JP5188669B2 - Method for manufacturing moisture-proof insulating paint and insulated electronic parts - Google Patents
Method for manufacturing moisture-proof insulating paint and insulated electronic parts Download PDFInfo
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- JP5188669B2 JP5188669B2 JP2003407477A JP2003407477A JP5188669B2 JP 5188669 B2 JP5188669 B2 JP 5188669B2 JP 2003407477 A JP2003407477 A JP 2003407477A JP 2003407477 A JP2003407477 A JP 2003407477A JP 5188669 B2 JP5188669 B2 JP 5188669B2
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- 239000003973 paint Substances 0.000 title claims description 18
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 238000000034 method Methods 0.000 title description 9
- 239000011347 resin Substances 0.000 claims description 32
- 229920005989 resin Polymers 0.000 claims description 32
- 239000000203 mixture Substances 0.000 claims description 13
- 239000003208 petroleum Substances 0.000 claims description 10
- 229920001971 elastomer Polymers 0.000 claims description 8
- 239000002904 solvent Substances 0.000 claims description 8
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 150000003505 terpenes Chemical class 0.000 claims description 6
- 235000007586 terpenes Nutrition 0.000 claims description 6
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 5
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 5
- 239000003086 colorant Substances 0.000 claims description 4
- 239000000945 filler Substances 0.000 claims description 4
- 239000003607 modifier Substances 0.000 claims description 4
- 229920001400 block copolymer Polymers 0.000 claims description 3
- BXOUVIIITJXIKB-UHFFFAOYSA-N ethene;styrene Chemical group C=C.C=CC1=CC=CC=C1 BXOUVIIITJXIKB-UHFFFAOYSA-N 0.000 claims description 3
- 229920005996 polystyrene-poly(ethylene-butylene)-polystyrene Polymers 0.000 claims description 3
- 229920006132 styrene block copolymer Polymers 0.000 claims description 3
- 239000000654 additive Substances 0.000 claims description 2
- 230000000996 additive effect Effects 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 239000000758 substrate Substances 0.000 description 10
- 239000011521 glass Substances 0.000 description 7
- 238000009413 insulation Methods 0.000 description 7
- 238000013329 compounding Methods 0.000 description 6
- 239000002518 antifoaming agent Substances 0.000 description 4
- 229920005992 thermoplastic resin Polymers 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 125000001931 aliphatic group Chemical group 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- IIEWJVIFRVWJOD-UHFFFAOYSA-N ethylcyclohexane Chemical compound CCC1CCCCC1 IIEWJVIFRVWJOD-UHFFFAOYSA-N 0.000 description 2
- UAEPNZWRGJTJPN-UHFFFAOYSA-N methylcyclohexane Chemical compound CC1CCCCC1 UAEPNZWRGJTJPN-UHFFFAOYSA-N 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 229920000346 polystyrene-polyisoprene block-polystyrene Polymers 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000005662 Paraffin oil Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- COYJIMCVCRLOIW-UHFFFAOYSA-L [Mn+2].CCCCCC=CC([O-])=O.CCCCCC=CC([O-])=O Chemical compound [Mn+2].CCCCCC=CC([O-])=O.CCCCCC=CC([O-])=O COYJIMCVCRLOIW-UHFFFAOYSA-L 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000005456 alcohol based solvent Substances 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 239000003849 aromatic solvent Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000010227 cup method (microbiological evaluation) Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 239000003759 ester based solvent Substances 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 239000001023 inorganic pigment Substances 0.000 description 1
