TW201247798A - Moistureproof insulation material - Google Patents

Moistureproof insulation material Download PDF

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TW201247798A
TW201247798A TW101106267A TW101106267A TW201247798A TW 201247798 A TW201247798 A TW 201247798A TW 101106267 A TW101106267 A TW 101106267A TW 101106267 A TW101106267 A TW 101106267A TW 201247798 A TW201247798 A TW 201247798A
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Taiwan
Prior art keywords
moisture
solvent
insulating material
proof insulating
styrene
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TW101106267A
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Chinese (zh)
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TWI466962B (en
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Kazuhiko Ooga
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Showa Denko Kk
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/28Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances natural or synthetic rubbers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D109/00Coating compositions based on homopolymers or copolymers of conjugated diene hydrocarbons
    • C09D109/06Copolymers with styrene
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D153/00Coating compositions based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Coating compositions based on derivatives of such polymers
    • C09D153/02Vinyl aromatic monomers and conjugated dienes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D157/00Coating compositions based on unspecified polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C09D157/02Copolymers of mineral oil hydrocarbons
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H01B3/442Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from aromatic vinyl compounds
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Paints Or Removers (AREA)
  • Organic Insulating Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Laminated Bodies (AREA)

Abstract

Provided is a moistureproof insulation material that has a solid content concentration that is able to secure a thickness capable of achieving sufficient moistureproofness after coating/drying, within a viscosity range wherein the moistureproof insulation material can be easily applied with a dispenser, and that has excellent adhesion characteristic with respect to glass base material or polyimide, and excellent long-term insulation reliability. Also provided is an electronic part insulated with the moistureproof insulation material. The present invention is a moistureproof insulation material comprising a styrenic thermoplastic elastomer, a tackifier, and a solvent, and is characterized in having the aforementioned solvent further comprising an aliphatic hydrocarbon type solvent having a boiling point of not less than 80 DEG C and less than 110 DEG C, and a solvent comprising dialkyl carbonate indicated by the following chemical formula (1) (diethyl carbonate or dimethyl carbonate, for example). Preferably, the solvent further comprises an aliphatic hydrocarbon type solvent having a boiling point of not less than 110 DEG C and less than 140 DEG C (ethylcyclohexane or dimethylcyclohexane, for example). (R1 and R2 in the chemical formula (1) indicate a methyl group and an ethyl group, respectively, and independent of each other)

Description

201247798 六、發明說明: 【發明所屬之技術領域】 本發明係關於一種作業性、速乾燥性優異之電子零件 的防濕絕緣材料、及藉其防濕絕緣材料而絕緣處理之電子 零件。 【先前技術】 以往,在電子機器之製造步驟中,就從濕氣或塵埃或 腐蝕性氣體等保護封裝電路板或電極等之金屬露出部的目 的而言,可塗佈絕緣性皮膜。此塗佈材料係有紫外線硬化 型、濕氣硬化性、溶劑乾燥型等之型式,分別可使用丙烯 酸樹脂、聚矽氧樹脂、苯乙烯嵌段共聚物樹脂等。 濕氣硬化型之塗佈材料係聚矽氧樹脂本身之耐濕性優 異,但有透濕性,故爲保護電路或電極之金屬,有必須塗 佈很厚塗佈材料之問題點。 紫外線硬化型之塗佈材料係可在短時間硬化且生產性 優異,故被廣泛使用。如此之紫外線硬化型塗佈材料係已 知有例如特開2007-30868 1號公報記載之聚烯烴多元醇或 特開2007-332279號公報記載之聚碳酸酯多元醇所衍生之 胺基甲酸酯改性丙烯酸酯化合物等。 在電子機器之製造步驟中係若確認出以防濕絕緣材料 實施塗佈處理後有任何不良情形,有除去產生不良之零件 而再度重新黏合新零件之修復步驟。在此修復步驟中再黏 合零件時,由於不確定發生不良之部位,故紫外線照射時 -5- 201247798 很難定位,常使用溶劑乾燥型之塗佈材料。 溶劑乾燥型之塗佈材料用組成物係於特開2003-145687號公報已揭示一種苯乙烯系熱可塑性彈性體、增黏 劑及甲苯所構成之組成物。但,就毒性或環境之觀點,宜 使用影響小於甲苯之溶劑。 又,特開2005- 1 26456號公報 '特開2005- 1 62986號 公報、特開2006- 1 653 1號公報、及特開2006-45340號公 報中已揭示一種苯乙烯系熱可塑性彈性體、增黏劑、矽烷 偶合劑及乙基環己烷所構成之組成物。但,在以乙基環己 烷作爲主成分之溶劑中係因加速乾燥性,若提高固形分濃 度,組成物之黏度變高,其結果,作業性(亦即,點膠性 能)降低。又,因低黏度化,若增加乙基環己烷之量,形 成約1 3 0 // m乾燥後之膜厚時,在室溫至沾黏性消失之時 間有耗費5分鐘或其以上之情況。 [先前技術文獻] [專利文獻] [專利文獻1]特開2007-3 0868 1號公報 [專利文獻2]特開2007-332279號公報 [專利文獻3]特開2003-145687號公報 [專利文獻4]特開2005-126456號公報 [專利文獻5 ]特開2 0 0 5 - 1 6 2 9 8 6號公報 [專利文獻6]特開2006-1 653 1號公報 [專利文獻7]特開2006-45340號公報[Technical Field] The present invention relates to a moisture-proof insulating material for an electronic component excellent in workability and quick-drying property, and an electronic component insulated by the moisture-proof insulating material. [Prior Art] In the manufacturing process of an electronic device, an insulating film can be applied for the purpose of protecting a metal exposed portion such as a package board or an electrode from moisture, dust, or a corrosive gas. The coating material may be of a UV curable type, a moisture curable property, a solvent-drying type or the like, and an acrylic resin, a polyoxymethylene resin, a styrene block copolymer resin or the like may be used. The moisture-curing coating material is a polyoxyxene resin which is excellent in moisture resistance, but has moisture permeability. Therefore, in order to protect the metal of the circuit or the electrode, there is a problem that it is necessary to apply a very thick coating material. The ultraviolet curable coating material is widely used because it can be hardened in a short time and is excellent in productivity. For example, a polyolefin polyol described in JP-A-2007-30868, or a urethane derived from a polycarbonate polyol described in JP-A-2007-332279, is known. Modified acrylate compound and the like. In the manufacturing step of the electronic device, if any defect occurs after the coating treatment with the moisture-proof insulating material is confirmed, the repairing step of re-bonding the new part is removed by removing the defective part. When the parts are re-bonded in this repair step, it is difficult to position the UV-irradiated -5-201247798 due to the uncertainty of the defective part, and the solvent-drying type coating material is often used. A solvent-drying type composition for a coating material is disclosed in JP-A-2003-145687, which discloses a composition comprising a styrene-based thermoplastic elastomer, a tackifier, and toluene. However, it is advisable to use a solvent which is less than toluene in terms of toxicity or environment. A styrene-based thermoplastic elastomer, which is disclosed in Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. A composition comprising a tackifier, a decane coupling agent, and ethylcyclohexane. However, in the solvent containing ethylcyclohexane as a main component, the drying property is accelerated, and when the solid content concentration is increased, the viscosity of the composition is increased, and as a result, the workability (i.e., the gel performance) is lowered. Further, when the viscosity is low, if the amount of ethylcyclohexane is increased to form a film thickness after drying at about 1 3 0 // m, it takes 5 minutes or more from room temperature to the time when the stickiness disappears. Happening. [PRIOR ART DOCUMENT] [Patent Document 1] JP-A-2007-332687 [Patent Document 3] JP-A-2007-332687 [Patent Document 3] JP-A-2003-145687 Japanese Patent Laid-Open Publication No. 2005-126456 [Patent Document 5] JP-A-2006-65 (PATENT DOCUMENT) Bulletin No. 2006-45340

S -6 - 201247798 【發明內容】 [發明之槪要] [發明欲解決之課題] 溶劑乾燥型之塗佈材料係因未伴隨硬化反應,必須可 顯現只以塗佈/乾燥所需之物性,因此,必須增大樹脂之 分子量。但,樹脂之分子量愈大,塗佈材料之黏度愈高, 作業性降低,或爲確保作業性,若稀釋塗佈材料,塗佈、 乾燥後之塗膜的厚度變薄,擔心防濕性差,進而,塗佈後 ,至塗膜表面之沾黏消失止的時間變長,故有生產性低落 之問題。 爲了步驟之效率化,溶劑乾燥型之塗佈材料係宜以塗 佈後3分鐘或其以下之時間移至如下步驟,尋求速乾燥性 。但,若乾燥太快,點膠時,於點膠液產生拉絲性,嚴重 時係唧筒前端部產生堵塞等之不良情形,故必須適度之乾 燥性。 [用以解決課題之手段] 本發明人等係爲解決上述課題,累積專心硏究之結果 ,發現在含有苯乙烯系熱可塑性彈性體之溶劑乾燥型塗佈 材料中,使用具有80°C以上未達1 l〇°C之沸點的脂肪族烴 系溶劑作爲溶劑的主成分且倂用由二烷基碳酸酯所構成之 溶劑,俾可得到具有低黏度且充分之固形分濃度,且顯現 速乾燥性之優異的防濕絕緣皮膜,終完成本發明。 201247798 亦即’本發明(I )之防濕絕緣材料,其係含有苯乙 烯系熱塑性彈性體、增黏劑、及溶劑之防濕絕緣材料,其 特徵係前述溶劑含有由具有80t以上、未達丨! 〇t之沸點 的脂肪族烴系溶劑及以式(1 ) 【化1】 R1S -6 - 201247798 [Summary of the Invention] [Problems to be Solved by the Invention] The solvent-drying type coating material is required to exhibit physical properties required for coating/drying only because the curing reaction is not accompanied. Therefore, it is necessary to increase the molecular weight of the resin. However, the higher the molecular weight of the resin, the higher the viscosity of the coating material, the lower the workability, or the workability, and if the coating material is diluted, the thickness of the coating film after application and drying becomes thin, and the moisture resistance is poor. Further, after the application, the time until the adhesion of the surface of the coating film disappears becomes long, which causes a problem of low productivity. For the efficiency of the step, the solvent-drying type coating material is preferably moved to the following step at a time of 3 minutes or less after the coating to seek quick drying property. However, if the drying is too fast, the dispensing property may cause stringiness in the dispensing liquid, and in the case of serious clogging at the front end of the cylinder, it is necessary to have a moderate dryness. [Means for Solving the Problems] The inventors of the present invention have found that the solvent-dried coating material containing a styrene-based thermoplastic elastomer has a temperature of 80 ° C or higher. An aliphatic hydrocarbon solvent having a boiling point of less than 1 l ° C is used as a main component of the solvent, and a solvent composed of a dialkyl carbonate is used, and a low viscosity and a sufficient solid concentration are obtained, and the rate of development is high. The moisture-proof insulating film excellent in drying property finally completes the present invention. 201247798, which is a moisture-proof insulating material of the present invention (I), which is a moisture-proof insulating material containing a styrene-based thermoplastic elastomer, a tackifier, and a solvent, characterized in that the solvent is contained in an amount of 80 t or more. Hey! An aliphatic hydrocarbon solvent having a boiling point of 〇t and a formula (1)

(1) (式(1)中,R1與R2分別獨立地表示甲基或乙基) 所示之碳酸二烷基酯所構成之溶劑。 本發明(II )之電子零件,其係使用本發明(I )之防 濕絕緣材料而被絕緣處理者。 進一步換言之,本發明係關於以下之[1 ]〜[1 1 ]。 [1 ] 一種防濕絕緣材料,其係含有苯乙烯系熱塑性彈 性體、增黏劑、及溶劑之防濕絕緣材料,其特徵係前述溶 劑含有由具有8 0 °c以上、未達1 1 0 °C之沸點的脂肪族烴系 溶劑及以式(1 ) 【化2】 R1 OY〇、R2 (1)(1) A solvent comprising a dialkyl carbonate represented by (in the formula (1), R1 and R2 each independently represent a methyl group or an ethyl group). The electronic component of the invention (II) which is treated by the use of the moisture-proof insulating material of the invention (I). Further, in other words, the present invention relates to the following [1] to [1 1 ]. [1] A moisture-proof insulating material comprising a styrene-based thermoplastic elastomer, a tackifier, and a solvent-based moisture-proof insulating material, characterized in that the solvent contains 80 ° C or more and less than 1 10 An aliphatic hydrocarbon solvent having a boiling point of °C and a formula (1) R2 OY〇, R2 (1)

(式(1 )中,R1與R2分別獨立地表示甲基或乙基) 所示之碳酸二烷基酯所構成之溶劑。 [2]如[1 ]項之防濕絕緣材料,其中前述溶劑進一步含(In the formula (1), R1 and R2 each independently represent a solvent of a dialkyl carbonate represented by a methyl group or an ethyl group). [2] The moisture-proof insulating material according to [1], wherein the solvent further comprises

