JP2005108956A - チップ状電子部品 - Google Patents

チップ状電子部品 Download PDF

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Publication number
JP2005108956A
JP2005108956A JP2003337217A JP2003337217A JP2005108956A JP 2005108956 A JP2005108956 A JP 2005108956A JP 2003337217 A JP2003337217 A JP 2003337217A JP 2003337217 A JP2003337217 A JP 2003337217A JP 2005108956 A JP2005108956 A JP 2005108956A
Authority
JP
Japan
Prior art keywords
inorganic filler
chip
electronic component
present
component according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2003337217A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005108956A5 (enExample
Inventor
Masato Hashimoto
正人 橋本
Seiji Hoshitoku
聖治 星徳
Mitsuru Harada
充 原田
Takashi Obayashi
孝志 大林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2003337217A priority Critical patent/JP2005108956A/ja
Publication of JP2005108956A publication Critical patent/JP2005108956A/ja
Publication of JP2005108956A5 publication Critical patent/JP2005108956A5/ja
Withdrawn legal-status Critical Current

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JP2003337217A 2003-09-29 2003-09-29 チップ状電子部品 Withdrawn JP2005108956A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003337217A JP2005108956A (ja) 2003-09-29 2003-09-29 チップ状電子部品

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003337217A JP2005108956A (ja) 2003-09-29 2003-09-29 チップ状電子部品

Publications (2)

Publication Number Publication Date
JP2005108956A true JP2005108956A (ja) 2005-04-21
JP2005108956A5 JP2005108956A5 (enExample) 2006-04-06

Family

ID=34533107

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003337217A Withdrawn JP2005108956A (ja) 2003-09-29 2003-09-29 チップ状電子部品

Country Status (1)

Country Link
JP (1) JP2005108956A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007032201A1 (ja) * 2005-09-15 2007-03-22 Matsushita Electric Industrial Co., Ltd. チップ状電子部品
US7604871B2 (en) * 2006-06-07 2009-10-20 Honeywell International Inc. Electrical components including abrasive powder coatings for inhibiting tin whisker growth
US20120022184A1 (en) * 2009-04-02 2012-01-26 Huntsman International Llc Direct Overmolding

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03248401A (ja) * 1990-02-26 1991-11-06 Sannopuko Kk 導電性ペーストの製造方法
JPH04198271A (ja) * 1990-11-27 1992-07-17 Mitsui Mining Co Ltd 導電性ペースト組成物
JPH077876B2 (ja) * 1988-09-08 1995-01-30 松下電器産業株式会社 導電性樹脂膜およびその製造方法
JPH07198271A (ja) * 1994-01-12 1995-08-01 Nippon Steel Corp 溶解炉のスクラップ予熱塔
JPH11339559A (ja) * 1998-05-26 1999-12-10 Toshiba Chem Corp 異方性導電接着剤
JP2002260442A (ja) * 2001-03-06 2002-09-13 Toyobo Co Ltd 導電性ペースト
JP2003045227A (ja) * 2001-07-27 2003-02-14 Toppan Forms Co Ltd 導電ペースト及びそれを塗工したシート類

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH077876B2 (ja) * 1988-09-08 1995-01-30 松下電器産業株式会社 導電性樹脂膜およびその製造方法
JPH03248401A (ja) * 1990-02-26 1991-11-06 Sannopuko Kk 導電性ペーストの製造方法
JPH04198271A (ja) * 1990-11-27 1992-07-17 Mitsui Mining Co Ltd 導電性ペースト組成物
JPH07198271A (ja) * 1994-01-12 1995-08-01 Nippon Steel Corp 溶解炉のスクラップ予熱塔
JPH11339559A (ja) * 1998-05-26 1999-12-10 Toshiba Chem Corp 異方性導電接着剤
JP2002260442A (ja) * 2001-03-06 2002-09-13 Toyobo Co Ltd 導電性ペースト
JP2003045227A (ja) * 2001-07-27 2003-02-14 Toppan Forms Co Ltd 導電ペースト及びそれを塗工したシート類

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007032201A1 (ja) * 2005-09-15 2007-03-22 Matsushita Electric Industrial Co., Ltd. チップ状電子部品
US7794628B2 (en) * 2005-09-15 2010-09-14 Panasonic Corporation Chip-shaped electronic component
US7604871B2 (en) * 2006-06-07 2009-10-20 Honeywell International Inc. Electrical components including abrasive powder coatings for inhibiting tin whisker growth
US8329248B2 (en) 2006-06-07 2012-12-11 Honeywell International Inc. Methods for inhibiting tin whisker growth using abrasive powder coatings
US20120022184A1 (en) * 2009-04-02 2012-01-26 Huntsman International Llc Direct Overmolding
JP2012522854A (ja) * 2009-04-02 2012-09-27 ハンツマン・アドヴァンスト・マテリアルズ・（スイッツランド）・ゲーエムベーハー ダイレクトオーバーモールディング
US8999433B2 (en) * 2009-04-02 2015-04-07 Huntsman International Llc Direct overmolding

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