- JMMWKPVZQRWMSS-UHFFFAOYSA-N isopropanol acetate Natural products CC(C)OC(C)=O JMMWKPVZQRWMSS-UHFFFAOYSA-N 0.000 description 1
- 229940011051 isopropyl acetate Drugs 0.000 description 1
- GWYFCOCPABKNJV-UHFFFAOYSA-N isovaleric acid Chemical compound CC(C)CC(O)=O GWYFCOCPABKNJV-UHFFFAOYSA-N 0.000 description 1
- 239000005453 ketone based solvent Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- SGGOJYZMTYGPCH-UHFFFAOYSA-L manganese(2+);naphthalene-2-carboxylate Chemical compound [Mn+2].C1=CC=CC2=CC(C(=O)[O-])=CC=C21.C1=CC=CC2=CC(C(=O)[O-])=CC=C21 SGGOJYZMTYGPCH-UHFFFAOYSA-L 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- -1 methacryloxy, acryloxy, mercapto, amino Chemical group 0.000 description 1
- GYNNXHKOJHMOHS-UHFFFAOYSA-N methyl-cycloheptane Natural products CC1CCCCCC1 GYNNXHKOJHMOHS-UHFFFAOYSA-N 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 239000012860 organic pigment Substances 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000000088 plastic resin Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 150000003097 polyterpenes Chemical class 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 239000005028 tinplate Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000005491 wire drawing Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Description
本発明は、電子部品の絶縁に適した基材との接着性に優れた防湿絶縁塗料および絶縁処理された電子部品及びその製造法に関する。 The present invention relates to a moisture-proof insulating paint excellent in adhesion to a base material suitable for insulation of electronic components, an electronic component subjected to insulation treatment, and a method for manufacturing the same.
電気機器は年々小型軽量化および多機能化の傾向にあり、これを制御する各種電気機器に搭載した実装回路板は、湿気、塵埃、ガス等から保護する目的で絶縁処理が行われている。この絶縁処理法には、アクリル系樹脂、ウレタン系樹脂、シリコーン系樹脂等の塗料による保護コーティング処理が広く採用されている。 Electrical devices tend to be smaller and lighter and more multifunctional year by year, and the mounting circuit boards mounted on various electrical devices that control them are subjected to insulation treatment for the purpose of protecting them from moisture, dust, gas, and the like. In this insulation treatment method, a protective coating treatment with a paint such as an acrylic resin, a urethane resin, or a silicone resin is widely employed.
このような実装回路板は、過酷な環境下、特に高湿度下で使用され、例えば携帯電話、パーソナルコンピューター、洗濯機、自動車等の機器に搭載されて使用されている。しかしながら、前記アクリル系樹脂、ウレタン系樹脂、シリコーン系樹脂等は、ガラスやプリント基板等の基材との接着性が劣り、より過酷な高温高湿条件下では基材と樹脂の界面から水が浸入し、防湿効果が十分発揮されないなどの問題があった。 Such a mounting circuit board is used under a severe environment, particularly under high humidity, and is used by being mounted on a device such as a mobile phone, a personal computer, a washing machine, or an automobile. However, the acrylic resin, urethane resin, silicone resin, and the like have poor adhesion to substrates such as glass and printed circuit boards, and water from the interface between the substrate and the resin under more severe high temperature and humidity conditions. There were problems such as penetration and insufficient moisture-proof effect.
本発明は、このような従来技術の問題点を解決し、防湿絶縁等に適し、耐熱性及び基材との接着性に優れた耐熱性防湿絶縁塗料、絶縁処理された電子部品並びにその製造法を提供するものである。 The present invention solves such problems of the prior art, is suitable for moisture-proof insulation and the like, and is heat-resistant and moisture-proof insulating paint excellent in heat resistance and adhesion to a substrate , insulation-treated electronic component , and method for producing the same Is to provide.