S -8- 201247798 有由具有1 1 0 °C以上、未達1 4 0 °c之沸點的脂肪族烴系溶 劑。 [3] 如[2]項之防濕絕緣材料,其中於防濕絕緣材料中 所含有之具有80°C以上、未達1 1 0°C之沸點的脂肪族烴系 溶劑與具有110°C以上、未達140°C之沸點的脂肪族烴系 溶劑的質量比爲65: 35〜97: 3之範圍。 [4] 如Π]〜[3]項中任一項之防濕絕緣材料,其中於 防濕絕緣材料中所含有之具有80°C以上、未達1 10。(:之沸 點的脂肪族烴系溶劑與具有11(TC以上、未達14(TC之沸 點的脂肪族烴系溶劑之總量與以式(1 )所示之碳酸二烷 基酯所構成之溶劑的質量比爲85: 15〜98: 2之範圍。 [5] 如[1]〜[4]項中任一項之防濕絕緣材料,其中具 有80°C以上、未達1 10°C之沸點的脂肪族烴系溶劑爲環己 烷及/或甲基環己烷》 [6] 如[2]〜[5]項中任一項之防濕絕緣材料,其中具 有ll〇°C以上、未達140°C之沸點的脂肪族烴系溶劑爲由 順式-1,2-二甲基環己烷 '順式- l,3-二甲基環己烷、順式-1,4-二甲基環己烷、反式-i,2-二甲基環己烷、反式-1,3-二 甲基環己烷、反式-1,4-二甲基環己烷及乙基環己烷所構成 之群中選出的至少1種。 [7] 如[1]〜[6]項中任一項之防濕絕緣材料,其中相 對於防濕絕緣材料之總質量,苯乙烯系熱塑性彈性體與增 黏劑之總量爲20〜40質量%,溶劑之總量爲60〜80質量 %,於防濕絕緣材料中所含有之苯乙烯系熱塑性彈性體與 -9- 201247798 增黏劑的質量比爲2 : 1〜1 0 : 1的範圍,於防濕絕緣材料 中所含有之具有80°C以上、未達1 10°C之沸點的脂肪族烴 系溶劑與以式(1 )所示之碳酸二烷基酯所構成之溶劑的 總量相對於溶劑之總量爲6 5質量%以上,進—步,在防濕 絕緣材料之25 °C的黏度爲1.2 Pa · s以下。 [8] 如Π]〜[7]項中任一項之防濕絕緣材料,其中苯 乙烯系熱塑性彈性體爲由苯乙烯-丁二烯嵌段共聚合彈性 體、苯乙烯-異戊二烯嵌段共聚合彈性體、苯乙烯-乙烯/丁 烯嵌段共聚合彈性體、及苯乙烯-乙烯/丙烯嵌段共聚合彈 性體所構成之群中選出的至少1種。 [9] 如[1]〜[8]項中任一項之防濕絕緣材料,其中源 自苯乙烯系熱塑性彈性體中所含有之苯乙烯的構造單元之 含量相對於苯乙烯系熱塑性彈性體的總量爲1 5〜5 0質量% 〇 [10] 如[1 ]〜[9]項中任一項之防濕絕緣材料,其中增 黏劑爲石油系樹脂增黏劑。 [11] 一種電子零件,其係使用如[1]〜[10]項中任一 項之防濕絕緣材料而被絕緣處理者。 [發明之效果] 本發明之防濕絕緣材料係具有低黏度且充分的固形分 濃度,作業性、與基材之密著性、防濕性、絕緣信賴性優 異,故藉由以此防濕絕緣材料進行塗佈處理’可得到被高 度保護防濕絕緣之電子零件。S -8- 201247798 has an aliphatic hydrocarbon-based solvent having a boiling point of 110 ° C or more and less than 140 ° C. [3] The moisture-proof insulating material according to [2], wherein the aliphatic hydrocarbon-based solvent having a boiling point of 80 ° C or more and less than 110 ° C contained in the moisture-proof insulating material has 110 ° C The mass ratio of the above aliphatic hydrocarbon solvent having a boiling point of not higher than 140 ° C is in the range of 65:35 to 97:3. [4] The moisture-proof insulating material according to any one of [3], wherein the moisture-proof insulating material contains 80 ° C or more and less than 1 10 . (: an aliphatic hydrocarbon-based solvent having a boiling point of 11 and a total amount of 11 (TC or more, less than 14 (the boiling point of the aliphatic hydrocarbon-based solvent) and the dialkyl carbonate represented by the formula (1) The mass ratio of the solvent is in the range of 85: 15 to 98: 2. [5] The moisture-proof insulating material according to any one of [1] to [4], which has a temperature of 80 ° C or more and less than 1 10 ° C. The aliphatic hydrocarbon-based solvent of the boiling point is cyclohexane and/or methylcyclohexane. [6] The moisture-proof insulating material according to any one of [2] to [5], which has a ll 〇 ° C or more An aliphatic hydrocarbon solvent having a boiling point of less than 140 ° C is composed of cis-1,2-dimethylcyclohexane 'cis-l,3-dimethylcyclohexane, cis-1,4 - dimethylcyclohexane, trans-i,2-dimethylcyclohexane, trans-1,3-dimethylcyclohexane, trans-1,4-dimethylcyclohexane and [7] The moisture-proof insulating material according to any one of [1] to [6], wherein benzene is relative to the total mass of the moisture-proof insulating material. The total amount of the ethylene-based thermoplastic elastomer and the tackifier is 20 to 40% by mass, and the total amount of the solvent is 60 to 80% by mass. The mass ratio of the styrene-based thermoplastic elastomer contained in the wet insulating material to the -9-201247798 tackifier is in the range of 2:1 to 1 0:1, and the moisture-proof insulating material contains 80 ° C or more. The total amount of the solvent of the aliphatic hydrocarbon solvent having a boiling point of less than 10 ° C and the dialkyl carbonate represented by the formula (1) is 65 mass % or more based on the total amount of the solvent. The step of the moisture-proof insulating material at a viscosity of 25 ° C is less than 1.2 Pa · s. [8] The moisture-proof insulating material according to any one of items [1] to [7], wherein the styrene-based thermoplastic elastomer is Styrene-butadiene block copolymerized elastomer, styrene-isoprene block copolymerized elastomer, styrene-ethylene/butylene block copolymerized elastomer, and styrene-ethylene/propylene intercalation The moisture-proof insulating material of any one of the above-mentioned [1] to [8], which is contained in the styrene-based thermoplastic elastomer. The content of the structural unit of styrene is 15 to 50% by mass relative to the total amount of the styrene-based thermoplastic elastomer 〇 [10] such as [1] The moisture-proof insulating material according to any one of [9], wherein the tackifier is a petroleum resin tackifier. [11] An electronic component using any one of [1] to [10] The effect of the invention is that the moisture-proof insulating material of the present invention has a low viscosity and a sufficient solid concentration, workability, adhesion to a substrate, moisture resistance, and insulation reliability. Excellent in properties, so that the coating process can be carried out by using the moisture-proof insulating material to obtain a highly protected moisture-proof insulating electronic component.

S -10- 201247798 【實施方式】 [用以實施發明之形態] 以下,具體地說明本發明。 首先,說明有關本發明(I)的防濕絕緣材料。 本發明(I)之防濕絕緣材料,其係含有苯乙烯系熱 塑性彈性體、增黏劑、及溶劑之防濕絕緣材料,其特徵係 前述溶劑含有由具有8 0 °c以上、未達1 1 0 °C之沸點的脂肪 族烴系溶劑及以式(1 )所示之碳酸二烷基酯所構成之溶 劑。 【化3】 R1 II〇 (1) (式(1)中,R1與R2分別獨立地表示甲基或乙基) 又,本說明書中記載之「熱塑性彈性體」係可藉加熱 流動而與一般之熱塑性塑膠同樣的成形加工,在常溫係具 有顯示橡膠彈性(亦即,明顯的彈性恢復)的性質之高分 子化合物,詳而言之,已記載於物理化學辭典編集委員會 編、「熱塑性彈性體之全部」、初版第1刷、(股)工業 調查會發行,2003年12月20曰。 又,本說明書記載之「苯乙烯系熱塑性彈性體」係意 指於分子構造中具有源自苯乙烯之構造單元的熱塑性彈性 體。 WSL· -11 - 201247798 於本發明(I)的防濕絕緣材料所使用之苯乙稀系熱 塑性彈性體係耐濕性、絕緣信賴性優異。苯乙烯系熱塑性 彈性體之例係可舉例如苯乙烯-丁二烯嵌段共聚合彈性體 、苯乙烯-異戊二烯嵌段共聚合彈性體、苯乙烯-乙烯/ 丁烯 嵌段共聚合彈性體、苯乙烯-乙烯/丙烯嵌段共聚合彈性體 等。如此之苯乙烯系熱塑性彈性體的市售品係可舉例如 D1 1 01 ' D1102、D1155、DKX 405、DKX 410、DKX 415 、D1192、 D1161、 D1171、 G1652、 G1730(以上 ’ KratonS -10- 201247798 [Embodiment] [Mode for Carrying Out the Invention] Hereinafter, the present invention will be specifically described. First, the moisture-proof insulating material relating to the invention (I) will be explained. The moisture-proof insulating material of the present invention (I), which is a moisture-proof insulating material containing a styrene-based thermoplastic elastomer, a tackifier, and a solvent, characterized in that the solvent contains 80 ° C or more and less than 1 A solvent composed of an aliphatic hydrocarbon solvent having a boiling point of 10 ° C and a dialkyl carbonate represented by the formula (1). [Chemical Formula 3] R1 II〇(1) (In the formula (1), R1 and R2 each independently represent a methyl group or an ethyl group) Further, the "thermoplastic elastomer" described in the present specification can be heated and flowed in general. The thermoplastic compound has the same molding process, and has a polymer compound exhibiting rubber elasticity (that is, significant elastic recovery) at room temperature. In detail, it has been described in the Physical Chemistry Dictionary Committee, "The Thermoplastic Elastomer". All of them, the first edition of the first brush, (stock) industrial survey will be issued, December 20, 2003. Further, the "styrene-based thermoplastic elastomer" described in the present specification means a thermoplastic elastomer having a structural unit derived from styrene in a molecular structure. WSL· -11 - 201247798 The styrene-based thermoplastic elastic system used in the moisture-proof insulating material of the present invention (I) is excellent in moisture resistance and insulation reliability. Examples of the styrene-based thermoplastic elastomer include, for example, a styrene-butadiene block copolymerized elastomer, a styrene-isoprene block copolymerized elastomer, and a styrene-ethylene/butylene block copolymerization. Elastomer, styrene-ethylene/propylene block copolymerized elastomer, and the like. Commercial products of such styrene-based thermoplastic elastomers include, for example, D1 1 01 'D1102, D1155, DKX 405, DKX 410, DKX 415, D1192, D1161, D1171, G1652, G1730 (above ‘ Kraton

Polymer 公司製)、Tufprene (註冊商標)A、Tufprene ( 註冊商標)125、Tufprene (註冊商標)126S、Tuftech ( 註冊商標)HI 141、Tuftech (註冊商標)H1041、Tuftech (註冊商標)H1043、Tuftech (註冊商標)H1052' (以 上,旭化成化學股份公司製)等。此等係可1種或組合2 種以上而使用。 源自苯乙烯系熱塑性彈性體中所含有之苯乙烯的構造 單元之含量相對於苯乙烯系熱塑性彈性體的總量爲1 5〜5 0 質量%,更佳係1 8〜4 5質量%、最佳係1 9〜4 3質量%。源 自苯乙烯系熱可塑性彈性體中所含有之苯乙烯之構造單元 的含量,相對於苯乙烯系熱可塑性彈性體之總量未達15 質量%時,有時該彈性體之凝集力不足,難謂佳。又,若 相對於苯乙烯系熱可塑性彈性體之總量,多於5 0質量%, 有該彈性體之橡膠性質消失的傾向,有防濕性能不足之傾 向,難謂佳。 本發明所使用之增黏劑係用以調配於以具有橡膠彈性Polymer company), Tufprene (registered trademark) A, Tufprene (registered trademark) 125, Tufprene (registered trademark) 126S, Tuftech (registered trademark) HI 141, Tuftech (registered trademark) H1041, Tuftech (registered trademark) H1043, Tuftech ( Registered trademark) H1052' (above, manufactured by Asahi Kasei Chemicals Co., Ltd.). These may be used alone or in combination of two or more. The content of the structural unit derived from styrene contained in the styrene-based thermoplastic elastomer is from 15 to 50% by mass, more preferably from 18 to 45% by mass, based on the total amount of the styrene-based thermoplastic elastomer. The best system is 1 9 to 4 3 mass%. When the content of the structural unit derived from styrene contained in the styrene-based thermoplastic elastomer is less than 15% by mass based on the total amount of the styrene-based thermoplastic elastomer, the cohesive force of the elastomer may be insufficient. It's hard to say good. In addition, when the total amount of the styrene-based thermoplastic elastomer is more than 50% by mass, the rubber property of the elastomer tends to disappear, and the tendency of the moisture-proof performance is insufficient, which is difficult. The tackifier used in the present invention is formulated to have rubber elasticity

S -12- 201247798 之彈性體爲代表的高分子化合物而具有黏著功能之物質。 相較於以彈性體爲代表之高分子化合物,分子量非常小, 一般’爲分子量數百〜數千之寡聚物領域的化合物,在室 溫爲玻璃狀態其本身具有未顯示橡膠彈性的性質。 增黏劑一般係可使用石油系樹脂增黏劑、萜烯系樹脂 增黏劑、松香系樹脂增黏劑'香豆酮茚烯樹脂增黏劑、苯 乙烯系樹脂增黏劑等。 石油系樹脂增黏劑係可舉例如脂肪族系石油樹脂 '芳 香族系石油樹脂、脂肪族-芳香族共聚合系石油樹脂、脂 環族系石油樹脂、二環戊二烯樹脂及此等之氫化物等的改 性物。合成石油樹脂可爲C5系,亦可爲C9系。 萜烯系樹脂增黏劑係可舉例如/3 -蒎烯 (pinene )樹月旨 、α -蒎烯樹脂、萜烯-酚樹脂、芳香族改性萜烯樹脂、氫 化萜烯樹脂等。此等之萜烯系樹脂許多爲不具有極性基之 樹脂。 松香系樹脂增黏劑係可舉例如橡膠松香、煤焦油松香 、木質松香等之松香;氫化松香、不均化松香、聚合松香 、順丁烯二酸化松香等之改性松香;松香甘油酯、氫化松 香酯、氫化松香甘油酯等之松香酯等。此等之松香系樹脂 係具有極性基者。 此等之增黏劑中’宜爲石油系樹脂增黏劑、萜烯系樹 脂增黏劑。更宜爲石油系樹脂增黏劑。 此等之增黏劑係可分別單獨,或組合2種以上而使用 -13- 201247798 苯乙烯系熱塑性彈性體及增黏劑之摻合量係相對於防 濕絕緣材料之總質量,苯乙烯系熱塑性彈性體與增黏劑之 總摻合量爲20〜40質量%,宜爲22〜35質量%,更宜爲 23〜3 3質量%。相對於防濕絕緣材料之總質量,苯乙烯系 熱塑性彈性體與增黏劑之總摻合量若少於2 0質量%,塗佈 材料之厚度變薄,有時無法得到充分的防濕性與膜強度。 進一步,藉由固形分濃度變低,至塗佈後之塗膜表面的沾 黏消失爲止的時間變長,其結果,有時生產性降低。又, 苯乙烯系熱塑性彈性體與增黏劑之總摻合量相對於防濕絕 緣材料之總質量,若多於40質量%,塗佈材料之黏度變高 而作業性差,很難均一地塗佈,在以點膠機之黏合時,有 時唧筒堵塞,難謂佳。 苯乙烯系熱塑性彈性體與增黏劑之摻合比率就質量比 計’爲2: 1〜10: 1的範圍,較佳係2.5: 1〜9.5: 1的範 圍,更佳係3:1〜9:1的範圍。 苯乙烯系熱塑性彈性體與增黏劑之摻合比率就質量比 計若大於10: 1,有時無法顯現充分的黏著功能而不佳。 又,苯乙烯系熱塑性彈性體與增黏劑之摻合比率就質量比 計若小於2 : 1,塗佈乾燥後之皮膜的抗拉(破裂)強度有 時明顯降低。其結果’除去不良發生之零件而再度重新黏 合新零件的修復步驟時所進行之剝離而除去防濕絕緣皮膜 時,造成防濕絕緣皮膜被切斷而無法當作1片的膜予以除 去,不佳。 本發明(I )之防濕絕緣材料係含有具有8 0 °C以上、The elastomer of S -12- 201247798 is a polymer compound represented by an elastomer and has an adhesive function. Compared with a polymer compound represented by an elastomer, the molecular weight is extremely small, and a compound in the field of oligomers having a molecular weight of several hundred to several thousands generally has a property of not exhibiting rubber elasticity at room temperature in a glass state. As the tackifier, a petroleum resin tackifier, a terpene resin tackifier, a rosin resin tackifier, a coumarone terpene resin tackifier, and a styrene resin tackifier can be used. Examples of the petroleum-based resin tackifier include an aliphatic petroleum resin, an aromatic petroleum resin, an aliphatic-aromatic copolymerized petroleum resin, an alicyclic petroleum resin, a dicyclopentadiene resin, and the like. A modified product such as a hydride. The synthetic petroleum resin may be a C5 system or a C9 system. Examples of the terpene-based resin tackifier include /3 -pinene, alpha-pinene resin, terpene-phenol resin, aromatic modified terpene resin, hydrogenated terpene resin, and the like. Many of these terpene-based resins are resins which do not have a polar group. Examples of the rosin-based resin tackifier include rosin such as rubber rosin, coal tar rosin, and wood rosin; modified rosin such as hydrogenated rosin, uneven rosin, polymerized rosin, and maleated rosin; rosin glyceride, hydrogenated A rosin ester such as rosin ester or hydrogenated rosin glyceride. These rosin-based resins have a polar base. Among these tackifiers, 'preferably a petroleum resin tackifier and a terpene resin tackifier. More suitable for petroleum resin tackifiers. These tackifiers can be used alone or in combination of two or more. The blending amount of the styrene-based thermoplastic elastomer and the tackifier is -13, 201247798, and the total mass of the moisture-proof insulating material is compared with the total mass of the moisture-proof insulating material. The total blending amount of the thermoplastic elastomer and the tackifier is from 20 to 40% by mass, preferably from 22 to 35% by mass, more preferably from 23 to 3% by mass. When the total blending amount of the styrene-based thermoplastic elastomer and the tackifier is less than 20% by mass based on the total mass of the moisture-proof insulating material, the thickness of the coating material becomes thin, and sufficient moisture resistance may not be obtained. With film strength. Further, when the solid content concentration is lowered, the time until the adhesion of the surface of the coating film after application disappears becomes long, and as a result, productivity may be lowered. Further, when the total blending amount of the styrene-based thermoplastic elastomer and the tackifier is more than 40% by mass based on the total mass of the moisture-proof insulating material, the viscosity of the coating material becomes high and workability is poor, and it is difficult to apply uniformly. Cloth, when the glue is glued, sometimes the tube is clogged, which is hard to say. The blending ratio of the styrene-based thermoplastic elastomer to the tackifier is in the range of 2:1 to 10:1, preferably 2.5:1 to 9.5:1, more preferably 3:1. The range of 9:1. When the blend ratio of the styrene-based thermoplastic elastomer to the tackifier is more than 10:1 by mass ratio, it may not be sufficient to exhibit sufficient adhesive function. Further, when the blend ratio of the styrene-based thermoplastic elastomer to the tackifier is less than 2:1, the tensile strength of the film after coating drying is remarkably lowered. As a result, when the moisture-proof insulating film is removed by removing the moisture-proof insulating film by removing the defective part and re-bonding the new part, the moisture-proof insulating film is cut off and cannot be removed as one film. good. The moisture-proof insulating material of the invention (I) contains 80 ° C or more,

