After coating and holding at room temperature for 10 minutes, it was dried at 70 ° C. for 1.5 hours. Using this test piece, a bias voltage of 30 V was applied, and a constant temperature and humidity test under the conditions of a temperature of 85 ° C. and a humidity of 85% RH was performed using MIGRATION TESTER MODEL MIG-8600 (manufactured by IMV). The resistance values 1000 hours after the start and start of the temperature and humidity steady test are shown in Table 1.
  • the compounds D1 to D4 are excellent in drying property, adhesion to a glass substrate, and long-term insulation reliability, and have a low viscosity of 1.2 Pa ⁇ s or less.
  • the formulation E2 has a high viscosity and poor handling properties, and the formulations E1, E3 to E8 are inferior in drying rate or always generate a filamentous coating liquid. It can be seen that the product is suitable for a moisture-proof insulating material to be applied using a dispenser.
  • the moisture-proof insulating material of the present invention is a composition that can exhibit low viscosity and quick drying properties, and by coating with this moisture-proof insulating material, it is possible to obtain an electronic component that is highly moisture-proof and insulated.

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Abstract

Provided is a moistureproof insulation material that has a solid content concentration that is able to secure a thickness capable of achieving sufficient moistureproofness after coating/drying, within a viscosity range wherein the moistureproof insulation material can be easily applied with a dispenser, and that has excellent adhesion characteristic with respect to glass base material or polyimide, and excellent long-term insulation reliability. Also provided is an electronic part insulated with the moistureproof insulation material. The present invention is a moistureproof insulation material comprising a styrenic thermoplastic elastomer, a tackifier, and a solvent, and is characterized in having the aforementioned solvent further comprising an aliphatic hydrocarbon type solvent having a boiling point of not less than 80°C and less than 110°C, and a solvent comprising dialkyl carbonate indicated by the following chemical formula (1) (diethyl carbonate or dimethyl carbonate, for example). Preferably, the solvent further comprises an aliphatic hydrocarbon type solvent having a boiling point of not less than 110°C and less than 140°C (ethylcyclohexane or dimethylcyclohexane, for example). (R1 and R2 in the chemical formula (1) indicate a methyl group and an ethyl group, respectively, and independent of each other)

Description

防湿絶縁材料Moisture-proof insulation material
 本発明は、作業性、速乾燥性に優れた電子部品の防湿絶縁材料、およびその防湿絶縁材料によって絶縁処理された電子部品に関する。 The present invention relates to a moisture-proof insulating material for an electronic component excellent in workability and quick drying property, and an electronic component insulated by the moisture-proof insulating material.
 従来、電子機器の製造工程においては、実装回路板や電極などの金属露出部を、湿気や塵埃あるいは腐食性ガスなどから保護する目的で、絶縁性皮膜によるコーティングが行われている。このコーティング材料には紫外線硬化型、湿気硬化型、溶媒乾燥型などのタイプがあり、それぞれアクリル樹脂、シリコーン樹脂、スチレンブロック共重合体樹脂などが使用されている。 Conventionally, in the manufacturing process of electronic devices, coating with an insulating film is performed for the purpose of protecting exposed metal parts such as mounting circuit boards and electrodes from moisture, dust, corrosive gas, and the like. This coating material includes types such as an ultraviolet curable type, a moisture curable type, and a solvent dry type, and acrylic resin, silicone resin, styrene block copolymer resin, and the like are used, respectively.
 湿気硬化型のコーティング材料は、シリコーン樹脂自身の耐湿性には優れているものの、透湿性があるため、回路や電極の金属を保護するためにはコーティング材料を厚く塗布しなければならない問題点がある。 Moisture-curing coating materials are excellent in moisture resistance of silicone resin itself, but have moisture permeability, so there is a problem that a thick coating material must be applied to protect the metal of circuits and electrodes. is there.
 紫外線硬化型のコーティング材料は、短時間での硬化が可能で生産性に優れているため広く使用されている。このような紫外線硬化型コーティング材料としては、例えば、特開2007-308681号公報に記載のポリオレフィンポリオールや特開2007-332279号公報に記載のポリカーボネートポリオールから誘導されたウレタン変性アクリレート化合物などが知られている。 UV curable coating materials are widely used because they can be cured in a short time and have excellent productivity. As such an ultraviolet curable coating material, for example, a polyolefin polyol described in JP-A-2007-308681 and a urethane-modified acrylate compound derived from a polycarbonate polyol described in JP-A-2007-332279 are known. ing.
 電子機器の製造工程においては、防湿絶縁材料によるコーティング処理を実施した後に何らかの不具合が確認されると、その不具合が発生した部品を除去して再度新たな部品を接合し直すというリペア工程がある。このリペア工程において部品を再接合する際には、不具合の発生する部位が不確定であるため、紫外線照射時の位置決めが困難であり、溶媒乾燥型のコーティング材料が使用されることが多い。 In the electronic device manufacturing process, there is a repair process in which when a defect is confirmed after the coating treatment with the moisture-proof insulating material is performed, the defective part is removed and a new part is joined again. When the parts are rejoined in this repair process, the location where the problem occurs is uncertain, so positioning during ultraviolet irradiation is difficult, and solvent-drying coating materials are often used.
 溶媒乾燥型のコーティング材料用組成物としては、特開2003-145687号公報にスチレン系熱可塑性エラストマー、粘着付与剤およびトルエンからなる組成物が開示されている。しかし、毒性や環境の観点で、トルエンよりも影響が小さい溶媒を使用することが望まれている。 As a solvent-drying type coating material composition, JP-A No. 2003-145687 discloses a composition comprising a styrene thermoplastic elastomer, a tackifier, and toluene. However, from the viewpoint of toxicity and environment, it is desired to use a solvent having a smaller influence than toluene.
 また、特開2005-126456号公報、特開2005-162986号公報、特開2006-16531号公報、および特開2006-45340号公報に、スチレン系熱可塑性エラストマー、粘着付与剤、シランカップリング剤およびエチルシクロヘキサンからなる組成物が開示されている。しかし、エチルシクロヘキサンを主成分とする溶媒では、乾燥性を速めるために固形分濃度を高くすると、組成物の粘度が高くなってしまい、その結果、作業性(即ち、ポッティング性能)が低下する。また、低粘度化するために、エチルシクロヘキサンの量を増やすと、130μm程度の乾燥後の膜厚を形成する場合には、室温でタックが無くなるまでの時間が5分程度或いはそれ以上かかってしまう状況にあった。 JP-A-2005-126456, JP-A-2005-162986, JP-A-2006-16531, and JP-A-2006-45340 disclose styrenic thermoplastic elastomers, tackifiers, and silane coupling agents. And a composition consisting of ethylcyclohexane. However, in a solvent containing ethylcyclohexane as a main component, if the solid content concentration is increased in order to increase the drying property, the viscosity of the composition increases, and as a result, workability (ie, potting performance) decreases. In addition, when the amount of ethylcyclohexane is increased in order to reduce the viscosity, when a film thickness after drying of about 130 μm is formed, it takes about 5 minutes or more until tack disappears at room temperature. Was in the situation.
特開2007-308681号公報JP 2007-308681 A 特開2007-332279号公報JP 2007-332279 A 特開2003-145687号公報JP 2003-145687 A 特開2005-126456号公報JP 2005-126456 A 特開2005-162986号公報JP 2005-162986 A 特開2006-16531号公報JP 2006-16531 A 特開2006-45340号公報JP 2006-45340 A
 溶媒乾燥型のコーティング材料は硬化反応を伴わないため、塗布・乾燥のみで必要な物性が発現できなければならず、そのため樹脂の分子量は大きくならざるを得ない。しかし樹脂の分子量が大きくなるほどコーティング材料の粘度が高くなり、作業性が低下する。あるいは作業性を確保するためにコーティング材料を希釈すると、塗布・乾燥後のコーティング膜の厚みが薄くなり、防湿性に劣る懸念があり、さらに、塗布後、塗膜の表面のタックが無くなるまでの時間が長くかかるため、生産性が落ちるという問題があった。 Since the solvent-drying coating material does not involve a curing reaction, the necessary physical properties must be expressed only by coating and drying, and the molecular weight of the resin must be increased. However, as the molecular weight of the resin increases, the viscosity of the coating material increases and workability decreases. Alternatively, if the coating material is diluted to ensure workability, the thickness of the coating film after application / drying may be reduced, resulting in inferior moisture resistance. Since it took a long time, there was a problem that productivity decreased.
 工程の効率化のため溶媒乾燥型のコーティング材料は塗布後3分程度或いはそれ以下の時間で次工程に移ることが望ましく、速乾燥性が求められる。しかし、乾燥があまりに速すぎるとポッティングの際に、ポッティング液に曳糸性が生じたり、ひどい場合にはシリンジ先端部の詰まりなどの不具合が生じるため、適度な乾燥性が必要である。 In order to improve the efficiency of the process, it is desirable that the solvent-drying type coating material be transferred to the next process in about 3 minutes or less after application, and quick drying is required. However, if the drying is too fast, the potting liquid may have a stringiness during potting, and if it is severe, problems such as clogging of the syringe tip will occur, so an appropriate drying property is required.
 本発明者らは上記課題を解決すべく鋭意研究を重ねた結果、スチレン系熱可塑性エラストマーを含有する溶媒乾燥型コーティング材料において、80℃以上110℃未満の沸点を有する脂肪族炭化水素系溶媒を溶媒の主成分として使用しかつジアルキルカーボネートからなる溶媒を併用することによって、低粘度かつ十分な固形分濃度を有し、速乾燥性を発現する優れた防湿絶縁皮膜が得られることを見出し、本発明を完成するに至った。 As a result of intensive studies to solve the above problems, the present inventors have found that an aliphatic hydrocarbon solvent having a boiling point of 80 ° C. or more and less than 110 ° C. in a solvent-drying coating material containing a styrene-based thermoplastic elastomer. It has been found that by using a solvent composed of a dialkyl carbonate in combination with a main component of a solvent, an excellent moisture-proof insulating film having a low viscosity and sufficient solid content concentration and expressing quick drying properties can be obtained. The invention has been completed.
 即ち、本発明(I)は、スチレン系熱可塑性エラストマー、粘着付与剤、および溶媒を含む防湿絶縁材料であって、前記溶媒が80℃以上110℃未満の沸点を有する脂肪族炭化水素系溶媒および式(1)
Figure JPOXMLDOC01-appb-C000002
(式(1)中、RとRは、それぞれ独立に、メチル基またはエチル基を表す。)
で表されるジアルキルカーボネートからなる溶媒を含むことを特徴とする防湿絶縁材料である。
That is, the present invention (I) is a moisture-proof insulating material containing a styrenic thermoplastic elastomer, a tackifier, and a solvent, wherein the solvent has an aliphatic hydrocarbon solvent having a boiling point of 80 ° C. or higher and lower than 110 ° C. Formula (1)
Figure JPOXMLDOC01-appb-C000002
(In Formula (1), R 1 and R 2 each independently represents a methyl group or an ethyl group.)
It is a moisture-proof insulating material characterized by including the solvent which consists of dialkyl carbonate represented by these.
 本発明(II)は、本発明(I)の防湿絶縁材料を用いて絶縁処理された電子部品である。 The present invention (II) is an electronic component that has been insulated using the moisture-proof insulating material of the present invention (I).
 さらに言えば、本発明は以下の[1]~[11]に関する。
 [1] スチレン系熱可塑性エラストマー、粘着付与剤、および溶媒を含む防湿絶縁材料であって、前記溶媒が80℃以上110℃未満の沸点を有する脂肪族炭化水素系溶媒および式(1)
Figure JPOXMLDOC01-appb-C000003
(式(1)中、RとRは、それぞれ独立に、メチル基またはエチル基を表す。)
で表されるジアルキルカーボネートからなる溶媒を含むことを特徴とする防湿絶縁材料。
 [2] 前記溶媒が、さらに110℃以上140℃未満の沸点を有する脂肪族炭化水素系溶媒を含むことを特徴とする[1]に記載の防湿絶縁材料。
 [3] 防湿絶縁材料中に含まれる80℃以上110℃未満の沸点を有する脂肪族炭化水素系溶媒と110℃以上140℃未満の沸点を有する脂肪族炭化水素系溶媒の質量比が65:35~97:3の範囲であることを特徴とする[2]に記載の防湿絶縁材料。
 [4] 防湿絶縁材料中に含まれる80℃以上110℃未満の沸点を有する脂肪族炭化水素系溶媒と110℃以上140℃未満の沸点を有する脂肪族炭化水素系溶媒の総量と式(1)で表されるジアルキルカーボネートからなる溶媒の質量比が85:15~98:2の範囲であることを特徴とする[1]~[3]のいずれか1つに記載の防湿絶縁材料。
 [5] 80℃以上110℃未満の沸点を有する脂肪族炭化水素系溶媒が、シクロヘキサンおよび/またはメチルシクロヘキサンであることを特徴とする[1]~[4]のいずれか1つに記載の防湿絶縁材料。
 [6] 110℃以上140℃未満の沸点を有する脂肪族炭化水素系溶媒が、cis-1,2-ジメチルシクロヘキサン、cis-1,3-ジメチルシクロヘキサン、cis-1,4-ジメチルシクロヘキサン、trans-1,2-ジメチルシクロヘキサン、trans-1,3-ジメチルシクロヘキサン、trans-1,4-ジメチルシクロヘキサンおよびエチルシクロヘキサンからなる群から選ばれる少なくとも1種であることを特徴とする[2]~[5]のいずれか1つに記載の防湿絶縁材料。
 [7] 防湿絶縁材料の総質量に対して、スチレン系熱可塑性エラストマーと粘着付与剤の総量が20~40質量%であり、溶媒の総量が60~80質量%であり、防湿絶縁材料中に含まれるスチレン系熱可塑性エラストマーと粘着付与剤の質量比が2:1~10:1の範囲であり、防湿絶縁材料中に含まれる80℃以上110℃未満の沸点を有する脂肪族炭化水素系溶媒と式(1)で表されるジアルキルカーボネートからなる溶媒の総量が、溶媒の総量に対して65質量%以上であり、さらに、防湿絶縁材料の25℃での粘度が1.2Pa・s以下であることを特徴とする[1]~[6]のいずれか1つに記載の防湿絶縁材料。
 [8] スチレン系熱可塑性エラストマーが、スチレン-ブタジエンブロック共重合エラストマー、スチレン-イソプレンブロック共重合エラストマー、スチレン-エチレン/ブチレンブロック共重合エラストマー、およびスチレン-エチレン/プロピレンブロック共重合エラストマーからなる群から選ばれる少なくとも1種であることを特徴とする請求項[1]~[7]のいずれか1つに記載の防湿絶縁材料。
 [9] スチレン系熱可塑性エラストマー中に含まれるスチレン由来の構造単位の含量が、スチレン系熱可塑性エラストマーの総量に対して15~50質量%であることを特徴とする[1]~[8]のいずれか1つに記載の防湿絶縁材料。
 [10] 粘着付与剤が、石油系樹脂粘着付与剤であることを特徴とする[1]~[9]いずれか1つに記載の防湿絶縁材料。
 [11] [1]~[10]のいずれか1つに記載の防湿絶縁材料を用いて絶縁処理された電子部品。
Furthermore, the present invention relates to the following [1] to [11].