本発明は、以下の発明に関する。
（１）（ａ）Ａ−Ｂ−Ａ型スチレン−エチレン／ブチレン‐スチレンブロック共重合体ゴム（ＳＥＢＳ）あるいはスチレン−エチレン／プロピレン‐スチレンブロック共重合体ゴム（ＳＥＰＳ）１０〜４０重量部、（ｂ）粘着性付与樹脂１〜２０重量部 、（ｃ）シランカップリング剤０．１〜５重量部及び（ｄ）溶剤５０〜９０重量部を含有してなる防湿絶縁塗料。
（２）（ｂ）粘着性付与樹脂が、石油系樹脂、ロジン系樹脂及びテルペン系樹脂あるいはそれらの混合物である上記（１）記載の防湿絶縁塗料。
（３）（ｃ）シランカップリング剤が、メタクリロキシ系、アクリロキシ系、メルカプト系及びアミノ系あるいはそれらの混合物である上記（１）記載の防湿絶縁塗料。
（４）さらに充填剤、改質剤、消泡剤および着色剤からなる添加剤から選ばれる少なくとも１種を含む、上記（１）記載の耐熱性防湿絶縁塗料。
（５）上記（１）〜（４）のいずれかに記載の耐熱性防湿絶縁塗料を用いて絶縁処理された電子部品。
（６）上記（１）〜（４）のいずれかに記載の耐熱性防湿絶縁塗料を、電子部品に塗布し、乾燥する上記（５）記載の絶縁処理された電子部品の製造法。
The present invention relates to the following inventions.
(1) (a ) 10-40 parts by weight of ABA type styrene-ethylene / butylene-styrene block copolymer rubber (SEBS) or styrene-ethylene / propylene-styrene block copolymer rubber (SEPS) , b) A moisture-proof insulating coating comprising 1 to 20 parts by weight of a tackifying resin , (c) 0.1 to 5 parts by weight of a silane coupling agent, and (d) 50 to 90 parts by weight of a solvent.
( 2 ) (b) The moisture-proof insulating paint according to the above (1), wherein the tackifying resin is a petroleum resin, a rosin resin and a terpene resin or a mixture thereof.
( 3 ) (c) The moisture-proof insulating paint according to the above (1), wherein the silane coupling agent is a methacryloxy-type, acryloxy-type, mercapto-type, amino-type or a mixture thereof.
( 4 ) The heat-resistant and moisture-proof insulating paint according to the above (1), further comprising at least one selected from an additive consisting of a filler, a modifier, an antifoaming agent and a colorant.
( 5 ) An electronic component that has been insulated using the heat-resistant and moisture-proof insulating paint described in any one of (1) to ( 4 ) above.
( 6 ) The method for producing an insulated electronic component according to the above ( 5 ), wherein the heat-resistant and moisture-proof insulating paint described in any one of (1) to ( 4 ) is applied to an electronic component and dried.
本発明の耐熱性防湿絶縁塗料の塗膜は、防湿性、耐熱性及び基材との接着性に優れ、これによって高い信頼性の絶縁処理された電子部品を得ることができる。 The coating film of the heat-resistant moisture-proof insulating paint of the present invention is excellent in moisture-proof property, heat resistance, and adhesiveness with a substrate, whereby a highly reliable electronic component with insulation treatment can be obtained.
本発明に用いられる（ａ）成分は、Ａ−Ｂ−Ａ型スチレン−エチレン／ブチレン‐スチレンブロック共重合体ゴム（ＳＥＢＳ）あるいはスチレン−エチレン／プロピレン‐スチレンブロック共重合体ゴム（ＳＥＰＳ）の熱可塑性樹脂である。これらの熱可塑性樹脂の配合量は、１０〜４０重量部であり、１５〜３０重量部が好ましく、２０〜２５重量部がより好ましい。熱可塑性樹脂の配合量が１０重量部未満だと組成物の防湿効果が劣り、４０重量部を超えるとガラスやプリント基板等の基材との接着性が劣る。その他の熱可塑性樹脂としてスチレン−ブタジエン−スチレンブロック共重合体ゴム（ＳＢＳ）、スチレン−イソプレン−スチレンブロック共重合体ゴム（ＳＩＳ）等が挙げられ、これらを使用すると耐熱性が劣る。 The component (a) used in the present invention is the heat of ABA type styrene-ethylene / butylene-styrene block copolymer rubber (SEBS) or styrene-ethylene / propylene-styrene block copolymer rubber (SEPS). It is a plastic resin . The amount of the thermoplastic resins is 10 to 40 parts by weight, preferably 15 to 30 parts by weight, more preferably 20 to 25 parts by weight. Poor moisture effect of the amount of the thermoplastic resins compositions with less than 10 parts by weight, poor adhesion to the glass or a printed circuit board like substrate exceeds 40 parts by weight. Examples of other thermoplastic resins include styrene-butadiene-styrene block copolymer rubber (SBS), styrene-isoprene-styrene block copolymer rubber (SIS), and when these are used, heat resistance is poor.