S -14- 201247798 未達u 0 °c之沸點的脂肪族烴系溶劑作爲必要成分。在本 說明書中,只要無特別聲明,所謂沸點係意指在1氣壓之 沸點。 又,所謂脂肪族烴系溶劑係意指只由脂肪族烴所構成 之溶劑或含有脂肪族烴約80%以上之溶劑。 具有80°C以上、未達1 1 〇°C之沸點的脂肪族烴系溶劑 係可舉例如正庚烷(沸點98.4°C )、環己烷(沸點80.7°C )、甲基環己烷(沸點101.1 °C)等。此等之中,較佳者 係環己烷、甲基環己烷。最佳者係甲基環己烷。 本發明(I )之防濕絕緣材料,係含有以式(1)所示 之碳酸二烷基酿所構成之溶劑作爲必要成分。 【化4】 R1 R2 ⑴S -14- 201247798 An aliphatic hydrocarbon solvent having a boiling point of not more than 0 °c is an essential component. In the present specification, the term "boiling point" means a boiling point at 1 atmosphere unless otherwise stated. Further, the aliphatic hydrocarbon solvent means a solvent composed only of an aliphatic hydrocarbon or a solvent containing an aliphatic hydrocarbon of about 80% or more. The aliphatic hydrocarbon solvent having a boiling point of 80 ° C or higher and less than 1 1 ° C can be, for example, n-heptane (boiling point: 98.4 ° C), cyclohexane (boiling point: 80.7 ° C), and methylcyclohexane. (boiling point 101.1 °C) and the like. Among these, preferred are cyclohexane and methylcyclohexane. The best is methylcyclohexane. The moisture-proof insulating material of the invention (I) contains a solvent composed of a dialkyl carbonate represented by the formula (1) as an essential component. [4] R1 R2 (1)

II 0 (式(1 )中,R1與R2分別獨立地表示甲基或乙基) 由以式(1 )所示之碳酸二烷基酯所構成之溶劑的例 係可舉例如碳酸二甲酯、碳酸甲乙酯 '碳酸二乙酯。 此等之中,若考量速乾燥性與拉絲性之均衡性,最佳 者係碳酸二乙酯。 本發明(I)之防濕絕緣材料’進一步宜含有具有110 °c以上、未達1 40°c之沸點的脂肪族烴系溶劑。 具有110°C以上、未達140°C之沸點的脂肪族烴系溶 劑係可舉例如正辛烷(沸點125.7°C )、順式-1,2-二甲基 -15- 201247798 環己烷(沸點1 2 9 · 7 °C )、順式-1,3 -二甲基環己烷(沸點 120.1°C)、順式-1,4-二甲基環己烷(沸點124.3°C)、反 式-1,2-二甲蕋環己烷(沸點123.4°C)、反式-1,3-二甲基 環己烷(沸點124.5 °C )、反式-1,4-二甲基環己烷(沸點 119.41)、乙基環己烷(沸點132 °C)等。此等之中,較 佳者係順式-1,2-二甲基環己烷、順式-1,3-二甲基環己烷、 順式-1,4-二甲基環己烷、反式-丨,2-二甲基環己烷、反式-1,3-二甲基環己烷、反式-1,4-二甲基環己烷、乙基環己烷 ,若考量取得之容易性,最宜爲乙基環己烷。 併用具有80°C以上、未達1 1 0°C之沸點的脂肪族烴系 溶劑、以式(1 )所示之碳酸二烷基酯所構成之溶劑及具 有1 10°C以上、未達140°C之沸點的脂肪族烴系溶劑以外 之溶劑若爲無損特性的範圍均可。此等之溶劑,可舉例如 具有十氫萘等之脂環構造之烴溶劑、醋酸正丙酯、醋酸正 丁酯、醋酸異丁酯、醋酸第三丁酯、醋酸異丙酯、醋酸乙 酯等之醋酸酯系溶劑、乙二醇二甲醚、乙二醇二乙醚、乙 二醇單乙醚、丙二醇二甲醚、丙二醇單甲醚等之醚系溶劑 、乙醇、1-丙醇、2-丙醇等之醇系溶劑、丙酮、甲乙酮、 甲基異丁基酮等之酮系溶劑及石油腦等。塗佈防濕絕緣材 料後,若考量在室溫無風的條件下之乾燥性與作業性,宜 沸點爲1 4〇°C以下,具體上宜爲醋酸正丁酯、醋酸異丁酯 、醋酸第三丁酯、醋酸異丙酯、醋酸乙酯、醋酸正丙酯等 之醋酸酯系溶劑,更宜爲醋酸正丙酯、醋酸異丁酯、醋酸 第三丁酯、醋酸正丁酯。 -16- 201247798 於防濕絕緣材料所含有的溶劑之總量係相對於防濕絕 緣材料之總質量宜爲60〜80質量%,更宜爲65〜78質量 %,最宜爲70〜76質量%。若溶劑之總量太多,塗佈材料 之厚度太薄,有時無法得到充分的防濕性與膜強度。進一 步,藉由固形分濃度變低,至塗佈後之塗膜表面的沾黏消 失止之時間變長,其結果,有時生產性變低。反之,若溶 劑之總量太少,塗佈材料之黏度變高而作業性差,很難均 —地塗佈,或,以點膠機之點膠時,有時啷筒會堵塞。 倂用具有80°C以上、未達110°C之沸點的脂肪族烴系 溶劑與具有110°C以上、未達140°C之沸點的脂肪族烴系 溶劑時,其摻合比率係以質量比計宜爲65 : 3 5〜97 : 3, 更佳係68 : 32〜95 : 5。具有80°C以上、未達110°C之沸 點的脂肪族烴系溶劑與具有1 1 (TC以上、未達1 40°C之沸 點的脂肪族烴系溶劑之摻合比率係以質量比計若小於65 : 3 5,塗佈防濕絕緣材料後,有時至塗膜表面的沾黏消失止 之時間變長。具有80 °C以上、未達1 1 0°C之沸點的脂肪族 烴系溶劑與具有1 l〇°C以上、未達140°C之沸點的脂肪族 烴系溶劑之摻合比率係以質量比計若大於97 : 3,苯乙烯 系熱塑性彈性體之濃度高的組成物時,乾燥太快,點膠機 之唧筒會堵塞,或有時塗出液具有拉絲性,難謂佳。 於防濕絕緣材料中所含有之具有80 °C以上、未達11〇 °C之沸點的脂肪族烴系溶劑(倂用具有1 1 〇°c以上、未達 1 4 0 °C之沸點的脂肪族烴系溶劑時,具有8 0 °C以上、未達 1 1 0 °C之沸點的脂肪族烴系溶劑與具有1 1 0 °c以上、未達 -17- 201247798 1 4 0 t之沸點的脂肪族烴系溶劑之總量)與以式(1 )所示 之碳酸二烷酯所構成的溶劑之質量比較佳係85 : 1 5〜98 : 2的範圍,更佳係88: 12〜97: 3之範圍,若由碳酸二烷 酯所構成的溶劑之比率太少,源自點膠機之液體塗出時, 有時塗出液具有拉絲性。反之,若由碳酸二烷酯所構成的 溶劑之比率太多,有時熱可撓性彈性體之溶解性降低》 於防濕絕緣材料中所含有之具有80°C以上、未達110 °C之沸點的脂肪族烴系溶劑與以式(1 )所示之碳酸二烷 酯所構成的溶劑之總量係相對於溶劑之總量,較佳係65 質量%以上,更佳係70〜98質量%。具有80°C以上、未達 1 1 〇 °C之沸點的脂肪族烴系溶劑與以式(1 )所示之碳酸二 烷酯所構成的溶劑之總量若太少,對於熱塑性彈性體之溶 解性、源自點膠機之液體的塗出時之塗出液拉絲性的抑制 、至防濕絕緣材料塗佈後之塗膜表面沾黏消失止的時間及 防濕絕緣材料之黏度的4項目,很難均衡性地控制,難謂 佳。 具有8 0 °C以上、未達1 1 〇 °C之沸點的脂肪族烴系溶劑 之全溶劑占有的比例係宜爲65〜95質量%,更宜爲70〜 9 3質量%。 以式(1 )所示之碳酸二烷酯所構成的溶劑之全溶劑 占有的比例係宜爲2〜1 5質量%,更宜爲2〜1 0質量%。 倂用具有1 1 〇 °C以上、未達1 40 °C之沸點的脂肪族烴 系溶劑時係宜具有8 (TC以上、未達1 1 〇 °C之沸點的脂肪族 烴系溶劑、以式(1 )所示之碳酸二烷酯所構成的溶劑及II 0 (In the formula (1), R1 and R2 each independently represent a methyl group or an ethyl group). Examples of the solvent composed of the dialkyl carbonate represented by the formula (1) include, for example, dimethyl carbonate. , ethyl methyl carbonate 'diethyl carbonate. Among these, in consideration of the balance between the quick drying property and the stringiness, diethyl carbonate is preferred. The moisture-proof insulating material '(I) of the invention (I) further preferably contains an aliphatic hydrocarbon-based solvent having a boiling point of 110 ° C or more and less than 140 ° C. The aliphatic hydrocarbon solvent having a boiling point of 110 ° C or higher and less than 140 ° C may, for example, be n-octane (boiling point 125.7 ° C), cis-1,2-dimethyl-15-201247798 cyclohexane. (boiling point 1 2 9 · 7 °C), cis-1,3-dimethylcyclohexane (boiling point 120.1 ° C), cis-1,4-dimethylcyclohexane (boiling point 124.3 ° C) , trans-1,2-dimethylhydrazine cyclohexane (boiling point 123.4 ° C), trans-1,3-dimethylcyclohexane (boiling point 124.5 ° C), trans-1,4-dimethyl Cyclohexane (boiling point: 119.41), ethylcyclohexane (boiling point: 132 ° C), and the like. Among these, preferred are cis-1,2-dimethylcyclohexane, cis-1,3-dimethylcyclohexane, and cis-1,4-dimethylcyclohexane. , trans-oxime, 2-dimethylcyclohexane, trans-1,3-dimethylcyclohexane, trans-1,4-dimethylcyclohexane, ethylcyclohexane, if Considering the ease of obtaining, it is most suitable for ethylcyclohexane. Further, a solvent having an aliphatic hydrocarbon solvent having a boiling point of not less than 110 ° C and a boiling point of not more than 110 ° C, a dialkyl carbonate represented by the formula (1), and a solvent having a boiling point of 10 ° C or more are used. The solvent other than the aliphatic hydrocarbon solvent having a boiling point of 140 ° C may be in a range of non-destructive properties. Examples of the solvent include a hydrocarbon solvent having an alicyclic structure such as decalin, n-propyl acetate, n-butyl acetate, isobutyl acetate, tert-butyl acetate, isopropyl acetate, and ethyl acetate. An ether solvent such as an acetate solvent, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, ethylene glycol monoethyl ether, propylene glycol dimethyl ether or propylene glycol monomethyl ether, ethanol, 1-propanol, 2- An alcohol solvent such as propanol, a ketone solvent such as acetone, methyl ethyl ketone or methyl isobutyl ketone, or petroleum brain. After coating the moisture-proof insulating material, if the drying property and workability under the condition of no wind at room temperature are considered, the boiling point should be 14 ° C or less, specifically n-butyl acetate, isobutyl acetate, acetic acid The acetate solvent such as tributyl ester, isopropyl acetate, ethyl acetate or n-propyl acetate is more preferably n-propyl acetate, isobutyl acetate, tert-butyl acetate or n-butyl acetate. -16- 201247798 The total amount of the solvent contained in the moisture-proof insulating material is preferably 60 to 80% by mass, more preferably 65 to 78% by mass, most preferably 70 to 76% by mass based on the total mass of the moisture-proof insulating material. %. If the total amount of the solvent is too large, the thickness of the coating material is too thin, and sufficient moisture resistance and film strength may not be obtained. Further, as the solid content concentration becomes lower, the time until the adhesion of the surface of the coating film after application is shortened becomes longer, and as a result, the productivity is sometimes lowered. On the other hand, if the total amount of the solvent is too small, the viscosity of the coating material becomes high and the workability is poor, and it is difficult to apply it uniformly, or when the dispenser is dispensed, the cartridge may be clogged. When an aliphatic hydrocarbon solvent having a boiling point of 80 ° C or more and less than 110 ° C and an aliphatic hydrocarbon solvent having a boiling point of 110 ° C or more and less than 140 ° C are used, the blending ratio is mass The ratio is 65: 3 5~97: 3, better 68: 32~95: 5. The blend ratio of the aliphatic hydrocarbon solvent having a boiling point of 80 ° C or higher and less than 110 ° C to the aliphatic hydrocarbon solvent having a boiling point of 1 1 (TC or more and less than 140 ° C) is by mass ratio If it is less than 65:3 5, after applying the moisture-proof insulating material, the time until the adhesion of the surface of the coating film disappears becomes longer. The aliphatic hydrocarbon having a boiling point of 80 ° C or higher and less than 110 ° C The blending ratio of the solvent to the aliphatic hydrocarbon solvent having a boiling point of not more than 1 l ° C and not higher than 140 ° C is a composition having a mass ratio of more than 97 : 3 and a high concentration of the styrene thermoplastic elastomer When the material is too fast, the cylinder of the dispenser may be clogged, or sometimes the coating liquid has stringiness, which is difficult to say. The moisture-proof insulating material contains 80 ° C or more and less than 11 ° C. The aliphatic hydrocarbon-based solvent having a boiling point of 80 ° C or higher and less than 110 ° C when an aliphatic hydrocarbon solvent having a boiling point of 1 〇 ° C or more and less than 140 ° C is used. The boiling point of the aliphatic hydrocarbon solvent and the total amount of the aliphatic hydrocarbon solvent having a boiling point of 1 to 10 ° C or less and not reaching the boiling point of -17 to 201247798 140 k) The quality of the solvent composed of the dialkyl carbonate represented by the formula (1) is preferably in the range of 85:1 5 to 98:2, more preferably in the range of 88:12 to 97:3, if the dialkyl carbonate is used. The ratio of the solvent to be formed is too small, and the coating liquid may have stringiness when it is applied from the liquid of the dispenser. Conversely, if the ratio of the solvent composed of dialkyl carbonate is too large, sometimes the heat may be Reduced Solubility of Flexible Elastomer" An aliphatic hydrocarbon solvent having a boiling point of 80 ° C or higher and less than 110 ° C contained in the moisture-proof insulating material and a dialkyl carbonate represented by the formula (1) The total amount of the solvent to be formed is preferably 65 mass% or more, more preferably 70 to 98 mass%, based on the total amount of the solvent, and an aliphatic group having a boiling point of 80 ° C or more and less than 1 1 ° C. If the total amount of the solvent of the hydrocarbon solvent and the dialkyl carbonate represented by the formula (1) is too small, the solubility to the thermoplastic elastomer, and the coating liquid when the liquid of the dispenser is applied Suppression of stringiness, time to the surface of the coating film after application of the moisture-proof insulating material, and viscosity of the moisture-proof insulating material 4 items, it is difficult to control in a balanced manner, it is difficult to say that the ratio of the total solvent occupied by the aliphatic hydrocarbon solvent having a boiling point of 80 ° C or more and less than 1 1 〇 ° C is preferably 65 to 95% by mass. More preferably, the ratio of the total solvent of the solvent composed of the dialkyl carbonate represented by the formula (1) is preferably from 2 to 15% by mass, more preferably from 2 to 1 0. 5% by mass. When using an aliphatic hydrocarbon solvent having a boiling point of 1 〇 ° C or higher and less than 1 40 ° C, it is preferred to have an aliphatic hydrocarbon system having a boiling point of 8 (TC or more and less than 1 1 〇 ° C). a solvent, a solvent composed of a dialkyl carbonate represented by the formula (1), and