[1] A moisture-proof insulating material containing a styrene-based thermoplastic elastomer, a tackifier, and a solvent, wherein the solvent has a boiling point of 80 ° C. or higher and lower than 110 ° C. and formula (1)
Figure JPOXMLDOC01-appb-C000003
(In Formula (1), R 1 and R 2 each independently represents a methyl group or an ethyl group.)
A moisture-proof insulating material comprising a solvent comprising a dialkyl carbonate represented by the formula:
[2] The moisture-proof insulating material according to [1], wherein the solvent further includes an aliphatic hydrocarbon solvent having a boiling point of 110 ° C. or higher and lower than 140 ° C.
[3] The mass ratio of the aliphatic hydrocarbon solvent having a boiling point of 80 ° C. or higher and lower than 110 ° C. contained in the moisture-proof insulating material to the aliphatic hydrocarbon solvent having a boiling point of 110 ° C. or higher and lower than 140 ° C. is 65:35. The moisture-proof insulating material according to [2], which is in a range of ˜97: 3.
[4] The total amount of the aliphatic hydrocarbon solvent having a boiling point of 80 ° C. or more and less than 110 ° C. and the aliphatic hydrocarbon solvent having a boiling point of 110 ° C. or more and less than 140 ° C. contained in the moisture-proof insulating material and formula (1) The moisture-proof insulating material according to any one of [1] to [3], wherein the mass ratio of the solvent comprising dialkyl carbonate represented by the formula is in the range of 85:15 to 98: 2.
[5] The moisture-proof according to any one of [1] to [4], wherein the aliphatic hydrocarbon solvent having a boiling point of 80 ° C. or higher and lower than 110 ° C. is cyclohexane and / or methylcyclohexane. Insulating material.
[6] An aliphatic hydrocarbon solvent having a boiling point of 110 ° C. or higher and lower than 140 ° C. is cis-1,2-dimethylcyclohexane, cis-1,3-dimethylcyclohexane, cis-1,4-dimethylcyclohexane, trans- [2] to [5], which are at least one selected from the group consisting of 1,2-dimethylcyclohexane, trans-1,3-dimethylcyclohexane, trans-1,4-dimethylcyclohexane and ethylcyclohexane The moisture-proof insulating material according to any one of the above.
[7] The total amount of the styrene-based thermoplastic elastomer and the tackifier is 20 to 40% by mass and the total amount of the solvent is 60 to 80% by mass with respect to the total mass of the moisture-proof insulating material. Aliphatic hydrocarbon solvent having a boiling point of 80 ° C. or more and less than 110 ° C. contained in the moisture-proof insulating material, wherein the mass ratio of the styrene thermoplastic elastomer and the tackifier contained is in the range of 2: 1 to 10: 1. And the total amount of the solvent composed of the dialkyl carbonate represented by the formula (1) is 65% by mass or more based on the total amount of the solvent, and the moisture-proof insulating material has a viscosity at 25 ° C. of 1.2 Pa · s or less. The moisture-proof insulating material according to any one of [1] to [6], wherein
[8] The styrene thermoplastic elastomer is selected from the group consisting of a styrene-butadiene block copolymer elastomer, a styrene-isoprene block copolymer elastomer, a styrene-ethylene / butylene block copolymer elastomer, and a styrene-ethylene / propylene block copolymer elastomer. The moisture-proof insulating material according to any one of claims 1 to 7, wherein the moisture-proof insulating material is at least one selected.
[9] The content of structural units derived from styrene contained in the styrenic thermoplastic elastomer is 15 to 50% by mass based on the total amount of the styrenic thermoplastic elastomer [1] to [8] The moisture-proof insulating material according to any one of the above.
[10] The moisture-proof insulating material according to any one of [1] to [9], wherein the tackifier is a petroleum resin tackifier.
[11] An electronic component that is insulated using the moisture-proof insulating material according to any one of [1] to [10].
 本発明の防湿絶縁材料は、低粘度かつ十分な固形分濃度を有し、作業性、基材との密着性、防湿性、絶縁信頼性に優れており、この防湿絶縁材料でコーティング処理することにより、高度に防湿絶縁保護された電子部品を得ることができる。 The moisture-proof insulating material of the present invention has a low viscosity and a sufficient solid content concentration, and is excellent in workability, adhesion to a substrate, moisture-proof, and insulation reliability. Thus, an electronic component that is highly moisture-proof and insulated can be obtained.
 以下、本発明を具体的に説明する。
 まず、本発明(I)の防湿絶縁材料について説明する。
 本発明(I)は、スチレン系熱可塑性エラストマー、粘着付与剤、および溶媒を含む防湿絶縁材料であって、前記溶媒が80℃以上110℃未満の沸点を有する脂肪族炭化水素系溶媒および式(1)で表されるジアルキルカーボネートからなる溶媒を含むことを特徴とする防湿絶縁材料である。
Figure JPOXMLDOC01-appb-C000004
(式(1)中、RとRは、それぞれ独立に、メチル基またはエチル基を表す。)
The present invention will be specifically described below.
First, the moisture-proof insulating material of the present invention (I) will be described.
The present invention (I) is a moisture-proof insulating material containing a styrenic thermoplastic elastomer, a tackifier, and a solvent, wherein the solvent has an aliphatic hydrocarbon solvent having a boiling point of 80 ° C. or higher and lower than 110 ° C. and a formula ( A moisture-proof insulating material comprising a solvent comprising a dialkyl carbonate represented by 1).
Figure JPOXMLDOC01-appb-C000004
(In Formula (1), R 1 and R 2 each independently represents a methyl group or an ethyl group.)
 なお、本明細書に記載の「熱可塑性エラストマー」とは、加熱することによって流動して通常の熱可塑性プラスチックと同様の成形加工ができ、常温ではゴム弾性(即ち、顕著な弾性回復)を示す性質を有する高分子化合物であり、詳細は、物理化学辞典編集委員会編、「熱可塑性エラストマーのすべて」、初版第1刷、(株)工業調査会発行、2003年12月20日 に記載されている。 The “thermoplastic elastomer” described in the present specification is flowable by heating and can be molded in the same manner as ordinary thermoplastics, and exhibits rubber elasticity (that is, remarkable elastic recovery) at room temperature. This is a high-molecular compound with properties. Details are described in “Edition Committee for Physicochemical Dictionary”, “All about Thermoplastic Elastomers”, first edition, first edition, published by Industrial Research Co., Ltd., December 20, 2003. ing.
 また、本明細書に記載の「スチレン系熱可塑性エラストマー」とは、分子構造中にスチレンに由来する構造単位を有する熱可塑性エラストマーを意味する。 Also, the “styrene thermoplastic elastomer” described in the present specification means a thermoplastic elastomer having a structural unit derived from styrene in the molecular structure.
 本発明(I)の防湿絶縁材料に用いられるスチレン系熱可塑性エラストマーは、耐湿性、絶縁信頼性に優れている。スチレン系熱可塑性エラストマーの例としては、スチレン-ブタジエンブロック共重合エラストマー、スチレン-イソプレンブロック共重合エラストマー、スチレン-エチレン/ブチレンブロック共重合エラストマー、スチレン-エチレン/プロピレンブロック共重合エラストマー等を挙げることができる。このようなスチレン系熱可塑性エラストマーの市販品としては、D1101、D1102、D1155、DKX405、DKX410、DKX415、D1192、D1161、D1171、G1652、G1730(以上、クレイトンポリマー社製)、タフプレン(登録商標)A、タフプレン(登録商標)125、タフプレン(登録商標)126S、タフテック(登録商標)H1141、タフテック(登録商標)H1041、タフテック(登録商標)H1043、タフテック(登録商標)H1052、(以上、旭化成ケミカルズ株式会社製)などが挙げられる。これらは1種または2種以上を組み合わせて用いることができる。 The styrene thermoplastic elastomer used for the moisture-proof insulating material of the present invention (I) is excellent in moisture resistance and insulation reliability. Examples of styrenic thermoplastic elastomers include styrene-butadiene block copolymer elastomers, styrene-isoprene block copolymer elastomers, styrene-ethylene / butylene block copolymer elastomers, styrene-ethylene / propylene block copolymer elastomers, and the like. it can. Commercially available products of such styrenic thermoplastic elastomers include D1101, D1102, D1155, DKX405, DKX410, DKX415, D1192, D1161, D1171, G1652, and G1730 (above, Kraton Polymer Co., Ltd.), Tufprene (registered trademark) A TUFPRENE (registered trademark) 125, TUFPRENE (registered trademark) 126S, TUFTEC (registered trademark) H1141, TUFTECH (registered trademark) H1041, TUFTECH (registered trademark) H1043, TUFTEC (registered trademark) H1052, (above, Asahi Kasei Chemicals Corporation Manufactured). These can be used alone or in combination of two or more.
 スチレン系熱可塑性エラストマー中に含まれるスチレン由来の構造単位の含量が、スチレン系熱可塑性エラストマーの総量に対して15~50質量%であることが好ましく、より好ましくは18~45質量%であり、さらに好ましくは19~43質量%である。スチレン系熱可塑性エラストマー中に含まれるスチレン由来の構造単位の含量が、スチレン系熱可塑性エラストマーの総量に対して15質量%未満の場合には、該エラストマーの凝集力不足になる場合があり、好ましいこととはいえない。また、スチレン系熱可塑性エラストマーの総量に対して50質量%より多くなると、該エラストマーのゴム的性質が無くなる傾向になり、また、防湿性能が不足する傾向にあり、好ましいこととはいえない。 The content of structural units derived from styrene contained in the styrene-based thermoplastic elastomer is preferably 15 to 50% by mass, more preferably 18 to 45% by mass, based on the total amount of the styrene-based thermoplastic elastomer. More preferably, it is 19 to 43% by mass. When the content of the structural unit derived from styrene contained in the styrene-based thermoplastic elastomer is less than 15% by mass with respect to the total amount of the styrene-based thermoplastic elastomer, the cohesive force of the elastomer may be insufficient, which is preferable. That's not true. On the other hand, if it exceeds 50% by mass with respect to the total amount of the styrenic thermoplastic elastomer, the rubber-like properties of the elastomer tend to be lost, and the moisture-proof performance tends to be insufficient, which is not preferable.
 本発明に用いられる粘着付与剤とは、ゴム弾性を有するエラストマーに代表される高分子化合物に配合して粘着機能を持たせるための物質である。エラストマーに代表される高分子化合物に比べ、分子量ははるかに小さく、一般に、分子量数百~数千のオリゴマー領域の化合物であり、室温ではガラス状態でそのもの自体ではゴム弾性を示さない性質を有する。 The tackifier used in the present invention is a substance that is added to a polymer compound typified by an elastomer having rubber elasticity to give an adhesive function. Compared to a polymer compound typified by an elastomer, the molecular weight is much smaller and is generally a compound in an oligomer region having a molecular weight of several hundred to several thousand, and has a property of not exhibiting rubber elasticity by itself in a glass state at room temperature.
 粘着付与剤としては、一般に、石油系樹脂粘着付与剤、テルペン系樹脂粘着付与剤、ロジン系樹脂粘着付与剤、クマロンインデン樹脂粘着付与剤、スチレン系樹脂粘着付与剤などを用いることができる。 As the tackifier, a petroleum resin tackifier, a terpene resin tackifier, a rosin resin tackifier, a coumarone indene resin tackifier, a styrene resin tackifier, or the like can be generally used.
 石油系樹脂粘着付与剤としては、脂肪族系石油樹脂、芳香族系石油樹脂、脂肪族-芳香族共重合系石油樹脂、脂環族系石油樹脂、ジシクロペンタジエン樹脂およびこれらの水添物等の変性物が挙げられる。合成石油樹脂は、C5系でも、C9系でもよい。 Examples of petroleum resin tackifiers include aliphatic petroleum resins, aromatic petroleum resins, aliphatic-aromatic copolymer petroleum resins, alicyclic petroleum resins, dicyclopentadiene resins, and hydrogenated products thereof. Of the modified product. The synthetic petroleum resin may be C5 or C9.
 テルペン系樹脂粘着付与剤としては、β-ピネン樹脂、α-ピネン樹脂、テルペン-フェノール樹脂、芳香族変性テルペン樹脂、水添テルペン樹脂などが挙げられる。これらのテルペン系樹脂の多くは、極性基を有しない樹脂である。 Examples of the terpene resin tackifier include β-pinene resin, α-pinene resin, terpene-phenol resin, aromatic modified terpene resin, hydrogenated terpene resin and the like. Many of these terpene resins are resins having no polar group.