本発明に用いられる粘着性付与樹脂（ｂ）は、基材に対する接着性を向上させるものであり、石油系樹脂、ロジン系樹脂及びテルペン系樹脂あるいはそれらの混合物が用いられ、溶剤に溶解しやすいものが好ましい。
石油系樹脂としては、脂肪族系石油樹脂、芳香族系石油樹脂、脂環式系石油樹脂、脂肪族／芳香族共重合系石油樹脂及びそれらの水添石油樹脂が挙げられる。
ロジン系樹脂としては、ロジン、ロジン変性樹脂及びその誘導体が挙げられる。
テルペン系樹脂としては、ポリテルペン、テルペンフェノール系樹脂等及びそれらの水添樹脂が挙げられる。
これらの粘着性付与樹脂の配合量は、１〜２０重量部であり、２〜１５重量部が好ましく、３〜１３重量部がより好ましい。粘着性付与樹脂の配合量が１重量部未満だとガラスやプリント基板等の基材との接着性が劣リ、２０重量部を超えると組成物の防湿効果が劣る。
The tackifying resin (b) used in the present invention improves the adhesion to the substrate, and petroleum-based resins, rosin-based resins and terpene-based resins or mixtures thereof are used and are easily dissolved in a solvent. Those are preferred.
Examples of the petroleum resins include aliphatic petroleum resins, aromatic petroleum resins, alicyclic petroleum resins, aliphatic / aromatic copolymer petroleum resins, and hydrogenated petroleum resins thereof.
Examples of the rosin resin include rosin, rosin-modified resin, and derivatives thereof.
Examples of terpene resins include polyterpenes, terpene phenol resins, and hydrogenated resins thereof.
The compounding amount of these tackifying resins is 1 to 20 parts by weight, preferably 2 to 15 parts by weight, and more preferably 3 to 13 parts by weight. When the compounding amount of the tackifying resin is less than 1 part by weight, the adhesiveness with a base material such as glass or a printed circuit board is poor, and when it exceeds 20 parts by weight, the moisture-proof effect of the composition is inferior.
本発明に用いられるシランカップリング剤（ｃ）は、メタクリロキシ系、アクリロキシ系、メルカプト系及びアミノ系あるいはそれらの混合物である。
これらのシランカップリング剤の配合量は、０．１〜５重量部であり、０．３〜３重量部が好ましく、０．５〜１重量部がより好ましい。シランカップリング剤の配合量が０．１重量部未満だとガラスやプリント基板等の基材との接着性が劣リ、５重量部を超えると製造方法によっては組成物の粘度が上昇し作業性が劣る。
The silane coupling agent (c) used in the present invention is methacryloxy, acryloxy, mercapto, amino, or a mixture thereof.
The compounding quantity of these silane coupling agents is 0.1-5 weight part, 0.3-3 weight part is preferable and 0.5-1 weight part is more preferable. If the amount of the silane coupling agent is less than 0.1 parts by weight, the adhesion to the substrate such as glass or printed circuit board is poor, and if it exceeds 5 parts by weight, the viscosity of the composition increases depending on the production method. Inferior.