-18- 201247798 具有ii〇°c以上、未達14(rc之沸點的脂肪族烴系溶劑之 合計量的全溶劑占有之比率宜爲70〜100質量%。 本發明(I)之防濕絕緣材料係防濕絕緣材料之在25 °C的黏度較佳係1.2 pa. s以下,更佳係1.1 pa. s以下, 最佳係1,〇 Pa· s以下。一般使用點膠機而塗佈,故若考 量塗佈時之點膠機的壓力,若防濕絕緣材料之在25 t:的黏 度高於1.2 Pa· s,有時塗佈時之壓力太高,又,藉點膠 機塗佈防濕絕緣材料時,可抑制塗佈後之擴展,其結果, 擔心乾燥後之厚度變厚至必要以上,難謂佳。 又’本說明書記載之黏度係使用Brookfield公司製之 DV_II + Pr〇 viSC0meter少量試樣接受器(Spindle之型號: SC4-3 1 ) ’以25°C、旋轉數20rpm測定之値》 本發明(I )之防濕絕緣材料係依需要而可使用流平 劑、消泡劑、抗氧化劑、著色劑、矽烷偶合劑等之添加劑 〇 劑係只要爲具有藉添加提昇塗膜表面之流平性之 功能的材料’無特別限制。具體上係可使用聚醚改性二甲 基聚砂氧院共聚物、聚酯改性二甲基聚矽氧烷共聚物、聚 醚改性甲基院基聚矽氧烷共聚物、芳烷基改性甲基烷基聚 砂氧院共聚物等。此等係可單獨使用,亦可組合2種以上 而使用。相對於本發明(I )之防濕絕緣材料丨00質量份 ’可添加0.01〜3質量份。未達〇.〇1質量份時,有可能顯 現流平劑之添加效果。又,多於3質量份時,藉由使用之 流平劑的種類’有可能於塗膜表面產生沾黏,使絕緣特性 -19- 201247798 劣化。 消泡劑係塗佈本發明(1 )之防濕絕緣材料時,若爲 具有消除或抑制產生或殘存之氣泡的作用,無特別限制。 於本發明(I )之防濕絕緣材料所使用的消泡劑,可舉例 如矽氧系油、含氟化合物、聚羧酸系化合物、聚丁二烯系 化合物、乙炔二醇系化合物等公知之消泡劑。其具體例可 舉例如 BYK-077 ( BYK Japan 股份公司製)、SN defoamer 470 ( San Nopco 股份公司製)、TSA 750S ( Momentive Performance Materials Japan 合同公司製)、Silicone Oil SH-203 (Toray Dow Corning股份公司製)等之聚矽氧系 消泡齊!J 、Dappo-SN-348 ( San Nopco 股份公司製)、 Dappo-SN-354( San Nopco 股份公司製)、Dapp〇-SN-368 (San Nopco股份公司製)、Disparlon 230 HF (楠本化成 股份公司製)等之丙稀酸聚合物系消泡劑、Surfynol DF-110D (日信化學工業股份公司製)、Surfynol DF-37 (日 信化學工業股份公司製)等之乙炔二醇系消泡劑、FA-630 (信越化學工業股份公司製)等之含氟聚矽氧系消泡劑等 。此等係可單獨使用,亦可組合2種以上而使用。一般, 相對於本發明(丨)之防濕絕緣材料1 〇〇質量份,可添加 0.001〜5質量份。未達0.01質量份時,有可能未顯現消 泡劑之添加效果。又’多於5質量份時,藉由使用之消泡 劑的種類,有可能於塗膜表面產生沾黏,或使絕緣特性劣 化。 著色劑係可舉例如公知之無機顏料、有機系顔料、及-18- 201247798 The ratio of the total solvent occupied by the total amount of the aliphatic hydrocarbon solvent having a boiling point of ii 〇 ° or more and less than 14 (the boiling point of rc is preferably 70 to 100% by mass. The moistureproof insulation of the invention (I) The moisture resistance of the moisture-proof insulating material of the material is preferably 1.2 pa.s or less, more preferably 1.1 pa.s or less, and the optimum is 1, 〇Pa·s or less. Generally, it is coated by a dispenser. Therefore, if considering the pressure of the dispenser during coating, if the moisture resistance of the moisture-proof insulating material is higher than 1.2 Pa·s at 25 t: sometimes the pressure during coating is too high, and it is coated by a dispenser. When the moisture-proof insulating material is coated, it is possible to suppress the expansion after coating, and as a result, it is difficult to increase the thickness after drying to a level more than necessary. Further, the viscosity described in the present specification is DV_II + Pr〇 manufactured by Brookfield. viSC0meter small sample receiver (Spindle model: SC4-3 1 ) 'Measured at 25 ° C, rotation number 20 rpm 》 The moisture-proof insulating material of the invention (I) can be used as needed, leveling agent Additives such as foaming agents, antioxidants, coloring agents, decane coupling agents, etc. The material for adding the function of leveling the surface of the coating film is not particularly limited. Specifically, a polyether-modified dimethyl polyoxalate copolymer or a polyester-modified dimethyl polyoxyalkylene copolymer can be used. , a polyether-modified methyl polyalkylene oxide copolymer, an aralkyl-modified methyl alkyl polyoxalate copolymer, etc. These may be used singly or in combination of two or more. The moisture-proof insulating material 丨 00 parts by mass of the invention (I) may be added in an amount of 0.01 to 3 parts by mass. When the amount is less than 1 part by mass, the effect of adding a leveling agent may be exhibited. Further, more than 3 masses In the case of the coating, the type of the leveling agent used may cause sticking on the surface of the coating film to deteriorate the insulating property -19-201247798. When the antifoaming agent is applied to the moisture-proof insulating material of the invention (1), The antifoaming agent used in the moisture-proof insulating material of the present invention (I) may, for example, be an anthracene-based oil, a fluorine-containing compound or a polycarboxylate, and has a function of eliminating or suppressing the generation or remaining of the bubbles. An acid compound, a polybutadiene compound, an acetylene glycol compound, etc. are known. Specific examples of the antifoaming agent include BYK-077 (manufactured by BYK Japan Co., Ltd.), SN defoamer 470 (manufactured by San Nopco Co., Ltd.), TSA 750S (manufactured by Momentive Performance Materials Japan Co., Ltd.), and Silicone Oil SH-203 ( Toray Dow Corning Co., Ltd.), etc., J, Dappo-SN-348 (manufactured by San Nopco Co., Ltd.), Dappo-SN-354 (manufactured by San Nopco Co., Ltd.), Dapp〇-SN- Acrylic polymer defoamer, Surfynol DF-110D (made by Nissin Chemical Industry Co., Ltd.), Surfynol DF-37 (made by San Nopco Co., Ltd.), Disparlon 230 HF (made by Nanben Chemical Co., Ltd.) An acetylene glycol-based antifoaming agent such as an acetylene glycol-based antifoaming agent manufactured by Nisshin Chemical Industries Co., Ltd., or a fluorine-containing polyfluorinated defoaming agent such as FA-630 (manufactured by Shin-Etsu Chemical Co., Ltd.). These may be used singly or in combination of two or more. In general, it is possible to add 0.001 to 5 parts by mass based on 1 part by mass of the moisture-proof insulating material of the present invention. When it is less than 0.01 parts by mass, the effect of adding a defoaming agent may not be exhibited. Further, when it is more than 5 parts by mass, the type of the defoaming agent to be used may cause sticking on the surface of the coating film or deteriorate the insulating properties. The coloring agent may, for example, be a known inorganic pigment, an organic pigment, or

S -20- 201247798 有機系染料 發明(I) ' ,具體例係 份公司製) 製)、OIL OIL BLUE Black (保 j 使用,亦可 加量係相對 可添加〇 . 〇 1 必須可 及加熱時之 抗氧化 料的熱劣化 使用例如酚 酚系抗 化合物。 等,依所希望的色調而分別摻合。可使用於本 匕防濕絕緣材料的著色劑係宜爲油溶性之染料 可舉例如OIL BLACK 8 60 ( Orient化學工業股 、OIL BLACK 803 (Orient化學工業股份公司 BLUE 2N ( Orient化學工業股份公司製)、 63 0 ( Orient化學工業股份公司製)、S〇T 二谷化學工業股份公司製)等。此等係可單獨 組合2種以上而使用。一般,此等之染料的添 於本發明(I )之防濕絕緣材料1 00質量份, 〜5質量份。 抑制本發明(I )之防濕絕緣材料的氧化劣化 變色時’可使用抗氧化劑,且佳。 劑係若爲具有防止本發明(I )之防濕絕緣材 或變色之作用的化合物即可,無特別限制,可 系抗氧化劑等。 氧化劑係可舉例如下述式(2 )〜式(1 2 )之 -21 - 201247798S -20- 201247798 Organic dyes invention (I) ', specific examples are made by the company), OIL OIL BLUE Black (protected by j, can also be added relative to the amount added. 〇1 must be able to heat The thermal deterioration of the antioxidant material is, for example, a phenol phenol-based compound, etc., and is blended separately according to a desired color tone. The coloring agent used for the moisture-proof insulating material of the present invention is preferably an oil-soluble dye, for example, OIL. BLACK 8 60 (Orient Chemical Industry Co., Ltd., OIL BLACK 803 (Orient Chemical Industry Co., Ltd. BLUE 2N (Orient Chemical Industry Co., Ltd.), 63 0 (Orient Chemical Industry Co., Ltd.), S〇T Ergu Chemical Industry Co., Ltd. These may be used alone or in combination of two or more kinds. Generally, these dyes are added to 100 parts by mass of the moisture-proof insulating material of the present invention (I), and 5 parts by mass. Suppressing the present invention (I) In the case of oxidative deterioration of the moisture-proof insulating material, it is preferable to use an antioxidant. The agent is not particularly limited as long as it has a function of preventing the moisture-proof insulating material or discoloration of the present invention (I). The antioxidant may be for example -21-based oxidizing agent such as the following formula (2) to (12) of --201,247,798

【化6】 h[chemical 6] h

(3)(3)

【化7】【化7】

OH (4) (Η 3。)3〇 ( C Η 3 )3OH (4) (Η 3.) 3〇 (C Η 3 )3

-22 - 201247798 【化8】-22 - 201247798 【化8】

【化9】 (5)【化9】 (5)

【化1 0】 (6)[化1 0] (6)

(7) 【化1 1】(7) [Chemical 1 1]

-23- (8)-23- (8)

cc

201247798 【化1 2201247798 【化1 2

ch2ch2coo-ch2Ch2ch2coo-ch2

ch2ch2coo-ch2 【化1 3】 ?hV°~a /^°v HO—'^CHjCHjCOO-CHj-C—( C ) CH, ^-〇 【化1 4Ch2ch2coo-ch2 [化1 3] ?hV°~a /^°v HO—'^CHjCHjCOO-CHj-C—(C) CH, ^-〇 【化1 4