 ロジン系樹脂粘着付与剤としては、ガムロジン、トール油ロジン、ウッドロジンなどのロジン;水添ロジン、不均化ロジン、重合ロジン、マレイン化ロジンなどの変性ロジン;ロジングリセリンエステル、水添ロジンエステル、水添ロジングリセリンエステルなどのロジンエステルなどが挙げられる。これらのロジン系樹脂は、極性基を有するものである。 Rosin resin tackifiers include rosins such as gum rosin, tall oil rosin, wood rosin; hydrogenated rosin, disproportionated rosin, polymerized rosin, modified rosin such as maleated rosin; rosin glycerin ester, hydrogenated rosin ester, water Examples thereof include rosin esters such as rosin glycerol ester. These rosin resins have polar groups.
 これらの粘着付与剤の中で、石油系樹脂粘着付与剤、テルペン系樹脂粘着付与剤が好ましい。さらに、好ましくは、石油系樹脂粘着付与剤である。 Of these tackifiers, petroleum resin tackifiers and terpene resin tackifiers are preferred. Furthermore, a petroleum resin tackifier is preferable.
 これらの粘着付与剤は、それぞれ単独で、あるいは2種以上を組み合わせて使用することができる。 These tackifiers can be used alone or in combination of two or more.
 スチレン系熱可塑性エラストマーおよび粘着付与剤の配合量については、防湿絶縁材料の総質量に対して、スチレン系熱可塑性エラストマーと粘着付与剤の総配合量が20~40質量%であり、好ましくは22~35質量%であり、さらに好ましくは、23~33質量%である。防湿絶縁材料の総質量に対して、スチレン系熱可塑性エラストマーと粘着付与剤の総配合量が、20質量%よりも少ないとコーティング材料の厚みが薄くなり、十分な防湿性と膜強度が得られない場合がある。さらに、固形分濃度が低くなることにより、塗布後の塗膜表面のタックが無くなるまでの時間が長くなり、その結果、生産性が低くなる場合がある。また、スチレン系熱可塑性エラストマーと粘着付与剤の総配合量が、防湿絶縁材料の総質量に対して40質量%よりも多いとコーティング材料の粘度が高くなって作業性が劣り、均一に塗布することが困難になる場合や、ディスペンサーでのポッティングの際に、シリンジが詰まる場合があり、好ましいこととはいえない。 With respect to the blending amount of the styrenic thermoplastic elastomer and the tackifier, the total blending amount of the styrenic thermoplastic elastomer and the tackifier is 20 to 40% by mass, preferably 22 with respect to the total mass of the moisture-proof insulating material. It is -35 mass%, More preferably, it is 23-33 mass%. If the total amount of the styrene-based thermoplastic elastomer and the tackifier is less than 20% by mass with respect to the total mass of the moisture-proof insulating material, the thickness of the coating material becomes thin, and sufficient moisture-proof properties and film strength can be obtained. There may not be. Furthermore, when solid content concentration becomes low, time until the coating-film surface tack after application | coating disappears becomes long, As a result, productivity may become low. Further, when the total blending amount of the styrene thermoplastic elastomer and the tackifier is more than 40% by mass with respect to the total mass of the moisture-proof insulating material, the viscosity of the coating material becomes high, the workability is inferior, and it is applied uniformly. When it becomes difficult, or when potting with a dispenser, the syringe may be clogged, which is not preferable.
 スチレン系熱可塑性エラストマーと粘着付与剤の配合比率については、質量比で、2:1~10:1の範囲であり、好ましくは2.5:1~9.5:1の範囲であり、さらに好ましくは3:1~9:1の範囲である。
 スチレン系熱可塑性エラストマーと粘着付与剤の配合比率が、質量比で、10:1より大きくなると、十分な粘着機能を発現することができない場合があり好ましくない。また、スチレン系熱可塑性エラストマーと粘着付与剤の配合比率が、質量比で、2:1より小さくなると、塗布乾燥後の皮膜の引張(破断)強度が、著しく低下してしまうことがある。その結果、不具合が発生した部品を除去して再度新たな部品を接合し直すというリペア工程の際に行われる防湿絶縁皮膜を引き剥がして除去する際に、防湿絶縁皮膜が切断されて1枚ものの膜として除去できなくなる場合が生じてしまい、好ましくない。
The blending ratio of the styrenic thermoplastic elastomer and the tackifier is in the range of 2: 1 to 10: 1, preferably in the range of 2.5: 1 to 9.5: 1, by mass ratio. The range is preferably 3: 1 to 9: 1.
If the blending ratio of the styrene-based thermoplastic elastomer and the tackifier is greater than 10: 1 by mass ratio, it may not be possible to develop a sufficient adhesion function, which is not preferable. On the other hand, if the blending ratio of the styrene-based thermoplastic elastomer and the tackifier is less than 2: 1 by mass ratio, the tensile (breaking) strength of the coating after application and drying may be significantly reduced. As a result, when the moisture-proof insulating film is removed by removing the moisture-proof insulating film that is removed during the repair process, in which the defective part is removed and a new part is re-joined, one piece of the moisture-proof insulating film is cut. Since it may become impossible to remove as a film, it is not preferable.
 本発明(I)の防湿絶縁材料は、80℃以上110℃未満の沸点を有する脂肪族炭化水素系溶媒を必須成分として含む。本明細書において、別段の定めがない限り、沸点とは、1気圧における沸点をいう。
 尚、脂肪族炭化水素系溶媒とは、脂肪族炭化水素のみからなる溶媒または脂肪族炭化水素を概ね80%以上含有する溶媒を意味する。
The moisture-proof insulating material of the present invention (I) contains an aliphatic hydrocarbon solvent having a boiling point of 80 ° C. or higher and lower than 110 ° C. as an essential component. In this specification, unless otherwise specified, the boiling point refers to the boiling point at 1 atmosphere.
The term “aliphatic hydrocarbon solvent” means a solvent composed of only aliphatic hydrocarbons or a solvent containing approximately 80% or more of aliphatic hydrocarbons.
 80℃以上110℃未満の沸点を有する脂肪族炭化水素系溶媒としては、例えば、n-ヘプタン(沸点98.4℃)、シクロヘキサン(沸点80.7℃)、メチルシクロヘキサン(沸点101.1℃)等を挙げることができる。これらの中で、好ましいものとしては、シクロヘキサン、メチルシクロヘキサンである。最も好ましいものとしては、メチルシクロヘキサンである。 Examples of the aliphatic hydrocarbon solvent having a boiling point of 80 ° C. or higher and lower than 110 ° C. include n-heptane (boiling point 98.4 ° C.), cyclohexane (boiling point 80.7 ° C.), methylcyclohexane (boiling point 101.1 ° C.). Etc. Of these, preferred are cyclohexane and methylcyclohexane. Most preferred is methylcyclohexane.
 本発明(I)の防湿絶縁材料は、式(1)で表されるジアルキルカーボネートからなる溶媒を必須成分として含む。
Figure JPOXMLDOC01-appb-C000005
(式(1)中、RとRは、それぞれ独立に、メチル基またはエチル基を表す。)
The moisture-proof insulating material of the present invention (I) contains a solvent composed of a dialkyl carbonate represented by the formula (1) as an essential component.
Figure JPOXMLDOC01-appb-C000005
(In formula (1), R 1 and R 2 each independently represents a methyl group or an ethyl group.)
 式(1)で表されるジアルキルカーボネートからなる溶媒の例としては、ジメチルカーボネート、メチルエチルカーボネート、ジエチルカーボネートを挙げることができる。
 これらの中で、速乾燥性と曳糸性のバランスを考慮すると、最も好ましいものはジエチルカーボネートである。
Examples of the solvent comprising the dialkyl carbonate represented by the formula (1) include dimethyl carbonate, methyl ethyl carbonate, and diethyl carbonate.
Of these, diethyl carbonate is most preferable in consideration of the balance between quick drying and spinnability.
 本発明(I)の防湿絶縁材料は、さらに、110℃以上140℃未満の沸点を有する脂肪族炭化水素系溶媒を含むことが好ましい。
 110℃以上140℃未満の沸点を有する脂肪族炭化水素系溶媒としては、例えば、n-オクタン(沸点125.7℃)、cis-1,2-ジメチルシクロヘキサン(沸点129.7℃)、cis-1,3-ジメチルシクロヘキサン(沸点120.1℃)、cis-1,4-ジメチルシクロヘキサン(沸点124.3℃)、trans-1,2-ジメチルシクロヘキサン(沸点123.4℃)、trans-1,3-ジメチルシクロヘキサン(沸点124.5℃)、trans-1,4-ジメチルシクロヘキサン(沸点119.4℃)、エチルシクロヘキサン(沸点132℃)等を挙げることができる。これらの中で、好ましいものとしては、cis-1,2-ジメチルシクロヘキサン、cis-1,3-ジメチルシクロヘキサン、cis-1,4-ジメチルシクロヘキサン、trans-1,2-ジメチルシクロヘキサン、trans-1,3-ジメチルシクロヘキサン、trans-1,4-ジメチルシクロヘキサン、エチルシクロヘキサンであり、入手の容易さを考慮すると、エチルシクロヘキサンが最も好ましい。
It is preferable that the moisture-proof insulating material of the present invention (I) further includes an aliphatic hydrocarbon solvent having a boiling point of 110 ° C. or higher and lower than 140 ° C.
Examples of the aliphatic hydrocarbon solvent having a boiling point of 110 ° C. or higher and lower than 140 ° C. include n-octane (boiling point 125.7 ° C.), cis-1,2-dimethylcyclohexane (boiling point 129.7 ° C.), cis- 1,3-dimethylcyclohexane (boiling point 120.1 ° C.), cis-1,4-dimethylcyclohexane (boiling point 124.3 ° C.), trans-1,2-dimethylcyclohexane (boiling point 123.4 ° C.), trans-1, Examples thereof include 3-dimethylcyclohexane (boiling point 124.5 ° C.), trans-1,4-dimethylcyclohexane (boiling point 119.4 ° C.), ethylcyclohexane (boiling point 132 ° C.), and the like. Of these, preferred are cis-1,2-dimethylcyclohexane, cis-1,3-dimethylcyclohexane, cis-1,4-dimethylcyclohexane, trans-1,2-dimethylcyclohexane, trans-1, 3-Dimethylcyclohexane, trans-1,4-dimethylcyclohexane, and ethylcyclohexane. Considering availability, ethylcyclohexane is most preferable.
 また、80℃以上110℃未満の沸点を有する脂肪族炭化水素系溶媒、式(1)で表されるジアルキルカーボネートからなる溶媒および110℃以上140℃未満の沸点を有する脂肪族炭化水素系溶媒以外の溶媒を併用することも特性を損なわない範囲であれば可能である。これらの溶媒としては、例えば、デカヒドロナフタリン等の脂環構造を有する炭化水素溶媒、酢酸n-プロピル、酢酸n-ブチル、酢酸イソブチル、酢酸t-ブチル、酢酸イソプロピル、酢酸エチル等の酢酸エステル系溶媒、エチレングリコールジメチルエーテル、エチレングリコールジエチルエーテル、エチレングリコールモノエチルエーテル、プロピレングリコールジメチルエーテル、プロピレングリコールモノメチルエーテル等のエーテル系溶媒、エタノール、1-プロパノール、2-プロパノール等のアルコール系溶媒、アセトン、メチルエチルケトン、メチルイソブチルケトン等のケトン系溶媒および石油ナフサ等が挙げられる。防湿絶縁材料を塗布後、室温無風の条件下における乾燥性と作業性を考慮すると、沸点が140℃以下であることが望ましく、具体的には、酢酸n-ブチル、酢酸イソブチル、酢酸t-ブチル、酢酸イソプロピル、酢酸エチル、酢酸n-プロピル等の酢酸エステル系溶媒が好ましく、さらに好ましくは、酢酸n-プロピル、酢酸イソブチル、酢酸t-ブチル、酢酸n-ブチルである。 In addition, an aliphatic hydrocarbon solvent having a boiling point of 80 ° C. or more and less than 110 ° C., a solvent comprising a dialkyl carbonate represented by the formula (1), and an aliphatic hydrocarbon solvent having a boiling point of 110 ° C. or more and less than 140 ° C. It is possible to use these solvents in combination as long as the characteristics are not impaired. Examples of these solvents include hydrocarbon solvents having an alicyclic structure such as decahydronaphthalene, acetate esters such as n-propyl acetate, n-butyl acetate, isobutyl acetate, t-butyl acetate, isopropyl acetate, and ethyl acetate. Solvents, ether solvents such as ethylene glycol dimethyl ether, ethylene glycol diethyl ether, ethylene glycol monoethyl ether, propylene glycol dimethyl ether, propylene glycol monomethyl ether, alcohol solvents such as ethanol, 1-propanol, 2-propanol, acetone, methyl ethyl ketone, Examples thereof include ketone solvents such as methyl isobutyl ketone and petroleum naphtha. In consideration of the drying property and workability under the condition of no wind at room temperature after applying the moisture-proof insulating material, the boiling point is desirably 140 ° C. or less, specifically, n-butyl acetate, isobutyl acetate, t-butyl acetate Acetate solvents such as isopropyl acetate, ethyl acetate, and n-propyl acetate are preferred, and n-propyl acetate, isobutyl acetate, t-butyl acetate, and n-butyl acetate are more preferred.