本発明に用いられる溶剤（d）は、アセトン、メチルエチルケトン等のケトン系溶剤、トルエン、キシレン等の芳香族系溶剤、シクロヘキサン、メチルシクロヘキサン、エチルシクロヘキサン等の脂肪族系溶剤、酢酸エチル、酢酸ブチル、酢酸イソプロピル等のエステル系溶剤、エタノール、ブタノール等のアルコール系溶剤、パラフィン油、ナフテン油等のパラフィン系溶剤、ミネラルターペン、ナフサ等の石油系溶剤などである。溶剤の配合量は、作業性に関連する塗料の粘度に応じて決められるが、５０〜９０重量部、好ましくは６０〜８０重量部の割合である。 Solvent (d) used in the present invention includes ketone solvents such as acetone and methyl ethyl ketone, aromatic solvents such as toluene and xylene, aliphatic solvents such as cyclohexane, methylcyclohexane and ethylcyclohexane, ethyl acetate, butyl acetate, Examples thereof include ester solvents such as isopropyl acetate, alcohol solvents such as ethanol and butanol, paraffin solvents such as paraffin oil and naphthene oil, and petroleum solvents such as mineral terpenes and naphtha. Although the compounding quantity of a solvent is determined according to the viscosity of the coating material relevant to workability | operativity, it is a 50-90 weight part, Preferably it is a ratio of 60-80 weight part.
本発明では必要に応じ充填剤、改質剤、消泡剤、着色剤および接着性付与剤などを塗料に任意に添加することができる。 In the present invention, a filler, a modifier, an antifoaming agent, a colorant, an adhesion-imparting agent, and the like can be arbitrarily added to the paint as necessary.
充填剤としては、微粉末酸化けい素、酸化マグネシウム、水酸化アルミニウム、炭酸カルシウム等が挙げられる。 Examples of the filler include fine powder silicon oxide, magnesium oxide, aluminum hydroxide, calcium carbonate and the like.
改質剤としては例えば、乾燥性を向上させるためにナフテン酸マンガン、オクテン酸マンガン等の有機酸金属塩などが使用できる。 As the modifier, for example, organic acid metal salts such as manganese naphthenate and manganese octenoate can be used to improve the drying property.
消泡剤としては例えば、シリコン系オイル、フッ素オイル、ポリカルボン酸系ポリマーなど公知の消泡剤が挙げられる。 Examples of the antifoaming agent include known antifoaming agents such as silicone oil, fluorine oil, and polycarboxylic acid polymer.
着色剤としては、公知の無機顔料、有機系顔料、及び有機系染料等が挙げられ、所望する色調に応じてそれぞれを配合する。これらは、２種以上組み合わせて使用しても良い。 Examples of the colorant include known inorganic pigments, organic pigments, organic dyes, and the like, and each is blended according to a desired color tone. You may use these in combination of 2 or more types.
本発明になる耐熱性防湿絶縁塗料を用いて絶縁される電子部品としてはマイコン、トランジスタ、コンデンサ、抵抗、リレー、トランス等、及びこれらを搭載した実装回路板などが挙げられ、さらにこれら電子部品に接合されるリード線、ハーネス、フィルム基板等も含むことができる。 Examples of electronic components insulated using the heat-resistant and moisture-proof insulating paint according to the present invention include a microcomputer, a transistor, a capacitor, a resistor, a relay, a transformer, and a mounting circuit board on which these are mounted. Bonded lead wires, harnesses, film substrates, and the like can also be included.
本発明になる耐熱性防湿絶縁塗料を用いて絶縁される電子部品の製造法としては、一般に知られている浸漬法、ハケ塗り法、スプレー法、線引き塗布法、ディスペンス法等の方法によってこの塗料を上記電子部品に塗布し、乾燥すればよい。 As a method for producing an electronic component insulated using the heat-resistant moisture-proof insulating paint according to the present invention, this paint can be obtained by a generally known method such as a dipping method, a brush coating method, a spray method, a wire drawing method, or a dispensing method. May be applied to the electronic component and dried.
以下に本発明を実施例により説明するが、本発明はこれらに制限されるものではない。
本発明で、「部」として表わしたものは特に限定しない限り重量部を示す。
表１に示す配合組成及び配合量で樹脂組成物を作製し、その塗膜の特性を下記の方法で測定した。結果を表1に示す。
EXAMPLES The present invention will be described below with reference to examples, but the present invention is not limited thereto.