-24- (12) 201247798 【化1 5】-24- (12) 201247798 【化1 5】

OHOH

要求對可塗佈本發明(I)之防濕絕緣材料的塗膜之 玻璃或金屬氧化物之牢固密著性時,可使用矽烷偶合劑。 所謂矽烷偶合劑係分子內同時具有與有機材料反應鍵 結之官能基、及與無機材料反應鍵結之官能基的有機矽化 合物,一般其構造係如下述式(1 3 )所示。 【化1 6】When a strong adhesion to a glass or a metal oxide of a coating film to which the moisture-proof insulating material of the present invention (I) can be applied is required, a decane coupling agent can be used. The decane coupling agent is an organic ruthenium compound having both a functional group reactively bonded to an organic material and a functional group bonded to an inorganic material in the molecule, and its structure is generally represented by the following formula (13). 【化1 6】

此處,Y係與有機材料反應鍵結之官能基,可舉例如 乙烯基、環氧基、胺基、取代胺基、(甲基)丙烯醯氧基 、氫硫基等作爲其代表例。X係與無機材料反應之官能基 ’藉水、或濕氣受到水解而生成矽院醇。此砂院醇與無機 材料反應鍵結。X之代表例可舉例如烷氧基、乙醯氧基、 氯原子等。R3爲2價之有機基,R4表示烷基。a表示1〜 3之整數,b表示〇〜2之整數。但a + b = 3。 砂院偶合劑係可舉例如3 -異氰酸酯丙基三乙氧基砂院 、3-異氰酸酯丙基三甲氧基矽烷、3-異氰酸酯丙基甲基二 乙氧基矽烷、3-異氰酸酯丙基甲基二甲氧基砂院、對苯乙 -25- 201247798 烯基三甲氧基矽烷、對苯乙烯基三乙氧基矽烷、乙烯基三 甲氧基矽烷、乙烯基三乙氧基矽烷、乙烯基三異丙氧基矽 烷、乙烯基參(2-甲氧基乙氧基)矽烷、3-丙烯醯氧丙基 三甲氧基矽烷、3-甲基丙烯醯氧丙基三甲氧基矽烷、3-丙 烯醯氧丙基三乙氧基矽烷、3-甲基丙烯醯氧丙基三乙氧基 矽烷、3-丙烯醯氧丙基甲基二甲氧基矽烷、3-甲基丙烯醯 氧丙基甲基二甲氧基矽烷、3-丙烯醯氧丙基甲基二乙氧基 矽烷、3-甲基丙烯醯氧丙基甲基二乙氧基矽烷、2- (3,4-環氧基環己基)乙基三甲氧基矽烷、3-環氧丙氧基丙基三 甲氧基矽烷、3-環氧丙氧基丙基甲基二甲氧基矽烷、3-環 氧丙氧基丙基三乙氧基矽烷、3-環氧丙氧基丙基甲基二乙 氧基矽烷、N-2-(胺基乙基)-3-胺基丙基甲基二甲氧基矽 烷、N-(2-胺基乙基)-3-胺基丙基三甲氧基矽烷、N-(2-胺基乙基)-3-胺基丙基三乙氧基矽烷、3-胺基丙基三甲氧 基矽烷、3-胺基丙基三乙氧基矽烷、3-三乙氧基矽氧基-N-(1,3-二甲基-亞丁基)丙基胺、N-苯基-3-胺基丙基三甲 氧基矽烷、3 -氫硫基丙基三甲氧基矽烷、3 -氫硫基丙基三 乙氧基矽烷、烯丙基三甲氧基矽烷等。 此等之矽烷偶合劑之中,較佳者係可舉例如N-2-(胺 基乙基)-3-胺基丙基甲基二甲氧基矽烷、N-(2-胺基乙基 )-3-胺基丙基三甲氧基矽烷、N-( 2-胺基乙基)-3-胺基 丙基三乙氧基矽烷、3-胺基丙基三甲氧基矽烷、3-胺基丙 基三乙氧基矽烷、3-三乙氧基矽氧基-N- ( 1,3·二甲基-亞 丁基)丙基胺、N-苯基-3-胺基丙基三甲氧基矽烷等之含Here, the functional group in which Y is reactively bonded to an organic material may, for example, be a vinyl group, an epoxy group, an amine group, a substituted amine group, a (meth) acryloxy group, a thiol group or the like. The functional group that X reacts with the inorganic material is hydrolyzed by water or moisture to form brothel alcohol. This sand courtyard alcohol reacts with inorganic materials. Representative examples of X include, for example, an alkoxy group, an ethenyloxy group, a chlorine atom, and the like. R3 is a divalent organic group, and R4 represents an alkyl group. a represents an integer from 1 to 3, and b represents an integer of 〇~2. But a + b = 3. The sand chamber coupling agent may, for example, be 3-isocyanate propyl triethoxy sand, 3-isocyanate propyl trimethoxy decane, 3-isocyanate propyl methyl diethoxy decane, 3-isocyanate propyl methyl group. Dimethoxy sand, p-phenylethyl-25- 201247798 alkenyl trimethoxy decane, p-styryl triethoxy decane, vinyl trimethoxy decane, vinyl triethoxy decane, vinyl triiso Propoxy decane, vinyl ginseng (2-methoxyethoxy) decane, 3-propenyl methoxypropyl trimethoxy decane, 3-methyl propylene oxypropyl trimethoxy decane, 3-propene oxime Oxypropyl triethoxy decane, 3-methyl propylene oxypropyl triethoxy decane, 3-propenyl propyl propyl dimethyl dimethoxy decane, 3-methyl propylene methoxy propyl methyl Dimethoxydecane, 3-propenylmethoxypropylmethyldiethoxydecane, 3-methylpropenyloxypropylmethyldiethoxydecane, 2-(3,4-epoxycyclohexyl Ethyltrimethoxydecane, 3-glycidoxypropyltrimethoxydecane, 3-glycidoxypropylmethyldimethoxydecane, 3-glycidoxypropyl III Oxydecane, 3-glycidoxypropylmethyldiethoxydecane, N-2-(aminoethyl)-3-aminopropylmethyldimethoxydecane, N-(2 -aminoethyl)-3-aminopropyltrimethoxydecane, N-(2-aminoethyl)-3-aminopropyltriethoxydecane, 3-aminopropyltrimethoxy Decane, 3-aminopropyltriethoxydecane, 3-triethoxymethoxyoxy-N-(1,3-dimethyl-butylene)propylamine, N-phenyl-3-amine Propyltrimethoxydecane, 3-hydrothiopropyltrimethoxydecane, 3-hydrothiopropyltriethoxydecane, allyltrimethoxydecane, and the like. Among these decane coupling agents, preferred are, for example, N-2-(aminoethyl)-3-aminopropylmethyldimethoxydecane, N-(2-aminoethyl) ,-3-aminopropyltrimethoxydecane, N-(2-aminoethyl)-3-aminopropyltriethoxydecane, 3-aminopropyltrimethoxydecane, 3-amine Propyltriethoxydecane, 3-triethoxymethoxy-N-(1,3·dimethyl-butylene)propylamine, N-phenyl-3-aminopropyltrimethoxy Containing decane, etc.

S -26- 201247798 有胺基的矽烷偶合劑、3 -氫硫基丙基三甲氧基矽烷、3 -氫 硫基丙基三乙氧基矽烷等之含有氫硫基的矽烷偶合劑、3-丙烯醯氧基丙基三乙氧基矽烷、3-甲基丙烯醯氧基丙基三 乙氧基矽烷、3-丙烯醯氧基丙基甲基二甲氧基矽烷、3-甲 基丙烯醯氧基丙基甲基二甲氧基矽烷、3_丙烯醯氧基丙基 甲基二乙氧基矽烷、3-甲基丙烯醯氧基丙基甲基二乙氧基 矽烷等之含(甲基)丙烯醯氧基矽烷偶合劑。市售品可舉 例如KBM- 5 03 (信越化學工業股份公司製)、KBM-903 ( 信越化學工業股份公司製)、KBE-903 (信越化學工業股 份公司製)、Z-6062 (Toray Dow Corning股份公司製) 、Z-602 3 ( Toray Dow Corning股份公司製)等。此等係 可1種或組合2種以上而使用》 爲對適於本發明(I)之防濕絕緣材料的玻璃基材賦 予密著性’係矽烷偶合劑之摻合量相對於苯乙烯系熱塑性 彈性體100質量份,宜爲0.1〜1〇質量份,更宜爲〇.5〜8 質量份。 本發明(Π )係使用本發明(I )之防濕絕緣材料而被 絕緣處理之電子零件。如此之電子零件係可舉例如微電腦 、電晶體、電容器、電阻、繼電器、變壓器等、及搭載此 等之封裝電路板等,進一步,亦包含黏合於此等電子零件 之導線、配件、薄膜基板等。 又,可舉例如液晶顯示器面板、電漿顯示器面板、有 機電激發光面板、場發射型顯示器面板等之平面顯示器面 板的訊號輸入部作爲電子零件等。尤其,於電子零件用顯 -27- 201247798 示器用基板等之1C周邊部或面板貼合部等較宜使用本發 明(I)之防濕絕緣材料。 本發明(Π)之電子零件係可藉由使用防濕絕緣材料 而絕緣處理電子零件來製造。本發明(H)之電子零件的 具體製造方法係首先,藉由一般所知之浸漬法、刮塗法、 噴塗法、拉線塗佈法等之方法而使上述之防濕絕緣材料塗 佈於上述電子零件,使防濕絕緣材料所含有之有機溶劑揮 發而乾燥塗膜,俾可得到電子零件。 [實施例] 以下,藉實施例更具體地說明本發明,但本發明係不 僅限制於以下之實施例。 實施例1 混合作爲苯乙烯-丁二烯嵌段共聚合彈性體之 D 1 1 5 5 (Kraton Polymer公司製、苯乙嫌含量40質量。/〇) 25g、 作爲增黏劑之Quintone (註冊商標)D100 (日本Zeon股 份公司製脂肪族-芳香族共聚合系石油樹脂)6.lg、作爲溶 劑之甲基環己烷(九善石油化學股份公司製、商品名: Suwaclean MCH) 71.0g、乙基環己烷(九善石油化學股份 公司製、商品名:Suwaclean ECH) 5.8g、碳酸二乙酯( 三井化學Fine股份公司製)3.2g’作爲摻合物D1。 摻合物D1在25。(:的黏度爲0_68Pa· s。 -28- 201247798 實施例2 混合作爲苯乙烯-丁二烯嵌段共聚合彈性體之D1155 (Kraton Polymer公司製、苯乙烯含量40質量%) 22.5g 、作爲增黏劑之Quintone (註冊商標)D100 (日本Zeon 股份公司製)5.5g、作爲溶劑之甲基環己烷(九善石油化 學股份公司製 '商品名:Suwaclean MCH) 60.0g、乙基環 己院(九善石油化學股份公司製、商品名:Suwaclean ECH) 8.0g、碳酸二乙酯(三井化學Fine股份公司製) 4.〇g,作爲摻合物D2。 摻合物D2在25 °C的黏度爲0.67 Pa· s。 實施例3 混合作爲苯乙烯-丁二烯嵌段共聚合彈性體之D1 155 (Kraton Polymer公司製、苯乙嫌含量40質量%) 22.5g 、作爲增黏劑之Quintone (註冊商標)D1 00 (日本Zeon 股份公司製)5 .5 g、作爲溶劑之甲基環己烷(九善石油化 學股份公司製、商品名:Suwaclean MCH) 56.0g、乙基環 己烷(九善石油化學股份公司製、商品名:Suwaclean ECH) 8.0g、碳酸二甲酯(宇部興產股份公司製)4.0g、 碳酸二乙酯(三井化學Fine股份公司製)4.0g,作爲摻合 物D3。 摻合物D3在25 °C的黏度爲〇·62 Pa· s。 實施例4 29 - 201247798 混合作爲苯乙烯-丁二烯嵌段共聚合彈性體之Dll 55 (Kraton Polymer公司製、苯乙嫌含量40質量%) 22.5g 、作爲增黏劑之Quintone (註冊商標)D100 (日本Zeon 股份公司製)5.5g、作爲溶劑之甲基環己烷(九善石油化 學股份公司製、商品名:Suwaclean MCH) 68.0g、碳酸二 乙酯(三井化學Fine股份公司製)4.0g,作爲摻合物D4 〇 摻合物D4在25 °C的黏度爲0.67 Pa. s。 比較例1 混合作爲苯乙烯-異戊二烯嵌段共聚合彈性體之 D1161 ( Kraton Polymer公司製、苯乙嫌含量15質量0/〇) 2〇g、作爲增黏劑之I-MARV (註冊商標)P-100 (出光興 產股份公司製、以C5餾份作爲主成分之二環戊二烯/芳香 族共聚合系之氫化石油樹脂、P級係氫化率較S級更高之 級數)l〇g、作爲矽烷偶合劑之N-2-(胺基乙基)-3-胺基 丙基甲基二甲氧基矽烷(信越化學工業股份公司製 '商品 名:KB Μ-6 02 ) lg、作爲溶劑之乙基環己烷(九善石油化 學股份公司製 '商品名:Suwaclean ECH) 7〇g’作爲接合 物E1。 摻合物E1在25 °C的黏度爲1.11 Pa· s。 比較例2 混合作爲苯乙烯-乙烯基/ 丁烯嵌段共聚合·性體之S -26- 201247798 A hydrazine coupling agent containing an amine group, a thiol coupling agent containing a thiol group such as 3-alhydrothiopropyltrimethoxydecane, 3-hydrothiopropyltriethoxydecane, or the like Propylene methoxypropyltriethoxydecane, 3-methylpropenyloxypropyltriethoxydecane, 3-propenyloxypropylmethyldimethoxydecane, 3-methylpropene oxime Containing oxypropylmethyldimethoxydecane, 3-propyleneoxypropylmethyldiethoxydecane, 3-methylpropenyloxypropylmethyldiethoxydecane, etc. Base) propylene methoxy oxane coupling agent. For example, KBM- 5 03 (manufactured by Shin-Etsu Chemical Co., Ltd.), KBM-903 (manufactured by Shin-Etsu Chemical Co., Ltd.), KBE-903 (manufactured by Shin-Etsu Chemical Co., Ltd.), and Z-6062 (Toray Dow Corning) Z-602 3 (manufactured by Toray Dow Corning Co., Ltd.). These may be used alone or in combination of two or more. In order to impart adhesion to a glass substrate suitable for the moisture-proof insulating material of the present invention (I), the blending amount of the decane coupling agent is relative to the styrene system. The thermoplastic elastomer is preferably used in an amount of from 0.1 to 1 part by mass, more preferably from 0.5 to 8 parts by mass, based on 100 parts by mass of the thermoplastic elastomer. The present invention (Π) is an electronic component which is insulated by using the moisture-proof insulating material of the invention (I). Such an electronic component may, for example, be a microcomputer, a transistor, a capacitor, a resistor, a relay, a transformer, or the like, and a packaged circuit board on which such a package is mounted, and further includes a wire, an accessory, a film substrate, and the like that are bonded to the electronic component. . Further, for example, a signal input portion of a flat display panel such as a liquid crystal display panel, a plasma display panel, an electromechanical excitation light panel, or a field emission type display panel may be used as an electronic component. In particular, it is preferable to use the moisture-proof insulating material of the present invention (I) in the peripheral portion of the 1C such as the substrate for electronic parts, or the panel bonding portion of the panel. The electronic component of the present invention can be manufactured by insulating and treating electronic parts using a moisture-proof insulating material. In the specific manufacturing method of the electronic component of the invention (H), first, the above-mentioned moisture-proof insulating material is applied by a method such as a commonly known dipping method, a doctor blade method, a spray coating method, or a wire coating method. In the above electronic component, the organic solvent contained in the moisture-proof insulating material is volatilized to dry the coating film, and an electronic component can be obtained. [Examples] Hereinafter, the present invention will be specifically described by way of Examples, but the present invention is not limited to the examples below. Example 1 D 1 1 5 5 (manufactured by Kraton Polymer Co., Ltd., benzoic acid content: 40 mass%/〇) as a styrene-butadiene block copolymerized elastomer 25 g, Quintone as a tackifier (registered trademark) ) D100 (an aliphatic-aromatic copolymerized petroleum resin manufactured by Zeon Co., Ltd.) 6.lg, methylcyclohexane as a solvent (manufactured by Jiushan Petrochemical Co., Ltd., trade name: Suwaclean MCH) 71.0g, B Cyclohexane (manufactured by Jiushan Petrochemical Co., Ltd., trade name: Suwaclean ECH) 5.8 g, diethyl carbonate (manufactured by Mitsui Chemicals, Inc.) 3.2 g' as the blend D1. Blend D1 is at 25. (: Viscosity is 0_68 Pa·s. -28-201247798 Example 2 D1155 (40% by mass of styrene content, manufactured by Kraton Polymer Co., Ltd.) as a styrene-butadiene block copolymerized elastomer was mixed, and 22.5 g was added. 5.5 g of Quintone (registered trademark) D100 (made by Japan Zeon Co., Ltd.), methylcyclohexane as a solvent (product name: Suwaclean MCH, manufactured by Jiushan Petrochemical Co., Ltd.) 60.0 g, Ethyl ring (made by Jiushan Petrochemical Co., Ltd., trade name: Suwaclean ECH) 8.0g, diethyl carbonate (manufactured by Mitsui Chemicals, Inc.) 4. 〇g, as blend D2. Blend D2 at 25 °C The viscosity was 0.67 Pa·s. Example 3 D1 155 (manufactured by Kraton Polymer Co., Ltd., benzene and ethyl ester content: 40% by mass) as a styrene-butadiene block copolymerized elastomer 22.5 g, Quintone as a tackifier (registered trademark) D1 00 (made by Japan Zeon Co., Ltd.) 5 .5 g, methylcyclohexane as a solvent (manufactured by Jiushan Petrochemical Co., Ltd., trade name: Suwaclean MCH) 56.0 g, ethylcyclohexane ( Nine-good Petrochemical Co., Ltd., trade name: Suwaclea n ECH) 8.0 g, dimethyl carbonate (manufactured by Ube Industries, Ltd.) 4.0 g, and diethyl carbonate (manufactured by Mitsui Chemicals, Inc.) 4.0 g, as blend D3. Blend D3 at 25 °C The viscosity is 〇·62 Pa· s. Example 4 29 - 201247798 Dll 55 (manufactured by Kraton Polymer Co., Ltd., benzene and ethylene content 40% by mass) as a styrene-butadiene block copolymerized elastomer 22.5 g 5.5 g of Quintone (registered trademark) D100 (manufactured by Japan Zeon Co., Ltd.) as a tackifier, methylcyclohexane (manufactured by Jiushan Petrochemical Co., Ltd., trade name: Suwaclean MCH) as a solvent, 68.0 g, diethyl carbonate The ester (manufactured by Mitsui Chemicals, Inc.) 4.0 g, as a blend of D4 yttrium blend D4, had a viscosity of 0.67 Pa·s at 25 ° C. Comparative Example 1 Mixing as a styrene-isoprene block copolymerization Elastomer D1161 (manufactured by Kraton Polymer Co., Ltd., benzene and benzene content: 15 mass% / 〇) 2〇g, I-MARV (registered trademark) P-100 as a tackifier (made by Idemitsu Kosan Co., Ltd., C5 distillation) Hydrogenated petroleum resin, P-stage hydrogen, as a main component of dicyclopentadiene/aromatic copolymerization a higher order than the S grade) l〇g, N-2-(aminoethyl)-3-aminopropylmethyldimethoxydecane as a decane coupling agent (manufactured by Shin-Etsu Chemical Co., Ltd. 'Trade name: KB Μ-6 02 ) lg, ethyl cyclohexane as a solvent (trade name: Suwaclean ECH, manufactured by Jiu-Sen Petrochemical Co., Ltd.) 7〇g' as a joint E1. The viscosity of the blend E1 at 25 ° C was 1.11 Pa·s. Comparative Example 2 Mixing as a styrene-vinyl/butene block copolymerization/sexual body