 防湿絶縁材料に含まれる溶媒の総量は、防湿絶縁材料の総質量に対して、好ましくは60~80質量%であり、より好ましくは65~78質量%であり、さらに好ましくは70~76質量%である。溶媒の総量が多すぎると、コーティング材料の厚みが薄くなり、十分な防湿性と膜強度が得られない場合がある。さらに、固形分濃度が低くなることにより、塗布後の塗膜表面のタックが無くなるまでの時間が長くなり、その結果、生産性が低くなる場合がある。逆に、溶媒の総量が少なすぎると、コーティング材料の粘度が高くなって作業性が劣り、均一に塗布することが困難になる場合や、ディスペンサーでのポッティングの際に、シリンジが詰まる場合がある。 The total amount of the solvent contained in the moisture-proof insulating material is preferably 60 to 80% by mass, more preferably 65 to 78% by mass, and still more preferably 70 to 76% by mass with respect to the total mass of the moisture-proof insulating material. It is. When the total amount of the solvent is too large, the thickness of the coating material becomes thin and sufficient moisture resistance and film strength may not be obtained. Furthermore, when solid content concentration becomes low, time until the coating-film surface tack after application | coating disappears becomes long, As a result, productivity may become low. On the other hand, if the total amount of the solvent is too small, the viscosity of the coating material becomes high, the workability is inferior, it becomes difficult to apply uniformly, and the syringe may be clogged when potting with a dispenser. .
 80℃以上110℃未満の沸点を有する脂肪族炭化水素系溶媒と110℃以上140℃未満の沸点を有する脂肪族炭化水素系溶媒を併用する場合には、その配合比率は、質量比で、好ましくは65:35~97:3であり、より好ましくは68:32~95:5である。80℃以上110℃未満の沸点を有する脂肪族炭化水素系溶媒と110℃以上140℃未満の沸点を有する脂肪族炭化水素系溶媒の配合比率は、質量比で65:35より小さくなると、防湿絶縁材料を塗布した後、塗膜表面のタックが無くなるまでの時間が長くかかってしまう場合がある。80℃以上110℃未満の沸点を有する脂肪族炭化水素系溶媒と110℃以上140℃未満の沸点を有する脂肪族炭化水素系溶媒の配合比率は、質量比で97:3より大きくなると、スチレン系熱可塑性エラストマーの濃度が高い組成物の場合には、乾燥が速くなりすぎ、ディスペンサーのシリンジが詰まったり、塗出液が曳糸性を有する場合があり、好ましいこととは言えない。 When an aliphatic hydrocarbon solvent having a boiling point of 80 ° C. or more and less than 110 ° C. and an aliphatic hydrocarbon solvent having a boiling point of 110 ° C. or more and less than 140 ° C. are used in combination, the blending ratio is preferably a mass ratio. Is 65:35 to 97: 3, more preferably 68:32 to 95: 5. When the blending ratio of the aliphatic hydrocarbon solvent having a boiling point of 80 ° C. or more and less than 110 ° C. and the aliphatic hydrocarbon solvent having a boiling point of 110 ° C. or more and less than 140 ° C. is less than 65:35 by mass ratio, moisture-proof insulation After applying the material, it may take a long time to eliminate tackiness on the surface of the coating film. When the blending ratio of the aliphatic hydrocarbon solvent having a boiling point of 80 ° C. or more and less than 110 ° C. and the aliphatic hydrocarbon solvent having a boiling point of 110 ° C. or more and less than 140 ° C. is greater than 97: 3 by mass ratio, In the case of a composition having a high thermoplastic elastomer concentration, drying is too fast, the syringe of the dispenser may be clogged, and the coating solution may have spinnability, which is not preferable.
 防湿絶縁材料中に含まれる80℃以上110℃未満の沸点を有する脂肪族炭化水素系溶媒(110℃以上140℃未満の沸点を有する脂肪族炭化水素系溶媒を併用する場合は、80℃以上110℃未満の沸点を有する脂肪族炭化水素系溶媒と110℃以上140℃未満の沸点を有する脂肪族炭化水素系溶媒の総量)と式(1)で表されるジアルキルカーボネートからなる溶媒の質量比は、好ましくは85:15~98:2の範囲であり、より好ましくは88:12~97:3の範囲である。ジアルキルカーボネートからなる溶媒の比率が少なすぎると、ディスペンサーからの液の塗出の際に、塗出液が曳糸性を有する場合がある。逆に、ジアルキルカーボネートからなる溶媒の比率が多すぎると、熱可撓性エラストマーの溶解性が低下してしまう場合がある。 An aliphatic hydrocarbon solvent having a boiling point of 80 ° C. or more and less than 110 ° C. contained in the moisture-proof insulating material (when an aliphatic hydrocarbon solvent having a boiling point of 110 ° C. or more and less than 140 ° C. is used in combination, 80 ° C. or more and 110 ° C. The total mass of the aliphatic hydrocarbon solvent having a boiling point of less than ℃ and the aliphatic hydrocarbon solvent having a boiling point of 110 ° C. or more and less than 140 ° C.) and the mass ratio of the solvent comprising the dialkyl carbonate represented by the formula (1) is , Preferably in the range of 85:15 to 98: 2, and more preferably in the range of 88:12 to 97: 3. If the ratio of the solvent composed of dialkyl carbonate is too small, the coating solution may have spinnability when the solution is applied from the dispenser. On the other hand, if the ratio of the solvent composed of dialkyl carbonate is too large, the solubility of the heat-flexible elastomer may decrease.
 防湿絶縁材料中に含まれる80℃以上110℃未満の沸点を有する脂肪族炭化水素系溶媒と式(1)で表されるジアルキルカーボネートからなる溶媒の総量は、溶媒の総量に対して、好ましくは65質量%以上であり、より好ましくは70~98質量%である。80℃以上110℃未満の沸点を有する脂肪族炭化水素系溶媒と式(1)で表されるジアルキルカーボネートからなる溶媒の総量が少なすぎると、熱可塑性エラストマーへの溶解性、ディスペンサーからの液の塗出時の塗出液の曳糸性の抑制、防湿絶縁材料塗布後の塗膜表面のタックが無くなるまでの時間及び防湿絶縁材料の粘度の4項目について、バランスよく制御することが困難になる傾向にあり、好ましいこととは言えない。 The total amount of the solvent composed of the aliphatic hydrocarbon solvent having a boiling point of 80 ° C. or higher and lower than 110 ° C. contained in the moisture-proof insulating material and the dialkyl carbonate represented by the formula (1) is preferably relative to the total amount of the solvent. It is 65% by mass or more, more preferably 70 to 98% by mass. If the total amount of the solvent consisting of an aliphatic hydrocarbon solvent having a boiling point of 80 ° C. or more and less than 110 ° C. and the dialkyl carbonate represented by the formula (1) is too small, the solubility in the thermoplastic elastomer, the liquid from the dispenser It is difficult to control in a well-balanced manner with respect to the four items of suppression of the spinnability of the coating liquid at the time of coating, the time until tackiness of the coating surface after application of the moisture-proof insulating material and the viscosity of the moisture-proof insulating material are eliminated. There is a tendency and it cannot be said that it is preferable.
 80℃以上110℃未満の沸点を有する脂肪族炭化水素系溶媒の全溶媒に占める割合は、好ましくは65~95質量%であり、より好ましくは70~93質量%である。
 式(1)で表されるジアルキルカーボネートからなる溶媒の全溶媒に占める割合は、好ましくは2~15質量%であり、より好ましくは2~10質量%である。
 110℃以上140℃未満の沸点を有する脂肪族炭化水素系溶媒を併用する場合には、80℃以上110℃未満の沸点を有する脂肪族炭化水素系溶媒、式(1)で表されるジアルキルカーボネートからなる溶媒および110℃以上140℃未満の沸点を有する脂肪族炭化水素系溶媒との合計量の全溶媒に占める割合は、70~100質量%が好ましい。
The ratio of the aliphatic hydrocarbon solvent having a boiling point of 80 ° C. or higher and lower than 110 ° C. to the total solvent is preferably 65 to 95% by mass, more preferably 70 to 93% by mass.
The proportion of the solvent consisting of the dialkyl carbonate represented by the formula (1) in the total solvent is preferably 2 to 15% by mass, more preferably 2 to 10% by mass.
When an aliphatic hydrocarbon solvent having a boiling point of 110 ° C. or more and less than 140 ° C. is used in combination, an aliphatic hydrocarbon solvent having a boiling point of 80 ° C. or more and less than 110 ° C., a dialkyl carbonate represented by the formula (1) The ratio of the total amount of the solvent consisting of the above and the aliphatic hydrocarbon solvent having a boiling point of 110 ° C. or higher and lower than 140 ° C. to the total solvent is preferably 70 to 100% by mass.
 本発明(I)の防湿絶縁材料は、防湿絶縁材料の25℃での粘度は、好ましくは1.2Pa・s以下であり、より好ましくは1.1Pa・s以下であり、さらに好ましくは1.0Pa・s以下である。一般的にディスペンサーを用いて塗布されるので、塗布する際のディスペンサーの圧力を考慮すると、防湿絶縁材料の25℃での粘度が1.2Pa・sより高くなると、塗布する際の圧力が高くなりすぎる場合があり、また、防湿絶縁材料をディスペンサーにより塗布する場合、塗布後の広がりが抑制され、その結果、乾燥後の厚みが必要以上に厚くなる懸念があり、好ましいこととはいえない。 In the moisture-proof insulating material of the present invention (I), the moisture-proof insulating material has a viscosity at 25 ° C. of preferably 1.2 Pa · s or less, more preferably 1.1 Pa · s or less, and still more preferably 1. 0 Pa · s or less. Since it is generally applied using a dispenser, the pressure at the time of application increases when the viscosity of the moisture-proof insulating material at 25 ° C. is higher than 1.2 Pa · s in consideration of the pressure of the dispenser. When the moisture-proof insulating material is applied by a dispenser, the spread after the application is suppressed, and as a result, there is a concern that the thickness after drying becomes unnecessarily thick, which is not preferable.
 なお、本明細書に記載の粘度は、ブルックフィールド社製のDV-II+Pro viscometer 少量サンプルアダプター(スピンドルの型番:SC4-31)を用いて、25℃、回転数20rpmで測定した値である。 In addition, the viscosity described in the present specification is a value measured at 25 ° C. and a rotation speed of 20 rpm using a DV-II + Pro viscometer small sample adapter (spindle model number: SC4-31) manufactured by Brookfield.
 本発明(I)の防湿絶縁材料は、必要に応じてレベリング剤、消泡剤、酸化防止剤、着色剤、シランカップリング剤等の添加剤を用いることができる。 In the moisture-proof insulating material of the present invention (I), additives such as a leveling agent, an antifoaming agent, an antioxidant, a coloring agent, and a silane coupling agent can be used as necessary.
 レベリング剤としては、添加することにより塗膜表面のレベリング性を向上させる機能を有する材料であれば、特に制限はない。具体的には、ポリエーテル変性ジメチルポリシロキサン共重合物、ポリエステル変性ジメチルポリシロキサン共重合物、ポリエーテル変性メチルアルキルポリシロキサン共重合物、アラルキル変性メチルアルキルポリシロキサン共重合物等が使用できる。これらは、単独で使用しても、2種以上組み合わせて使用してもよい。本発明(I)の防湿絶縁材料100質量部に対し、0.01~3質量部添加することができる。0.01質量部未満の場合には、レベリング剤の添加効果が発現しない可能性がある。また、3質量部より多い場合には、使用するレベリング剤の種類によっては、塗膜表面にべたつきが発生したり、絶縁特性を劣化させる可能性がある。 The leveling agent is not particularly limited as long as it is a material having a function of improving the leveling property of the coating film surface when added. Specifically, polyether-modified dimethylpolysiloxane copolymer, polyester-modified dimethylpolysiloxane copolymer, polyether-modified methylalkylpolysiloxane copolymer, aralkyl-modified methylalkylpolysiloxane copolymer, and the like can be used. These may be used alone or in combination of two or more. 0.01 to 3 parts by mass can be added to 100 parts by mass of the moisture-proof insulating material of the present invention (I). When the amount is less than 0.01 part by mass, the effect of adding the leveling agent may not be exhibited. On the other hand, when the amount is more than 3 parts by mass, the surface of the coating film may become sticky or the insulating properties may be deteriorated depending on the type of the leveling agent used.
 消泡剤としては、本発明(I)の防湿絶縁材料を塗布する際に、発生或いは残存する気泡を消す或いは抑制する作用を有するものであれば、特に制限はない。本発明(I)の防湿絶縁材料に使用される消泡剤としては、シリコーン系オイル、フッ素含有化合物、ポリカルボン酸系化合物、ポリブタジエン系化合物、アセチレンジオール系化合物など公知の消泡剤が挙げられる。その具体例としては、例えば、BYK-077(ビックケミー・ジャパン株式会社製)、SNデフォーマー470(サンノプコ株式会社製)、TSA750S(モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社製)、シリコーンオイルSH-203(東レ・ダウコーニング株式会社製)等のシリコーン系消泡剤、ダッポーSN-348(サンノプコ株式会社製)、ダッポーSN-354(サンノプコ株式会社製)、ダッポーSN-368(サンノプコ株式会社製)、ディスパロン230HF(楠本化成株式会社製)等のアクリル重合体系消泡剤、サーフィノールDF-110D(日信化学工業株式会社製)、サーフィノールDF-37(日信化学工業株式会社製)等のアセチレンジオール系消泡剤、FA-630(信越化学工業株式会社製)等のフッ素含有シリコーン系消泡剤等を挙げることができる。これらは、単独で使用しても、2種以上組み合わせて使用してもよい。通常、本発明(I)の防湿絶縁材料100質量部に対し、0.001~5質量部添加することができる。0.01質量部未満の場合には、消泡剤の添加効果が発現しない可能性がある。また、5質量部より多い場合には、使用する消泡剤の種類によっては、塗膜表面にべたつきが発生したり、絶縁特性を劣化させる可能性がある。 The antifoaming agent is not particularly limited as long as it has an action of eliminating or suppressing bubbles generated or remaining when the moisture-proof insulating material of the present invention (I) is applied. Examples of antifoaming agents used in the moisture-proof insulating material of the present invention (I) include known antifoaming agents such as silicone oils, fluorine-containing compounds, polycarboxylic acid compounds, polybutadiene compounds, and acetylenic diol compounds. . Specific examples thereof include, for example, BYK-077 (manufactured by Big Chemie Japan Co., Ltd.), SN deformer 470 (manufactured by San Nopco Co., Ltd.), TSA750S (manufactured by Momentive Performance Materials Japan GK), silicone oil SH-203. Silicone defoaming agents such as Toray Dow Corning Co., Ltd., Dappo SN-348 (manufactured by San Nopco), Dappo SN-354 (manufactured by San Nopco), Dappo SN-368 (manufactured by San Nopco), Acetylene such as acrylic polymer antifoaming agents such as Disparon 230HF (manufactured by Enomoto Kasei Co., Ltd.), Surfinol DF-110D (manufactured by Nissin Chemical Industry Co., Ltd.), Surfynol DF-37 (manufactured by Nissin Chemical Industry Co., Ltd.) Diol-based antifoaming agent, FA-630 (Shin-Etsu Chemical) Business Co., Ltd.), a fluorine-containing silicone-based anti-foaming agent such as, etc. can be mentioned. These may be used alone or in combination of two or more. Usually, 0.001 to 5 parts by mass can be added to 100 parts by mass of the moisture-proof insulating material of the present invention (I). If the amount is less than 0.01 parts by mass, the effect of adding the antifoaming agent may not be exhibited. On the other hand, when the amount is more than 5 parts by mass, the surface of the coating film may become sticky or the insulating properties may be deteriorated depending on the type of antifoaming agent used.