In the present invention, what is expressed as “parts” indicates parts by weight unless otherwise specified.
The resin composition was produced with the compounding composition and compounding quantity shown in Table 1, and the characteristic of the coating film was measured with the following method. The results are shown in Table 1.
(1)基材（ガラス）との接着性
ＪＩＳ Ｋ ５４００の「碁盤目テープ法」に準じ試験を行った。
(2)透湿度
ＪＩＳ Ｚ ０２０８の「防湿包装材料の透湿度試験方法（カップ法）」に準じ試験を行った。
(3)屈曲性
樹脂をブリキ板に塗布後、２５℃／２４ｈの条件で乾燥し、試験片とした。次にこの試験片を１００℃の恒温槽に５００ｈ放置後、ＪＩＳＣ２１０３『丸棒による屈曲性』に準じて屈曲性を測定した。
(1) Adhesiveness with substrate (glass) The test was conducted according to “cross-cut tape method” of JIS K 5400.
(2) Moisture permeability The test was conducted in accordance with JIS Z 0208 “Moisture permeability test method for moisture-proof packaging materials (cup method)”.
(3) Flexibility After applying the resin to the tin plate, it was dried at 25 ° C./24 h to obtain a test piece. Next, this test piece was left in a constant temperature bath at 100 ° C. for 500 hours, and then the flexibility was measured according to JIS C2103 “Bendability with a round bar”.
表１から熱可塑性樹脂を２０重量部、粘着性付与樹脂を１０重量部加えた組成物（実施例１、２）は、基材（ガラス）との接着性、防湿性及び耐熱性に優れることがわかる。
また、ＳＥＢＳ樹脂のかわりにＳＢＳ樹脂を使用した組成（比較例１）は、耐熱性に劣り、粘着性付与樹脂を加えなかった組成（比較例２）は、基材（ガラス）との接着性に劣ることがわかる。
The composition (Examples 1 and 2) in which 20 parts by weight of the thermoplastic resin and 10 parts by weight of the tackifying resin are added from Table 1 is excellent in adhesion to the base material (glass) , moisture resistance and heat resistance. I understand.
In addition, the composition using the SBS resin instead of the SEBS resin (Comparative Example 1) is inferior in heat resistance, and the composition without adding the tackifying resin (Comparative Example 2 ) is adhesive to the substrate (glass) . it can be seen that the poor.
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| JP5791623B2 (en) * | 2010-10-22 | 2015-10-07 | 昭和電工株式会社 | Moisture-proof insulation material |
| WO2012124737A1 (en) * | 2011-03-15 | 2012-09-20 | 昭和電工株式会社 | Moisture-proof insulative coating with visible light-blocking properties |
| TWI512060B (en) * | 2011-04-26 | 2015-12-11 | Chi Mei Corp | Moisture-proof and insulating coating material and uses thereof |
| KR102049841B1 (en) * | 2012-09-28 | 2019-11-28 | 니폰 제온 가부시키가이샤 | Composite gas barrier laminate and method for producing same, and composite electrode |
| US20190241694A1 (en) | 2016-10-28 | 2019-08-08 | Hitachi Chemical Company, Ltd. | Curable composition for forming elastic resin layer |
| CN116426198A (en) * | 2023-04-03 | 2023-07-14 | 珠海格力新材料有限公司 | High-vulcanization-resistance three-proofing adhesive and preparation method thereof |
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| JPH051267A (en) * | 1991-06-27 | 1993-01-08 | Minnesota Mining & Mfg Co <3M> | Rubber-type adhesive composition excellent in heat resistance |
| JP2003145687A (en) * | 2001-11-15 | 2003-05-20 | Nitto Shinko Kk | Moistureproof sheet for electronic machinery parts |
| JP2005126456A (en) * | 2003-10-21 | 2005-05-19 | Hitachi Chem Co Ltd | Moistureproof insulating coating material, electronic part subjected to insulation treatment and method for producing the same |
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