-30- 201247798 G1652 ( Kraton Polymer公司製、苯乙嫌含量30質量%) 2〇g及苯乙烯-丁二烯嵌段共聚合彈性體之D1101 ( Kraton Polymer公司製、苯乙烯含量31質量% ) 20g、作爲增黏 劑之I-MARV (註冊商標)P-100 (出光興產股份公司製、 以C5餾份作爲主成分之二環戊二烯/芳香族共聚合系之氫 化石油樹脂)10g、作爲矽烷偶合劑之N-2-(胺基乙基)· 3-胺基丙基甲基二甲氧基矽烷(信越化學工業股份公司製 、商品名·· KBM-602 ) lg、作爲溶劑之乙基環己烷(九善 石油化學股份公司製、商品名:Suwaclean ECH ) 70g,作 爲摻合物E2 ^ 摻合物E2在25 °C的黏度太高,而無法以前述之黏度 測定條件進行測定。 比較例3 混合作爲苯乙烯-丁二烯嵌段共聚合彈性體之D1 155 (Kraton Polymer公司製、苯乙烯含量40質量% ) 25g、 作爲增黏劑之Quintone (註冊商標)D100 (日本Zeon股 份公司製脂肪族-芳香族共聚合系石油樹脂)6.lg、作爲溶 劑之乙基環己烷(九善石油化學股份公司製、商品名: Suwaclean ECH) 80g,作爲摻合物 E3。 摻合物E3在25°C的黏度爲0.88 Pa · s。 比較例4 混合作爲苯乙烯-丁二烯嵌段共聚合彈性體之D1155 -31 - 201247798 (Kraton Polymer公司製、苯乙稀含量40質量%) 22.5g 、作爲增黏劑之Quintone (註冊商標)D100 (日本Zeon 股份公司製)5.5g、作爲溶劑之乙基環己烷(九善石油化 學股份公司製、商品名:Suwaclean ECH) 64g、醋酸正丁 酯(協和發酵化學股份公司製、商品名:醋酸丁酯-P ) 8g ,作爲摻合物E 4。 摻合物E4在25 °C的黏度爲0.66 Pa. s。 比較例5 混合作爲苯乙烯-丁二烯嵌段共聚合彈性體之D 1 1 5 5 (Kraton Polymer公司製、苯乙稀含量40質量%) 22.5g 、作爲增黏劑之Quintone (註冊商標)D100 (日本Zeon 股份公司製)3.0g及I-MARV (註冊商標)S-110C出光興 產股份公司製、以C 5餾份作爲主成分之二環戊二烯/芳香 族共聚合系之氫化石油樹脂)2.5g、作爲溶劑之乙基環己 烷(九善石油化學股份公司製、商品名:Suwaclean ECH )64g、醋酸正丁酯(協和發酵化學股份公司製、商品名 :醋酸丁酯-P) 8g,作爲摻合物E5。 摻合物E5在25 °C的黏度爲0.68 Pa. s。 比較例6 混合作爲苯乙烯-異戊二烯嵌段共聚合彈性體之 D1161 ( Kraton Polymer公司製、苯乙燃含量15質量% ) 22.5g、作爲增黏劑之Quintone (註冊商標)D100 (日本-30- 201247798 G1652 (manufactured by Kraton Polymer Co., Ltd., benzoic acid content: 30% by mass) 2〇g and styrene-butadiene block copolymerized elastomer D1101 (manufactured by Kraton Polymer Co., Ltd., styrene content: 31% by mass) 20g, I-MARV (registered trademark) P-100 as a tackifier (hydrogenated petroleum resin of dicyclopentadiene/aromatic copolymerization system made of C5 fraction as a main component) 10g N-2-(Aminoethyl)-3-aminopropylmethyldimethoxydecane (manufactured by Shin-Etsu Chemical Co., Ltd., trade name KBM-602) as a decane coupling agent lg, as a solvent Ethylcyclohexane (manufactured by Jiushan Petrochemical Co., Ltd., trade name: Suwaclean ECH) 70g, as the blend E2 ^ blend E2 has too high viscosity at 25 °C, and cannot be measured with the aforementioned viscosity. The measurement was carried out. Comparative Example 3 D1 155 (made by Kraton Polymer Co., Ltd., styrene content: 40% by mass) as a styrene-butadiene block copolymerized elastomer 25 g, Quintone (registered trademark) D100 as a tackifier (Japan Zeon Co., Ltd.) Co., Ltd., an aliphatic-aromatic copolymer-based petroleum resin, a product of 6. lg, ethylcyclohexane (manufactured by Jiushan Petrochemical Co., Ltd., trade name: Suwaclean ECH) as a solvent, 80 g, as a blend E3. The viscosity of the blend E3 at 25 ° C was 0.88 Pa · s. Comparative Example 4 D1155 -31 - 201247798 (manufactured by Kraton Polymer Co., Ltd., styrene content 40% by mass) as a styrene-butadiene block copolymerized elastomer 22.5 g, Quintone (registered trademark) as a tackifier Dg (manufactured by Japan Zeon Co., Ltd.), 5.5 g, ethylcyclohexane (manufactured by Jiushan Petrochemical Co., Ltd., trade name: Suwaclean ECH), 64 g, n-butyl acetate (manufactured by Kyowa Fermentation Chemical Co., Ltd., trade name) : butyl acetate-P) 8 g as a blend E 4 . The viscosity of the blend E4 at 25 ° C was 0.66 Pa.s. Comparative Example 5 D 1 1 5 5 (manufactured by Kraton Polymer Co., Ltd., styrene content: 40% by mass) as a styrene-butadiene block copolymerized elastomer 22.5 g, Quintone (trademark) as a tackifier D100 (manufactured by Zeon Co., Ltd.) 3.0g and I-MARV (registered trademark) S-110C Idemitsu Co., Ltd., hydrogenation of dicyclopentadiene/aromatic copolymerization system with C 5 fraction as a main component Petroleum resin) 2.5 g, ethyl cyclohexane as a solvent (manufactured by Jiushan Petrochemical Co., Ltd., trade name: Suwaclean ECH) 64 g, n-butyl acetate (manufactured by Kyowa Fermentation Chemical Co., Ltd., trade name: butyl acetate - P) 8g as blend E5. The viscosity of the blend E5 at 25 ° C was 0.68 Pa.s. Comparative Example 6 D1161 (available from Kraton Polymer Co., Ltd., benzotriene content: 15% by mass) as a styrene-isoprene block copolymerized elastomer 22.5 g, Quintone (registered trademark) D100 as a tackifier

S -32- 201247798S -32- 201247798

Zeon股份公司製)5.5g、作爲溶劑之乙基環己烷(九善石 油化學股份公司製、商品名·· Suwaclean ECH) 67g、醋酸 正丁酯(協和發酵化學股份公司製、商品名:醋酸丁酯-p )5g,作爲摻合物E6。 摻合物E6在25 °C的黏度爲1.22 Pa· s。 比較例7 混合作爲苯乙烯-丁二烯嵌段共聚合彈性體之D1155 (Kraton Polymer公司製、苯乙稀含量40質量%) 25g、 作爲增黏劑之Quint one (註冊商標)D100 (日本Zeon股 份公司製)6.lg、作爲溶劑之乙基環己烷(九善石油化學 股份公司製、商品名:Suwaclean ECH) 98.5g,作爲摻合 物E7。 摻合物E7在25 °C的黏度爲0.32 Pa· 比較例8 混合作爲苯乙烯-丁二烯嵌段共聚合彈性體之D1155 (Kraton Polymer公司製、苯乙烯含量40質量% ) 25g、 作爲增黏劑之Quint one (註冊商標)D100 (日本Zeon股 份公司製脂肪族-芳香族共聚合系石油樹脂)6. lg、作爲溶 劑之甲基環己烷(九善石油化學股份公司製、商品名:5.5g, manufactured by Zeon Co., Ltd., ethylcyclohexane as a solvent (manufactured by Jiushan Petrochemical Co., Ltd., trade name · Suwaclean ECH) 67g, n-butyl acetate (trade name: acetic acid, manufactured by Kyowa Fermentation Chemical Co., Ltd.) Butyl ester-p) 5 g as a blend E6. The blend E6 had a viscosity of 1.22 Pa·s at 25 °C. Comparative Example 7 D1155 (manufactured by Kraton Polymer Co., Ltd., styrene content: 40% by mass) as a styrene-butadiene block copolymerized elastomer, 25 g, and Quint one (registered trademark) D100 as a tackifier (Japanese Zeon) 6.lg, manufactured by the company, 98.5 g of ethylcyclohexane (manufactured by Jiushan Petrochemical Co., Ltd., trade name: Suwaclean ECH) as a solvent, as a blend E7. The viscosity of the blend E7 at 25 ° C was 0.32 Pa. Comparative Example 8 D1155 (40% by mass of styrene content, manufactured by Kraton Polymer Co., Ltd.) as a styrene-butadiene block copolymerized elastomer was mixed. Quint one (registered trademark) D100 (manufactured by Zeon Co., Ltd., an aliphatic-aromatic copolymerized petroleum resin) 6. lg, methylcyclohexane as a solvent (manufactured by Jiushan Petrochemical Co., Ltd., trade name) :