 着色剤としては、公知の無機顔料、有機系顔料、および有機系染料等が挙げられ、所望する色調に応じてそれぞれを配合する。本発明(I)の防湿絶縁材料に用いられる着色剤としては油溶性の染料が好ましく、具体例としては、例えば、OIL BLACK860(オリエント化学工業株式会社製)、OIL BLACK 803(オリエント化学工業株式会社製)、OIL BLUE 2N(オリエント化学工業株式会社製)、OIL BLUE 630(オリエント化学工業株式会社製)、SOT Black(保土谷化学工業株式会社製)などを挙げることができる。これらは、単独で使用しても、2種以上組み合わせて使用してもよい。通常、これらの染料の添加量は、本発明(I)の防湿絶縁材料100質量部に対し、0.01~5質量部添加することができる。 Examples of the colorant include known inorganic pigments, organic pigments, organic dyes, and the like, and each is blended according to a desired color tone. The colorant used in the moisture-proof insulating material of the present invention (I) is preferably an oil-soluble dye. Specific examples include, for example, OIL BLACK860 (manufactured by Orient Chemical Industry Co., Ltd.), OIL BLACK 803 (Orient Chemical Industry Co., Ltd.). And OIL BLUE 2N (made by Orient Chemical Co., Ltd.), OIL BLUE 630 (made by Orient Chemical Co., Ltd.), SOT Black (made by Hodogaya Chemical Co., Ltd.), and the like. These may be used alone or in combination of two or more. Usually, the added amount of these dyes can be 0.01 to 5 parts by mass with respect to 100 parts by mass of the moisture-proof insulating material of the present invention (I).
 本発明(I)の防湿絶縁材料の酸化劣化および加熱時の変色を押さえることが必要な場合には、酸化防止剤を使用することができ、かつ、好ましい。
 酸化防止剤としては、本発明(I)の防湿絶縁材料の熱劣化や変色を防止する作用のある化合物であれば特に制限は無く、例えば、フェノール系酸化防止剤等を使用することができる。
 フェノール系酸化防止剤としては、例えば、下記式(2)~式(12)のような化合物を挙げることができる。
Figure JPOXMLDOC01-appb-C000006
Figure JPOXMLDOC01-appb-C000007
Figure JPOXMLDOC01-appb-C000008
Figure JPOXMLDOC01-appb-C000009
Figure JPOXMLDOC01-appb-C000010
Figure JPOXMLDOC01-appb-C000011
Figure JPOXMLDOC01-appb-C000012
Figure JPOXMLDOC01-appb-C000013
Figure JPOXMLDOC01-appb-C000014
Figure JPOXMLDOC01-appb-C000015
Figure JPOXMLDOC01-appb-C000016
When it is necessary to suppress oxidative degradation and discoloration during heating of the moisture-proof insulating material of the present invention (I), an antioxidant can be used and is preferable.
The antioxidant is not particularly limited as long as it is a compound capable of preventing thermal deterioration and discoloration of the moisture-proof insulating material of the present invention (I). For example, a phenol-based antioxidant can be used.
Examples of phenolic antioxidants include compounds represented by the following formulas (2) to (12).
Figure JPOXMLDOC01-appb-C000006
Figure JPOXMLDOC01-appb-C000007
Figure JPOXMLDOC01-appb-C000008
Figure JPOXMLDOC01-appb-C000009
Figure JPOXMLDOC01-appb-C000010
Figure JPOXMLDOC01-appb-C000011
Figure JPOXMLDOC01-appb-C000012
Figure JPOXMLDOC01-appb-C000013
Figure JPOXMLDOC01-appb-C000014
Figure JPOXMLDOC01-appb-C000015
Figure JPOXMLDOC01-appb-C000016
 本発明(I)の防湿絶縁材料を塗布してできる塗膜のガラスや金属酸化物への強固な密着性が要求される場合には、シランカップリング剤を使用することができる。
 シランカップリング剤とは、分子内に有機材料と反応結合する官能基、および無機材料と反応結合する官能基を同時に有する有機ケイ素化合物で、一般的にその構造は下記式(13)のように示される。
Figure JPOXMLDOC01-appb-C000017
 ここで、Yは有機材料と反応結合する官能基で、ビニル基、エポキシ基、アミノ基、置換アミノ基、(メタ)アクリロイル基、メルカプト基等がその代表例として挙げられる。Xは無機材料と反応する官能基で、水、あるいは湿気により加水分解を受けてシラノールを生成する。このシラノールが無機材料と反応結合する。Xの代表例としてアルコキシ基、アセトキシ基、塩素原子などを挙げることができる。Rは、2価の有機基であり、Rはアルキル基を表す。aは1~3の整数を表し、bは0~2の整数を表す。ただし、a+b=3である。
A silane coupling agent can be used when a strong adhesion to a glass or metal oxide of a coating film formed by applying the moisture-proof insulating material of the present invention (I) is required.
A silane coupling agent is an organosilicon compound having a functional group reactively bonded to an organic material and a functional group reactively bonded to an inorganic material in the molecule, and generally has a structure as shown in the following formula (13). Indicated.
Figure JPOXMLDOC01-appb-C000017
Here, Y is a functional group reactively bonded to an organic material, and representative examples thereof include a vinyl group, an epoxy group, an amino group, a substituted amino group, a (meth) acryloyl group, a mercapto group, and the like. X is a functional group that reacts with an inorganic material and is hydrolyzed by water or moisture to produce silanol. This silanol reacts with the inorganic material. Representative examples of X include an alkoxy group, an acetoxy group, a chlorine atom, and the like. R 3 is a divalent organic group, and R 4 represents an alkyl group. a represents an integer of 1 to 3, and b represents an integer of 0 to 2. However, a + b = 3.
 シランカップリング剤としては、例えば、3-イソシアネートプロピルトリエトキシシラン、3-イソシアネートプロピルトリメトキシシラン、3-イソシアネートプロピルメチルジエトキシシラン、3-イソシアネートプロピルメチルジメトキシシラン、p-スチリルトリメトキシシラン、p-スチリルトリエトキシシラン、ビニルトリメトキシシラン、ビニルトリエトキシシラン、ビニルトリイソプロポキシシラン、ビニルトリス(2-メトキシエトキシ)シラン、3-アクリロイルオキシプロピルトリメトキシシラン、3-メタクリロイルオキシプロピルトリメトキシシラン、3-アクリロイルオキシプロピルトリエトキシシラン、3-メタクリロイルオキシプロピルトリエトキシシラン、3-アクリロイルオキシプロピルメチルジメトキシシラン、3-メタクリロイルオキシプロピルメチルジメトキシシラン、3-アクリロイルオキシプロピルメチルジエトキシシラン、3-メタクリロイルオキシプロピルメチルジエトキシシラン、2-(3,4-エポキシシクロヘキシル)エチルトリメトキシシラン、3-グリシドキシプロピルトリメトキシシラン、3-グリシドキシプロピルメチルジメトキシシラン、3-グリシドキシプロピルトリエトキシシラン、3-グリシドキシプロピルメチルジエトキシシラン、N-2-(アミノエチル)-3-アミノプロピルメチルジメトキシシラン、N-(2-アミノエチル)-3-アミノプロピルトリメトキシシラン、N-(2-アミノエチル)-3-アミノプロピルトリエトキシシラン、3-アミノプロピルトリメトキシシラン、3-アミノプロピルトリエトキシシラン、3-トリエトキシシリル-N-(1,3-ジメチル-ブチリデン)プロピルアミン、N-フェニル-3-アミノプロピルトリメトキシシラン、3-メルカプトプロピルトリメトキシシラン、3-メルカプトプロピルトリエトキシシラン、アリルトリメトキシシラン等を挙げることができる。 Examples of the silane coupling agent include 3-isocyanatopropyltriethoxysilane, 3-isocyanatopropyltrimethoxysilane, 3-isocyanatopropylmethyldiethoxysilane, 3-isocyanatopropylmethyldimethoxysilane, p-styryltrimethoxysilane, p -Styryltriethoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, vinyltriisopropoxysilane, vinyltris (2-methoxyethoxy) silane, 3-acryloyloxypropyltrimethoxysilane, 3-methacryloyloxypropyltrimethoxysilane, 3 -Acryloyloxypropyltriethoxysilane, 3-methacryloyloxypropyltriethoxysilane, 3-acryloyloxypropylmethyldi Toxisilane, 3-methacryloyloxypropylmethyldimethoxysilane, 3-acryloyloxypropylmethyldiethoxysilane, 3-methacryloyloxypropylmethyldiethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, 3-glycid Xylpropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropyltriethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, N-2- (aminoethyl) -3-aminopropyl Methyldimethoxysilane, N- (2-aminoethyl) -3-aminopropyltrimethoxysilane, N- (2-aminoethyl) -3-aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, 3 Aminopropyltriethoxysilane, 3-triethoxysilyl-N- (1,3-dimethyl-butylidene) propylamine, N-phenyl-3-aminopropyltrimethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-mercaptopropyl Examples include triethoxysilane and allyltrimethoxysilane.
 これらのシランカップリング剤の中で、好ましいものとしては、N-2-(アミノエチル)-3-アミノプロピルメチルジメトキシシラン、N-(2-アミノエチル)-3-アミノプロピルトリメトキシシラン、N-(2-アミノエチル)-3-アミノプロピルトリエトキシシラン、3-アミノプロピルトリメトキシシラン、3-アミノプロピルトリエトキシシラン、3-トリエトキシシリル-N-(1,3-ジメチル-ブチリデン)プロピルアミン、N-フェニル-3-アミノプロピルトリメトキシシラン等のアミノ基含有シランカップリング剤、3-メルカプトプロピルトリメトキシシラン、3-メルカプトプロピルトリエトキシシラン等のメルカプト基含有シランカップリング剤、3-アクリロイルオキシプロピルトリエトキシシラン、3-メタクリロイルオキシプロピルトリエトキシシラン、3-アクリロイルオキシプロピルメチルジメトキシシラン、3-メタクリロイルオキシプロピルメチルジメトキシシラン、3-アクリロイルオキシプロピルメチルジエトキシシラン、3-メタクリロイルオキシプロピルメチルジエトキシシラン等の(メタ)アクリロイル基含有シランカップリング剤が挙げられ、市販品としては、KBM-503(信越化学工業株式会社製)、KBM-903(信越化学工業株式会社製)、KBE-903(信越化学工業株式会社製)、Z-6062(東レ・ダウコーニング株式会社製)、Z-6023(東レ・ダウコーニング株式会社製)などが挙げられる。これらは1種または2種以上を組み合わせて用いることができる。 Among these silane coupling agents, preferred are N-2- (aminoethyl) -3-aminopropylmethyldimethoxysilane, N- (2-aminoethyl) -3-aminopropyltrimethoxysilane, N -(2-aminoethyl) -3-aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-triethoxysilyl-N- (1,3-dimethyl-butylidene) propyl Amino group-containing silane coupling agents such as amines and N-phenyl-3-aminopropyltrimethoxysilane, mercapto group-containing silane coupling agents such as 3-mercaptopropyltrimethoxysilane and 3-mercaptopropyltriethoxysilane, 3- Acryloyloxypropyltriethoxysila 3-methacryloyloxypropyltriethoxysilane, 3-acryloyloxypropylmethyldimethoxysilane, 3-methacryloyloxypropylmethyldimethoxysilane, 3-acryloyloxypropylmethyldiethoxysilane, 3-methacryloyloxypropylmethyldiethoxysilane, etc. Examples of commercially available products include KBM-503 (manufactured by Shin-Etsu Chemical Co., Ltd.), KBM-903 (manufactured by Shin-Etsu Chemical Co., Ltd.), and KBE-903 (stock of Shin-Etsu Chemical Co., Ltd.). Company-made), Z-6062 (manufactured by Toray Dow Corning Co., Ltd.), Z-6023 (manufactured by Toray Dow Corning Co., Ltd.), and the like. These can be used alone or in combination of two or more.
 本発明(I)の防湿絶縁材料に好適なガラス基材への密着性を与えるためには、シランカップリング剤の配合量が、スチレン系熱可塑性エラストマー100質量部に対して0.1~10質量部であることが好ましく、0.5~8質量部であることがさらに好ましい。 In order to give adhesion to a glass substrate suitable for the moisture-proof insulating material of the present invention (I), the amount of the silane coupling agent is 0.1 to 10 with respect to 100 parts by mass of the styrene thermoplastic elastomer. The amount is preferably part by mass, and more preferably 0.5 to 8 parts by mass.
 本発明(II)は、本発明(I)の防湿絶縁材料を用いて絶縁処理された電子部品である。このような電子部品としては、マイクロコンピュータ、トランジスタ、コンデンサ、抵抗、リレー、トランス等、およびこれらを搭載した実装回路板などが挙げられ、さらにこれら電子部品に接合されるリード線、ハーネス、フィルム基板等も含むことができる。
 また、液晶ディスプレイパネル、プラズマディスプレイパネル、有機エレクトロルミネッセンスパネル、フィールドエミッションディスプレイパネル等のフラットパネルディスプレイパネルの信号入力部等も、電子部品として挙げられる。特に、電子部品用ディスプレイ用基板等のIC周辺部やパネル張り合わせ部等に、本発明(I)の防湿絶縁材料を好ましく使用できる。
The present invention (II) is an electronic component that is insulated using the moisture-proof insulating material of the present invention (I). Examples of such electronic components include microcomputers, transistors, capacitors, resistors, relays, transformers, etc., and mounting circuit boards on which these are mounted, and lead wires, harnesses, and film substrates that are joined to these electronic components. Etc. can also be included.
Moreover, the signal input part of flat panel display panels, such as a liquid crystal display panel, a plasma display panel, an organic electroluminescent panel, and a field emission display panel, are also mentioned as an electronic component. In particular, the moisture-proof insulating material of the present invention (I) can be preferably used in IC peripheral parts such as display boards for electronic parts, panel bonding parts, and the like.
 本発明(II)の電子部品は、防湿絶縁材料を用いて電子部品を絶縁処理することにより製造される。本発明(II)の電子部品の具体的な製造方法としては、まず、一般に知られている浸漬法、ハケ塗り法、スプレー法、線引き塗布法等の方法によって上述した防湿絶縁材料を上記電子部品に塗布し、防湿絶縁材料に含まれる有機溶媒を揮発させて塗膜を乾燥させることにより、電子部品が得られる。 The electronic component of the present invention (II) is manufactured by insulating the electronic component using a moisture-proof insulating material. As a specific method for producing the electronic component of the present invention (II), first, the above-described moisture-proof insulating material is applied to the electronic component by a generally known method such as dipping, brushing, spraying, or drawing. The electronic component can be obtained by applying to the substrate and evaporating the organic solvent contained in the moisture-proof insulating material and drying the coating film.
 以下、実施例により本発明を更に具体的に説明するが、本発明は以下の実施例にのみ制限されるものではない。 Hereinafter, the present invention will be described more specifically by way of examples. However, the present invention is not limited only to the following examples.
 実施例1
 スチレン-ブタジエンブロック共重合エラストマーとしてD1155(クレイトンポリマー社製,スチレン含量40質量%)25g、粘着付与剤としてクイントン(登録商標)D100(日本ゼオン株式会社製脂肪族-芳香族共重合系石油樹脂)6.1g、溶媒としてメチルシクロヘキサン(丸善石油化学株式会社製 商品名:スワクリーンMCH)71.0g、エチルシクロヘキサン(丸善石油化学株式会社製 商品名:スワクリーンECH)5.8g、ジエチルカーボネート(三井化学ファイン株式会社製)3.2gを混合し、配合物D1とした。
 配合物D1の25℃での粘度は、0.68Pa・sであった。
Example 1
25 g of D1155 (made by Kraton Polymer Co., Ltd., styrene content 40% by mass) as a styrene-butadiene block copolymer elastomer, and Quinton (registered trademark) D100 (aliphatic-aromatic copolymer petroleum resin made by Nippon Zeon Co., Ltd.) as a tackifier 6.1 g, 71.0 g of methylcyclohexane (manufactured by Maruzen Petrochemical Co., Ltd., trade name: Suwaclean MCH) as a solvent, 5.8 g of ethylcyclohexane (manufactured by Maruzen Petrochemical Co., Ltd .: trade name: Suwaclean ECH), diethyl carbonate (Mitsui (Chemical Fine Co., Ltd.) 3.2g was mixed and it was set as the compound D1.
The viscosity of the formulation D1 at 25 ° C. was 0.68 Pa · s.
 実施例2
 スチレン-ブタジエンブロック共重合エラストマーとしてD1155(クレイトンポリマー社製,スチレン含量40質量%)22.5g、粘着付与剤としてクイントン(登録商標)D100(日本ゼオン株式会社製)5.5g、溶媒としてメチルシクロヘキサン(丸善石油化学株式会社製 商品名:スワクリーンMCH)60.0g、エチルシクロヘキサン(丸善石油化学株式会社製 商品名:スワクリーンECH)8.0g、ジエチルカーボネート(三井化学ファイン株式会社製)4.0gを混合し、配合物D2とした。
 配合物D2の25℃での粘度は、0.67Pa・sであった。
Example 2
22.5 g of D1155 (made by Kraton Polymer Co., Ltd., styrene content 40% by mass) as a styrene-butadiene block copolymer elastomer, 5.5 g of Quinton (registered trademark) D100 (made by Nippon Zeon Co., Ltd.) as a tackifier, and methylcyclohexane as a solvent (Maruzen Petrochemical Co., Ltd., trade name: Suwaclean MCH) 60.0 g, ethylcyclohexane (Maruzen Petrochemical Co., Ltd., trade name: Swaclean ECH) 8.0 g, diethyl carbonate (Mitsui Chemicals Fine Co., Ltd.) 4. 0 g was mixed to make Formulation D2.
The viscosity of the formulation D2 at 25 ° C. was 0.67 Pa · s.
 実施例3
 スチレン-ブタジエンブロック共重合エラストマーとしてD1155(クレイトンポリマー社製,スチレン含量40質量%)22.5g、粘着付与剤としてクイントン(登録商標)D100(日本ゼオン株式会社製)5.5g、溶媒としてメチルシクロヘキサン(丸善石油化学株式会社製 商品名:スワクリーンMCH)56.0g、エチルシクロヘキサン(丸善石油化学株式会社製 商品名:スワクリーンECH)8.0g、ジメチルカーボネート(宇部興産株式会社製)4.0g、ジエチルカーボネート(三井化学ファイン株式会社製)4.0gを混合し、配合物D3とした。
 配合物D3の25℃での粘度は、0.62Pa・sであった。
Example 3
22.5 g of D1155 (made by Kraton Polymer Co., Ltd., styrene content 40% by mass) as a styrene-butadiene block copolymer elastomer, 5.5 g of Quinton (registered trademark) D100 (made by Nippon Zeon Co., Ltd.) as a tackifier, and methylcyclohexane as a solvent (Maruzen Petrochemical Co., Ltd., trade name: Suwaclean MCH) 56.0 g, ethylcyclohexane (Maruzen Petrochemical Co., Ltd., trade name: Suwaclean ECH) 8.0 g, dimethyl carbonate (Ube Industries, Ltd.) 4.0 g Then, 4.0 g of diethyl carbonate (manufactured by Mitsui Chemicals Fine Co., Ltd.) was mixed to obtain a formulation D3.
The viscosity of the formulation D3 at 25 ° C. was 0.62 Pa · s.
 実施例4
 スチレン-ブタジエンブロック共重合エラストマーとしてD1155(クレイトンポリマー社製,スチレン含量40質量%)22.5g、粘着付与剤としてクイントン(登録商標)D100(日本ゼオン株式会社製)5.5g、溶媒としてメチルシクロヘキサン(丸善石油化学株式会社製 商品名:スワクリーンMCH)68.0g、ジエチルカーボネート(三井化学ファイン株式会社製)4.0gを混合し、配合物D4とした。
 配合物D4の25℃での粘度は、0.67Pa・sであった。
Example 4
22.5 g of D1155 (made by Kraton Polymer Co., Ltd., styrene content 40% by mass) as a styrene-butadiene block copolymer elastomer, 5.5 g of Quinton (registered trademark) D100 (made by Nippon Zeon Co., Ltd.) as a tackifier, and methylcyclohexane as a solvent (Maruzen Petrochemical Co., Ltd., trade name: Swaclean MCH) 68.0 g and diethyl carbonate (Mitsui Chemicals Fine Co., Ltd.) 4.0 g were mixed to obtain a compound D4.
The viscosity of the formulation D4 at 25 ° C. was 0.67 Pa · s.
 比較例1
 スチレン-イソプレンブロック共重合エラストマーとしてD1161(クレイトンポリマー社製,スチレン含量15質量%)20g、粘着付与剤としてアイマーブ(登録商標)P-100(出光興産株式会社製、C5留分を主成分とするジシクロペンタジエン/芳香族共重合系の水添石油樹脂、PグレードはSグレードよりも水素化(水添)率が高いグレード)10g、シランカップリング剤としてN-2-(アミノエチル)-3-アミノプロピルメチルジメトキシシラン(信越化学工業株式会社製 商品名:KBM-602)1g、溶媒としてエチルシクロヘキサン(丸善石油化学株式会社製 商品名:スワクリーンECH)70gを混合し、配合物E1とした。
 配合物E1の25℃での粘度は、1.11Pa・sであった。
Comparative Example 1
20 g of D1161 (manufactured by Kraton Polymer Co., Ltd., styrene content 15% by mass) as a styrene-isoprene block copolymer elastomer, and Imabe (registered trademark) P-100 (manufactured by Idemitsu Kosan Co., Ltd., based on C5 fraction as a tackifier) Hydrogenated petroleum resin of dicyclopentadiene / aromatic copolymer system, P grade has a hydrogenation (hydrogenation) rate higher than S grade) 10 g, N-2- (aminoethyl) -3 as silane coupling agent -Compound 1 was prepared by mixing 1 g of aminopropylmethyldimethoxysilane (trade name: KBM-602, manufactured by Shin-Etsu Chemical Co., Ltd.) and 70 g of ethylcyclohexane (trade name: Suwaclean ECH, manufactured by Maruzen Petrochemical Co., Ltd.) as a solvent. .
The viscosity of Formulation E1 at 25 ° C. was 1.11 Pa · s.
 比較例2
 スチレン-エチレン/ブチレンブロック共重合エラストマーとしてG1652(クレイトンポリマー社製,スチレン含量30質量%)20gおよびスチレン-ブタジエンブロック共重合エラストマーD1101(クレイトンポリマー社製,スチレン含量31質量%)20g、粘着付与剤としてアイマーブ(登録商標)P-100(出光興産株式会社製、C5留分を主成分とするジシクロペンタジエン/芳香族共重合系の水添石油樹脂)10g、シランカップリング剤としてN-2-(アミノエチル)-3-アミノプロピルメチルジメトキシシラン(信越化学工業株式会社製 商品名:KBM-602)1g、溶媒としてエチルシクロヘキサン(丸善石油化学株式会社製 商品名:スワクリーンECH)70gを混合し、配合物E2とした。
 配合物E2の25℃での粘度は高すぎて、前記の粘度測定条件で測定することができなかった。
Comparative Example 2
20 g of G1652 (manufactured by Kraton Polymer, styrene content 30% by mass) and 20 g of styrene-butadiene block copolymer elastomer D1101 (manufactured by Kraton Polymer, 31% by mass of styrene) as a styrene-ethylene / butylene block copolymer elastomer, tackifier 10 g of I-MAB (registered trademark) P-100 (manufactured by Idemitsu Kosan Co., Ltd., dicyclopentadiene / aromatic copolymer hydrogenated petroleum resin mainly containing C5 fraction), N-2- as a silane coupling agent 1 g of (aminoethyl) -3-aminopropylmethyldimethoxysilane (trade name: KBM-602, manufactured by Shin-Etsu Chemical Co., Ltd.) and 70 g of ethylcyclohexane (trade name: Suwaclean ECH, manufactured by Maruzen Petrochemical Co., Ltd.) as a solvent were mixed. Formulation E2.
The viscosity at 25 degreeC of the compound E2 was too high, and could not be measured on the said viscosity measurement conditions.
 比較例3
 スチレン-ブタジエンブロック共重合エラストマーとしてD1155(クレイトンポリマー社製,スチレン含量40質量%)25g、粘着付与剤としてクイントン(登録商標)D100(日本ゼオン株式会社製脂肪族-芳香族共重合系石油樹脂)6.1g、溶媒としてエチルシクロヘキサン(丸善石油化学株式会社製 商品名:スワクリーンECH)80gを混合し、配合物E3とした。
 配合物E3の25℃での粘度は、0.88Pa・sであった。
Comparative Example 3
25 g of D1155 (made by Kraton Polymer Co., Ltd., styrene content 40% by mass) as a styrene-butadiene block copolymer elastomer, and Quinton (registered trademark) D100 (aliphatic-aromatic copolymer petroleum resin made by Nippon Zeon Co., Ltd.) as a tackifier 6.1 g and 80 g of ethylcyclohexane (manufactured by Maruzen Petrochemical Co., Ltd., trade name: SWACLEAN ECH) as a solvent were mixed to obtain a formulation E3.
The viscosity of the formulation E3 at 25 ° C. was 0.88 Pa · s.
 比較例4
 スチレン-ブタジエンブロック共重合エラストマーとしてD1155(クレイトンポリマー社製,スチレン含量40質量%)22.5g、粘着付与剤としてクイントン(登録商標)D100(日本ゼオン株式会社製)5.5g、溶媒としてエチルシクロヘキサン(丸善石油化学株式会社製 商品名:スワクリーンECH)64g、酢酸n-ブチル(協和発酵ケミカル株式会社製 商品名:酢酸ブチル-P)8gを混合し、配合物E4とした。
 配合物E4の25℃での粘度は、0.66Pa・sであった。
Comparative Example 4
22.5 g of D1155 (made by Kraton Polymer Co., Ltd., styrene content 40% by mass) as a styrene-butadiene block copolymer elastomer, 5.5 g of Quinton (registered trademark) D100 (made by Nippon Zeon Co., Ltd.), and ethylcyclohexane as a solvent (Maruzen Petrochemical Co., Ltd., trade name: Swaclean ECH) 64 g and n-butyl acetate (Kyowa Hakko Chemical Co., Ltd., trade name: butyl acetate-P) 8 g were mixed to obtain a blend E4.