Suwaclean MCH) 80g,作爲摻合物 E8。 摻合物E8在25°C的黏度爲0.72 Pa · s。 -33- 201247798 [摻合物之評估] 依上述組成所調製之摻合物D1〜D4及E1、E3〜E8 之特性依以下所示的方法評估。結果表示於表1中。 〈黏度之測定〉 黏度係依以下之方法測定。 使用試料10ml,使用黏度計(Brookfield公司製、型 式:DV-II + Pro),使用少量試樣接受器及型號C4-31之 旋轉子,以溫度25.0°C、旋轉數20rpm之條件測定黏度約 成爲一定時之値。 〈無沾黏時間之評估〉 無沾黏時間係依以下之方法評估。 使摻合物D 1〜D 4及摻合物E 1、E 3〜E 8分別於玻璃 上使用自動點膠機而塗佈成乾燥後之厚度爲約350#m, 塗佈後’藉指觸每隔3 0秒確認塗膜表面之有無沾黏。使 沾黏消失之最初的時間作爲無沾黏時間。 無沾黏時間係速乾燥性之指標,愈短愈佳。 又,摻合物E2係黏度太高,而無法以自動點膠機塗 佈。 〈有無拉絲性之評估〉 對於有無拉絲性係依以下之方法評估。 使摻合物D1〜D4及摻合物E1、E3〜E8分別於玻璃 -34 - 201247798 上使用點膠機而塗佈成乾燥後之厚度爲約3 50 gm,其塗 佈之終了時,判斷是否塗佈液從點膠機之前端變成絲狀。 ◎:絲狀之塗佈液係完全不產生。 〇:有產生絲狀之塗佈液,亦有時不產生。 X :經常產生絲狀之塗佈液。 〈對玻璃之密著性及源自玻璃之剝離性的評估〉 對玻璃之密著性係依以下之方法評估。 使摻合物D1〜D4及摻合物El、E3〜E8分別於玻璃 上塗佈成乾燥後之厚度爲130/zm,在室溫保持10分鐘後 ,以70 °C乾燥0.5小時後,在室溫放置12小時。有關此 等之塗膜,只剝離評估試驗用之硬化膜的一端,製作寬 2.5mm之黏著力測定用試驗片。黏著力係與玻璃板剝離之 硬化膜成爲90度之角度,固定於拉抗試驗機(股份公司 島津製作所製、EZ Test/CE ),使最初之卡盤間距離爲 2.5cm,測定在23 °C中以50mm/分之速度90度剝離強度來 求出。 又,所謂「剝離性」中之X符號係於90度剝離強度之 測定中切斷硬化膜,在「剝離性j中之〇符號係於90度 剝離強度之測定中未切斷硬化膜而可剝離。 某程度之密著性係必須用以維持防濕性、絕緣信賴性 ,但於LCD面板之出貨前檢査有不良時,玻璃面板係欲 再利用(可撓性配線板係捨棄),故欲剝離時係宜塗膜未 被完全切斷,可漂亮地剝離。 -35- 201247798 〈對聚醯亞胺薄膜之密著性的評估及源自聚醯亞胺之剝離 性的評估〉 對聚醯亞胺薄膜之密著性係依以下之方法評估。 使摻合物D丨〜D4及摻合物El、E3〜E8分別於聚醯 亞胺薄膜(商品名:Kapton (註冊商標)150EN、Toray Dupont股份公司製)上,塗佈成乾燥後之厚度爲130 μ m ,在室溫保持10分鐘後,以70°C乾燥0.5小時後,在室 溫放置1 2小時。其後,製作未塗佈此聚醯亞胺薄膜之摻 合物的面與置入玻璃布之環氧樹脂板以雙面接著膠帶貼合 之板(以下,記爲「貼黏聚醯亞胺薄膜的環氧樹脂板」) 。有關此等之塗膜,只剝離評估試驗用之硬化膜的一端, 製作寬2.5mm之黏著力測定用試驗片。黏著力係與貼黏聚 醯亞胺薄膜的環氧樹脂板剝離之硬化膜成爲90度之角度 ,固定於拉抗試驗機(股份公司島津製作所製、EZ Test/CE ),使最初之卡盤間距離爲2.5cm,測定在2 3 °C 中以50mm/分之速度90度剝離強度來求出。結果表示於 表1中。 又,所謂「剝離性」中之X符號係於90度剝離強度之 測定中切斷硬化膜,在「剝離性」中之〇符號係於90度 剝離強度之測定中未切斷硬化膜而可剝離。 〈透濕度評估〉 使摻合物D 1〜D4及摻合物El、Ε3〜Ε8分別於鐵氟Suwaclean MCH) 80g as a blend E8. The viscosity of the blend E8 at 25 ° C was 0.72 Pa · s. -33-201247798 [Evaluation of Blend] The characteristics of the blends D1 to D4 and E1, E3 to E8 prepared according to the above composition were evaluated by the methods shown below. The results are shown in Table 1. <Measurement of Viscosity> The viscosity was measured by the following method. Using a sample of 10 ml, using a viscometer (manufactured by Brookfield Co., Ltd., type: DV-II + Pro), a small amount of sample receiver and a rotator of model C4-31 were used, and the viscosity was measured at a temperature of 25.0 ° C and a number of revolutions of 20 rpm. Be a certain time. <Evaluation of no sticking time> No sticking time was evaluated by the following method. The blends D 1 to D 4 and the blends E 1 and E 3 to E 8 were respectively coated on a glass using an automatic dispenser to have a thickness of about 350 #m after drying. The surface of the coating film was confirmed to be sticky every 30 seconds. The initial time to make the stick disappear is used as the non-stick time. No sticking time is the indicator of quick drying, the shorter the better. Also, the blend E2 has a too high viscosity and cannot be applied by an automatic dispenser. <Evaluation of the presence or absence of stringiness> The presence or absence of stringiness is evaluated by the following method. The blends D1 to D4 and the blends E1, E3 to E8 were respectively coated on a glass-34 - 201247798 using a dispenser to have a thickness of about 3 50 gm after drying, and when the coating was finished, it was judged Whether the coating liquid is changed from the front end of the dispenser to a filament. ◎: The silky coating liquid was not produced at all. 〇: There is a silky coating solution which is sometimes not produced. X: A filamentous coating liquid is often produced. <Evaluation of adhesion of glass and peeling property derived from glass> The adhesion of glass was evaluated by the following method. The blends D1 to D4 and the blends El, E3 to E8 were respectively coated on glass to have a thickness of 130/zm after drying, and were kept at room temperature for 10 minutes, and then dried at 70 ° C for 0.5 hour. Leave at room temperature for 12 hours. Regarding the coating film of the above, only one end of the cured film for evaluation test was peeled off, and a test piece for measuring the adhesion force of 2.5 mm in width was produced. The adhesive film is at a 90 degree angle from the cured film peeled off from the glass plate, and is fixed to a tensile tester (made by Shimadzu Corporation, EZ Test/CE), so that the distance between the initial chucks is 2.5 cm, measured at 23 °. C was obtained at a peeling strength of 90 degrees at a speed of 50 mm/min. In addition, the X-symbol in the "peelability" cuts the cured film in the measurement of the 90-degree peel strength, and the "defectiveness j" symbol is that the cured film is not cut in the measurement of the 90-degree peel strength. A certain degree of adhesion must be used to maintain moisture resistance and insulation reliability. However, when the LCD panel is inspected before shipment, the glass panel is intended to be reused (the flexible wiring board is discarded). Therefore, when peeling is desired, the film is not completely cut and can be peeled off beautifully. -35- 201247798 <Evaluation of the adhesion of the polyimide film and the evaluation of the peeling property derived from polyimine] The adhesion of the polyimide film was evaluated by the following method: The blends D丨~D4 and the blends El, E3 to E8 were respectively obtained on the polyimide film (trade name: Kapton (registered trademark) 150EN The film was dried to a thickness of 130 μm, dried at room temperature for 10 minutes, and then dried at 70 ° C for 0.5 hours, and then allowed to stand at room temperature for 12 hours. Thereafter, it was prepared. The surface of the blend not coated with the polyimide film and the epoxy tree placed in the glass cloth Then a double-sided tape plate bonded to the board (hereinafter referred to as "polyimide film paste sticky epoxy resin plate"). With respect to these coating films, only one end of the cured film for evaluation test was peeled off, and a test piece for measuring the adhesion force of 2.5 mm in width was prepared. The adhesive film is peeled from the epoxy resin sheet of the adhesive polyimide film at an angle of 90 degrees, and is fixed to a tensile tester (made by Shimadzu Corporation, EZ Test/CE) to make the initial chuck. The distance between the two was 2.5 cm, and the measurement was carried out at a peeling strength of 90 degrees at a speed of 50 mm/min at 23 °C. The results are shown in Table 1. In addition, the X-symbol in the "peelability" cuts the cured film in the measurement of the 90-degree peel strength, and the "debonding property" is a symbol in which the cured film is not cut in the measurement of the 90-degree peel strength. Stripped. <Evaluation of moisture permeability> The blends D 1 to D4 and the blends El, Ε 3 Ε Ε 8 are respectively in the iron fluoride

S -36- 201247798 龍(註冊商標)板上乾燥後之厚度成爲約130/zm之方式 使用桿塗佈器,重疊塗佈,俾製作自立膜。 使用透濕杯治具(Tester產業股份公司製),使此等 自立膜的透濕度依據JIS Z0208而測定。 又,透濕度之試驗條件係溫度40°C、濕度90%RH、 2 4小時。 〈使用可撓性基板之長期電性絕緣信賴性之評估〉 蝕刻可撓性銅箔層合板(住友金屬礦山股份公司製、 級名·· S’perflex、銅厚:8/zm、聚醯亞胺厚:38/zm)而 製造之於JPCA-ET01記載之微細梳形圖型形狀的基板(銅 配線寬/銅配線間寬=1 5 y m/ 1 5 # m )實施鍍錫處理的可撓 性配線板上,使摻合物D1〜D4及摻合物El' E3〜E8分 別塗佈成乾燥後之厚度爲l〇〇em,在室溫保持10分鐘後 ,以7〇°C乾燥1.5小時。 使用此試驗片,施加偏壓電壓3 0V,使用MIGRATION TESTER MODEL MIG-8600 (IMV 公司製)而進行溫度 85 °C、濕度85%RH之條件的溫濕度定常試驗。將起動上述 溫濕度定常試驗後1 000小時後之電阻値表示於表1中。 〈使用玻璃基板上配線之長期絕緣信賴性的評估〉 於玻璃基板上形成線/線距爲4〇vm/10#m之梳形圖 形形狀的ITO配線之圖型電極上,使摻合物D1〜D4及E1 、E3〜E8分別塗佈成乾燥後之厚度爲l〇〇#m,在室溫保S-36-201247798 Long (registered trademark) The thickness after drying on a plate was about 130/zm. Using a bar coater, the coating was superposed, and a self-supporting film was produced. The moisture permeability of the self-supporting film was measured in accordance with JIS Z0208 using a moisture permeable cup jig (manufactured by Tester Industries, Ltd.). Further, the test conditions for the moisture permeability were a temperature of 40 ° C, a humidity of 90% RH, and 24 hours. <Evaluation of long-term electrical insulation reliability using a flexible substrate> Etching flexible copper foil laminate (manufactured by Sumitomo Metal Mining Co., Ltd., grade name · S'perflex, copper thickness: 8/zm, Juyiya The substrate having a fine comb-shaped pattern described in JPCA-ET01 (the thickness of the amine is 38/zm) (the width of the copper wiring/the width of the copper wiring is =1 ym / 15 5 m) is flexible. On the flexible wiring board, the blends D1 to D4 and the blends El' E3 to E8 were respectively applied to have a thickness of 100 μm after drying, and after being kept at room temperature for 10 minutes, they were dried at 7 ° C. hour. Using this test piece, a temperature and humidity constant test under the conditions of a temperature of 85 ° C and a humidity of 85% RH was carried out using a MIGRATION TESTER MODEL MIG-8600 (manufactured by IMV) using a bias voltage of 30 V. The resistance 値 after starting the above-mentioned temperature and humidity constant test for 1,000 hours is shown in Table 1. <Evaluation of Long-Term Insulation Reliability of Wiring on Glass Substrate> On a glass substrate, a pattern electrode of an ITO wiring having a comb-shaped pattern of 4 〇vm/10 #m was formed on the glass substrate to make a blend D1. ~D4 and E1, E3~E8 are respectively coated to a thickness of l〇〇#m after drying, and are kept at room temperature.

C -37- 201247798 持1 〇分鐘後,以7 0 °C乾燥1 .5小時° 使用此試驗片,施加偏廳電壓30V ’使用MIGRATI0N TESTER MODEL MIG-8600 ( IMV 公司製)而進行溫度 85 。(: '濕度8 5 %RH之條件的溫濕度定常試驗。將起動上述 溫濕度定常試驗初期及起動後丨〇〇〇小時後之電阻値表示 於表1中。C -37-201247798 After drying for 1 hour, the temperature was dried at 70 °C for 1.5 hours. Using this test piece, a bias voltage of 30 V was applied. The temperature was 85 using MIGRATI0N TESTER MODEL MIG-8600 (manufactured by IMV). (: The temperature and humidity constant test of the condition of 'humidity 8 5 % RH.) The resistance 値 at the beginning of the above-mentioned temperature and humidity constant test and after the start of the start is shown in Table 1.