The viscosity in 25 degreeC of the compound E4 was 0.66 Pa.s.
 比較例5
 スチレン-ブタジエンブロック共重合エラストマーとしてD1155(クレイトンポリマー社製,スチレン含量40質量%)22.5g、粘着付与剤としてクイントン(登録商標)D100(日本ゼオン株式会社製)3.0gおよびアイマーブ(登録商標)S-110(出光興産株式会社製、C5留分を主成分とするジシクロペンタジエン/芳香族共重合系の水添石油樹脂)2.5g、溶媒としてエチルシクロヘキサン(丸善石油化学株式会社製 商品名:スワクリーンECH)64g、酢酸n-ブチル(協和発酵ケミカル株式会社製 商品名:酢酸ブチル-P)8gを混合し、配合物E5とした。
 配合物E5の25℃での粘度は、0.68Pa・sであった。
Comparative Example 5
22.5 g of D1155 (manufactured by Kraton Polymer Co., Ltd., styrene content 40 mass%) as a styrene-butadiene block copolymer elastomer, 3.0 g of Quinton (registered trademark) D100 (manufactured by Nippon Zeon Co., Ltd.) and Imabe (registered trademark) as a tackifier ) S-110 (manufactured by Idemitsu Kosan Co., Ltd., 2.5 g of dicyclopentadiene / aromatic copolymer hydrogenated petroleum resin mainly containing C5 fraction), ethylcyclohexane (manufactured by Maruzen Petrochemical Co., Ltd.) Name: Swaclean ECH) 64 g and n-butyl acetate (trade name: butyl acetate-P, manufactured by Kyowa Hakko Chemical Co., Ltd.) 8 g were mixed to obtain a compound E5.
The viscosity in 25 degreeC of the compound E5 was 0.68 Pa.s.
 比較例6
 スチレン-イソプレンブロック共重合エラストマーとしてD1161(クレイトンポリマー社製,スチレン含量15質量%)22.5g、粘着付与剤としてクイントン(登録商標)D100(日本ゼオン株式会社製)5.5g、溶媒としてエチルシクロヘキサン(丸善石油化学株式会社製 商品名:スワクリーンECH)67g、酢酸n-ブチル(協和発酵ケミカル株式会社製 商品名:酢酸ブチル-P)5gを混合し、配合物E6とした。
 配合物E6の25℃での粘度は、1.22Pa・sであった。
Comparative Example 6
22.5 g of D1161 (manufactured by Kraton Polymer, styrene content: 15% by mass) as a styrene-isoprene block copolymer elastomer, 5.5 g of Quinton (registered trademark) D100 (manufactured by ZEON Corporation) as a tackifier, and ethylcyclohexane as a solvent (Maruzen Petrochemical Co., Ltd., trade name: Swaclean ECH) 67 g and n-butyl acetate (Kyowa Hakko Chemical Co., Ltd., trade name: butyl acetate-P) were mixed to obtain a formulation E6.
The viscosity in 25 degreeC of the compound E6 was 1.22 Pa.s.
 比較例7
 スチレン-ブタジエンブロック共重合エラストマーとしてD1155(クレイトンポリマー社製,スチレン含量40質量%)25g、粘着付与剤としてクイントン(登録商標)D100(日本ゼオン株式会社製)6.1g、溶媒としてエチルシクロヘキサン(丸善石油化学株式会社製 商品名:スワクリーンECH)98.5gを混合し、配合物E7とした。
 配合物E7の25℃での粘度は、0.32Pa・sであった。
Comparative Example 7
25 g of D1155 (made by Kraton Polymer Co., Ltd., styrene content 40% by mass) as a styrene-butadiene block copolymer elastomer, 6.1 g of Quinton (registered trademark) D100 (made by Nippon Zeon Co., Ltd.) as a tackifier, and ethylcyclohexane (Maruzen) as a solvent 98.5 g of Petrochemical Co., Ltd. trade name: SWACLEAN ECH) was mixed to prepare a compound E7.
The viscosity in 25 degreeC of the compound E7 was 0.32 Pa.s.
 比較例8
 スチレン-ブタジエンブロック共重合エラストマーとしてD1155(クレイトンポリマー社製,スチレン含量40質量%)25g、粘着付与剤としてクイントン(登録商標)D100(日本ゼオン株式会社製脂肪族-芳香族共重合系石油樹脂)6.1g、溶媒としてメチルシクロヘキサン(丸善石油化学株式会社製 商品名:スワクリーンMCH)80gを混合し、配合物E8とした。
 配合物E8の25℃での粘度は、0.72Pa・sであった。
Comparative Example 8
25 g of D1155 (made by Kraton Polymer Co., Ltd., styrene content 40% by mass) as a styrene-butadiene block copolymer elastomer, and Quinton (registered trademark) D100 (aliphatic-aromatic copolymer petroleum resin made by Nippon Zeon Co., Ltd.) as a tackifier 6.1 g and 80 g of methylcyclohexane (manufactured by Maruzen Petrochemical Co., Ltd., trade name: SWACLEAN MCH) as a solvent were mixed to obtain a formulation E8.
The viscosity in 25 degreeC of the compound E8 was 0.72 Pa.s.
[配合物の評価]
 上記の組成により調製した配合物D1~D4およびE1、E3~E8の特性を、以下に示す方法により評価した。結果を表1に示す。
[Evaluation of formulation]
The characteristics of the blends D1 to D4 and E1, E3 to E8 prepared with the above compositions were evaluated by the following methods. The results are shown in Table 1.
<粘度の測定>
 粘度は以下の方法により測定した。
 試料10mLを使用して、粘度計(Brookfield社製、型式:DV-II+Pro)を用いて、少量サンプルアダプターおよび型番C4-31のスピンドルを使用し、温度25.0℃、回転数20rpmの条件で粘度がほぼ一定になったときの値を測定した。
<Measurement of viscosity>
The viscosity was measured by the following method.
Using a sample of 10 mL, using a viscometer (manufactured by Brookfield, model: DV-II + Pro), using a small sample adapter and a spindle of model number C4-31, at a temperature of 25.0 ° C. and a rotation speed of 20 rpm The value when the viscosity became almost constant was measured.
<タックフリータイムの評価>
 タックフリータイムは以下の方法により評価した。
 配合物D1~D4および配合物E1、E3~E8をそれぞれガラス上に乾燥後の厚みが約350μmになるように自動ディスペンサーを用いて塗布し、塗布後、塗膜表面のべたつきの有無を30秒ごとに指触により確認した。べたつきが無くなった最初の時間をタックフリータイムとした。
 タックフリータイムは速乾燥性の指標であり、短いほど好ましい。
 なお、配合物E2は、粘度が高すぎて、自動ディスペンサーでの塗布ができなかった。
<Evaluation of tack free time>
The tack free time was evaluated by the following method.
Formulations D1 to D4 and Formulations E1 and E3 to E8 were each coated on glass using an automatic dispenser so that the thickness after drying was about 350 μm. After coating, the coating surface was checked for stickiness for 30 seconds. Each was confirmed by finger touch. The first time when stickiness disappeared was defined as tack-free time.
The tack free time is an index of quick drying property, and the shorter the free time, the better.
In addition, the formulation E2 was too high in viscosity and could not be applied with an automatic dispenser.
<曳糸性の有無の評価>
 曳糸性の有無については以下の方法により評価した。
 配合物D1~D4および配合物E1、E3~E8をそれぞれガラス上に乾燥後の厚みが約350μmになるようにディスペンサーを用いて塗布し、その塗布の終了時に、塗工液が、ディスペンサーの先端から糸状になるか否かで判断した。
 ◎:糸状の塗工液は全く発生しない。
 ○:糸状の塗工液が発生する場合も発生しない場合もある。
 ×:常に糸状の塗工液が発生する。
<Evaluation of presence or absence of spinnability>
The presence or absence of spinnability was evaluated by the following method.
Formulations D1 to D4 and Formulations E1 and E3 to E8 were each applied onto a glass using a dispenser so that the thickness after drying was about 350 μm. At the end of the application, the coating liquid was applied to the tip of the dispenser. Judgment was made based on whether or not it became a filament.
A: No filamentous coating solution is generated.
○: A thread-like coating liquid may or may not be generated.
X: A filamentous coating solution is always generated.
<ガラスへの密着性およびガラスからの引き剥がし性の評価>
 ガラスへの密着性は以下の方法により評価した。
 配合物D1~D4および配合物E1、E3~E8を、それぞれガラス上に乾燥後の厚みが130μmになるよう塗布し、室温で10分間保持した後に、70℃で0.5時間乾燥した後、室温で12時間放置した。これらの塗膜について、評価試験用の硬化膜の一端のみを剥離して、幅2.5mmの接着力測定用試験片を作製した。接着力は、ガラス板と剥離した硬化フィルムが90度の角度を成すように引張り試験機(株式会社島津製作所製、EZ Test/CE)に固定し、最初のチャック間距離を2.5cmとし、23℃において50mm/minの速度で90度引き剥がし強さを測定して求めた。
 また、「引き剥がし性」における×印とは、90度引き剥がし強さの測定中に硬化膜が切れたことを意味し、「引き剥がし性」における○印とは、90度引き剥がし強さの測定中に硬化膜が切れずに剥離できたことを意味する。
 ある程度の密着性は、防湿性、絶縁信頼性を維持するために必要であるが、LCDパネルの出荷前検査で不良がある場合には、ガラスパネルは再利用したい(フレキシブル配線板は捨てる)ので、引き剥がしたいときには、塗膜が切れることなくきれいに引き剥がしを行えることが好ましい。
<Evaluation of adhesion to glass and peelability from glass>
The adhesion to glass was evaluated by the following method.
Formulations D1 to D4 and Formulations E1 and E3 to E8 were each coated on glass so that the thickness after drying was 130 μm, held at room temperature for 10 minutes, and then dried at 70 ° C. for 0.5 hours. Left at room temperature for 12 hours. About these coating films, only the end of the cured film for evaluation tests was peeled off, and a test piece for measuring adhesive strength having a width of 2.5 mm was produced. The adhesive force is fixed to a tensile tester (manufactured by Shimadzu Corporation, EZ Test / CE) so that the cured film peeled off from the glass plate forms an angle of 90 degrees, and the initial distance between chucks is 2.5 cm. The 90-degree peel strength was measured at 23 ° C. at a speed of 50 mm / min.
In addition, “X” in “peelability” means that the cured film was cut during measurement of 90-degree peel strength, and “◯” in “peelability” means 90-degree peel strength. It means that the cured film could be peeled off without being cut during the measurement.
A certain level of adhesion is necessary to maintain moisture resistance and insulation reliability, but if there is a defect in the LCD panel pre-shipment inspection, the glass panel will be reused (the flexible wiring board will be discarded). When it is desired to peel off the film, it is preferable that the film can be peeled off without breaking the coating film.
<ポリイミドフィルムへの密着性の評価およびポリイミドからの引き剥がし性の評価>
 ポリイミドフィルムへの密着性は以下の方法により評価した。
 配合物D1~D4および配合物E1、E3~E8を、それぞれポリイミドフィルム(商品名:カプトン(登録商標)150EN、東レ・デュポン株式会社製)上に乾燥後の厚みが130μmになるよう塗布し、室温で10分間保持した後に、70℃で0.5時間乾燥した後、室温で12時間放置した。その後、このポリイミドフィルムの配合物が塗布されていない面とガラスクロス入りエポキシ樹脂板を両面接着テープで貼り合わせた板(以下、「ポリイミドフィルム貼り付けエポキシ樹脂板」と記す。)を作製した。これらの塗膜について、評価試験用の硬化膜の一端のみを剥離して、幅2.5mmの接着力測定用試験片を作製した。接着力は、ポリイミドフィルム貼り付けエポキシ樹脂板と剥離した硬化フィルムが90度の角度を成すように引張り試験機(株式会社島津製作所製、EZ Test/CE)に固定し、最初のチャック間距離を2.5cmとし、23℃において50mm/minの速度で90度引き剥がし強さを測定して求めた。結果を表1に示す。
 また、「引き剥がし性」における×印とは、90度引き剥がし強さの測定中に硬化膜が切れたことを意味し、「引き剥がし性」における○印とは、90度引き剥がし強さの測定中に硬化膜が切れずに剥離できたことを意味する。
<Evaluation of adhesion to polyimide film and evaluation of peelability from polyimide>
The adhesion to the polyimide film was evaluated by the following method.
Formulations D1 to D4 and Formulations E1 and E3 to E8 were respectively applied onto a polyimide film (trade name: Kapton (registered trademark) 150EN, manufactured by Toray DuPont Co., Ltd.) so that the thickness after drying was 130 μm. After holding at room temperature for 10 minutes, it was dried at 70 ° C. for 0.5 hour and then allowed to stand at room temperature for 12 hours. Then, the board (henceforth a "polyimide film sticking epoxy resin board") which bonded the surface in which this compound of polyimide film was not apply | coated, and the epoxy resin board containing glass cloth with the double-sided adhesive tape was produced. About these coating films, only the end of the cured film for evaluation tests was peeled off, and a test piece for measuring adhesive strength having a width of 2.5 mm was produced. The adhesive force is fixed to a tensile tester (manufactured by Shimadzu Corporation, EZ Test / CE) so that the cured film peeled off from the polyimide resin-attached epoxy resin plate forms an angle of 90 degrees. The peel strength was determined by measuring 90 ° at a speed of 50 mm / min at 23 ° C. and 2.5 cm. The results are shown in Table 1.
In addition, “X” in “peelability” means that the cured film was cut during measurement of 90-degree peel strength, and “◯” in “peelability” means 90-degree peel strength. It means that the cured film could be peeled off without being cut during the measurement.
<透湿度評価>
 配合物D1~D4および配合物E1、E3~E8を、それぞれテフロン(登録商標)板上に乾燥後の厚みが約130μmになるように、バーコーターを用いて、重ね塗りすることにより自立膜を作製した。
 透湿カップ治具(テスター産業株式会社製)を使用して、これらの自立膜の透湿度を、JIS Z0208に準拠して測定した。
 なお、透湿度の試験条件は、温度40℃、湿度90%RH、24時間とした。
<Water vapor permeability evaluation>
A self-supporting film was formed by overcoating the compounds D1 to D4 and the compounds E1 and E3 to E8 on a Teflon (registered trademark) plate using a bar coater so that the thickness after drying was about 130 μm. Produced.
Using a moisture permeable cup jig (manufactured by Tester Sangyo Co., Ltd.), the moisture permeability of these free-standing films was measured in accordance with JIS Z0208.
The test conditions for moisture permeability were a temperature of 40 ° C., a humidity of 90% RH, and 24 hours.
<フレキシブル基板を用いた長期電気絶縁信頼性の評価>
 フレキシブル銅張り積層板(住友金属鉱山株式会社製、グレード名:エスパーフレックス、銅厚:8μm、ポリイミド厚:38μm)をエッチングして製造した、JPCA-ET01に記載の微細くし形パターン形状の基板(銅配線幅/銅配線間幅=15μm/15μm)に錫メッキ処理を施したフレキシブル配線板に、配合物D1~D4およびE1、E3~E8を、それぞれ乾燥後の厚みが100μmになるよう塗布し、室温で10分間保持した後に、70℃で1.5時間乾燥した。
 この試験片を用いて、バイアス電圧30Vを印加し、温度85℃、湿度85%RHの条件での温湿度定常試験を、MIGRATION TESTER MODEL MIG-8600(IMV社製)を用いて行った。上記温湿度定常試験をスタートしてから1000時間後の抵抗値を表1に記す。
<Evaluation of long-term electrical insulation reliability using flexible substrates>
A substrate having a fine comb pattern shape described in JPCA-ET01, manufactured by etching a flexible copper-clad laminate (manufactured by Sumitomo Metal Mining Co., Ltd., grade name: Esperflex, copper thickness: 8 μm, polyimide thickness: 38 μm) (Copper wiring width / copper wiring width = 15 μm / 15 μm) The coatings D1 to D4, E1, and E3 to E8 were each applied to a flexible wiring board that had been subjected to tin plating so that the thickness after drying would be 100 μm. After being kept at room temperature for 10 minutes, it was dried at 70 ° C. for 1.5 hours.
Using this test piece, a bias voltage of 30 V was applied, and a constant temperature and humidity test under the conditions of a temperature of 85 ° C. and a humidity of 85% RH was performed using MIGRATION TESTER MODEL MIG-8600 (manufactured by IMV). Table 1 shows resistance values 1000 hours after the start of the temperature and humidity steady test.
<ガラス基板上配線を用いた長期絶縁信頼性の評価>
 ガラス基板上にライン/スペースが40μm/10μmである櫛形パターン形状のITO配線を形成したパターン電極上に、配合物D1~D4およびE1、E3~E8を、それぞれ乾燥後の厚みが100μmになるよう塗布し、室温で10分間保持した後に、70℃で1.5時間乾燥した。
 この試験片を用いて、バイアス電圧30Vを印加し、温度85℃、湿度85%RHの条件での温湿度定常試験を、MIGRATION TESTER MODEL MIG-8600(IMV社製)を用いて行った。上記温湿度定常試験をスタート初期およびスタートしてから1000時間後の抵抗値を表1に記す。
Figure JPOXMLDOC01-appb-T000018
<Evaluation of long-term insulation reliability using wiring on glass substrate>
The composition D1 to D4 and E1, E3 to E8 are each dried to a thickness of 100 μm on a patterned electrode in which a comb-shaped ITO wiring having a line / space of 40 μm / 10 μm is formed on a glass substrate. After coating and holding at room temperature for 10 minutes, it was dried at 70 ° C. for 1.5 hours.
Using this test piece, a bias voltage of 30 V was applied, and a constant temperature and humidity test under the conditions of a temperature of 85 ° C. and a humidity of 85% RH was performed using MIGRATION TESTER MODEL MIG-8600 (manufactured by IMV). The resistance values 1000 hours after the start and start of the temperature and humidity steady test are shown in Table 1.
Figure JPOXMLDOC01-appb-T000018
 表1の結果より、配合物D1~D4は乾燥性、ガラス基材への密着性、長期絶縁信頼性に優れており、かつ、粘度が1.2Pa・s以下と低粘度であることがわかる。これに対して、配合物E2は粘度が高くハンドリング性が悪く、配合物E1、E3~E8は乾燥速度に劣るかまたは糸状の塗工液が常に発生する結果となっており、本発明の組成物はディスペンサーを用いて塗布する防湿絶縁材料に適していることがわかる。 From the results shown in Table 1, it can be seen that the compounds D1 to D4 are excellent in drying property, adhesion to a glass substrate, and long-term insulation reliability, and have a low viscosity of 1.2 Pa · s or less. . On the other hand, the formulation E2 has a high viscosity and poor handling properties, and the formulations E1, E3 to E8 are inferior in drying rate or always generate a filamentous coating liquid. It can be seen that the product is suitable for a moisture-proof insulating material to be applied using a dispenser.
 本発明の防湿絶縁材料は、低粘度かつ速乾燥性を発現できる組成物であり、この防湿絶縁材料でコーティング処理することにより、高度に防湿絶縁保護された電子部品を得ることができる。 The moisture-proof insulating material of the present invention is a composition that can exhibit low viscosity and quick drying properties, and by coating with this moisture-proof insulating material, it is possible to obtain an electronic component that is highly moisture-proof and insulated.

Claims (11)

  1.  スチレン系熱可塑性エラストマー、粘着付与剤、および溶媒を含む防湿絶縁材料であって、前記溶媒が80℃以上110℃未満の沸点を有する脂肪族炭化水素系溶媒および式(1)
    Figure JPOXMLDOC01-appb-C000001
    (式(1)中、RとRは、それぞれ独立に、メチル基またはエチル基を表す。)
    で表されるジアルキルカーボネートからなる溶媒を含むことを特徴とする防湿絶縁材料。
    A moisture-proof insulating material comprising a styrene-based thermoplastic elastomer, a tackifier, and a solvent, wherein the solvent has a boiling point of 80 ° C. or higher and lower than 110 ° C. and formula (1)
    Figure JPOXMLDOC01-appb-C000001
    (In Formula (1), R 1 and R 2 each independently represents a methyl group or an ethyl group.)
    A moisture-proof insulating material comprising a solvent comprising a dialkyl carbonate represented by the formula:
  2.  前記溶媒が、さらに110℃以上140℃未満の沸点を有する脂肪族炭化水素系溶媒を含むことを特徴とする請求項1に記載の防湿絶縁材料。 The moisture-proof insulating material according to claim 1, wherein the solvent further contains an aliphatic hydrocarbon solvent having a boiling point of 110 ° C or higher and lower than 140 ° C.
  3.  防湿絶縁材料中に含まれる80℃以上110℃未満の沸点を有する脂肪族炭化水素系溶媒と110℃以上140℃未満の沸点を有する脂肪族炭化水素系溶媒の質量比が65:35~97:3の範囲であることを特徴とする請求項2に記載の防湿絶縁材料。 The mass ratio of the aliphatic hydrocarbon solvent having a boiling point of 80 ° C. to less than 110 ° C. and the aliphatic hydrocarbon solvent having a boiling point of 110 ° C. to less than 140 ° C. contained in the moisture-proof insulating material is 65:35 to 97: The moisture-proof insulating material according to claim 2, which is in a range of 3.
  4.  防湿絶縁材料中に含まれる80℃以上110℃未満の沸点を有する脂肪族炭化水素系溶媒と110℃以上140℃未満の沸点を有する脂肪族炭化水素系溶媒の総量と式(1)で表されるジアルキルカーボネートからなる溶媒の質量比が85:15~98:2の範囲であることを特徴とする請求項1~3のいずれか1項に記載の防湿絶縁材料。 The total amount of the aliphatic hydrocarbon solvent having a boiling point of 80 ° C. or more and less than 110 ° C. and the aliphatic hydrocarbon solvent having a boiling point of 110 ° C. or more and less than 140 ° C. contained in the moisture-proof insulating material is expressed by the formula (1). The moisture-proof insulating material according to any one of claims 1 to 3, wherein the mass ratio of the solvent comprising dialkyl carbonate is in the range of 85:15 to 98: 2.
  5.  80℃以上110℃未満の沸点を有する脂肪族炭化水素系溶媒が、シクロヘキサンおよび/またはメチルシクロヘキサンであることを特徴とする請求項1~4のいずれか1項に記載の防湿絶縁材料。 The moisture-proof insulating material according to any one of claims 1 to 4, wherein the aliphatic hydrocarbon solvent having a boiling point of 80 ° C or higher and lower than 110 ° C is cyclohexane and / or methylcyclohexane.
  6.  110℃以上140℃未満の沸点を有する脂肪族炭化水素系溶媒が、cis-1,2-ジメチルシクロヘキサン、cis-1,3-ジメチルシクロヘキサン、cis-1,4-ジメチルシクロヘキサン、trans-1,2-ジメチルシクロヘキサン、trans-1,3-ジメチルシクロヘキサン、trans-1,4-ジメチルシクロヘキサンおよびエチルシクロヘキサンからなる群から選ばれる少なくとも1種であることを特徴とする請求項2~5のいずれか1項に記載の防湿絶縁材料。 Aliphatic hydrocarbon solvents having boiling points of 110 ° C. or more and less than 140 ° C. are cis-1,2-dimethylcyclohexane, cis-1,3-dimethylcyclohexane, cis-1,4-dimethylcyclohexane, trans-1,2, 6. At least one member selected from the group consisting of dimethylcyclohexane, trans-1,3-dimethylcyclohexane, trans-1,4-dimethylcyclohexane and ethylcyclohexane. The moisture-proof insulating material as described in 1.
  7.  防湿絶縁材料の総質量に対して、スチレン系熱可塑性エラストマーと粘着付与剤の総量が20~40質量%であり、溶媒の総量が60~80質量%であり、防湿絶縁材料中に含まれるスチレン系熱可塑性エラストマーと粘着付与剤の質量比が2:1~10:1の範囲であり、防湿絶縁材料中に含まれる80℃以上110℃未満の沸点を有する脂肪族炭化水素系溶媒と式(1)で表されるジアルキルカーボネートからなる溶媒の総量が、溶媒の総量に対して65質量%以上であり、さらに、防湿絶縁材料の25℃での粘度が1.2Pa・s以下であることを特徴とする請求項1~6のいずれか1項に記載の防湿絶縁材料。 The total amount of styrenic thermoplastic elastomer and tackifier is 20 to 40% by mass, and the total amount of solvent is 60 to 80% by mass with respect to the total mass of the moisture-proof insulating material. An aliphatic hydrocarbon solvent having a boiling point of 80 ° C. or more and less than 110 ° C. contained in the moisture-proof insulating material, wherein the mass ratio of the thermoplastic elastomer to the tackifier is in the range of 2: 1 to 10: 1 and the formula ( 1) The total amount of the solvent consisting of the dialkyl carbonate represented by 1) is 65% by mass or more based on the total amount of the solvent, and the moisture-proof insulating material has a viscosity at 25 ° C. of 1.2 Pa · s or less. The moisture-proof insulating material according to any one of claims 1 to 6, characterized in that:
  8.  スチレン系熱可塑性エラストマーが、スチレン-ブタジエンブロック共重合エラストマー、スチレン-イソプレンブロック共重合エラストマー、スチレン-エチレン/ブチレンブロック共重合エラストマー、およびスチレン-エチレン/プロピレンブロック共重合エラストマーからなる群から選ばれる少なくとも1種であることを特徴とする請求項1~7のいずれか1項に記載の防湿絶縁材料。 The styrenic thermoplastic elastomer is at least selected from the group consisting of a styrene-butadiene block copolymer elastomer, a styrene-isoprene block copolymer elastomer, a styrene-ethylene / butylene block copolymer elastomer, and a styrene-ethylene / propylene block copolymer elastomer. The moisture-proof insulating material according to any one of claims 1 to 7, wherein the moisture-proof insulating material is one kind.
  9.  スチレン系熱可塑性エラストマー中に含まれるスチレン由来の構造単位の含量が、スチレン系熱可塑性エラストマーの総量に対して15~50質量%であることを特徴とする請求項1~8のいずれか1項に記載の防湿絶縁材料。 9. The content of structural units derived from styrene contained in the styrenic thermoplastic elastomer is 15 to 50% by mass with respect to the total amount of the styrenic thermoplastic elastomer. The moisture-proof insulating material as described in 1.
  10.  粘着付与剤が、石油系樹脂粘着付与剤であることを特徴とする請求項1~9のいずれか1項に記載の防湿絶縁材料。 The moisture-proof insulating material according to any one of claims 1 to 9, wherein the tackifier is a petroleum resin tackifier.
  11.  請求項1~10のいずれか1項に記載の防湿絶縁材料を用いて絶縁処理された電子部品。 An electronic component insulated using the moisture-proof insulating material according to any one of claims 1 to 10.
PCT/JP2012/053859 2011-02-25 2012-02-17 Moistureproof insulation material WO2012115011A1 (en)

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