S -38- 201247798S -38- 201247798

rL 1]£ 表 1比較例8| in csi O e e to o o o 1 80.0 I ο ο C3 ο 0. 72 in X 〇 eO 〇 e〇 csl 〇 2X10, 3X105 比較例7| ΙΑ «Ν* o o o «〇 e o e O 」8·5 ο e ο 0. 32 o ◎ ο Csj 〇 CO esi ο 〇 卜 -1 2X10· -1 3X10*1 |比較例6| C9 22.5 e e u&gt; u1» o o o a 1 67.0 1 G ο 1.22 m i/i ◎ CNi 〇 CM 〇 g 1X10· 2X10· 比較例5 22.5 | 〇 o o o C0 m CNJ o o o 1 64.0 1 Ο σ «Ο 0.68 l〇 ui ◎ CO 〇 CSJ C0 〇 〇 I 2X109| 1 3X109 比較例4 22.5 | 〇 o o l〇 tri o o O C3 1 64.0 1 Ο ο ΟΟ 0.66 u&gt; in ◎ 卜 〇 C9 ca 〇 〇 卜 1 2X10* i 1 2X10·; 比較例3| o o o CO o o o o 1 80.0 1 Ο e ο 0.88 o txi ◎ o cO 〇 «〇 oi 〇 ο 2X10» 3X109 j 比較例2 | ο o s o o o o - o 1__Ι〇ι〇__1 Ο ο ο κ·蓉展 N-Nit mE.m is驿迂 Jig 7¾¾ 如?迎 •QC sBS Ifgtf 埘醮埕驛 } 1 1 1 S 1 1 比較例1 | C3 s Q O o o o — o '70.0 1 ο ο ο 〇 ui ◎ o 〇 塗膜嚴重碎裂 不能測定 X S 1 1X10· 2X10' 實施例4 22.5 | o 〇 o o o Q | 68.0 | ο ο ο ο 一 ο 0.67 Q OJ 〇 o cO 0 a〇 csl 〇 〇 卜 2X10» 2X10» 實施例3| 22.5 | o o o LA o o o 56.0 | ο οό ο 七 ο 七 ο 0.62 U7 〇 o csi 〇 a〇 ca 〇 〇 2X10, 3X10· 實施例2 22.5 | o o o m Lri o o o Γβαο | ο C0 ο ο ο 0.67 〇 cO ◎ o cJ 〇 00 01 〇 2X10* 2X10* 實施例Μ u&gt; CM C3 o o «0 o o o O JZ «θ ui ο &lt;SI ο 0. 6&amp; «/&gt; 〇 o cU 〇 CO 〇 〇 2X10* 3X10&quot; tc 60 b6 be to 60 Μ Μ Μ) Μ v&gt; 2 I N/cw N/ca |g/m2*24hrs a 〇 I D1155 I | D1161 j | D1652 | 1 D1101 | o 歹 e o .Ξ δ | l-MARV ^S-110 | I l-MARV ®p-100 | I KBM-602 | | 甲基環己烷 1 1 乙基環己烷 1 I 碳酸二甲酯 I I 碳酸二乙酯 1 1 醋酸正丁酯 1 黏度125*0) 無沾黏時間 1 有無拉絲性 | | 對玻璃之密著性 1 餿 Μ s m 剝 Μ 痺 海 m m 對聚酸亞胺薄膜之密著性 1源自聚酸亞胺之塗膜的剝離性 1 透濕度 1000小時後 之電阻値 1000小時後 之電阻値 踩 11 || 橄鍤 11 S! -39- 201247798 從表1之結果,可知摻合物D 1〜D 4 璃基材之密著性、長期絕緣信賴性優| l-2Pa · s以下,爲低黏度。然而,摻合物 操作性差,摻合物E 1、E3〜E8係乾燥速 絲狀之塗佈液的結果,本發明之組成物係 而塗佈之防濕絕緣材料。 [產業上之利用可能性] 本發明之防濕絕緣材料係可顯現低黏 組成物,藉由以此防濕絕緣材料塗佈處理 度防濕絕緣保護之電子零件。 係乾燥性,於玻 ;,且,黏度爲 E2係黏度高、 度差或經常發生 適於使用點膠機 且速乾燥性之 俾可得到被高 -40-rL 1]£ Table 1 Comparative Example 8| in csi O ee to ooo 1 80.0 I ο ο C3 ο 0. 72 in X 〇eO 〇e〇csl 〇2X10, 3X105 Comparative Example 7| ΙΑ «Ν* ooo «〇eoe O ”8·5 ο e ο 0. 32 o ◎ ο Csj 〇CO esi ο 〇卜-1 2X10· -1 3X10*1 |Comparative Example 6| C9 22.5 ee u&gt; u1» oooa 1 67.0 1 G ο 1.22 mi /i ◎ CNi 〇CM 〇g 1X10· 2X10· Comparative Example 5 22.5 | 〇ooo C0 m CNJ ooo 1 64.0 1 Ο σ «Ο 0.68 l〇ui ◎ CO 〇CSJ C0 〇〇I 2X109| 1 3X109 Comparative Example 4 22.5 〇ool〇tri oo O C3 1 64.0 1 Ο ο ΟΟ 0.66 u&gt; in ◎ Buddy C9 ca 1 Bu 1 2X10* i 1 2X10·; Comparative Example 3| ooo CO oooo 1 80.0 1 Ο e ο 0.88 o txi ◎ o cO 〇«〇oi 〇ο 2X10» 3X109 j Comparative Example 2 | ο osoooo - o 1__Ι〇ι〇__1 Ο ο ο κ · Rong Zhan N-Nit mE.m is驿迂Jig 73⁄43⁄4迎•QC sBS Ifgtf 埘醮埕驿} 1 1 1 S 1 1 Comparative Example 1 | C3 s QO ooo — o '70.0 1 ο ο ο 〇ui ◎ o 〇 The film is severely chipped and cannot be measured XS 1 1X10· 2X10' Example 4 22.5 | o 〇ooo Q | 68.0 | ο ο ο ο 一ο 0.67 Q OJ 〇o cO 0 a〇csl 2 2X10» 2X10» Example 3| 22.5 | ooo LA ooo 56.0 | ο οό ο ο 七ο 0.62 U7 〇o csi 〇a〇ca 〇〇2X10, 3X10· Example 2 22.5 | ooom Lri ooo Γβαο | ο C0 ο ο ο 0.67 〇cO ◎ o cJ 〇00 01 〇2X10* 2X10* Example Μ u&gt; CM C3 oo «0 ooo O JZ «θ ui ο &lt;SI ο 0. 6&amp;«/&gt; 〇o cU 〇CO 〇〇2X10* 3X10&quot; tc 60 b6 be to 60 Μ Μ Μ) Μ v&gt; 2 IN/cw N/ca |g/m2*24hrs a 〇I D1155 I | D1161 j | D1652 | 1 D1101 | o 歹eo .Ξ δ | l-MARV ^S-110 | I l-MARV ®p-100 | I KBM-602 | | Methylcyclohexane 1 1 Ethylcyclohexane 1 I Dimethyl carbonate II Diethyl carbonate 1 1 N-butyl acetate 1 Viscosity 125*0) No sticking time 1 With or without stringiness | | Adhesion to glass 1馊Μ sm Μ Μ 痹 mm mm mm The adhesion to the polyimide film 1 The peeling property of the coating film derived from polyimine 1 The resistance after 1000 hours of moisture 値 1000 hours after the resistance 値 step 11 || Olive 11 S! -39- 201247798 From the results of Table 1, it is understood that the adhesion of the blend D 1 to D 4 glass substrate and the long-term insulation reliability are excellent, l-2 Pa · s or less, and the viscosity is low. However, the blend has poor handleability, and the blends E 1 and E3 to E8 are the results of drying the fast-filament coating liquid, and the composition of the present invention is a moisture-proof insulating material coated. [Industrial Applicability] The moisture-proof insulating material of the present invention exhibits a low-viscosity composition, and the moisture-proof insulating material is coated with the moisture-proof insulating member to protect the electronic component. It is dry, in glass; and, the viscosity is E2, the viscosity is high, the degree is poor or often occurs. It is suitable for using the dispenser and the quick drying property can be high -40-

Claims (1)

201247798 七、申請專利範圍: 1 ·—種防濕絕緣材料,其係含有苯乙烯系熱塑性彈性 體、增黏劑、及溶劑之防濕絕緣材料,其特徵係前述溶劑 含有由具有80°C以上、未達1 10°C之沸點的脂肪族烴系溶 劑及以式(1 ) 【化1】 R,〇\C/〇、R2 II ⑴ 〇 (式(1)中,R1與R2分別獨立地表示甲基或乙基) 所示之碳酸二烷基酯所構成之溶劑。 2 .如申請專利範圍第1項之防濕絕緣材料,其中前述 溶劑進一步含有由具有1 1 〇 °C以上、未達1 40 °C之沸點的 脂肪族烴系溶劑。 3. 如申請專利範圍第2項之防濕絕緣材料,其中於防 濕絕緣材料中所含有之具有80°C以上、未達1 1 〇°C之沸點 的脂肪族烴系溶劑與具有ll〇°C以上、未達140°C之沸點 的脂肪族烴系溶劑的質量比爲65 : 35〜97 : 3之範圍。 4. 如申請專利範圍第1〜3項中任一項之防濕絕緣材 料,其中於防濕絕緣材料中所含有之具有8〇t以上、未達 11 0 °C之沸點的脂肪族烴系溶劑與具有11 〇 °c以上、未達 1 40°c之沸點的脂肪族烴系溶劑之總量與以式(1 )所示之 碳酸二烷基酯所構成之溶劑的質量比爲85: 15〜98: 2之 範圍。 -41 - 201247798 5. 如申請專利範圍第1〜4項中任一項之防濕絕緣材 料,其中具有8(TC以上、未達1 10°C之沸點的脂肪族烴系 溶劑爲環己烷及/或甲基環己烷。 6. 如申請專利範圍第2〜5項中任一項之防濕絕緣材 料,其中具有U0°C以上、未達140°C之沸點的脂肪族烴 系溶劑爲由順式-1,2·二甲基環己烷、順式-1,3-二甲基環己 烷、順式-1,4-二甲基環己烷、反式-1,2-二甲基環己烷、反 式-1,3-二甲基環己烷、反式-1,4-二甲基環己烷及乙基環己 烷所構成之群中選出的至少1種。 7. 如申請專利範圍第1〜6項中任一項之防濕絕緣材 料,其中相對於防濕絕緣材料之總質量,苯乙烯系熱塑性 彈性體與增黏劑之總量爲2 0〜4 0質量%,溶劑之總量爲 60〜80質量%,於防濕絕緣材料中所含有之苯乙烯系熱塑 性彈性體與增黏劑的質量比爲2 : 1〜1 0 : 1的範圍,於防 濕絕緣材料中所含有之具有80°C以上、未達1 1 〇°C之沸點 的脂肪族烴系溶劑與以式(1 )所示之碳酸二烷基酯所構 成之溶劑的總量相對於溶劑之總量爲65質量%以上,進一 步,在防濕絕緣材料之25 °C的黏度爲1.2 Pa· s以下。 8. 如申請專利範圍第1〜7項中任一項之防濕絕緣材 料,其中苯乙烯系熱塑性彈性體爲由苯乙烯-丁二烯嵌段 共聚合彈性體、苯乙烯-異戊二烯嵌段共聚合彈性體、苯 乙烯-乙烯/ 丁烯嵌段共聚合彈性體 '及苯乙烯-乙烯/丙烯 嵌段共聚合彈性體所構成之群中選出的至少1種。 9. 如申請專利範園第1〜8項中任一項之防濕絕緣材 S -42- 201247798 料,其中源自苯乙烯系熱塑性彈性體中所含有之苯乙烯的 構造單元之含量相對於苯乙烯系熱塑性彈性體的總量爲15 〜5 0質量%。 1 0.如申請專利範圍第1〜9項中任一項之防濕絕緣材 料,其中增黏劑爲石油系樹脂增黏劑。 1 1 . 一種電子零件,其係使用如申請專利範圍第1〜1 0 項中任一項之防濕絕緣材料而被絕緣處理者。 -43- 201247798 四 指定代表圖: (一) 本案指定代表圖為:無 (二) 本代表圖之元件符號簡單說明:無 201247798 五 本案若有化學式時,請揭示最能顯示發明特徵的化學 式:無201247798 VII. Patent application scope: 1 · A kind of moisture-proof insulating material, which is a moisture-proof insulating material containing a styrene-based thermoplastic elastomer, a tackifier, and a solvent, characterized in that the solvent contains 80 ° C or more. An aliphatic hydrocarbon solvent having a boiling point of less than 10 ° C and a formula (1) R, 〇\C/〇, R2 II (1) 〇 (in the formula (1), R1 and R2 are independently A solvent composed of a dialkyl carbonate represented by a methyl group or an ethyl group. 2. The moisture-proof insulating material according to claim 1, wherein the solvent further contains an aliphatic hydrocarbon solvent having a boiling point of not more than 1 40 ° C and not more than 1 40 ° C. 3. The moisture-proof insulating material according to item 2 of the patent application, wherein the aliphatic hydrocarbon-based solvent having a boiling point of 80 ° C or more and less than 1 1 〇 ° C contained in the moisture-proof insulating material has ll〇 The mass ratio of the aliphatic hydrocarbon solvent having a boiling point of not higher than 140 ° C is in the range of 65:35 to 97:3. 4. The moisture-proof insulating material according to any one of claims 1 to 3, wherein the aliphatic hydrocarbon system having a boiling point of 8 〇t or more and less than 110 ° C contained in the moisture-proof insulating material The mass ratio of the solvent to the solvent of the aliphatic hydrocarbon solvent having a boiling point of 11 〇 ° or more and less than 140 ° C and the solvent of the dialkyl carbonate represented by the formula (1) is 85: 15 to 98: range of 2. -41 - 201247798 5. The moisture-proof insulating material according to any one of claims 1 to 4, wherein the aliphatic hydrocarbon solvent having a boiling point of 8 (TC or more and less than 10 ° C is cyclohexane) And/or methylcyclohexane. 6. The moisture-proof insulating material according to any one of claims 2 to 5, wherein the aliphatic hydrocarbon solvent having a boiling point of not more than U0 ° C and not exceeding 140 ° C It is composed of cis-1,2·dimethylcyclohexane, cis-1,3-dimethylcyclohexane, cis-1,4-dimethylcyclohexane, trans-1,2 At least 1 selected from the group consisting of dimethylcyclohexane, trans-1,3-dimethylcyclohexane, trans-1,4-dimethylcyclohexane and ethylcyclohexane 7. The moisture-proof insulating material according to any one of claims 1 to 6, wherein the total amount of the styrene-based thermoplastic elastomer and the tackifier is 20 with respect to the total mass of the moisture-proof insulating material. ~40% by mass, the total amount of the solvent is 60 to 80% by mass, and the mass ratio of the styrene-based thermoplastic elastomer to the tackifier contained in the moisture-proof insulating material is 2:1 to 1 0:1. , contained in moisture-proof insulation materials The total amount of the solvent of the aliphatic hydrocarbon solvent having a boiling point of 80 ° C or higher and not higher than 1 1 ° C and the dialkyl carbonate represented by the formula (1) is relative to the total amount of the solvent. 5% by mass or more, and further, the moisture-proof insulating material has a viscosity of not less than 1.2 Pa·s at 25 ° C. 8. The moisture-proof insulating material according to any one of claims 1 to 7, wherein the styrene is The thermoplastic elastomer is composed of a styrene-butadiene block copolymerized elastomer, a styrene-isoprene block copolymerized elastomer, a styrene-ethylene/butylene block copolymerized elastomer, and styrene. At least one selected from the group consisting of ethylene/propylene block copolymerized elastomers. 9. A moisture-proof insulating material S-42-201247798, in which the source is applied, as disclosed in any one of claims 1 to 8. The content of the structural unit of styrene contained in the styrene-based thermoplastic elastomer is 15 to 50% by mass based on the total amount of the styrene-based thermoplastic elastomer. 1 0. In the scope of claims 1 to 9 Any of the moisture-proof insulating materials, wherein the tackifier is a petroleum resin tackifier. An electronic component which is insulated by using a moisture-proof insulating material according to any one of claims 1 to 10 of the patent application. -43- 201247798 Four designated representative drawings: (1) Representative representative map of the case For: None (2) Simple description of the symbol of the representative figure: No 201247798 If there is a chemical formula in the five cases, please disclose the chemical formula that best shows the characteristics of the invention: none
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CN103392210B (en) 2016-01-27
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KR101477039B1 (en) 2014-12-29
JP5893001B2 (en) 2016-03-23

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